Datasheet

AOD11S60/AOI11S60
600V 11A α MOS TM Power Transistor
General Description
Product Summary
The AOD11S60 & AOI11S60 have been fabricated using
the advanced αMOSTM high voltage process that is
designed to deliver high levels of performance and
robustness in switching applications.
By providing low RDS(on), Qg and EOSS along with
guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power supply
designs.
VDS @ Tj,max
700V
IDM
45A
RDS(ON),max
0.399Ω
Qg,typ
11nC
Eoss @ 400V
2.7µJ
100% UIS Tested
100% Rg Tested
TO252
DPAK
Top View
TO251A
IPAK
Bottom View
Top View
D
Bottom View
D
D
G
S
S
G
G
S
S
S
G
AOI11S60
AOD11S60
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
Continuous Drain
Current
G
D
D
VGS
TC=25°C
TC=100°C
Maximum
600
Units
V
±30
V
11
ID
8.5
A
Pulsed Drain Current C
IDM
Avalanche Current C
IAR
2
A
Repetitive avalanche energy C
EAR
60
mJ
Single pulsed avalanche energy H
TC=25°C
Power Dissipation B Derate above 25oC
MOSFET dv/dt ruggedness
Peak diode recovery dv/dt
Junction and Storage Temperature Range
EAS
120
mJ
45
PD
dv/dt
TJ, TSTG
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds K
TL
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A,D
Symbol
RθJA
Maximum Case-to-sink A
RθCS
Maximum Junction-to-CaseD,F
RθJC
Rev3: Jan 2012
208
W
1.67
100
20
-55 to 150
W/ oC
300
°C
V/ns
°C
Typical
Maximum
Units
45
55
°C/W
-0.45
0.5
0.6
°C/W
°C/W
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Page 1 of 7
AOD11S60/AOI11S60
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
ID=250µA, VGS=0V, TJ=25°C
600
-
-
ID=250µA, VGS=0V, TJ=150°C
650
700
-
V
µA
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
VDS=600V, VGS=0V
-
-
1
VDS=480V, TJ=150°C
-
10
-
IGSS
Gate-Body leakage current
VDS=0V, VGS=±30V
-
-
±100
VGS(th)
Gate Threshold Voltage
VDS=5V,ID=250µA
2.8
3.5
4.1
nΑ
V
RDS(ON)
Static Drain-Source On-Resistance
VSD
Diode Forward Voltage
IS
ISM
VGS=10V, ID=3.8A, TJ=25°C
-
0.35
0.399
Ω
VGS=10V, ID=3.8A, TJ=150°C
-
0.98
1.11
Ω
IS=5.5A,VGS=0V, TJ=25°C
-
0.84
-
V
Maximum Body-Diode Continuous Current
-
-
11
A
Maximum Body-Diode Pulsed CurrentC
-
-
45
A
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Coss
Output Capacitance
Co(er)
Effective output capacitance, energy
related I
Crss
Effective output capacitance, time
related J
Reverse Transfer Capacitance
Rg
Gate resistance
Co(tr)
-
545
-
pF
-
37.3
-
pF
-
30.8
-
pF
-
93.6
-
pF
VGS=0V, VDS=100V, f=1MHz
-
1.42
-
pF
VGS=0V, VDS=0V, f=1MHz
-
16.5
-
Ω
VGS=0V, VDS=100V, f=1MHz
VGS=0V, VDS=0 to 480V, f=1MHz
SWITCHING PARAMETERS
Total Gate Charge
Qg
-
11
-
nC
-
2.8
-
nC
Gate Drain Charge
-
3.8
-
nC
Turn-On DelayTime
-
20
-
ns
-
20
-
ns
-
59
-
ns
-
20
-
ns
Qgs
Gate Source Charge
Qgd
tD(on)
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
VGS=10V, VDS=480V, ID=5.5A
VGS=10V, VDS=400V, ID=5.5A,
RG=25Ω
Body Diode Reverse Recovery Time
Peak Reverse Recovery Current
IF=5.5A,dI/dt=100A/µs,VDS=400V
-
250
-
ns
Irm
IF=5.5A,dI/dt=100A/µs,VDS=400V
-
21
-
Qrr
Body Diode Reverse Recovery Charge IF=5.5A,dI/dt=100A/µs,VDS=400V
-
3.3
-
A
µC
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation
limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial TJ
=25°C.
D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g.
G.These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
H. L=60mH, IAS=2A, VDD=150V, Starting TJ=25°C
I. Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V(BR)DSS.
J. Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% V(BR)DSS.
K. Wave soldering only allowed at leads.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev3: Jan 2012
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Page 2 of 7
AOD11S60/AOI11S60
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
16
24
10V
10V
20
7V
12
7V
12
6V
8
5.5V
4
5V
6V
ID (A)
ID (A)
16
8
5.5V
4
5V
VGS=4.5V
VGS=4.5V
0
0
0
5
10
15
0
20
5
10
15
20
VDS (Volts)
Figure 2: On-Region [email protected]°C
VDS (Volts)
Figure 1: On-Region [email protected]°C
100
1.2
-55°C
VDS=20V
10
0.9
RDS(ON) (Ω )
ID(A)
125°C
1
25°C
VGS=10V
0.6
0.3
0.1
0.0
0.01
2
4
6
8
0
10
10
15
20
25
ID (A)
Figure 4: On-Resistance vs. Drain Current and
Gate Voltage
VGS(Volts)
Figure 3: Transfer Characteristics
1.2
3
2.5
VGS=10V
ID=3.8A
BVDSS (Normalized)
Normalized On-Resistance
5
2
1.5
1
1.1
1
0.9
0.5
0
-100
-50
0
50
100
150
200
Temperature (°C)
Figure 5: On-Resistance vs. Junction Temperature
Rev3: Jan 2012
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0.8
-100
-50
0
50
100
150
200
TJ (oC)
Figure 6: Break Down vs. Junction Temperature
Page 3 of 7
AOD11S60/AOI11S60
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
15
1.0E+02
1.0E+01
125°C
12
VDS=480V
ID=5.5A
25°C
1.0E-01
9
VGS (Volts)
IS (A)
1.0E+00
1.0E-02
6
1.0E-03
3
1.0E-04
1.0E-05
0
0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 7: Body-Diode Characteristics (Note E)
0
8
12
16
Qg (nC)
Figure 8: Gate-Charge Characteristics
10000
6
5
Ciss
1000
Eoss(uJ)
Capacitance (pF)
4
100
Eoss
4
3
Coss
2
10
1
Crss
0
1
0
100
200
300
400
500
VDS (Volts)
Figure 9: Capacitance Characteristics
0
600
100
200
300
400
VDS (Volts)
Figure 10: Coss stored Energy
500
600
800
RDS(ON)
limited
10µs
100µs
1
DC
1ms
TJ(Max)=150°C
TC=25°C
600
Power (W)
10
ID (Amps)
100
400
10ms
200
0.1
TJ(Max)=150°C
TC=25°C
0.01
1
10
100
1000
0
0.0001
VDS (Volts)
Figure 11: Maximum Forward Biased Safe
Operating Area (Note F)
Rev3: Jan 2012
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0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 12: Single Pulse Power Rating Junction-toCase (Note F)
Page 4 of 7
AOD11S60/AOI11S60
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
Zθ JC Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=0.6°C/W
1
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
PD
0.1
Ton
0.01
T
Single Pulse
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 13: Normalized Maximum Transient Thermal Impedance (Note F)
120
12
Current rating ID(A)
EAS(mJ)
90
60
30
0
9
6
3
0
25
75
100
125
TCASE (°C)
Figure 14: Avalanche energy
Rev3: Jan 2012
50
150
175
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0
25
50
75
100
125
TCASE (°C)
Figure 15: Current De-rating (Note B)
150
Page 5 of 7
AOD11S60/AOI11S60
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
400
TA=25°C
Power (W)
300
200
100
0
0.01
0.1
1
10
100
Pulse Width (s)
Figure 16: Single Pulse Power Rating Junction-to-Ambient (Note G)
1000
Zθ JA Normalized Transient
Thermal Resistance
10
1
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=55°C/W
0.1
0.01
PD
0.001
Ton
Single Pulse
0.0001
0.001
0.01
0.1
T
1
10
100
1000
10000
Pulse Width (s)
Figure 17: Normalized Maximum Transient Thermal Impedance (Note G)
Rev3: Jan 2012
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Page 6 of 7
AOD11S60/AOI11S60
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
DUT
-
Vgs
Ig
Charge
Res istive Switching Test Circuit & Waveforms
RL
Vds
Vds
DUT
Vgs
+
VDC
90%
Vdd
-
Rg
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
t off
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LI
Vds
2
AR
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Diode Recovery Tes t Circuit & Waveforms
Qrr = - Idt
Vds +
DUT
Vgs
Vds -
Isd
Vgs
Ig
Rev3: Jan 2012
L
Isd
+
VDC
-
IF
trr
dI/dt
IRM
Vdd
Vdd
Vds
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Page 7 of 7