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Dec. 2015
DDR3 SDRAM Memory
Product Guide
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SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
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ⓒ 2015 Samsung Electronics Co., Ltd. All rights reserved.
-1-
Dec. 2015
Product Guide
DDR3 SDRAM Memory
1. DDR3 SDRAM MEMORY ORDERING INFORMATION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
K 4 B X X X X X X X - X X X X
Speed
SAMSUNG Memory
DRAM
Temp & Power
DRAM Type
Package Type
Density
Revision
Interface (VDD, VDDQ)
Bit Organization
# of Internal Banks
1. SAMSUNG Memory : K
2. DRAM : 4
3. DRAM Type
B : DDR3 SDRAM
10. Revision
M : 1st Gen.
A : 2nd Gen.
B/Q : 3rd Gen.
C : 4th Gen.
D : 5th Gen.
E : 6th Gen.
F : 7th Gen.
G : 8th Gen.
4~5. Density
51 : 512Mb
1G :
1Gb
2G :
2Gb
4G :
4Gb
8G :
8Gb
11. "-"
12. Package Type
H
M
B
E
O
6~7. Bit Organization
04 :
08 :
16 :
33 :
x4
x8
x16
x32
9. Interface ( VDD, VDDQ)
6 : SSTL (1.5V, 1.5V)
FBGA (Halogen-free & Lead-free)
FBGA (Halogen-free & Lead-free, DDP)
FBGA (Halogen-free & Lead-free, Flip Chip)
FBGA(Lead-free & Halogen-free, QDP)
FBGA(Lead-free & Halogen-free, QDP for 64GB
LRDIMM)
13. Temp & Power
C : Commercial Temp.( 0C ~ 85C) & Normal Power(1.5V)
Y : Commercial Temp.( 0C ~ 85C) & Low VDD(1.35V)
8. # of Internal Banks
3 : 4 Banks
4 : 8 Banks
5 : 16 Banks
:
:
:
:
:
14~15. Speed
F7 : DDR3-800
F8 : DDR3-1066
H9 : DDR3-1333
K0 : DDR3-1600
MA : DDR3-1866
NB : DDR3-2133
-2-
(400MHz @ CL=6, tRCD=6, tRP=6)
(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
(933MHz @ CL=13, tRCD=13, tRP=13)
(1066MHz @ CL=14, tRCD=14, tRP=14)
Dec. 2015
Product Guide
DDR3 SDRAM Memory
2. DDR3 SDRAM Component Product Guide
Density
2Gb Q-die
4Gb Q-die
Banks
8Banks
8Banks
Part Number
Package & Power,
Temp. & Speed
Org.
K4B2G0446Q
BCH9/K0/MA
512Mx4
K4B2G0846Q
BCH9/K0/MA
256Mx8
K4B2G1646Q
BCH9/K0/MA
K4B2G0446Q
PKG
Avail.
78 ball
FBGA
EOL
Q1’16
128Mx16
96ball
FBGA
MP
BYH9/K0/MA
512Mx4
K4B2G0846Q
BYH9/K0/MA
256Mx8
78 ball
FBGA
EOL
Q1’16
K4B2G1646Q
BYH9/K0/MA
128Mx16
96ball
FBGA
MP
78 ball
FBGA
EOL
Q1’16
96ball
FBGA
MP
78 ball
FBGA
EOL
Q1’16
96ball
FBGA
MP
K4B4G0446Q
HCH9/K0/MA
1Gx4
K4B4G0846Q
HCH9/K0/MA
512Mx8
K4B4G1646Q
HCH9/K0/MA
256Mx16
K4B4G0446Q
HYH9/K0/MA
1Gx4
K4B4G0846Q
HYH9/K0/MA
512Mx8
K4B4G1646Q
HYH9/K0/MA
256Mx16
K4B4G0446D
BCH9/K0/MA
1Gx4
K4B4G0846D
BCH9/K0/MA
512Mx8
K4B4G1646D
4Gb D-die
8Banks
8Banks
BCH9/K0/MA
1.5V
1.35V
1.5V
1.35V
1.5V
K4B4G0446D
BYH9/K0/MA
1Gx4
BYH9/K0/MA
512Mx8
BYH9/K0/MA
78 ball
FBGA
1.35V
78 ball
FBGA
256Mx16
96ball
FBGA
78 ball
FBGA
K4A4G045WE
BCH9/K0/MA
1Gx4
K4A4G085WE
BCH9/K0/MA
512Mx8
K4A4G165WE
BCH9/K0/MA
256Mx16
96ball
FBGA
K4A4G045WE
BYH9/K0/MA
1Gx4
K4A4G085WE
BYH9/K0/MA
512Mx8
78 ball
FBGA
K4A4G165WE
BYH9/K0/MA
256Mx16
-3-
MP
96ball
FBGA
256Mx16
K4B4G0846D
K4B4G1646D
4Gb E-die
VDD Voltage1
1.5V
1.35V
96ball
FBGA
MP
MP
MP
NOTE
Dec. 2015
Product Guide
DDR3 SDRAM Memory
3. DDR3 SDRAM Module Ordering Information
1
2
3
4
5
6
7
8
9
10
11
12
13 14
15
16
171
M X X X B X X X X X X X - X X X X
Memory Module
DIMM Type
Data bits
Memory Buffer
Speed
DRAM Component Type
Temp & Power
Depth
PCB Revision
Package
# of Banks in Comp. & Interface
Component Revision
Bit Organization
10. Component Revision
M : 1st Gen.
A
B/Q : 3rd Gen.
C
D : 5th Gen.
E
F : 7th Gen.
G
11. Package
1. Memory Module : M
2. DIMM Type
3 : DIMM
4 : SODIMM
H
M
B
E
O
3~4. Data Bits
71 :
74 :
78 :
86 :
90 :
91 :
92 :
93 :
x64
x72
x64
x72
x72
x72
x72
x72
204pin Unbuffered SODIMM
204pin ECC Unbuffered SODIMM
240pin Unbuffered DIMM
240pin LR DIMM
240pin VLP Unbuffered DIMM
240pin ECC Unbuffered DIMM
240pin VLP Registered DIMM
240pin Registered DIMM
5. DRAM Component Type
B : DDR3 SDRAM
33 : 32M (for 128Mb/512Mb)
65 : 64M (for 128Mb/512Mb)
29 : 128M (for 128Mb/512Mb)
57 : 256M (for 512Mb/2Gb)
52 : 512M (for 512Mb/2Gb)
1K : 1G (for 2Gb)
2K : 2G (for 2Gb)
8. # of Banks in comp. & Interface
7 :
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
FBGA(Lead-free & Halogen-free)
FBGA(Lead-free & Halogen-free, DDP)
FBGA (Halogen-free & Lead-free, Flip Chip)
FBGA(Lead-free & Halogen-free, QDP)
FBGA(Lead-free & Halogen-free, QDP for 64GB
LRDIMM)
12. PCB Revision
0 : None
2 : 2nd Rev.
4 : 4th Rev.
1 : 1st Rev.
3 : 3rd Rev.
S : Reduced Layer
13. "_"
6~7. Depth
32 : 32M
64 : 64M
28 : 128M
56 : 256M
51 : 512M
1G: 1G
2G: 2G
4G: 4G
8G: 8G
:
:
:
:
:
:
:
:
:
8Banks & SSTL-1.5V
14. Temp & Power
C : Commercial Temp.( 0C ~ 85C) & Normal Power(1.5V)
Y : Commercial Temp.( 0C ~ 85C) & Low VDD(1.35V)
15~16. Speed2
F7 : DDR3-800
F8 : DDR3-1066
H9 : DDR3-1333
K0 : DDR3-1600
MA: DDR3-1866
(400MHz @ CL=6, tRCD=6, tRP=6)
(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
(933MHz @ CL=13, tRCD=13, tRP=13)
17. Memory Buffer
0
1
2
3
4
9. Bit Organization
0 : x4
3 : x8
4 : x16
:
:
:
:
:
Inphi iMB02-GS02A
IDT A2 (Greendale)
Montage MB C0
Inphi iMB02-GS02B
Montage MB CI
NOTE:
1. Only used for LRDIMM
2. PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
PC3-14900(DDR3-1866)
-4-
Dec. 2015
Product Guide
DDR3 SDRAM Memory
4. DDR3 SDRAM Module Product Guide
4.1 240Pin DDR3 Registered DIMM
240Pin DDR3 Registered DIMM
Comp.
Version
Internal
Banks
Rank
PKG
Height
Avail.
Q-die
8
2
78ball
FBGA
30mm
EOL
Q1’16
4Gb
Q-die
8
1
78ball
FBGA
30mm
EOL
Q1’16
1G x 8 * 18 pcs
4Gb
Q-die
8
2
78ball
FBGA
30mm
EOL
Q1’16
C (1Rx4)
1G x 4 * 18 pcs
4Gb
E-die
8
1
78ball
FBGA
30mm
MP
YK0/CMA
B (2Rx8)
1G x 8 * 18 pcs
4Gb
Q-die
8
2
78ball
FBGA
30mm
EOL
Q1’16
M393B2G70QH0
YK0/CMA
E (2Rx4)
1G x 4 * 36 pcs
4Gb
Q-die
8
2
78ball
FBGA
30mm
EOL
Q1’16
16GB
M393B2G70DB0
YK0/CMA
E (2Rx4)
1G x 4 * 36 pcs
4Gb
D-die
8
2
78ball
FBGA
30mm
MP
2G x 72
16GB
M393B2G70EB0
YK0/CMA
E (2Rx4)
1G x 4 * 36 pcs
4Gb
E-die
8
2
78ball
FBGA
30mm
MP
4G x 72
32GB
M393B4G70DM0
YH9
AB (4Rx4)
2G
x 4 * 36 pcs
DDP
4Gb
D-die
8
4
78ball
FBGA
30mm
MP
Org.
Density
Part Number
Speed
Raw Card
Composition
1G x 72
8GB
M393B1K70QB0
YK0/CMA
E (2Rx4)
512M x 4 * 36 pcs
2Gb
1G x 72
8GB
M393B1G70QH0
YK0/CMA
C (1Rx4)
1G x 4 * 18 pcs
1G x 72
8GB
M393B1G73QH0
YK0/CMA
B (2Rx8)
1G x 72
8GB
M393B1G70EB0
YK0/CMA
1G x 72
8GB
M393B1G73EB0
2G x 72
16GB
2G x 72
NOTE
4.2 240Pin DDR3 LRDIMM
240Pin DDR3 LRDIMM
Composition
Comp.
Version
Org.
Density
Part Number
Speed
Raw Card
4G x 72
32GB
M386B4G70DM0
YK0/CMA
C (4Rx4)
2G
x 4 * 36 pcs
DDP
4Gb
8G x 72
64GB
M386B8G70DE0
YH9/CK0
E (8Rx4)
4G
x 4 * 36 pcs
QDP
4Gb
-5-
Internal
Banks
Rank
PKG
Height
Avail.
D-die
8
4
78ball
FBGA
30.35mm
MP
D-die
8
8
78ball
FBGA
30.35mm
MP
NOTE
Dec. 2015
Product Guide
DDR3 SDRAM Memory
4.3 240Pin DDR3 VLP Registered DIMM
240Pin DDR3 VLP Registered DIMM
Internal
Banks
Rank
PKG
Height
Avail.
D-die
8
1
78ball
FBGA
18.75mm
MP
4Gb
D-die
8
2
78ball
FBGA
18.75mm
MP
2G
x 4 * 18pcs
DDP
4Gb
D-die
8
2
78ball
FBGA
18.75mm
MP
4G
x 4 * 18pcs
QDP
4Gb
D-die
8
4
78ball
FBGA
18.75mm
MP
Composition
Comp.
Version
Org.
Density
Part Number
Speed
Raw Card
1G x 72
8GB
M392B1G73DB0
YK0/CMA
L (2Rx8)
1G x 8 * 18pcs
4Gb
1G x 72
8GB
M392B1G70DB0
YK0/CMA
M (1Rx4)
512M x 4 * 18pcs
2G x 72
16GB
M392B2G70DM0
YK0/CMA
N (2Rx4)
4G x 72
32GB
M392B4G70DE0
YH9
U (4Rx4)
NOTE
4.4 204Pin DDR3 ECC SODIMM
204Pin DDR3 ECC SODIMM
Comp.
Version
Internal
Banks
Rank
PKG
Height
Avail.
E-die
8
1
78 ball
FBGA
30mm
MP
4Gb
Q-die
8
2
78 ball
FBGA
30mm
EOL
Q1’16
4Gb
E-die
8
2
78 ball
FBGA
30mm
MP
Internal
Banks
Rank
PKG
Height
Avail.
Org.
Density
Part Number
Speed
Raw Card
Composition
512M x 64
4GB
M474B5173EB0
YK0
C (1Rx8)
512M x 8 * 9pcs
4Gb
1G x 64
8GB
M474B1G73QH0
YK0/CMA
D (2Rx8)
512M x 8 * 18pcs
1G x 64
8GB
M474B1G73EB0
YK0
D (2Rx8)
512M x 8 * 18pcs
NOTE
4.5 204Pin DDR3 Non ECC SODIMM
204Pin DDR3 Non ECC SODIMM
Comp.
Version
Org.
Density
Part Number
Speed
Raw Card
Composition
256M x 64
2GB
M471B5674QB0
YK0
C (1Rx16)
256M x 16 * 8 pcs
4Gb
Q-die
8
1
96 ball
FBGA
30mm
EOL
Q1’16
256M x 64
2GB
M471B5674EB0
YK0/YMA
C (1Rx16)
256M x 16 * 8 pcs
4Gb
E-die
8
1
96 ball
FBGA
30mm
MP
512M x 64
4GB
M471B5173QH0
YK0
B (1Rx8)
512M x 8 * 8 pcs
4Gb
Q-die
8
1
78 ball
FBGA
30mm
EOL
Q1’16
512M x 64
4GB
M471B5173DB0
YK0
B (1Rx8)
512M x 8 * 8 pcs
4Gb
D-die
8
1
78 ball
FBGA
30mm
MP
512M x 64
4GB
M471B5173EB0
YK0/YMA
B (1Rx8)
512M x 8 * 8 pcs
4Gb
E-die
8
1
78 ball
FBGA
30mm
MP
1G x 64
8GB
M471B1G73QH0
YK0
F (2Rx8)
512M x 8 * 16 pcs
4Gb
Q-die
8
2
78 ball
FBGA
30mm
EOL
Q1’16
1G x 64
8GB
M471B1G73DB0
YK0
F (2Rx8)
512M x 8 * 16 pcs
4Gb
D-die
8
2
78 ball
FBGA
30mm
MP
1G x 64
8GB
M471B1G73EB0
YK0/YMA
F (2Rx8)
512M x 8 * 16 pcs
4Gb
E-die
8
2
78 ball
FBGA
30mm
MP
-6-
NOTE
Dec. 2015
Product Guide
DDR3 SDRAM Memory
4.6 240Pin DDR3 ECC UDIMM
240Pin DDR3 ECC UDIMM
Composition
Comp.
Version
Internal
Banks
Rank
PKG
Height
Avail.
E-die
8
1
78 ball
FBGA
30mm
MP
4Gb
Q-die
8
2
78 ball
FBGA
30mm
EOL
Q1’16
4Gb
E-die
8
2
78 ball
FBGA
30mm
MP
Internal
Banks
Rank
PKG
Height
Avail.
Org.
Density
Part Number
Speed
Raw Card
512M x 64
4GB
M391B5173EB0
YK0/CMA
D (1Rx8)
512M x 8 * 9 pcs
4Gb
1G x 64
8GB
M391B1G73QH0
YK0/CMA
E (2Rx8)
512M x 8 * 18 pcs
1G x 64
8GB
M391B1G73EB0
YK0/CMA
E (2Rx8)
512M x 8 * 18 pcs
NOTE
4.7 240Pin DDR3 Non ECC UDIMM
240Pin DDR3 Non ECC UDIMM
Composition
Comp.
Version
Org.
Density
Part Number
Speed
Raw Card
256M x 64
2GB
M378B5773QB0
CK0/CMA
A (1Rx8)
256M x 8 * 8 pcs
2Gb
Q-die
8
1
78ball
FBGA
30mm
EOL
Q1’16
256M x 64
2GB
M378B5674EB0
YK0/YMA
C (1Rx16)
256M x 16 * 8 pcs
4Gb
E-die
8
1
96ball
FBGA
30mm
MP
512M x 64
4GB
M378B5173QH0
CK0/CMA
A (1Rx8)
512M x 8 * 8 pcs
4Gb
Q-die
8
1
78ball
FBGA
30mm
EOL
Q1’16
512M x 64
4GB
M378B5173QH0
YK0/YMA
A (1Rx8)
512M x 8 * 8 pcs
4Gb
Q-die
8
1
78ball
FBGA
30mm
EOL
Q1’16
512M x 64
4GB
M378B5173DB0
CK0/CMA
A (1Rx8)
512M x 8 * 8 pcs
4Gb
D-die
8
1
78ball
FBGA
30mm
MP
512M x 64
4GB
M378B5173EB0
CK0/CMA
A (1Rx8)
512M x 8 * 8 pcs
4Gb
E-die
8
1
78ball
FBGA
30mm
MP
512M x 64
4GB
M378B5173EB0
YK0/YMA
A (1Rx8)
512M x 8 * 8 pcs
4Gb
E-die
8
1
78ball
FBGA
30mm
MP
1G x 64
8GB
M378B1G73QH0
CK0/CMA
B (2Rx8)
512M x 8 * 16 pcs
4Gb
Q-die
8
2
78ball
FBGA
30mm
EOL
Q1’16
1G x 64
8GB
M378B1G73QH0
YK0/YMA
B (2Rx8)
512M x 8 * 16 pcs
4Gb
Q-die
8
2
78ball
FBGA
30mm
EOL
Q1’16
1G x 64
8GB
M378B1G73DB0
CK0/CMA
B (2Rx8)
512M x 8 * 16 pcs
4Gb
D-die
8
2
78ball
FBGA
30mm
MP
1G x 64
8GB
M378B1G73EB0
CK0/CMA
B (2Rx8)
512M x 8 * 16 pcs
4Gb
E-die
8
2
78ball
FBGA
30mm
MP
1G x 64
8GB
M378B1G73EB0
YK0/YMA
B (2Rx8)
512M x 8 * 16 pcs
4Gb
E-die
8
2
78ball
FBGA
30mm
MP
-7-
NOTE
Dec. 2015
Product Guide
DDR3 SDRAM Memory
5. RDIMM RCD Information
5.1 RCD Identification in JEDEC Description in Module Label
5.2 Label Example
4GB 2Rx8 PC3 - 12800R - 11 - 11 - B1 - P2
Made in Korea
M393B5270DH0-CK0
1102
5.3 RCD Information
- Example
PKG
2Gb Q-die
4Gb D-die
4Gb Q-die
4Gb E-die
JEDEC Description
RCD Vendor
RCD Version(Rev.)
IDT
B1
D3
Inphi
XV-GS02
P2
IDT
A1
D4
Inphi
UV-GS02
P3
(Example - 4GB 2Rx8 PC3(L)1 - 12800R - 11 - 11 - B1 - XX)
* NOTE
1) PC3L is used for 1.35V
2) RCD information is subject to change.
-8-
Dec. 2015
Product Guide
DDR3 SDRAM Memory
6. LRDIMM Memory Buffer Information
6.1 Label Example
32GB 4Rx4 PC3L - 10600L - 09 - 11 - C0
Made in Korea
M386B4G70BM0-YH90 1102
6.2 Memory Buffer Information
- Example
Voltage
Vendor
Revision
Module P/N
JEDEC Description On Label
Inphi
iMB02-GS02A
M386B4G70BM0-YH901
32GB 4Rx4 PC3L-10600L-09-11-C0
Montage
MB C0
M386B4G70BM0-YH921
32GB 4Rx4 PC3L-10600L-09-11-C0
Inphi
iMB02-GS02A
M386B4G70BM0-CMA31
32GB 4Rx4 PC3-14900L-13-11-C0
IDT
A2
M386B4G70BM0-CMA11
32GB 4Rx4 PC3-14900L-13-11-C0
Montage
MB C1
M386B4G70BM0-CMA41
32GB 4Rx4 PC3-14900L-13-11-C0
1.35V
1.5V
* NOTE
1) The 16th digit refers memory buffer vendor and revision.
0: Inphi iMB02-GS02A
1: IDT A2
2: Montage MB C0
3: Inphi iMB02-GS02B
4: Montage MB C1
2) Memory buffer information is subject to change.
-9-
Dec. 2015
Product Guide
DDR3 SDRAM Memory
7. Package Dimension
A
0.80 x 8 = 6.40
0.80 1.60
#A1 INDEX MARK
3.20
#A1
0.80 x12 = 9.60
4.80
0.80
0.80
(Datum B)
11.00  0.10
9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
7.50 0.10
B
11.00  0.10
(Datum A)
0.50  0.05
7.50 0.10
0.10MAX
78Ball FBGA for 2Gb Q-die (x4/x8) / 4Gb D-die (x4/x8) / 4Gb E-die (x4/8)
0.35 0.05
(0.95)
78 - 0.45 Solder ball
(Post Reflow 0.05  0.05)
MOLDING AREA
1.10 0.10
(1.90)
0.2 M A B
BOTTOM VIEW
TOP VIEW
96Ball FBGA for 2Gb Q-die (x16) / 4Gb D-die (x16) / 4Gb E-die (x16)
7.50 0.10
0.10MAX
A
0.80 x 8 6.40
0.80
9 8
#A1
7.50 0.10
13.30  0.10
13.30  0.10
0.80 x15 = 12.00
6.00
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
96 - 0.48 Solder ball
(Post Reflow 0.50  0.05)
B
7 6 5 4 3 2 1
0.40
(Datum B)
3.20
0.80
(Datum A)
#A1 INDEX MARK
1.60
(0.30)
(0.60)
0.37 0.05
MOLDING AREA
0.2 M A B
1.10 0.10
TOP VIEW
BOTTOM VIEW
- 10 -
Dec. 2015
Product Guide
DDR3 SDRAM Memory
78Ball FBGA for 4Gb Q-die (x4/8)
10.00  0.10
0.10MAX
A
0.80 x 8 = 6.40
3.20
#A1 INDEX MARK
1.60
0.80
11.00 0.10
0.80 x12 = 9.60
0.80
4.80
A
B
C
D
E
F
G
H
J
K
L
M
N
10.00 0.10
0.80
(Datum B)
#A1
B
9 8 7 6 5 4 3 2 1
11.00 0.10
(Datum A)
78 - 0.45 Solder ball
(Post Reflow 0.50  0.05)
(0.95)
0.2 M A B
0.35 0.05
MOLDING AREA
1.10 0.10
(1.90)
BOTTOM VIEW
TOP VIEW
96Ball FBGA for 4Gb Q-die (x16)
10.00  0.10
0.10MAX
A
0.80 x 8 = 6.40
#A1 INDEX MARK
1.60
B
96 - 0.45 Solder ball
(Post Reflow 0.50  0.05)
0.2 M A B
0.80
0.40
6.00
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
0.80 x15 = 12.00
9 8 7 6 5 4 3 2 1
(Datum B)
10.00 0.10
#A1
3.20
13.30 0.10
0.80
13.30 0.10
(Datum A)
(0.95)
0.35 0.05
MOLDING AREA
1.10 0.10
(1.90)
BOTTOM VIEW
TOP VIEW
- 11 -
Dec. 2015
Product Guide
DDR3 SDRAM Memory
8. Module Dimension
x72 240pin DDR3 SDRAM SDRAM ECC UDIMM
x64 240pin DDR3 SDRAM SDRAM Non ECC UDIMM
Units : Millimeters
128.95
ECC
SPD
17.30
9.50
N/A
(for x64)
2.30
(for x72)
30.00 ± 0.15
(4X)3.00 ± 0.1
133.35 ± 0.15
(2)
2.50
54.675
A
B
47.00
Max 4.0
71.00
N/A
(for x64)
ECC
(for x72)
2.50 ± 0.20
1.270 ± 0.10
5.00
0.80 ± 0.05
3.80
0.2 ± 0.15
1.50±0.10
1.00
2.50
Detail A
Detail B
- 12 -
2x 2.10 ± 0.15
Dec. 2015
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM RDIMM
Units : Millimeters
C
128.95
32.40
18.93
9.74
Max 4.0
54.675
2.30
2.50
A
1.0 max
B
47.00
1.27 ± 0.10
2.50 ± 0.20
71.00
5.00
0.80 ± 0.05
3.80
0.2 ± 0.15
1.00
10.9
R
1.50±0.10
Detail A
Detail B
Detail C
2x 2.10 ± 0.15
Register
2.50
17.30
Register
30.00 ± 0.15
18.92
0.
50
10.9
9.50
9.76
(2X)3.00
133.35 ± 0.15
Address, Command and Control lines
- 13 -
0.4
Dec. 2015
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM LRDIMM
Units : Millimeters
Max 4.8
2.30
2.50
17.30
9.50
30.35 ± 0.15
C
(2X)3.00
133.35 ± 0.15
54.675
B
A
47.00
2.50 ± 0.20
71.00
0.80 ± 0.05
9.9
3.80
0.6
5.00
0.2 ± 0.15
0.
50
1.50±0.10
R
1.00
2.50
Detail C
VTT
VTT
VTT
VTT
VTT
Detail B
VTT
Detail A
1.27
VTT
VTT
MB
Address, Command and Control lines
- 14 -
Dec. 2015
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM RDIMM Heat Spreader Design (DDP)
x72 240pin DDR3 SDRAM LRDIMM Heat Spreader Design (DDP)
1. FRONT PART
Outside
R0.2
4.65± 0.12
2
2 ± 0.1
2.6 ± 0.2
2
0.4
0.15
1.3
Green Line : TIM Attatch Line
7.45
Reg. pedestal line
80.78
119.29
128.5
2. BACK PART
Outside
Green Line : TIM Attatch Line
- 15 -
1.3
1
0.
Inside
Inside
R
127 ± 0.12
25.6 ± 0.15
31.4
23.6 ± 0.15
11.9
29.77
1
25.6 ± 0.15
0.65 ± 0.2
130.45 ± 0.15
9.26
1+0/ -0.3
133.15 ± 0.2
Dec. 2015
Product Guide
DDR3 SDRAM Memory
3. CLIP PART
39.3 ± 0.2
Upper Bending
Tilting Gap
29.77
6.3± 0.12
5
1.
R
7.3 ± 0.1
44.4
0.1 ~ 0.3
0.5
4. DDR3 RDIMM ASS’Y View
Reference thickness total (Maximum) : 7.55mm (With Clip thickness)
3.77
1.27
133.15
7.3 ± 0.1
19 ± 0.12
19 ± 0.12
39.3 ± 0.2
D
text mark ’D’
punch press_stamp
- 16 -
Clip open size
2.6~3.8
Dec. 2015
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM VLP RDIMM
Units : Millimeters
133.35 ± 0.15
128.95
Max 4.0
Register
18.75 ± 0.15
C
1.0 max
54.675
A
B
1.27 ± 0.10
47.00
71.00
2.50 ± 0.20
SPD/TS
0.80 ± 0.05
9.9
3.80
0.6
5.00
0.2 ± 0.15
0.
50
1.50±0.10
Detail B
Detail C
VTT
Register
VTT
Detail A
R
1.00
2.50
VTT
VTT
SPD/TS
Address, Command and Control lines
- 17 -
Dec. 2015
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM VLP RDIMM Heat Spreader Design (DDP, QDP)
1. FRONT PART
Outside
130.45
20.82
35.98
20.82
8.69
14.3
0.4
8.69
Driver
IC(DP:0.18mm)
Inside
Driver
IC(DP:0.18mm)
2. BACK PART
Outside
Driver
IC(DP:0.18mm)
Inside
Driver
IC(DP:0.18mm)
- 18 -
Dec. 2015
Product Guide
DDR3 SDRAM Memory
3. CLIP PART
35.82
9.16 ± 0.12
7.2 ± 0.1
9.16
9.16 ± 0.12
7.2 ± 0.1
Clip open size
3.0~4.3
SIDE-L
0.1
FRONT
SIDE-R
4. ASS’Y VIEW
7.55
Reference thickness total (Maximum) : 7.55 (With Clip thickness)
TIM Thickness 0.25
- 19 -
Dec. 2015
Product Guide
DDR3 SDRAM Memory
Units : Millimeters
x72 204 pin DDR3 SDRAM ECC SODIMM
x64 204pin DDR3 SDRAM Non ECC SODIMM
67.60 ± 0.13
63.60
6
20.00
SPD
30.00 ± 0.13
Max 3.8
1.00 ± 0.10
24.80
A
21.00
B
39.00
2X 1.80
0.10 M C A B
(OPTIONAL HOLES)
2X 4.00 ± 0.10
0.10 M C A B
0.60
1.65
0.45 ± 0.03
4.00 ± 0.10
2.55
1.00 ± 0.10
0.25 MAX
Detail A
Detail B
- 20 -
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