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Nov. 2015
DDR4 SDRAM Memory
Product Guide
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION
AND SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of
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intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.
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or any military or defense application, or any governmental procurement to which special terms or
provisions may apply.
For updates or additional information about Samsung products, contact your nearest Samsung
office.
All brand names, trademarks and registered trademarks belong to their respective owners.
-1-
Nov. 2015
Product Guide
DDR4 SDRAM Memory
1. DDR4 SDRAM MEMORY ORDERING INFORMATION
1
2
3
4
5
6
7
8
9
10
11
K 4 A X X X X X X X - X X X X
Speed
SAMSUNG Memory
DRAM
Temp & Power
DRAM Type
Package Type
Density
Revision
Interface (VDD, VDDQ)
Bit Organization
# of Internal Banks
1. SAMSUNG Memory : K
8. Revision
M
A
B
C
D
E
F
G
2. DRAM : 4
3. DRAM Type
A : DDR4 SDRAM
4. Density
4G : 4Gb
8G : 8Gb
AG : 16Gb
BG : 32Gb
9. Package Type
B
M
2
4
5. Bit Organization
04 : x 4
08 : x 8
16 : x16
6. # of Internal Banks
W : POD (1.2V, 1.2V)
:
:
:
:
FBGA (Halogen-free & Lead-free, Flip Chip)
FBGA (Halogen-free & Lead-free, DDP)
FBGA (Halogen-free & Lead-free, TSV 2High)
FBGA (Halogen-free & Lead-free, TSV 4High)
10. Temp & Power
C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
5 : 16 Banks
7. Interface ( VDD, VDDQ)
: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
: 6th Gen.
: 7th Gen.
: 8th Gen.
11. Speed
PB : DDR4-2133
RC : DDR4-2400
TD : DDR4-2666
RB : DDR4-2133
TC : DDR4-2400
WD : DDR4-2666
-2-
(1066MHz @ CL=15, tRCD=15, tRP=15)
(1200MHz @ CL=17, tRCD=17, tRP=17)
(1333MHz @ CL=19, tRCD=19, tRP=19)
(1066MHz @ CL=17, tRCD=15, tRP=15)
(1200MHz @ CL=19, tRCD=17, tRP=17)
(1333MHz @ CL=22, tRCD=19, tRP=19)
Nov. 2015
Product Guide
DDR4 SDRAM Memory
2. DDR4 SDRAM Component Product Guide
Density
Banks
4Gb D-die
16Banks
(4Bank Groups)
8Gb B-die
4Gb E-die
16Banks
(4Bank Groups)
16Banks
(4Bank Groups)
Part Number
Package & Power,
Temp. & Speed
Org.
K4A4G045WD
BCPB/RC
1G x 4
K4A4G085WD
BCPB/RC
512M x 8
K4A4G165WD
BCPB/RC
256M x 16
K4A8G045WB
BCPB/RC/TD1)
2G x 4
K4A8G085WB
BCPB/RC/TD1)
1G x 8
K4A8G165WB
BCPB/RC/TD1)
512M x 16
K4A4G045WE
BCPB/RC/TD1)
1G x 4
K4A4G085WE
BCPB/RC/TD1)
512M x 8
K4A4G165WE
BCPB/RC/TD1)
256M x 16
NOTE:
1) Need to contact SAMSUNG for TD (2666Mbps) availability
-3-
VDD Voltage
PKG
1.2V
78 ball FBGA
1.2V
96 ball FBGA
1.2V
78 ball FBGA
1.2V
96 ball FBGA
1.2V
78 ball FBGA
1.2V
96 ball FBGA
Avail.
MP
MP
MP
’16 1Q
NOTE
Nov. 2015
Product Guide
DDR4 SDRAM Memory
3. DDR4 SDRAM Module Ordering Information
1
2
3
4
5
6
7
8
9
10
11
12
13
M X X X A X X X X X X X - X X XX
Memory Module
DIMM Type
Memory buffer
Data bits
Speed
DRAM Component Type
Temp & Power
Depth
PCB Revision
Package
# of Banks in Comp. & Interface
Component Revision
Bit Organization
1. Memory Module : M
8. Component Revision
M : 1st Gen.
B : 3rd Gen.
D : 5th Gen.
F : 7th Gen.
2. DIMM Type
3 : DIMM
4 : SODIMM
3. Data Bits
71:
74 :
78:
86 :
91:
92:
93 :
x64
x72
x64
x72
x72
x72
x72
260pin Unbuffered SODIMM
260pin ECC Unbuffered SODIMM
288pin Unbuffered DIMM
288pin Load Reduced DIMM
288pin ECC Unbuffered DIMM
288pin VLP Registered DIMM
288pin Registered DIMM
A
C
E
G
:
:
:
:
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
9. Package
B : FBGA (Halogen-free & Lead-free, Flip Chip)
M : FBGA (Halogen-free & Lead-free, DDP)
2 : FBGA (Halogen-free & Lead-free, 2H TSV)
4 : FBGA (Halogen-free & Lead-free, 4H TSV)
10. PCB Revision
0 : None
2 : 2nd Rev.
4 : 4th Rev.
4. DRAM Component Type
1 : 1st Rev.
3 : 3rd Rev.
A : DDR4 SDRAM (1.2V VDD)
11. Temp & Power
C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
5. Depth
56
51
1G
2G
4G
8G
: 256M
: 512M
: 1G
: 2G
: 4G
: 8G
AG
1K
2K
4K
8K
AK
: 16G
: 1G (for 8Gb)
: 2G (for 8Gb)
: 4G (for 8Gb)
: 8G (for 8Gb)
: 16G
6. # of Banks in comp. & Interface
12. Speed
PB : DDR4-2133
RC : DDR4-2400
TD : DDR4-2666
RB : DDR4-2133
TC : DDR4-2400
WD : DDR4-2666
4 : 16Banks & POD-1.2V
7. Bit Organization
0 : x4
3 : x8
4 : x 16
-4-
(1066MHz @ CL=15, tRCD=15, tRP=15)
(1200MHz @ CL=17, tRCD=17, tRP=17)
(1333MHz @ CL=19, tRCD=19, tRP=19)
(1066MHz @ CL=17, tRCD=15, tRP=15)
(1200MHz @ CL=19, tRCD=17, tRP=17)
(1333MHz @ CL=22, tRCD=19, tRP=19)
Nov. 2015
Product Guide
DDR4 SDRAM Memory
4. DDR4 SDRAM Module Product Guide
4.1 288Pin DDR4 Registered DIMM
288Pin DDR4 Registered DIMM
Org.
Density
Part Number
Temp &
Power &
Speed
512G x 72
4GB
M393A5143DB0
CPB
D (1Rx8)
512G x 72
4GB
M393A5143DB0
CRC
1G x72
8GB
M393A1G40DB0
1G x72
8GB
1G x72
Comp.
Version
Internal
Banks
Rank
PKG
Height
Avail.
1G x8 * 9pcs
4Gb D-die
16
1
78ball
FBGA
31.25mm
MP
D (1Rx8)
1G x8 * 9pcs
4Gb D-die
16
1
78ball
FBGA
31.25mm
MP
’15 4Q
CPB
C (1Rx4)
1G x4 * 18pcs
4Gb D-die
16
1
78ball
FBGA
31.25mm
MP
M393A1G40DB1
CRC
C (1Rx4)
1G x4 * 18pcs
4Gb D-die
16
1
78ball
FBGA
31.25mm
MP
’15 4Q
8GB
M393A1G43DB0
CPB
E (2Rx8)
512M x8 * 18pcs
4Gb D-die
16
2
78ball
FBGA
31.25mm
MP
1G x72
8GB
M393A1G43DB1
CRC
E (2Rx8)
512M x8 * 18pcs
4Gb D-die
16
2
78ball
FBGA
31.25mm
MP
’15 4Q
1G x 72
8GB
M393A1G40EB1
CPB
C (1Rx4)
1G x4 * 18pcs
4Gb E-die
16
1
78ball
FBGA
31.25mm
MP
’16 1Q
1G x 72
8GB
M393A1G40EB1
CRC
C (1Rx4)
1G x4 * 18pcs
4Gb E-die
16
1
78ball
FBGA
31.25mm
MP
’16 1Q
1G x 72
8GB
M393A1G40EB1
CTD
C (1Rx4)
1G x4 * 18pcs
4Gb E-die
16
1
78ball
FBGA
31.25mm
ES
’15 3Q
1G x 72
8GB
M393A1G43EB1
CPB
E (2Rx8)
512M x8 * 18pcs
4Gb E-die
16
2
78ball
FBGA
31.25mm
MP
’16 1Q
1G x 72
8GB
M393A1G43EB1
CRC
E (2Rx8)
512M x8 * 18pcs
4Gb E-die
16
2
78ball
FBGA
31.25mm
MP
’16 1Q
1G x 72
8GB
M393A1G43EB1
CTD
E (2Rx8)
512M x8 * 18pcs
4Gb E-die
16
2
78ball
FBGA
31.25mm
ES
’15 3Q
1G x 72
8GB
M393A1K43BB0
CPB
D (1Rx8)
512M x8 * 9pcs
8Gb B-die
16
1
78ball
FBGA
31.25mm
MP
1G x 72
8GB
M393A1K43BB0
CRC
D (1Rx8)
512M x8 * 9pcs
8Gb B-die
16
1
78ball
FBGA
31.25mm
MP
1G x 72
8GB
M393A1K43BB0
CTD
D (1Rx8)
512M x8 * 9pcs
8Gb B-die
16
1
78ball
FBGA
31.25mm
ES
’15 3Q
2G x72
16GB
M393A2G40DB0
CPB
A (2Rx4)
1G x4 * 36pcs
4Gb D-die
16
2
78ball
FBGA
31.25mm
MP
2G x72
16GB
M393A2G40DB1
CRC
A (2Rx4)
1G x4 * 36pcs
4Gb D-die
16
2
78ball
FBGA
31.25mm
MP
’15 4Q
2G x72
16GB
M393A2G40EB1
CPB
A (2Rx4)
1G x4 * 36pcs
4Gb E-die
16
2
78ball
FBGA
31.25mm
MP
’16 1Q
2G x72
16GB
M393A2G40EB1
CRC
A (2Rx4)
1G x4 * 36pcs
4Gb E-die
16
2
78ball
FBGA
31.25mm
MP
’16 1Q
2G x72
16GB
M393A2G40EB1
CTD
A (2Rx4)
1G x4 * 36pcs
4Gb E-die
16
2
78ball
FBGA
31.25mm
ES
’15 3Q
2G x72
16GB
M393A2K40BB0
CPB
C (1Rx4)
2G x4 * 18pcs
8Gb B-die
16
1
78ball
FBGA
31.25mm
MP
2G x72
16GB
M393A2K40BB1
CRC
C (1Rx4)
2G x4 * 18pcs
8Gb B-die
16
1
78ball
FBGA
31.25mm
MP
2G x72
16GB
M393A2K40BB1
CTD
C (1Rx4)
2G x4 * 18pcs
8Gb B-die
16
1
78ball
FBGA
31.25mm
ES
’15 3Q
2G x72
16GB
M393A2K43BB1
CPB
E (2Rx8)
1G x8 * 18pcs
8Gb B-die
16
2
78ball
FBGA
31.25mm
MP
2G x72
16GB
M393A2K43BB1
CRC
E (2Rx8)
1G x8 * 18pcs
8Gb B-die
16
2
78ball
FBGA
31.25mm
MP
Raw Card
Composition
-5-
NOTE
Nov. 2015
Product Guide
DDR4 SDRAM Memory
2G x72
16GB
M393A2K43BB1
CTD
E (2Rx8)
1G x8 * 18pcs
8Gb B-die
16
2
78ball
FBGA
31.25mm
ES
’15 3Q
4G x72
32GB
M393A4K40BB0
CPB
A (2Rx4)
2G x4 * 36pcs
8Gb B-die
16
2
78ball
FBGA
31.25mm
MP
4G x72
32GB
M393A4K40BB1
CRC
A (2Rx4)
2G x4 * 36pcs
8Gb B-die
16
2
78ball
FBGA
31.25mm
MP
4G x72
32GB
M393A4K40BB1
CTD
A (2Rx4)
2G x4 * 36pcs
8Gb B-die
16
2
78ball
FBGA
31.25mm
ES
’15 3Q
8G x72
64GB
M393A8G40D40
CRB
A (8Rx4)
4H TSV
x4 * 36pcs
4G
4Gb D-die
16
8
78ball
FBGA
31.25mm
MP
8G x72
64GB
M393A8K40B21
CRB
A (4Rx4)
2H TSV
x4 * 36pcs
4G
8Gb B-die
16
4
78ball
FBGA
31.25mm
CS
’15 3Q
8G x72
64GB
M393A8K40B21
CTC
A (4Rx4)
2H TSV
x4 * 36pcs
4G
8Gb B-die
16
4
78ball
FBGA
31.25mm
CS
’15 3Q
8G x 72
64GB
M393A8K40B21
CWD
A (4Rx4)
2H TSV
x4 * 36pcs
4G
8Gb B-die
16
4
78ball
FBGA
31.25mm
TBD
16G x 72 128GB M393AAK40B41
CRB
A (8Rx4)
4H TSV
x4 * 36pcs
8G
8Gb B-die
16
8
78ball
FBGA
31.25mm
CS
’15 4Q
16G x 72 128GB M393AAK40B41
CTC
A (8Rx4)
4H TSV
x4 * 36pcs
8G
8Gb B-die
16
8
78ball
FBGA
31.25mm
CS
’15 4Q
16G x 72 128GB M393AAK40B41
CWD
A (8Rx4)
4H TSV
x4 * 36pcs
8G
8Gb B-die
16
8
78ball
FBGA
31.25mm
TBD
4.2 288Pin DDR4 Load Reduced DIMM
288Pin DDR4 Load Reduced DIMM
Org.
Density
Part Number
Temp &
Power &
Speed
Raw Card
Composition
Comp.
Version
Internal
Banks
Rank
PKG
Height
Avail.
4G x72
32GB M386A4G40DM0
CPB
D (4Rx4)
DDP
x4 * 36pcs 4Gb D-die
2G
16
4
78ball
FBGA
31.25mm
MP
4G x72
32GB M386A4G40DM1
CRC
D (4Rx4)
DDP
x4 * 36pcs 4Gb D-die
2G
16
4
78ball
FBGA
31.25mm
MP
’15 4Q
4G x72
32GB
M386A4K40BB0
CRC
A (2Rx4)
2G x4 * 36pcs 8Gb B-die
16
2
78ball
FBGA
31.25mm
MP
8G x72
64GB
M386A8K40BM1
CPB
D (4Rx4)
DDP
x4 * 36pcs 8Gb B-die
4G
16
4
78ball
FBGA
31.25mm
MP
8G x72
64GB
M386A8K40BM1
CRC
D (4Rx4)
DDP
x4 * 36pcs 8Gb B-die
4G
16
4
78ball
FBGA
31.25mm
MP
8G x72
64GB
TBD
CTD
D (4Rx4)
DDP
x4 * 36pcs 8Gb B-die
4G
16
4
78ball
FBGA
31.25mm
TBD
16G x72 128GB M386AAK40B40
CRB
A (8Rx4)
4H TSV
x4 * 36pcs 8Gb B-die
8G
16
8
78ball
FBGA
31.25mm
CS
’15 4Q
16G x72 128GB M386AAK40B40
CTC
A (8Rx4)
4H TSV
x4 * 36pcs 8Gb B-die
8G
16
8
78ball
FBGA
31.25mm
CS
’15 4Q
16G x72 128GB M386AAK40B40
CWD
A (8Rx4)
4H TSV
x4 * 36pcs 8Gb B-die
8G
16
8
78ball
FBGA
31.25mm
TBD
-6-
NOTE
Nov. 2015
Product Guide
DDR4 SDRAM Memory
4.3 288Pin DDR4 VLP Registered DIMM
288Pin DDR4 VLP Registered DIMM
Org.
Density
Part Number
Temp &
Power &
Speed
Raw Card
Internal
Banks
Rank
PKG
Height
Avail.
16
2
78ball
FBGA
18.75mm
MP
18pcs 8Gb B-die
16
2
78ball
FBGA
18.75mm
MP
18pcs 8Gb B-die
16
2
78ball
FBGA
18.75mm
MP
Composition
Comp.
Version
DDP
x4 * 18pcs 4Gb D-die
2G
2G x72
16GB M392A2G40DM0
CPB
J (2Rx4)
2G x72
16GB
M392A2K43BB0
CPB
H (2Rx8)
1G x8
2G x72
16GB
M392A2K43BB0
CRC
H(2Rx8)
1G x8
4G x72
32GB
M392A4K40BM0
CPB
J (2Rx4)
DDP
*
x4
18pcs 8Gb B-die
4G
16
2
78ball
FBGA
18.75mm
MP
4G x72
32GB
M392A4K40BM0
CRC
J (2Rx4)
DDP
*
x4
18pcs 8Gb B-die
4G
16
2
78ball
FBGA
18.75mm
MP
Internal
Banks
Rank
PKG
Height
Avail.
*
*
NOTE
4.4 260Pin DDR4 ECC SODIMM
260Pin DDR4 ECC SODIMM
Org.
Density
Part Number
Temp &
Power &
Speed
1G x72
8GB
M474A1G43DB0
CPB
G (2Rx8) 512M x8 * 18pcs 4Gb D-die
16
2
78ball
FBGA
30mm
MP
1G x72
8GB
M474A1G43DB1
CRC
G (2Rx8) 512M x8 * 18pcs 4Gb D-die
16
2
78ball
FBGA
30mm
MP
’15 4Q
1G x72
8GB
M474A1G43EB1
CPB
G (2Rx8) 512M x8 * 18pcs 4Gb E-die
16
2
78ball
FBGA
30mm
MP
’16 1Q
1G x72
8GB
M474A1G43EB1
CRC
G (2Rx8) 512M x8 * 18pcs 4Gb E-die
16
2
78ball
FBGA
30mm
MP
’16 1Q
1G x72
8GB
M474A1G43EB1
CTD
G (2Rx8) 512M x8 * 18pcs 4Gb E-die
16
2
78ball
FBGA
30mm
TBD
2G x72
16GB
M474A2K43BB1
CPB
G (2Rx8)
1G x8 * 18pcs 8Gb B-die
16
2
78ball
FBGA
30mm
MP
2G x72
16GB
M474A2K43BB1
CRC
G (2Rx8)
1G x8 * 18pcs 8Gb B-die
16
2
78ball
FBGA
30mm
MP
2G x72
16GB
M474A2K43BB1
CTD
G (2Rx8)
1G x8 * 18pcs 8Gb B-die
16
2
78ball
FBGA
30mm
TBD
Raw Card
Composition
-7-
Comp.
Version
NOTE
Nov. 2015
Product Guide
DDR4 SDRAM Memory
4.5 260Pin DDR4 Non ECC SODIMM
260Pin DDR4 Non ECC SODIMM
Org.
Density
Part Number
Temp &
Power &
Speed
256M x64
2GB
M471A5644EB0
CPB
C (1Rx16) 512M x16
256M x64
2GB
M471A5644EB0
CRC
C (1Rx16) 512M x16
512M x64
4GB
M471A5143DB0
512M x64
4GB
512M x64
Comp.
Version
Internal
Banks
Rank
PKG
Height
Avail.
4pcs
4Gb E-die
16
1
96ball
FBGA
30mm
CS
4pcs
4Gb E-die
16
1
96ball
FBGA
30mm
CS
CPB
A (1Rx8) 512M x8 * 8pcs
4Gb D-die
16
1
78ball
FBGA
30mm
MP
M471A5143EB0
CPB
A (1Rx8) 512M x8
8pcs
4Gb E-die
16
1
78ball
FBGA
30mm
MP
4GB
M471A5143EB1
CRC
A (1Rx8) 512M x8
8pcs
4Gb E-die
16
1
78ball
FBGA
30mm
CS
’16 1Q
1G x64
8GB
M471A1G43DB0
CPB
E (2Rx8) 512M x8 * 16pcs 4Gb D-die
16
2
78ball
FBGA
30mm
MP
1G x 64
8GB
M471A1G43EB1
CPB
E (2Rx8) 512M x8
16pcs 4Gb E-die
16
2
78ball
FBGA
30mm
CS
1G x 64
8GB
M471A1G43EB1
CRC
E (2Rx8) 512M x8
16pcs 4Gb E-die
16
2
78ball
FBGA
30mm
CS
1G x 64
8GB
M471A1K43BB0
CPB
A (1Rx8)
1G x8
8pcs
8Gb B-die
16
1
78ball
FBGA
30mm
MP
1G x 64
8GB
M471A1K43BB1
CRC
A (1Rx8)
1G x8
8pcs
8Gb B-die
16
1
78ball
FBGA
30mm
CS
’16 1Q
2G x 64
16GB
M471A2K43BB1
CPB
E (2Rx8)
1G x8
16pcs 8Gb B-die
16
2
78ball
FBGA
30mm
MP
2G x 64
16GB
M471A2K43BB1
CRC
E (2Rx8)
1G x8
16pcs 8Gb B-die
16
2
78ball
FBGA
30mm
CS
Raw Card
Composition
*
*
*
*
*
*
*
*
*
*
-8-
NOTE
Nov. 2015
Product Guide
DDR4 SDRAM Memory
4.6 288Pin DDR4 ECC UDIMM
288Pin DDR4 ECC UDIMM
Org.
Density
Part Number
Temp &
Power &
Speed
512M x72
4GB
M391A5143EB1
CPB
D (1Rx8) 512M x8
512M x72
4GB
M391A5143EB1
CRC
D (1Rx8) 512M x8
512M x72
4GB
M391A5143EB1
CTD
D (1Rx8) 512M x8
1G x72
8GB
M391A1G43DB0
CPB
E (2Rx8) 512M x8
1G x72
8GB
M391A1G43DB1
CRC
E (2Rx8) 512M x8
1G x72
8GB
M391A1G43EB1
CTD
E (2Rx8) 512M x8
1G x72
8GB
M391A1G43EB1
CPB
E (2Rx8) 512M x8
1G x72
8GB
M391A1G43EB1
CRC
E (2Rx8) 512M x8
2G x72
16GB
M391A2K43BB1
CPB
E (2Rx8)
1G x8
2G x72
16GB
M391A2K43BB1
CRC
E (2Rx8)
1G x8
2G x72
16GB
M391A2K43BB1
CTD
E (2Rx8)
1G x8
Raw Card
Comp.
Version
Internal
Banks
Rank
PKG
Height
Avail.
9pcs
4Gb E-die
16
2
78ball
FBGA
31.25mm
CS
’15 4Q
9pcs
4Gb E-die
16
2
78ball
FBGA
31.25mm
CS
’15 4Q
9pcs
4Gb E-die
16
2
78ball
FBGA
31.25mm
TBD
18pcs 4Gb D-die
16
2
78ball
FBGA
31.25mm
MP
18pcs 4Gb D-die
16
2
78ball
FBGA
31.25mm
MP
’15 4Q
18pcs 4Gb E-die
16
2
78ball
FBGA
31.25mm
TBD
18pcs 4Gb E-die
16
2
78ball
FBGA
31.25mm
MP
’16 1Q
18pcs 4Gb E-die
16
2
78ball
FBGA
31.25mm
MP
’16 1Q
18pcs 8Gb B-die
16
2
78ball
FBGA
31.25mm
MP
18pcs 8Gb B-die
16
2
78ball
FBGA
31.25mm
MP
18pcs 8Gb B-die
16
2
78ball
FBGA
31.25mm
TBD
Composition
*
*
*
*
*
*
*
*
*
*
*
-9-
NOTE
Nov. 2015
Product Guide
DDR4 SDRAM Memory
4.7 288Pin DDR4 Non ECC UDIMM
280Pin DDR4 Non ECC UDIMM
Org.
Density
Part Number
Temp &
Power &
Speed
256M x64
2GB
M378A5644EB0
CPB
512M x64
4GB
M378A5143DB0
512M x64
4GB
512M x64
Comp.
Version
Internal
Banks
Rank
PKG
Height
Avail.
C (1Rx16) 256M x16 * 8psc
4Gb E-die
16
1
96ball
FBGA
31.25mm
CS
Dec ’15
CPB
A (1Rx8) 512M x8 * 8pcs
4Gb D-die
16
1
78ball
FBGA
31.25mm
MP
M378A5143EB1
CPB
A (1Rx8) 512M x8 * 8pcs
4Gb E-die
16
1
78ball
FBGA
31.25mm
MP
4GB
M378A5143EB1
CRC
A (1Rx8) 512M x8 * 8pcs
4Gb E-die
16
1
78ball
FBGA
31.25mm
CS
’16 1Q
1G x64
8GB
M378A1G43DB0
CPB
B (2Rx8) 512M x8 * 16pcs 4Gb D-die
16
2
78ball
FBGA
31.25mm
MP
1G x64
8GB
M378A1G43EB1
CPB
B (2Rx8) 512M x8 * 16pcs 4Gb E-die
16
2
78ball
FBGA
31.25mm
MP
1G x64
8GB
M378A1G43EB1
CRC
B (2Rx8) 512M x8 * 16pcs 4Gb E-die
16
2
78ball
FBGA
31.25mm
CS
’16 1Q
1G x64
8GB
M378A1K43BB1
CPB
A (1Rx8)
1G x8 * 8pcs
8Gb B-die
16
1
78ball
FBGA
31.25mm
MP
1G x64
8GB
M378A1K43BB1
CRC
A (1Rx8)
1G x8 * 8pcs
8Gb B-die
16
1
78ball
FBGA
31.25mm
CS
’16 1Q
2G x64
16GB
M378A2K43BB1
CPB
B (2Rx8)
1G x8 * 16pcs 8Gb B-die
16
2
78ball
FBGA
31.25mm
MP
2G x64
16GB
M378A2K43BB1
CRC
B (2Rx8)
1G x8 * 16pcs 8Gb B-die
16
2
78ball
FBGA
31.25mm
CS
’16 1Q
Raw Card
Composition
- 10 -
NOTE
Nov. 2015
Product Guide
DDR4 SDRAM Memory
5. RDIMM, LRDIMM Memory Buffer Information
5.1 Label Example
2
1
4
3
5
6
7 8 9 10
11 12
32GB 4 1Rx4 PC4 -2133P -LD0-10-&##
Made in Korea
M386A4G40DM0-CPB
1344
5.2 JEDEC Description Information
1. Module total capacity, in gigabytes, for primary bus (ECC not counted)
2. Number of package ranks of memory installed and number of logical ranks per package rank
3. Device organization (data bit width) of SDRAMs used on this assembly
4. SDRAM and support component supply voltage (VDD)
blank = 1.2 V operable
5. Module speed in Mb/s/data pin
6. SDRAM speed grade
7. Module Type
E = Unbuffered DIMM ("UDIMM"), x64 primary + 8 bit ECC module data bus
L = Load Reduced DIMM (“LRDIMM”), x64 primary + 8 bit ECC module data bus
R = Registered DIMM ("RDIMM"), x64 primary + 8 bit ECC module data bus
S = Small Outline DIMM ("SO-DIMM"), no ECC (x64 bit module data bus)
U = Unbuffered DIMM ("UDIMM"), no ECC (x64 bit module data bus)
T = Unbuffered 72-bit small outline DIMM ("72b-SO-DIMM"), x64 primary + 8bit ECC module data bus
8. Reference design file used for this design (if applicable)
A = Reference design for raw card ’A’ is used for this assembly
B = Reference design for raw card ’B’ is used for this assembly
AC = Reference design for raw card ’AC’ is used for this assembly (example only)
ZZ = None of the JEDEC standard reference designs were used for this assembly
9. Revision number of the reference design used
0 = Initial release
1 = First revision
2 = Second revision
P = Pre-release or Engineering sample
Z = To be used when reference raw card = ZZ
10. JEDEC SPD Revision Encoding and Additions level used on this DIMM
5.3 RCD (& Data Buffer) Information
(These codes are only used SAMSUNG, Not JEDEC)
11&12. RCD, Data Buffer Revision & Vendor used on this DIMM
Jedec Desctription on label
Buffer Vendor
RCD ver
DC0
IDT
C0
DB ver (Only LRDIMM)
B1
MB1
Montage
B1
A1
P20
Inphi
GS02
GS01
MC0
Montage
C0
B0
DC3
IDT
C0
A3
MA0
Montage
A0
TBD
DB0
IDT
B0
TBD
PC0
Inphi
C0
TBD
- 11 -
Nov. 2015
Product Guide
DDR4 SDRAM Memory
6. Package Dimension
1.60
#A1 INDEX MARK
3.20
#A1
0.80 x12 = 9.60
4.80
0.80
0.80
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
7.50 0.10
B
9 8 7 6 5 4 3 2 1
11.00  0.10
0.80
(Datum A)
A
11.00  0.10
7.50 0.10
0.80 x 8 6.40
0.10MAX
78ball FBGA for
4Gb D-die (x4/x8) / DDP 8Gb D-die (x4) / 4H 16Gb D-die (x4)
4Gb E-die (x4/x8)
8Gb B-die (x4/x8) / DDP 16Gb B-die (x4) / 2H 16Gb B-die (x4) / 4H 32Gb B-die (x4)
0.37 0.05
78 - Æ0.48 Solder ball
(Post Reflow Æ0.50 ± 0.05)
1.10 0.10
0.2 M A B
BOTTOM VIEW
TOP VIEW
- 12 -
Nov. 2015
Product Guide
DDR4 SDRAM Memory
96ball FBGA for
4Gb D-die (x16)
4Gb E-die (x16)
8Gb B-die (x16)
7.50  0.10
1.60
#A1 INDEX MARK
3.20
96 - 0.48 Solder ball
(Post reflow 0.50 ± 0.05)
0.80 x15 = 12.00
0.40
7.50 0.10
0.80
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
#A1
B
9 8 7 6 5 4 3 2 1
13.30 0.10
0.80
13.30 0.10
(Datum A)
0.10MAX
A
0.80 x 8 = 6.40
(0.30)
MOLDING AREA
0.37 0.05
(0.60)
1.10 0.10
0.2 M A B
BOTTOM VIEW
TOP VIEW
- 13 -
Nov. 2015
Product Guide
DDR4 SDRAM Memory
7. Module Dimension
x72 288pin DDR4 SDRAM RDIMM
x72 288pin DDR4 SDRAM LRDIMM
x72 288pin DDR4 SDRAM ECC UDIMM
x64 288pin DDR4 SDRAM Non ECC UDIMM
Units : Millimeters
Max 3.9
64.60
56.10
31.25
17.60
30.75
133.35
1.4 ± 0.10
3.35
126.65
4.30
C
A
E
D
3.85 ± 0.10
B
1.50 ± 0.05
0.85
Detail B,E
9.35
10.20
2.1
2.6
2.6
0.25
Detail A
2.1
B : 2.1
E : 2.6
0.6 ± 0.03
9.35
10.20
Detail C
Detail D
- 14 -
Nov. 2015
Product Guide
DDR4 SDRAM Memory
x72 260pin DDR4 SDRAM ECC SODIMM
x64 260pin DDR4 SDRAM Non ECC SODIMM
Units : Millimeters
69.60
Max 3.7
30.00
65.60
1.2 ± 0.10
A
35.50
B
28.50
1.375
0.35 ± 0.03
0.50
4.00 ± 0.10
2.55
1.00 ± 0.05
0.30 MAX
Detail A
Detail B
- 15 -
Nov. 2015
Product Guide
DDR4 SDRAM Memory
x72 288pin DDR4 SDRAM VLP RDIMM
Units : Millimeters
Max 3.9
64.60
18.75
18.25
133.35
1.4 ± 0.10
56.10
126.65
4.30
A
C
E
D
B
3.85 ± 0.10
1.50 ± 0.05
0.85
Detail B,E
9.35
10.20
Detail C
- 16 -
2.6
2.6
2.1
B : 2.1
E : 2.6
0.25
2.1
Detail A
0.6 ± 0.03
9.35
10.20
Detail D
Nov. 2015
Product Guide
DDR4 SDRAM Memory
x72 288pin DDR4 SDRAM VLP RDIMM Heat Spreader Design Guide (DDP)
1. FRONT
127 ± 0.12
50.81
50.81
21.49
21.49
0.4
9.9
13.6
8.9
0.8 ± 0.05
0.4
Caution
"Hot surface"
63.68
2. BACK
127 ± 0.12
50.81
50.81
21.49
21.49
9.9
13.6
8.9
"Hot surface"
3. CLIP
35.82 ± 0.12
3.80
+0.5
-0.8
9.3 ± 0.12
6.8 ± 0.1
- 17 -
Nov. 2015
Product Guide
DDR4 SDRAM Memory
x72 288pin DDR4 SDRAM RDIMM Heat Spreader Design Guide (TSV)
1. FRONT PART
133.15 +0.40
-0.20
130.45 ± 0.2
5.785
17.02
6.075
4.35
25.75
31.1
2 ± 0.1
2.6 ± 0.2
127
2. BACK PART
3. CLIP PART
39.3 ± 0.2
19.25 ± 0.12
7 ± 0.12
R4
Clip open size
3.2 ± 0.6
- 18 -
Nov. 2015
Product Guide
DDR4 SDRAM Memory
x72 288pin DDR4 SDRAM LRDIMM Heat Spreader Design Guide (DDP)
1. FRONT PART
133.15 +0.40
-0.20
18.6 ± 0.25
25.75 ± 0.2
130.45 ± 0.2
0.6 ± 0.1
2.8 ± 0.2
127 ± 0.25
2. BACK PART
3. CLIP PART
39.3 ± 0.2
19.25 ± 0.12
7 ± 0.12
Clip open size
3.2 ± 0.6
- 19 -
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