87016

REVISIONS
LT
DESCRIPTION
DATE
Add new tolerance (B). Change RTC to 25 ppm/°C.
Dimensional changes. Change voltage to 50 V dc.
Add new suppliers.
Add new requirements for resistance characteristic,
power ratings, solderability, and dimensions.
Add new supplier. Editorial changes throughout.
Change package power rating to 1.0 watt.
Extend maximum resistance value to 150 kilohms.
Editorial changes throughout.
Deleted ozone depleting substance. Added new
supplier. Editorial changes throughout.
Changes in accordance with NOR
5905-R006-94.
Dimension changes. Editorial changes
throughout.
Update and validation of drawing. Changes RTC
and power rating paragraphs. Change reference
specification to MIL-PRF-914. Editorial changes
throughout.
Changes in accordance with NOR 5905-R003-02.
Changes in accordance with NOR 5905-R005-03.
Remove vendor from suggest sources. Editorial
changes throughout.
Add pure tin, manufacturer’s eligibility, and pulse
application paragraphs. Editorial changes
throughout.
A
B
C
D
E
F
G
H
J
K
L
M
N
APPROVED
27 MAY 88
D. Moore
10 MAY 89
28 MAY 91
6 FEB 92
D. Moore
D. Moore
D. Moore
13 JUL 92
D. Moore
13 SEP 93
D. Moore
13 JUL 94
D. Moore
25 SEP 95
N. Christolear
22 JUN 00
K. Cottongim
6 JUN 02
17 DEC 02
K. Cottongim
K. Cottongim
6 OCT 03
K. Cottongim
3 JUL 12
M. Radecki
CURRENT DESIGN ACTIVITY CAGE CODE 037Z3
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.100
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PREPARED BY
Alan R. Knox
Original date of
drawing
CHECKED BY
David W. Withrow
6 August 1987
APPROVED BY
David E. Moore
SIZE
A
REV
AMSC N/A
Source control drawing
CODE IDENT. NO.
14933
N
DESIGN ACTIVITY:
DEFENSE ELECTRONIC SUPPLY CENTER
DAYTON, OHIO 45444-5000
TITLE
RESISTOR NETWORK, FIXED, FILM, SURFACE
MOUNT, 20 PIN, LEADLESS CHIP CARRIER
DWG NO.
87016
PAGE
1
OF
9
5905-2012-E17
1. SCOPE
1.1 Scope. This drawing describes the requirements for a 20 pin, leadless chip carrier, resistor network. These
networks are available in hermetically sealed and nonhermetically sealed packages.
1.2 Part or Identifying Number (PIN). The complete PIN is as follows:
87016


Drawing
number
-
*


Schematic
(1.2.1)
****


Resistance value
designations
(1.2.1.1)
*


Resistance
tolerance
(3.3.1)
*


Characteristic
(1.2.1.2)
1.2.1 Schematic. The schematic of the resistor network shall be identified by a single letter in accordance with figure 1.
FIGURE 1. Schematics.
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1.2.1.1 Resistance value designations. The resistance value designations is in accordance with MIL-PRF-914.
Resistance value designations for the “B” schematic are as specified in table I.
TABLE I. Resistance value designation.
Resistance
designator
A001
A002
A003
A004
A005
A006
A007
R1
(ohms)
82
120
130
160
180
180
220
R2
(ohms)
130
200
210
260
240
390
270
Resistance
Designator
A008
A009
A010
A011
A012
A013
R1
(ohms)
220
330
330
330
1.5k
3k
R2
(ohms)
330
390
470
680
3.3k
6.2k
1.2.1.2 Characteristic. Resistor networks are available in characteristics C, H, K, R, or V in accordance with
MIL-PRF-914 (see 3.2). Matched ratios specified in MIL-PRF-914 for characteristics C and V are not applicable to
schematic B.
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of
this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-914
- Resistor Networks, Fixed, Film, Surface Mount, Nonestablished Reliability, and Established
Reliability, General Specification for.
DEPARTMENT OF DEFENSE STANDARD
MIL-STD-202
MIL-STD-790
- Test Methods for Electronic and Electrical Component Parts.
- Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical,
Electronic, and Fiber Optic Parts Specifications.
MIL-STD-1285 - Marking of Electrical and Electronic Parts.
*
(Copies of these documents are available online at https://assist.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
*
2.2 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of
this document and the references cited herein (except for related, specification sheets), the text of this document takes
precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption
has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-914 and as specified
herein.
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3.2 Interface and physical dimension requirements. Resistors shall meet the interface and physical dimensions as
specified in MIL-PRF-914 and herein (see figure 2). Cavity construction using wire bonding techniques shall be supplied
only as a characteristic C hermetically sealed resistor network.
3.2.1 Termination. Termination finish shall be tin-lead or hot solder dip as specified in MIL-PRF-914.
*
3.2.2 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin
content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3
percent lead, by mass (see 6.5).
3.3 Electrical characteristic.
3.3.1 Resistance tolerance. Resistors are available in (B) ±.1 percent, (D) ±.5 percent, (F) ±1 percent, (G) ±2 percent,
and (J) ±5 percent tolerances.
3.3.2 Resistor power ratings. The power rating for individual resistors shall be in accordance with table II.
3.3.3 Package power rating. The package power rating shall be in accordance with table II. For temperatures in
excess of 70°C, derate in accordance with MIL-PRF-914.
TABLE II. Power ratings.
Schematics
A
B
C
D
Characteristic
K
Element
(watts)
0.10
0.05
0.05
0.10
Characteristic
K
Network
(watts)
1.00
1.00
0.95
1.00
Characteristics
C, H, R, and V
Element
(watts)
0.050
0.025
0.025
0.050
Characteristics
C, H, R, and V
Network
(watts)
0.50
0.50
0.475
0.50
3.3.4 Power conditioning. Power conditioning shall be in accordance with MIL-PRF-914 at 1.5 times rated power
specified for individual resistors (see 3.3.2).
3.3.5 Temperature range. The operating temperature range shall be -55°C to +125°C.
3.3.6 Resistance temperature characteristic. The resistance temperature characteristic shall be in accordance with
MIL-PRF-914.
3.3.7 TC tracking. The TC tracking shall be ±10 ppm/°C.
3.3.8 Resistance range. The resistance range shall be from 10 ohms to 1 megohms.
3.3.9 Operating voltage. The maximum operating voltage shall be 50 V dc.
3.3.10 Solderability. When resistors are tested as specified in 4.5, there shall be no evidence of electrical or
mechanical damage.
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3.3.10.1 Failure criteria for leadless packages. The criteria for acceptable solderability during evaluation of the
terminations are:
a. The total surface area of the dipped part of the termination is at least 95 percent covered by a continuous new
solder coating.
b. That pinholes, voids, porosity, nonwetting, or dewetting are not concentrated in one area and do not exceed 5
percent of the total metallized termination area.
c.
That there shall be no solder bridging between any termination area and any other termination area not
connected to it by design. In the event that the solder dipping causes bridging, the test shall not be considered a
failure provided that a local application of heat (i.e., gas, soldering iron, or redipping) results in solder pullback and
no wetting of the dielectric area is indicated by microscope examination at a magnification of between 10 and
20x.
That area of the surface to be tested as specified in 4.6c shall include the total metallized area of both the castellations
and the terminal pads. In case of a dispute, the percentage of coverage with pinholes or voids shall be determined by
actual measurement of these areas, as compared to the total area.
3.4 Environmental characteristic. The environmental characteristics shall be in accordance with MIL-PRF-914
characteristic C, H, K, R, or V, except for RTC (see 3.3.6).
3.5 Marking. Marking shall be in accordance with MIL-STD-1285, except the PIN shall be as specified in 1.2, with the
manufacturer's CAGE number or trade mark and date code.
3.6 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable
materials should be used to the maximum extent possible provided that the material meets or exceeds the operational
and maintenance requirements, and promotes economically advantageous life cycle costs.
*
3.7 Manufacturer eligibility. To be eligible for listing as a approved source of supply, a manufacturer shall be listed on
the MIL-PRF-914 Qualified Products List for at least one part, or perform the group A and group B inspections specified
herein on a sample agreed upon by the manufacturer and DLA Land and Maritime-VAT.
*
3.7.1 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be listed
as an approved source of supply.
3.8 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or
appearance.
4. VERIFICATION
4.1 Product assurance program. The product assurance program specified in MIL-PRF-914 and maintained in
accordance with MIL-STD-790 is not applicable to this document.
4.2 Qualification inspection. Qualification inspection is not applicable to this document.
4.2.1 Failure rate qualification. The failure rate qualification specified in MIL-PRF-914 is not applicable to this
document.
4.3 Conformance inspection.
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4.3.1 Inspection of product for delivery. Inspection of product for delivery shall consist of group A and group B
inspections of MIL-PRF-914.
4.3.2 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B
requirements in lieu of performing group B tests (see 6.2d).
.310
MAX
.015 MAX
.003 MIN
.014
±.008
Inches
0.003
0.005
0.008
0.014
0.015
mm
0.08
0.13
0.20
0.36
0.38
Inches
0.020
0.023
0.025
0.040
0.050
mm
0.51
0.58
0.64
1.02
1.27
Inches
0.085
0.200
0.250
0.310
0.350
mm
2.16
5.08
6.35
7.87
8.89
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. Unless otherwise specified, tolerances are ±.008 (0.20 mm).
4. Adjacent corner pads may be rounded or diagonally cut to meet the .015 (0.38 mm) minimum
requirement.
FIGURE 2. Leadless chip carrier.
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4.4 Inspection of packaging. Inspection of packaging shall be in accordance with MIL-PRF-914.
4.5 “B” schematic tests. For the tests on “B” schematic, the dc resistance measurements, resistance temperature
characteristics measurement, and short time overload power application shall be made between each terminal and the
application common terminal without compensation for the shunt circuits. The pin to pin dc resistance measurements
shall be used directly to determine the acceptability to section 3 requirements.
4.6 Solderability. Solderability shall be in accordance with method 208 of MIL-STD-202. The following details shall
apply:
a. Application of flux. Flux type shall be in accordance with MIL-PRF-914. Terminations shall be immersed in the
flux, which is at room ambient temperature, to the minimum depth necessary to cover the surface to be tested. The
terminations shall be completely immersed by individually dipping each edge with the Y1 axis 30 degrees to 45
degrees from vertical. The terminations to be tested shall be immersed in the flux for a period of 5 seconds to 10
seconds.
b. Solder dip. The dross and burned flux shall be skimmed from the surface of the molten solder. (NOTE: May not
require separate operation in wave or flow pot). The molten solder shall be maintained at a uniform temperature of
245°C ±5°C. The surface of the molten solder shall be skimmed again prior to immersing the terminations in the
solder. The part shall be attached to a dipping device and the flux covered terminations immersed, one side at a
time, in molten solder to the depth, and in the same manner specified in 4.6a. The immersion and emersion rates
shall be 1.000 ±.250 inch per second and dwell time in the solder bath shall be 5.0 seconds ±0.5 second. After the
dipping process, the part shall be allowed to cool in air. Residue flux shall be removed from the terminations by
rinsing in a suitable solvent. If necessary, a soft cloth or cotton swab moistened with clean 91 percent isopropyl
alcohol shall be used to remove all remaining flux.
c. Examinations of terminations. After each dip coated termination has been thoroughly cleaned of flux, the
castellation and pad shall be examined using a magnification between 10x and 20x.
4.7 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction,
physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-914.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see
6.2). When actual packaging of materiel is to be performed by DoD personnel or in-house contractor personnel, these
personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging
requirements are maintained by the Inventory Control Point's packaging activity within the Military Department or Defense
Agency, or within the military service’s system commands. Packaging data retrieval is available from the managing
Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the
responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. Resistor networks are used in surface mounting applications where space is a major concern.
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6.2 Ordering data. The contract or purchase order should specify the following:
a.
Complete PIN (see 1.2).
b.
Requirements for delivery: One copy of the conformance inspection data or certification of compliance that parts
have passed conformance inspection with each shipment of parts by the manufacturer.
c.
Requirements for packaging and packing (i.e. ESD sensitive packaging).
d. Whether the manufacturer performs the group B tests or provides certification of compliance with group B
requirements (see 4.3.2).
6.3 PIN supersession. PIN's in the original 87016 and revision A have been superseded by a new PIN in revision B
that includes a characteristic code to differentiate between hermetically and nonhermetically sealed resistor networks.
Table III illustrates a generic PIN substitution:
TABLE III. PIN supersession.
87016
and 87016A
87016-******
87016B
Nonhermetic
87016-******V
87016-******H
87016B
Hermetic
87016-******C
6.4 Electrostatic charge. Under several combinations of conditions, these resistors can be electrically damaged, by
electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or shipping
resistors. Direct shipment to the Government is controlled by MIL-DTL-39032 which specifies a preventive packaging
procedure.
*
6.5 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker
growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can
develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a
whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to
inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification
for Electrodeposited Coatings of Tin).
*
6.6 Pulse applications. Designers are CAUTIONED on using the above resistors in high power pulse applications.
Since they have not been qualified nor tested for such applications, damage and premature failure are possible.
*
6.7 User of record. Coordination of this document for future revisions is coordinated only with the approved source of
supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be
achieved online at [email protected] or in writing to: DLA Land and Maritime-VAT, Post Office Box 3990, Columbus, OH
43218-3990 or by telephone (614) 692-0552 or DSN 850-0552.
*
6.8 Approved source of supply. Approved source of supply is listed herein. Additional sources will be added as they
become available. Assistance in the use of this drawing may be obtained online at [email protected] or contact DLA Land
and Maritime-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-0552 or DSN 850-0552.
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DLA Land and Maritime
drawing PIN
87016-*******
Characteristics H, K, R, and V; resistance
values 10 ohms through 150 kilohms;
resistance tolerances B, D, F, G, and J.
Schematics A, C, and D.
Characteristics C; resistance values 50
ohms through 150 kilohms; resistance
tolerances B, D, F, G, and J. Schematics A,
C, and D.
Characteristics C; resistance values 10
ohms through 150 kilohms; resistance
designators A001 through A013; resistance
tolerances B, D, F, G, and J. Schematics A,
B, C, and D
2/.
Vendor similar
designation or
type number 1/
Vendor
CAGE
790*
104-132
HC-154
HC-155
HC-156
HC-157
Vendor’s name
and address
57027
IRC, Inc.
4222 S. Staples Street
Corpus Christi, TX 78411-2702
57489
VISHAY Thin Film
2160 Liberty Drive
Niagara Falls, NY 14304-3798
27851
Spectrum Microwave
400 Nickerson Road
Marlborough, MA 01752
1/ Parts must be purchased to the DLA Land and Maritime PIN to assure that all performance requirements and tests
are met.
2/ Schematic B available to 100 kilohms.
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