432KB

The following document contains information on Cypress products.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury,
severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control,
mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where
chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such
failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating conditions. If any products described in this document
represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law
of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the
respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion
product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without
notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy,
completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other
warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of
the information in this document.
®
®
®
TM
Copyright © 2013 Spansion Inc. All rights reserved. Spansion , the Spansion logo, MirrorBit , MirrorBit Eclipse ,
TM
ORNAND and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and
other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.
Fujitsu Semiconductor Design (Chengdu) Co., Ltd.
Application Note
MCU-AN-500112-E-10
F²MC-8FX FAMILY
8-BIT MICROCONTROLLER
MB95410H/470H SERIES
ONE PHASE POWER METER
(RN8209) SOLUTION
IC CARD AND ESAM OPERATION
APPLICATION NOTE
IC Card and ESAM Operation V1.0.0
Revision History
Revision History
Versio
n
Date
Updated by
Modifications
1.0.0
6/1/2011
Funny Chen
First Draft : Write the user manual of IC card and ESAM function.
This manual contains 13 pages.
Specifications are subject to change without notice. For further information please contact each office.
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with sales representatives before ordering.
The information, such as descriptions of function and application circuit examples, in this document are presented solely
for the purpose of reference to show examples of operations and uses of FUJITSU SEMICONDUCTOR device; FUJITSU
SEMICONDUCTOR does not warrant proper operation of the device with respect to use based on such information. When
you develop equipment incorporating the device based on such information, you must assume any responsibility arising
out of such use of the information.
FUJITSU SEMICONDUCTOR assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as
license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of
FUJITSU SEMICONDUCTOR or any third party or does FUJITSU SEMICONDUCTOR warrant non-infringement of
any third-party's intellectual property right or other right by using such information. FUJITSU SEMICONDUCTOR
assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would
result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury,
severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use
requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU SEMICONDUCTOR will not be liable against you and/or any third party for any claims or
damages arising in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such
failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating conditions.
Exportation/release of any products described in this document may require necessary procedures in accordance with the
regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.
The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
© 2011 Fujitsu Semiconductor Design (Chengdu) Co., Ltd.
MCU-AN-500112-E-10 – Page 2
IC Card and ESAM Operation V1.1.0
Contents
Contents
REVISION HISTORY ............................................................................................................ 2
CONTENTS .......................................................................................................................... 3
1 INTRODUCTION .............................................................................................................. 4
2 BACKGROUND ............................................................................................................... 5
2.1
Overview ................................................................................................................. 5
2.2
Communication Protocol ......................................................................................... 5
3 HW DIAGRAM ................................................................................................................. 6
3.1
The HW diagram of prepayment function ................................................................ 6
4 HW REFERENCE SCH .................................................................................................... 7
5 FW DIAGRAM .................................................................................................................. 8
5.1
ISO7816-3-2006 Protocol ........................................................................................ 8
5.2
TimeCOS_PBOC Protocol ...................................................................................... 8
5.3
Firmware System Diagram ...................................................................................... 9
6 FW FUNCTION LIST...................................................................................................... 10
6.1
API ........................................................................................................................ 10
6.2
HAL ....................................................................................................................... 11
7 ADDITIONAL INFORMATION ....................................................................................... 12
8 APPENDIX ..................................................................................................................... 13
8.1
List of Figures and Tables ..................................................................................... 13
MCU-AN-500112-E-10 – Page 3
IC Card and ESAM Operation V1.0.0
Chapter 1 Introduction
1 Introduction
This application note describes how to use One Phase Power Meter (RN8209) solution’s IC
Card and ESAM function.
Chapter 2 explains the background.
Chapter 3 explains the HW diagram of IC Card and ESAM function.
Chapter 4 explains the HW reference SCH.
Chapter 5 explains the FW diagram.
Chapter 6 explains the FW function list.
MCU-AN-500112-E-10 – Page 4
IC Card and ESAM Operation V1.1.0
Chapter 2 Background
2 Background
Background of Prepayment Function
2.1
Overview
Prepayment function is realized by the communication between IC card and ESAM module.
2.2
Communication Protocol
Byte communication protocol refers to ISO7816-3-2006 protocol, and frame structure refers
to TimeCOS_PBOC protocol.
MCU-AN-500112-E-10 – Page 5
IC Card and ESAM Operation V1.0.0
Chapter 3 HW Diagram
3 HW Diagram
Hardware diagram of prepayment system
3.1
The HW diagram of prepayment function
IC card communication
interface
MB95F418
ESAM module
Figure 3-1: Hardware Diagram
MCU-AN-500112-E-10 – Page 6
IC Card and ESAM Operation V1.1.0
Chapter 4 HW Reference SCH
4 HW Reference SCH
Hardware reference SCH of prepayment system
VDD
P1
VCC
IO
RST
CLK
KEY
GND
R50
R51
10K
10K
6
5
4
3
2
1
IC_VCC
IC_IO
IC_RST
MCU_CLK
IC_KEY
C29
IC_CARD_PORT
103
Figure 4-1: IC Card Interface Circuit
103
SAM_IO
Q21
2N5551B
1
2
3
4
U11
GNDVCC
NC1 RST
IO CLK
NC2 NC3
8
7
6
5
C
C27
10K
R48 1K
SAM_VCC
2
E
R46
3
VDD
IC_VCC
SAM_RST
MCU_CLK
ESAM
Figure 4-2: ESAM Module Circuit
MCU-AN-500112-E-10 – Page 7
IC Card and ESAM Operation V1.0.0
Chapter 5 FW diagram
5 FW diagram
Firmware system diagram of AMR system
5.1
ISO7816-3-2006 Protocol
Communication protocol’s character frame is shown in Figure 5-1.
According to Figure 5-1, a character consists of ten consecutive moments numbered 1 to 10.
Each moment is either at state H or at state L.
⎯ Before moment 1, the electrical circuit I/O shall be at state H.
⎯ Moment 1 shall be at state L. It is the character start.
⎯ Moments 2 to 9 shall encode a byte according to a coding convention(send the LSB first).
⎯ Moment 10 shall encode the character parity.
⎯ After moment 10, both the card and the interface device shall remain in reception mode
(in error-free operation) for a certain time of “pause”, so that the electrical circuit I/O remains
at state H.
Figure 5-1: Character Format Data
5.2
TimeCOS_PBOC Protocol
Figure 5-2: Command and Response Frame Format
MCU-AN-500112-E-10 – Page 8
IC Card and ESAM Operation V1.1.0
Chapter 5 FW diagram
5.3
Firmware System Diagram
Start
Init IC card module
Init ESAM module
Card insert?
N
Y
Active card and reset
Y
Identity
authen OK?
Read command code
N
Excute the communication between
IC card and ESAM, and release IC
End
Figure 5-3: Firmware System Diagram
MCU-AN-500112-E-10 – Page 9
IC Card and ESAM Operation V1.0.0
Chapter 6 FW Function List
6 FW Function List
6.1
API
Table 6-1: FW API List
Function Prototype
Description
void IC_Card_Init(void)
Initialization for IC card connection
INT8U active_card(INT8U* receivebuffer)
Active IC card
void release_card(void)
Release IC card
INT8U user_card_process(void)
Process user card
INT8U user_card_01_process(void)
Process build-user card
INT8U user_card_02_03_process(void)
Process purchase card and complementary
card
INT8U key_card_process(INT8U cardtype)
Process key card
INT8U cur_para_set_card_process(void)
Process current parameter set card
INT8U esam_data_copy_card_process(void)
Process ESAM data copy card
INT8U para_preset_card_process(void)
Process parameter preset card
INT8U meter_num_set_card_process(void)
Process meter number set card
INT8U increase_charge_card_process(void)
Process increase charge card
INT8U relay_test_card_process(void)
Process relay test card
INT8U sys_identity_authen(void)
Identity authen between IC card and ESAM
INT8U card_process(void)
Process card
void Esam_Init(void)
Initialization for ESAM connection
void ActiveEsam(void)
Active ESAM module
void ReleaseEsam(void)
Release ESAM module
void GetUserNum(INT8U* buffer)
Get user number from ESAM
void GetMeterNum(INT8U* buffer)
Get meter number from ESAM
void UpdateEsamBalance(INT8U decValue)
Update ESAM balance
void GetEsamBalance(void)
Get ESAM balance
MCU-AN-500112-E-10 – Page 10
IC Card and ESAM Operation V1.1.0
Chapter 6 FW Function List
6.2
HAL
Table 6-2: FW HAL List
Function Prototype
Description
void CardPortResetRx(void)
Reset IC card RX procedure to RX standby
mode
void CardPortResetTx(void)
Reset IC card TX procedure to TX standby
mode
INT8U IsCardPortDataReady(void)
Check if any data received from IC card port
INT8U CardPortDataRead(void)
Retrieve a data byte from FIFO of IC card port
INT8U IsCardPortTxBusy(void)
Check if card port is busy in the middle of TX
INT8U IC_SAM_send_data(INT8U mode, INT8U length,
INT8U* buffer)
INT8U IC_SAM_receive_data(INT8U mode, INT8U length,
INT8U* buffer)
void IC_SAM_send_byte(INT8U mode, INT8U data)
Send data to IC card or ESAM
void EsamPortResetRx(void)
Reset Esam procedure to RX standby mode
void EsamPortResetTx(void)
Reset Esam procedure to TX standby mode
INT8U IsEsamPortDataReady(void)
Check if any data received from ESAM port
INT8U EsamPortDataRead(void)
Retrieve a data byte from FIFO of ESAM port
INT8U IsEsamPortTxBusy(void)
Check if ESAM port is busy in the middle of TX
Receive data from IC card or ESAM
send a byte data to IC card or ESAM
MCU-AN-500112-E-10 – Page 11
IC Card and ESAM Operation V1.0.0
Chapter 7 Additional Information
7 Additional Information
For more Information on FUJITSU semiconductor products, visit the following websites:
English version address:
http://www.fujitsu.com/cn/fsp/services/mcu/mb95/application_notes.html
Chinese version address:
http://www.fujitsu.com/cn/fss/services/mcu/mb95/application_notes.html
MCU-AN-500112-E-10 – Page 12
IC Card and ESAM Operation V1.1.0
Chapter 8 Appendix
8 Appendix
8.1
List of Figures and Tables
Table 6-1: FW API List ......................................................................................................... 10
Table 6-2: FW HAL List ........................................................................................................ 11
Figure 3-1: Hardware Diagram ............................................................................................... 6
Figure 4-1: IC Card Interface Circuit....................................................................................... 7
Figure 4-2: ESAM Module Circuit ........................................................................................... 7
Figure 5-1: Character Format Data ........................................................................................ 8
Figure 5-2: Command and Response Frame Format ............................................................. 8
Figure 5-3: Firmware System Diagram ................................................................................... 9
MCU-AN-500112-E-10 – Page 13