DS8295A 03

RT8295A
2A, 23V, 340kHz Synchronous Step-Down Converter
General Description
Features
The RT8295A is a high efficiency, monolithic synchronous
step-down DC/DC converter that can deliver up to 2A
output current from a 4.5V to 23V input supply. The
RT8295A's current mode architecture and external
compensation allow the transient response to be
optimized over a wide range of loads and output capacitors.
Cycle-by-cycle current limit provides protection against
shorted outputs and soft-start eliminates input current
surge during start-up. The RT8295A also provides under
voltage protection and thermal shutdown prptection. The
low current (<3μA) shutdown mode provides output
disconnection, enabling easy power management in
battery-powered systems. The RT8295A is available in a
SOP-8 (Exposed Pad) package.
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Ordering Information
RT8295A
Package Type
SP : SOP-8 (Exposed Pad-Option 1)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Z : ECO (Ecological Element with
Halogen Free and Pb free)
H : UVP Hiccup
L : UVP Latch-Off
±1.5% High Accuracy Feedback Voltage
4.5V to 23V Input Voltage Range
2A Output Current
Integrated N-MOSFET Switches
Current Mode Control
Fixed Frequency Operation : 340kHz
Adjustable Output from 0.8V to 20V
Up to 95% Efficiency
Programmable Soft-Start
Stable with Low-ESR Ceramic Output Capacitors
Cycle-by-Cycle Over Current Protection
Input Under Voltage Lockout
Output Under Voltage Protection
Thermal Shutdown Protection
RoHS Compliant and Halogen Free
Applications
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Wireless AP/Router
Set-Top-Box
Industrial and Commercial Low Power Systems
LCD Monitors and TVs
Green Electronics/Appliances
Point of Load Regulation of High-Performance DSPs
Pin Configurations
Note :
(TOP VIEW)
Richtek products are :
`
RoHS compliant and compatible with the current require-
`
Suitable for use in SnPb or Pb-free soldering processes.
VIN
2
SW
GND
3
GND
EN
6
COMP
5
FB
9
4
SS
7
SOP-8 (Exposed Pad)
Marking Information
RT8295AxZSP
RT8295AxGSP
RT8295AxZSP : Product Number
RT8295AxGSP : Product Number
RT8295Ax
GSPYMDNN
8
BOOT
ments of IPC/JEDEC J-STD-020.
x : H or L
YMDNN : Date Code
DS8295A-03 March 2011
RT8295Ax
ZSPYMDNN
x : H or L
YMDNN : Date Code
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1
RT8295A
Typical Application Circuit
VIN
4.5V to 23V
CIN
10µF
REN 100k
C SS
0.1µF
2 VIN
BOOT
1
RT8295A
SW 3
7 EN
8 SS
4, 9 (Exposed Pad)
GND
CBOOT
L
100nF 10µH
R1
75k
FB 5
COMP
6
CC
3.3nF
RC
13k
VOUT
3.3V/2A
COUT
22µF x 2
R2
24k
CP
Open
Table 1. Recommended Component Selection
VOUT (V) R1 (kΩ) R2 (kΩ) R C (kΩ) CC (nF) L (µH)
8
27
3
27
3.3
22
5
62
11.8
20
3.3
15
3.3
75
24
13
3.3
10
2.5
25.5
12
9.1
3.3
6.8
1.5
10.5
12
4.7
3.3
3.6
1.2
12
24
3.6
3.3
3.6
1
3
12
3
3.3
2
COUT (µF)
22 x 2
22 x 2
22 x 2
22 x 2
22 x 2
22 x 2
22 x 2
Functional Pin Description
Pin No.
Pin Name
1
BOOT
2
VIN
3
SW
4,
9 (Exposed Pad)
GND
5
FB
6
COMP
7
EN
8
SS
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Pin Function
Bootstrap for high side gate driver. Connect a 0.1µF or greater ceramic
capacitor from BOOT to SW pins.
Input Supply Voltage, 4.5V to 23V. Must bypass with a suitably large ceramic
capacitor.
Phase Node. Connect this pin to an external L-C filter.
Ground. The exposed pad must be soldered to a large PCB and connected to
GND for maximum power dissipation.
Feedback Input. This pin is connected to the converter output. It is used to set
the output of the converter to regulate to the desired value via an internal
resistive voltage divider. For an adjustable output, an external resistive
voltage divider is connected to this pin.
Compensation Node. COMP is used to compensate the regulation control
loop. Connect a series RC network from COMP to GND. In some cases, an
additional capacitor from COMP to GND is required.
Chip Enable (Active High). A logic high enables the converter; a logic low
forces the RT8295A into shutdown mode reducing the supply current to less
than 3µA. Attach this pin to VIN with a 100kΩ pull up resistor for automatic
startup.
Soft-Start Control Input. SS controls the soft-start period. Connect a capacitor
from SS to GND to set the soft-start period. A 0.1µF capacitor sets the
soft-start period to 13.5ms.
DS8295A-03 March 2011
RT8295A
Function Block Diagram
VIN
Internal
Regulator
Slope Comp
Shutdown
Comparator VA VCC
1.2V
+
-
EN
5k
Oscillator
Foldback
Control
Current Sense
Amplifier
+
-
VA
0.4V
+
UV
Comparator
Lockout
Comparator
+
2.7V
3V
VCC
BOOT
S
+
R
Current
Comparator
Q
130mΩ
Q
130mΩ
SW
GND
6µA
0.8V
SS
FB
DS8295A-03 March 2011
+
+EA
-
COMP
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RT8295A
Absolute Maximum Ratings
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(Note 1)
Supply Voltage, VIN ---------------------------------------------------------------------------------------------Input Voltage, SW -----------------------------------------------------------------------------------------------VBOOT − VSW ------------------------------------------------------------------------------------------------------All Other Pin Voltages ------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
SOP-8 (Exposed Pad) ------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
SOP-8 (Exposed Pad), θJA -------------------------------------------------------------------------------------SOP-8 (Εxposed Pad), θJC ------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) ----------------------------------------------------------------------Junction Temperature -------------------------------------------------------------------------------------------Storage Temperature Range -----------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM (Human Body Mode) -------------------------------------------------------------------------------------MM (Machine Mode) ---------------------------------------------------------------------------------------------
Recommended Operating Conditions
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−0.3V to 25V
−0.3V to (VIN + 0.3V)
−0.3V to 6V
−0.3V to 6V
1.333W
75°C/W
15°C/W
260°C
150°C
−65°C to 150°C
2kV
200V
(Note 4)
Supply Voltage, VIN ---------------------------------------------------------------------------------------------- 4.5V to 23V
Junction Temperature Range ----------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range ----------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = 12V, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Shutdown Supply Current
VEN = 0V
--
0.5
3
µA
Supply Current
VEN = 3 V, VFB = 0.9V
--
0.8
1.2
mA
0.788
0.8
0.812
V
--
940
--
µA/V
RDS(ON)1
--
130
--
mΩ
RDS(ON)2
--
130
--
mΩ
VEN = 0V, VSW = 0V
--
0
10
µA
Min. Duty Cycle, VBOOT − VSW = 4.8V
--
4.3
--
A
GCS
--
4
--
A/V
fOSC1
300
340
380
kHz
Feedback Voltage
Error Amplifier
Transconductance
High Side Switch On
Resistance
Low Side Switch
On-Resistance
High Side Switch Leakage
Current
Upper Switch Current Limit
COMP to Current Sense
Transconductance
Oscillation Frequency
VFB
4.5V ≤ VIN ≤ 23V
GEA
∆IC = ± 10µA
Short Circuit Oscillation
Frequency
fOSC2
VFB = 0V
--
100
--
kHz
Maximum Duty Cycle
DMAX
VFB = 0.7V
--
93
--
%
Minimum On Time
tON
--
100
--
ns
To be continued
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DS8295A-03 March 2011
RT8295A
Parameter
EN Input Threshold
Voltage
Symbol
Test Conditions
Min
Typ
Max
Unit
Logic-High
VIH
2.7
--
5.5
Logic-Low
VIL
--
--
0.4
3.8
4.2
4.5
V
--
320
--
mV
VIN Rising
V
Input Under Voltage Lockout Threshold
VUVLO
Input Under Voltage Lockout Hysteresis
∆VUVLO
Soft-Start Current
ISS
VSS = 0V
--
6
--
µA
Soft-Start Period
tSS
C SS = 0.1µF
--
13.5
--
ms
Thermal Shutdown
TSD
--
150
--
°C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in natural convection at T A = 25°C on a high effective thermal conductivity four-layer test board of
JEDEC 51-7 thermal measurement standard. The measurement case position of θJC is on the exposed pad of the
package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
DS8295A-03 March 2011
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RT8295A
Typical Operating Characteristics
Reference Voltage vs. Input Voltage
Efficiency vs. Output Current
0.820
90
0.815
Efficiency (%)
80
Reference Voltage (V)
100
VIN = 4.5V
VIN = 12V
VIN = 23V
70
60
50
40
30
20
0.810
0.805
0.800
0.795
0.790
0.785
10
VOUT = 3.3V
0
0.01
0.780
0.1
1
10
4
6
8
10
Output Current (A)
14
16
18
20
22
24
Input Voltage (V)
Reference Voltage vs. Temperature
Output Voltage vs. Output Current
0.820
3.40
0.815
3.38
3.36
0.810
Output Voltage (V)
Reference Voltage (V)
12
0.805
0.800
0.795
0.790
3.34
3.32
3.30
VIN = 4.5V
VIN = 12V
VIN = 23V
3.28
3.26
3.24
0.785
3.22
0.780
VOUT = 3.3V, IOUT = 0V to 2A
3.20
-50
-25
0
25
50
75
100
125
0
0.2
0.4
0.6
Temperature (°C)
1
1.2
1.4
1.6
1.8
2
Switching Frequency vs. Temperature
Switching Frequency vs. Input Voltage
380
380
370
370
Switching Frequency (kHz)1
Switching Frequency (kHz)1
0.8
Output Current (A)
360
350
340
330
320
310
360
350
340
330
320
310
VIN = 12V, VOUT = 3.3V, IOUT = 0.5A
VOUT = 3.3V, IOUT = 0.5A
300
300
4
6
8
10
12
14
16
18
Input Voltage (V)
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20
22
24
-50
-25
0
25
50
75
100
125
Temperature (°C)
DS8295A-03 March 2011
RT8295A
Current Limit vs. Temperature
Output Current Limit vs. Input Voltage
6.0
6.0
5.5
5.0
Current Limit (A)
Output Current Limit (A)
5.5
4.5
4.0
3.5
3.0
5.0
4.5
4.0
3.5
2.5
VOUT = 3.3V
2.0
VIN = 12V, VOUT = 3.3V
3.0
4
6
8
10
12
14
16
18
20
22
24
-50
-25
0
25
50
75
100
Input Voltage (V)
Temperature (°C)
Load Transient Response
Load Transient Response
VOUT
(100mV/Div)
VOUT
(100mV/Div)
IOUT
(1A/Div)
IOUT
(1A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 1A to 2A
VIN = 12V, VOUT = 3.3V, IOUT = 0.1A to 2A
Time (100μs/Div)
Time (100μs/Div)
Output Voltage Ripple
Output Voltage Ripple
VOUT
(10mV/Div)
VOUT
(10mV/Div)
VSW
(10V/Div)
VSW
(10V/Div)
IL
(1A/Div)
IL
(1A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 2A
Time (2.5μs/Div)
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125
VIN = 12V, VOUT = 3.3V, IOUT = 1A
Time (2.5μs/Div)
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RT8295A
Power On from VIN
Power Off from VIN
VIN
(5V/Div)
VIN
(5V/Div)
VOUT
(2V/Div)
VOUT
(2V/Div)
IL
(2A/Div)
IL
(2A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 2A
VIN = 12V, VOUT = 3.3V, IOUT = 2A
Time (5ms/Div)
Time (50ms/Div)
Power On from EN
Power Off from EN
VEN
(5V/Div)
VEN
(5V/Div)
VOUT
(2V/Div)
VOUT
(2V/Div)
IL
(2A/Div)
IL
(2A/Div)
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VIN = 12V, VOUT = 3.3V, IOUT = 2A
VIN = 12V, VOUT = 3.3V, IOUT = 2A
Time (5ms/Div)
Time (5ms/Div)
DS8295A-03 March 2011
RT8295A
Application Information
The RT8295A is a synchronous high voltage buck converter
that can support an input voltage range from 4.5V to 23V
while providing output current up to 2A.
Output Voltage Setting
The resistive voltage divider allows the FB pin to sense
the output voltage as shown in Figure 1.
VOUT
R1
FB
RT8295A
R2
GND
Figure 1. Output Voltage Setting
The output voltage is set by an external resistive voltage
divider according to the following equation :
VOUT = VFB  1+ R1 
 R2 
where VFB is the feedback reference voltage (0.8V typ.).
External Bootstrap Diode
Connect a 100nF low ESR ceramic capacitor between
the BOOT pin and SW pin. This capacitor provides the
gate driver voltage for the high side MOSFET.
It is recommended to add an external bootstrap diode
between an external 5V and BOOT pin for efficiency
improvement when input voltage is lower than 5.5V or duty
ratio is higher than 65% .The bootstrap diode can be a
low cost one such as IN4148 or BAT54. The external 5V
can be a 5V fixed input from system or a 5V output of the
RT8295A. Note that the external boot voltage must be
lower than 5.5V.
5V
BOOT
RT8295A
100nF
SW
Soft-Start
The RT8295A contains an external soft-start clamp that
gradually raises the output voltage. The soft-start timing
can be programmed by the external capacitor between
SS pin and GND. The chip provides a 6µA charge current
for the external capacitor. If 0.1µF capacitor is used to
set the soft-start, the period will be 13.5ms (typ.).
Chip Enable Operation
The EN pin is the chip enable input. Pulling the EN pin
low (<0.4V) will shut down the device. During shutdown
mode, the RT8295A quiescent current drops below 3µA.
Driving the EN pin high (>2.7V, < 5.5V) will turn on the
device again. For external timing control (e.g.RC), the EN
pin can also be externally pulled high by adding a REN*
resistor and C EN * capacitor f rom the VIN pin
(see Figure 5).
An external MOSFET can be added to implement digital
control on the EN pin when no system voltage above 2.5V
is available, as shown in Figure 3. In this case, a 100kΩ
pull-up resistor, REN, is connected between VIN and the
EN pin. MOSFET Q1 will be under logic control to pull
down the EN pin.
2 VIN
VIN
REN
100k
Chip Enable
CIN
BOOT
1
CBOOT
RT8295A
7 EN
VOUT
L
SW 3
R1
Q1
8 SS
CSS
4,
9 (Exposed Pad) GND
COUT
FB 5
COMP
6
CC
RC
R2
CP
Figure 3. Enable Control Circuit for Logic Control with
Low Voltage
To prevent enabling circuit when VIN is smaller than the
VOUT target value, a resistive voltage divider can be placed
between the input voltage and ground and connected to
the EN pin to adjust IC lockout threshold, as shown in
Figure 4. For example, if an 8V output voltage is regulated
from a 12V input voltage, the resistor ,REN2, can be
selected to set input lockout threshold larger than 8V.
Figure 2. External Bootstrap Diode
DS8295A-03 March 2011
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9
RT8295A
2
VIN
12V
REN1
100k
CIN
10µF
VIN
BOOT
1
CBOOT
L
RT8295A
7 EN
SW
3
VOUT
8V
R1
REN2
8 SS
FB 5
CSS
4,
9 (Exposed Pad)
GND
COUT
COMP
6
CC
RC
R2
CP
Figure 4. The Resistors can be Selected to Set IC
Lockout Threshold.
Hiccup Mode
For the RT8295AH, Hiccup Mode Under Voltage Protection
(UVP) is provided. When the FB voltage drops below half
of the feedback reference voltage, VFB, the UVP function
will be triggered and the RT8295AH will shut down for a
period of time and then recover automatically. The Hiccup
Mode UVP can reduce input current in short circuit
conditions.
Latch-Off Mode
For the RT8295AL, Latch-Off Mode Under Voltage
Protection (UVP) is provided. When the FB voltage drops
below half of the feedback reference voltage, VFB, UVP
will be triggered and the RT8295AL will shut down in LatchOff Mode. In shutdown condition, the RT8295AL can be
reset via the the EN pin or power input VIN.
Inductor Selection
The inductor value and operating frequency determine the
ripple current according to a specific input and output
voltage. The ripple current ∆IL increases with higher VIN
and decreases with higher inductance.
V
V
∆IL =  OUT  × 1 − OUT 
f
×
L
VIN 

 
ripple current stays below the specified maximum, the
inductor value should be chosen according to the following
equation :
 VOUT  
VOUT 
L =
× 1−


 f × ∆IL(MAX)   VIN(MAX) 
The inductor's current rating (caused a 40°C temperature
rising from 25°C ambient) should be greater than the
maximum load current and its saturation current should
be greater than the short circuit peak current limit. Please
see Table 2 for the inductor selection reference.
Table 2. Suggested Inductors for Typical
Application Circuit
Component
Supplier
Series
Dimensions
(mm)
TDK
VLF10045
10 x 9.7 x 4.5
TDK
TAIYO
YUDEN
SLF12565
12.5 x 12.5 x 6.5
NR8040
8x8x4
CIN and COUT Selection
The input capacitance, C IN, is needed to filter the
trapezoidal current at the source of the high side MOSFET.
To prevent large ripple current, a low ESR input capacitor
sized for the maximum RMS current should be used. The
RMS current is given by :
V
IRMS = IOUT(MAX) OUT
VIN
VIN
−1
VOUT
This formula has a maximum at VIN = 2VOUT , where
I RMS = I OUT /2. This simple worst-case condition is
commonly used for design because even significant
deviations do not offer much relief.
Choose a capacitor rated at a higher temperature than
required. Several capacitors may also be paralleled to
meet size or height requirements in the design.
Having a lower ripple current reduces not only the ESR
losses in the output capacitors but also the output voltage
ripple. High frequency with small ripple current can achieve
highest efficiency operation. However, it requires a large
inductor to achieve this goal.
For the input capacitor, one 10µF low ESR ceramic
capacitors are recommended. For the recommended
For the ripple current selection, the value of ∆IL = 0.24 (IMAX)
will be a reasonable starting point. The largest ripple
current occurs at the highest VIN. To guarantee that the
Moreover, the amount of bulk capacitance is also a key
for COUT selection to ensure that the control loop is stable.
Loop stability can be checked by viewing the load transient
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10
capacitor, please refer to Table 3 for more detail.
The selection of COUT is determined by the required ESR
to minimize voltage ripple.
DS8295A-03 March 2011
RT8295A
input, VIN. At best, this ringing can couple to the output
and be mistaken as loop instability. At worst, a sudden
inrush of current through the long wires can potentially
cause a voltage spike at VIN large enough to damage the
part.
response as described in a later section.
The output ripple, ∆VOUT , is determined by :
1 
∆VOUT ≤ ∆IL ESR +
8fCOUT 

The output ripple will be highest at the maximum input
Checking Transient Response
voltage since ∆IL increases with input voltage. Multiple
capacitors placed in parallel may be needed to meet the
ESR and RMS current handling requirement. Dry tantalum,
special polymer, aluminum electrolytic and ceramic
capacitors are all av ai labl e in surf ace mount
packages.Special polymer capacitors offer very low ESR
value. However, it provides lower capacitance density than
other types. Although Tantalum capacitors have the highest
capacitance density, it is important to only use types that
pass the surge test for use in switching power supplies.
Aluminum electrolytic capacitors have significantly higher
ESR. However, it can be used in cost-sensitive applications
for ripple current rating and long term reliability
considerations. Ceramic capacitors have excellent low
ESR characteristics but can have a high voltage coefficient
and audible piezoelectric effects. The high Q of ceramic
capacitors with trace inductance can also lead to significant
ringing.
The regulator loop response can be checked by looking
at the load transient response. Switching regulators take
several cycles to respond to a step in load current. When
a load step occurs, VOUT immediately shifts by an amount
equal to ∆ILOAD (ESR) and COUT also begins to be charged
or discharged to generate a feedback error signal for the
regulator to return VOUT to its steady-state value. During
this recovery time, VOUT can be monitored for overshoot or
ringing that would indicate a stability problem.
EMI Consideration
Since parasitic inductance and capacitance effects in PCB
circuitry would cause a spike voltage on SW pin when
high side MOSFET is turned-on/off, this spike voltage on
SW may impact on EMI performance in the system. In
order to enhance EMI performance, there are two methods
to suppress the spike voltage. One way is by placing an
R-C snubber between SW and GND and locating them as
close as possible to the SW pin (see Figure 5). Another
method is by adding a resistor in series with the bootstrap
capacitor, CBOOT , but this method will decrease the driving
capability to the high side MOSFET. It is strongly
recommended to reserve the R-C snubber during PCB
layout for EMI improvement. Moreover, reducing the SW
trace area and keeping the main power in a small loop will
be helpful on EMI performance. For detailed PCB layout
guide, please refer to the section Layout Considerations.
Higher values, lower cost ceramic capacitors are now
becoming available in smaller case sizes. Their high ripple
current, high voltage rating and low ESR make them ideal
for switching regulator applications. However, care must
be taken when these capacitors are used at input and
output. When a ceramic capacitor is used at the input
and the power is supplied by a wall adapter through long
wires, a load step at the output can induce ringing at the
2
VIN
4.5V to 23V
REN*
Chip Enable
CIN
10µF
VIN
BOOT
RT8295A
7 EN
SW
1
* : Optional
CBOOT
L
100nF 10µH
3
RS*
CEN*
8 SS
CSS
4,
0.1µF 9 (Exposed Pad)
GND
RBOOT*
R1
75k
CS*
FB
COMP
VOUT
3.3V/2A
COUT
22µFx2
5
6
CC
3.3nF
RC
13k
R2
24k
CP
NC
Figure 5. Reference Circuit with Snubber and Enable Timing Control
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11
RT8295A
For continuous operation, do not exceed the maximum
operation junction temperature 125°C. The maximum
power dissipation depends on the thermal resistance of
IC package, PCB layout, the rate of surroundings airflow
and temperature difference between junction to ambient.
The maximum power dissipation can be calculated by
following formula :
PD(MAX) = (TJ(MAX) − TA ) / θJA
where T J(MAX) is the maximum operation junction
temperature , TA is the ambient temperature and the θJA is
the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT8295A, the maximum junction temperature is 125°C.
The junction to ambient thermal resistance θJA is layout
dependent. For SOP-8(Exposed Pad) package, the
thermal resistance θJA is 75°C/W on the standard JEDEC
51-7 four-layers thermal test board. The maximum power
dissipation at TA = 25°C can be calculated by following
formula :
The maximum power dissipation depends on operating
ambient temperature for fixed T J(MAX) and thermal
resistance θJA. For RT8295A package, the derating curves
in Figure 7 allow the designer to see the effect of rising
ambient temperature on the maximum power dissipation .
2.2
Four Layer PCB
2.0
Power Dissipation (W)
Thermal Considerations
Copper Area
70mm2
50mm2
30mm2
10mm2
Min.Layout
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 7. Derating Curves for RT8295A Package
PD(MAX) = (125°C − 25°C) / (75°C/W ) = 1.333W
(min.copper area PCB layout)
P D(MAX) = (125°C − 25°C) / (49°C/ W ) = 2.04W
(70mm2 copper area PCB layout)
The thermal resistance θJA of SOP-8 (Exposed Pad) is
determined by the package architecture design and the
PCB layout design. However, the package architecture
design had been designed. If possible, it's useful to
increase thermal performance by the PCB layout copper
design. The thermal resistance θJA can be decreased by
adding copper area under the exposed pad of SOP-8
(Exposed Pad) package.
As shown in Figure 6, the amount of copper area to which
the SOP-8 (Exposed Pad) is mounted affects thermal
performance. W hen mount ed to the standard
SOP-8 (Exposed Pad) pad (Figure 6.a), θJA is 75°C/W.
Adding copper area of pad under the SOP-8 (Exposed
Pad) (Figure 6.b) reduces the θJA to 64°C/W. Even further
increasing the copper area of pad to 70mm2 (Figure 6.e)
reduces the θJA to 49°C/W.
www.richtek.com
12
(a) Copper Area = (2.3 x 2.3) mm2, θJA = 75°C/W
(b) Copper Area = 10mm2, θJA = 64°C/W
(c) Copper Area = 30mm2 , θJA = 54°C/W
DS8295A-03 March 2011
RT8295A
(d) Copper Area = 50mm2 , θJA = 51°C/W
(e) Copper Area = 70mm2 , θJA = 49°C/W
Figure 6. Themal Resistance vs. Copper Area Layout Design
Layout Considerations
For best performance of the RT8295A, the following layout giidelines must be strictly followed.
}
Input capacitor must be placed as close to the IC as possible.
}
SW should be connected to inductor by wide and short trace. Keep sensitive components away from this trace.
}
The feedback components must be connected as close to the device as possible
SW GND
VIN
GND
The feedback components
must be connected as close
to the device as possible.
CC
CIN
CSS
Input capacitor must
be placed as close
to the IC as possible.
BOOT
VIN
RS CS
SW
GND
2
3
GND
8
SS
7
EN
6
COMP
5
FB
9
4
COUT
CP
RC
R1
R2
L
VOUT
REN VIN
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace.
VOUT
GND
Figure 8. PCB Layout Guide
Table 3. Suggested Capacitors for CIN and COUT
Location
Component Supplier
Part No.
Capacitance (µF)
Case Size
CIN
MURATA
GRM31CR61E106K
10
1206
CIN
TDK
C3225X5R1E106K
10
1206
CIN
TAIYO YUDEN
TMK316BJ106ML
10
1206
COUT
MURATA
GRM31CR60J476M
47
1206
COUT
TDK
C3225X5R0J476M
47
1210
COUT
MURATA
GRM32ER71C226M
22
1210
COUT
TDK
C3225X5R1C22M
22
1210
DS8295A-03 March 2011
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13
RT8295A
Outline Dimension
H
A
M
EXPOSED THERMAL PAD
(Bottom of Package)
Y
J
X
B
F
C
I
D
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
4.801
5.004
0.189
0.197
B
3.810
4.000
0.150
0.157
C
1.346
1.753
0.053
0.069
D
0.330
0.510
0.013
0.020
F
1.194
1.346
0.047
0.053
H
0.170
0.254
0.007
0.010
I
0.000
0.152
0.000
0.006
J
5.791
6.200
0.228
0.244
M
0.406
1.270
0.016
0.050
X
2.000
2.300
0.079
0.091
Y
2.000
2.300
0.079
0.091
X
2.100
2.500
0.083
0.098
Y
3.000
3.500
0.118
0.138
Option 1
Option 2
8-Lead SOP (Exposed Pad) Plastic Package
Richtek Technology Corporation
Richtek Technology Corporation
Headquarter
Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City
5F, No. 95, Minchiuan Road, Hsintien City
Hsinchu, Taiwan, R.O.C.
Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Tel: (8862)86672399 Fax: (8862)86672377
Email: marketing@richtek.com
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
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14
DS8295A-03 March 2011