10 xZ122PB040FV M817F88x T3 14

10-FZ122PB040FV-M817F88
10-PZ122PB040FV-M817F88Y
target datasheet
flow PHASE 0
1200 V / 40 A
Features
flow 0 12mm housing
● High efficiency fast Fairchild IGBT
● Full current fast FWD
● Thermistor
Solder pins
Press-fit pins
Schematic
Target applications
●
●
●
●
●
Industrial Drives
Power Supply
Solar
UPS
Welding
Types
● 10-FZ122PB040FV-M817F88
● 10-PZ122PB040FV-M817F88Y
Maximum Ratings
Tj=25°C, unless otherwise specified
Parameter
Symbol
Condition
Value
Unit
1200
V
55
A
160
A
130
W
Half-Bridge Switch
Collector-emitter voltage
Collector current
V CES
IC
T j = T jmax
T s = 80 °C
Repetitive peak collector current
I CRM
t p limited by T jmax
Total power dissipation
P tot
T j = T jmax
Gate-emitter voltage
V GES
±20
V
Maximum Junction Temperature
T jmax
175
°C
Copyright Vincotech
1
T s = 80 °C
23 Dec. 2015 / Revision 3
10-FZ122PB040FV-M817F88
10-PZ122PB040FV-M817F88Y
target datasheet
Parameter
Symbol
Condition
Value
Unit
1200
V
Half-Bridge Diode
Peak Repetitive Reverse Voltage
Continuous (direct) forward current
V RRM
IF
T j = T jmax
T s = 80°C
33
A
Total power dissipation
P tot
T j = T jmax
T s = 80°C
73
W
Maximum Junction Temperature
T jmax
175
°C
Value
Unit
Parameter
Symbol
Condition
Module Properties
Thermal Properties
Storage temperature
T stg
-40…+125
°C
Operation temperature under switching
condition
T jop
-40…+(T jmax - 25)
°C
4000
V
min 12,7
mm
9,12 / 9,54
mm
Isolation Properties
Isolation voltage
V isol
DC voltage
t p=2s
Creepage distance
Clearance
Comparative Tracking Index
Copyright Vincotech
Solder pins / Press-fit pins
>200
CTI
2
23 Dec. 2015 / Revision 3
10-FZ122PB040FV-M817F88
10-PZ122PB040FV-M817F88Y
target datasheet
Characteristic Values
Half-Bridge Switch
Parameter
Conditions
Symbol
VCE [V]
VGE [V]
VGS [V]
VGS [V]
Vr [V]
Value
IC [A]
ID [A]
IF [A]
Tj[°C]
Unit
Min
Typ
Max
5
6,8
7,3
1,5
1,80
2,5
Static
Gate-emitter threshold voltage
Collec tor-emitter saturation voltage
Collec tor-emitter cut-off c urrent
Gate-emitter leakage current
Internal gate resistance
V GE(th)
V GE=V CE
0,04
15
V CEsat
0
I CES
20
I GES
40
25
125
25
125
25
1200
50
125
25
0
250
125
rg
none
Input capacitance
C ies
4300
Output capacitance
C oes
Reverse transfer c apac itanc e
C res
Gate c harge
f=100 KHz
0
30
V
µA
nA
Ω
180
25
V
pF
100
15
Qg
600
40
25
370
nC
0,73
K/W
Value
Unit
Thermal
Thermal resistanc e junction to sink
R th(j-s)
phase-change
material
ʎ =3,4W /mK
Half-Bridge Diode
Parameter
Conditions
Symbol
VCE [V]
VGE [V]
VGS [V]
VGS [V]
Vr [V]
IC [A]
ID [A]
IF [A]
Tj[°C]
Min
Typ
Max
25
2,30
2,62
150
2,29
Static
Forward voltage
VF
Reverse leakage current
Ir
35
1200
25
60
150
5500
V
µA
Thermal
Thermal resistanc e junction to sink
Copyright Vincotech
R th(j-s)
phase-change
material
ʎ = 3,4 W /mK
1,30
3
K/W
23 Dec. 2015 / Revision 3
10-FZ122PB040FV-M817F88
10-PZ122PB040FV-M817F88Y
target datasheet
Thermistor
Parameter
Conditions
Symbol
VCE [V]
VGE [V]
VGS [V]
VGS [V]
Vr [V]
Rated resistance
ΔR/R
Power dissipation
P
IC [A]
ID [A]
IF [A]
Tj[°C]
Min
25
R
Deviation of R100
Value
100
R100=1484 Ω
Power dissipation constant
Typ
Unit
Max
22
-5
kΩ
5
%
25
5
mW
25
1,5
mW/K
B-value
B(25/50)
Tol. ±1%
25
3962
K
B-value
B(25/100) Tol. ±1%
25
4000
K
Vincotech NTC Reference
Copyright Vincotech
I
4
23 Dec. 2015 / Revision 3
10-FZ122PB040FV-M817F88
10-PZ122PB040FV-M817F88Y
target datasheet
Ordering Code & Marking
Version
without thermal paste with Solder pins 12mm housing
without thermal paste with Press-fit pins 12mm housing
NN-NNNNNNNNNNNNNN
TTTTTTTVV WWYY UL
Vinco LLLLL SSSS
Ordering Code
10-FZ122PB040FV-M817F88
10-PZ122PB040FV-M817F88Y
Text
Datamatrix
Name
Date code
UL & Vinco
Lot
Serial
NN-NNNNNNNNNNNNNN
WWYY
UL Vinco
LLLLL
SSSS
Type&Ver
Lot number
Serial
Date code
TTTTTTTVV
LLLLL
SSSS
WWYY
Outline
Pin table [mm]
Pin
X
Y
Function
1
0
0
DC-
2
0
2,3
DC-
3
0
4,6
DC-
4
0
6,9
DC-
5
0
15,6
DC+
6
0
17,9
DC+
7
0
20,2
DC+
8
0
22,5
DC+
9
13,85
16,45
G12
10
16,75
16,45
S12
11
12
13
33,5
33,5
33,5
11,5
9,2
6,9
Ph
Ph
14
33,5
4,6
Ph
15
33,5
2,3
Ph
16
33,5
0
Ph
17
13,85
13,55
Ph
18
19,55
4,95
S11
19
19,55
7,85
G11
20
33,5
22,5
21
26,1
22,5
Therm1
Therm2
Copyright Vincotech
Ph
5
23 Dec. 2015 / Revision 3
10-FZ122PB040FV-M817F88
10-PZ122PB040FV-M817F88Y
target datasheet
Pinout
Identification
ID
Component
Voltage
Current
Function
T11,T12
IGBT
1200 V
40 A
Half-Bridge Switch
D11,D12
FWD
1200 V
35 A
Half-Bridge Diode
Rt
NTC
-
-
Thermistor
Copyright Vincotech
6
Comment
23 Dec. 2015 / Revision 3
10-FZ122PB040FV-M817F88
10-PZ122PB040FV-M817F88Y
target datasheet
Packaging instruction
Standard packaging quantity (SPQ)
135
>SPQ
Standard
<SPQ
Sample
Handling instruction
Handling instructions for flow 0 packages see vincotech.com website.
Package data
Package data for flow 0 packages see vincotech.com website.
Document No.:
Date:
10-xZ122PB040FV-M817F88x-T3-14
23 Dec. 2015
Modification:
Pages
Product status definition
Datasheet Status
Product Status
Target
Formative or In Design
Definition
This datasheet contains the design specifications for product development.
Specifications may change in any manner without notice. The data contained is
exclusively intended for technically trained staff.
DISCLAIMER
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine
the suitability of the information and the product for reader’s intended use.
LIFE SUPPORT POLICY
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval
of Vincotech.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or effectiveness.
Copyright Vincotech
7
23 Dec. 2015 / Revision 3