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FUJITSU SEMICONDUCTOR
SUPPORT SYSTEM
SS01-71141-1E
DSU-FR EMULATOR
QFP-100P HEADER TYPE 4
MB2198-165-E
OPERATION MANUAL
PREFACE
Thank you for purchasing the QFP-100P*1 header type 4 for the DSU-FR*2 emulator (model number
: MB2198-165-E).
The MB2198-165-E is used with the adapter unit for connecting to user systems that use the
MB91480 (QFP-100P) series of Fujitsu FR microcontrollers, together with the DSU-FR emulator
(model number : MB2198-01-E)*3 and DSU-FR cable (model number : MB2198-10-E)*4.
The manual explains how to handle the MB2198-165-E. Before using the MB2198-165-E, be sure
to read this manual.
Please contact the sales or support representative for details on the mass production and evaluation
MCU models that can be used with this product.
*1 : Uses the FPT-100P-M06 package (lead pitch: 0.65mm, body size: 14mm × 20mm)
*2 : FR, the abbreviation of FUJITSU RISC controller, is a line of products of Fujitsu Semiconductor Limited.
*3 : Referred to as the “emulator”.
*4 : Referred to as the “DSU cable”.
■ Handling and Use
Please refer to the following manuals for information about how to handle and use this product and
also for details on safety precautions.
•
•
•
•
DSU-FR EMULATOR MB2198-01-E OPERATION MANUAL
DSU-FR EMULATOR DSU-FR CABLE MB2198-10-E OPERATION MANUAL
DSU-FR EMULATOR BGA-224P ADAPTER MB2198-160-E OPERATION MANUAL
DSU-FR EMULATOR BGA-224P ADAPTER TYPE2 MB2198-160A-E OPERATION
MANUAL
■ European RoHS Compliance
Products with a -E suffix on the part number are European RoHS compliant products.
■ Notice on this document
All information included in this document is current as of the date it is issued. Such information is
subject to change without any prior notice.
Please confirm the latest relevant information with the sales representatives.
■ Cautions Regarding the Products Described in this Document
The following precautions apply to the product described in this document.
CAUTION
Indicates a feature that, if not used correctly, may result in minor or moderate injuries, and which may cause the customer system to malfunction.
Cuts
This product has parts with sharp points that are exposed.
Do not touch edge of the product with your bare hands.
Damage
When connect the header board to the user system, correctly position the index
mark (▲) on the NQPACK mounted on the user system with the index mark (▲)
on the header board, otherwise the emulator system and user system might be
damaged.
Damage
When mounting a mass production MCU, correctly position pin 1, otherwise the
mass production MCU and user system might be damaged.
i
• The contents of this document are subject to change without notice.
Customers are advised to consult with sales representatives before ordering.
• The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU SEMICONDUCTOR semiconductor device; FUJITSU SEMICONDUCTOR does not warrant proper operation of the device with respect to use
based on such information. When you develop equipment incorporating the device based on such information, you
must assume any responsibility arising out of such use of the information. FUJITSU SEMICONDUCTOR assumes no
liability for any damages whatsoever arising out of the use of the information.
• Any information in this document, including descriptions of function and schematic diagrams, shall not be construed
as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right
of FUJITSU SEMICONDUCTOR or any third party or does FUJITSU SEMICONDUCTOR warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU SEMICONDUCTOR assumes no liability for any infringement of the intellectual property rights or other rights of third parties
which would result from the use of information contained herein.
• The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air
traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)
for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU SEMICONDUCTOR will not be liable against you and/or any third party for any claims or
damages arising in connection with above-mentioned uses of the products.
• Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.
• Exportation/release of any products described in this document may require necessary procedures in accordance with
the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.
• The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Copyright ©2010 FUJITSU SEMICONDUCTOR LIMITED All rights reserved
ii
1. Checking the Delivered Product
Before using the MB2198-165-E, confirm that the following components are included in the box:
• QFP-100P Header type 4*1
:1
• Screws for securing the header board (M2 × 10mm, 0.4mm pitch)
:4
• Washers
:4
• NQPACK100RB179-A*2
:1
3
• HQPACK100RB179*
:1
• Operation manual (Japanese version)
:1
• Operation manual (English version, this manual)
:1
*1 : Referred to as the "header board".
A YQPACK100RB-4W (manufactured by Tokyo Eletech Corporation, referred to as the “YQPACK” in this manual) is mounted on the header board.
*2 : The IC socket (manufactured by Tokyo Eletech Corporation, referred to as the “NQPACK” in
this manual).
The NQPACK includes a specialized screw driver and three guide pins.
A more reliable compatible socket, the NQPACK100RB179-SL-A (sold separately; manufactured by Tokyo Eletech Corporation), can be used by making a screw hole in the user system
board for affixing the IC socket. For more information, contact Tokyo Eletech Corporation.
*3 : The IC socket cover (manufactured by Tokyo Eletech Corporation, referred to as the “HQPACK” in this manual). Includes four screws (M2 × 6mm, 0.4mm pitch) for attaching the HQPACK.
This product can function as an adapter unit when used in combination with an adapter board (sold
separately) (model number : MB2198-160-E or MB2198-160A-E) . The product can also function
as an emulator system when used in conjunction with an emulator.
For details about the emulators and adapter boards that support this product, contact our Sales Department or Support Department.
2. Handling Precautions
The adapter unit is precision-manufactured to improve dimensional accuracy and to ensure reliable
contact, and is therefore mechanically weak.
Take the following precautions to ensure that the header board is always used correctly in an appropriate environment.
• Avoid placing any stress on the NQPACK that is mounted on the user system while the adapter
unit is connected.
1
3. Notes on Designing
■ Notes on Printed Circuit Board for the User System
If the header board is connected to the user system, the heights of parts mounted in the space around
the header board are restricted.
When the printed circuit board of the user system is designed, consider the height of the parts so that
components mounted on the user system and the header board do not interfere within range of the
header board as shown in Figure 1.
5.0mm
5.0mm
4-φ3.5mm
119
120
ADAPTER I/F CN1
ADAPTER I/F CN2
119
120
1
2
1
68.0mm
CN1
CN2
CN3
2
13.0mm*
12.1mm
68.0mm
* : The height differs slightly depending on how the YQPACK and the NQPACK are engaged.
Figure 1 Header board dimensions
2
■ MCU Footprint Design Notes
Figure 2 shows the recommended dimensions of the footprint for mounting the NQPACK on the
printed circuit board of the user system.
The printed circuit board of the user system must be designed with due consideration given to this
footprint as well as to the mass production MCU.
For details on the footprint, contact Tokyo Eletech Corporation.
0.65mm × 19 = 12.35mm
0.65mm
7.0mm
19.8mm
φ 3.2mm*2
3 - φ 1.0mm*1
0.65mm × 29 = 18.85mm
2.4mm
0.35mm
2.4mm
No.1 pin
6.0mm
2.4mm
13.8mm
2.4mm
*1 : The positions of the holes (φ1.0mm) for the guide pins when the NQPACK is mounted. These
holes are not needed if the guide pins are not used.
*2 : The position of the screw hole (φ3.2mm) used to affix the IC socket when the
NQPACK100RB179-SL-A (sold separately, manufactured by Tokyo Eletech Corporation) is
mounted. This hole is not needed if the NQPACK100RB179-SL-A is not used.
Figure 2 Recommended dimensions of the footprint for mounting the NQPACK
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4. Connecting to the User System
Mount the attached NQPACK on the user system before using this product.
The header board and adapter board are connected in a stack structure.
■ Connection
1. To connect the header board to the user system, match pin 1 indicated by the index mark (▲) on
the NQPACK mounted on the user system with the index mark (▲) on the header board and then
insert it (see “Figure 3”). The YQPACK pins are thin and easily bent. When you are connecting
the YQPACK to the NQPACK, ensure that the YQPACK pins are not bent before pushing it all
the way into the NQPACK.
2. Insert the screws for securing the header board through the washers into the four holes on the
header board, and then tighten the screws in the opposite corners evenly using the special screw
driver that was included with the NQPACK (see “Figure 4”).
Be careful not to over-tighten the screws as this may result in bad connections.
YQPACK
(mounted on the soldered surface)
119
CN1
120
119
CN2
1
120
CN3
2
1
2
NQPACK index (▲)
Adapter I/F connector 2
Adapter I/F connector 1
Header board index (▲)
Figure 3 Index position
4
Screws for securing
the header board
Header board
Washer
YQPACK
User system
NQPACK
Figure 4 Header board connection
■ Disconnection
To disconnect the header board from the user system, remove all four screws, and then pull the header board straight out of the NQPACK.
5
5. Mounting Mass Production MCUs
To mount a mass production MCU on the user system, use the supplied HQPACK.
■ Mounting
1. To mount a mass production MCU on the user system, match the index mark (▲) on the NQPACK mounted on the user system with the index mark (●) on the mass production MCU.
2. Confirm that the mass production MCU is correctly mounted on the NQPACK, and then align
the index of the HQPACK with the index of the NQPACK (the corner that has a straight-line
notch cut out of it) and insert the HQPACK into the NQPACK (see “Figure 5”).
The HQPACK pins are thin and easily bent. When you are connecting the HQPACK to the NQPACK, ensure that the HQPACK pins are not bent before pushing it all the way into the NQPACK.
3. Insert the screws for securing the HQPACK into the four holes in the HQPACK, and then tighten
the screws in the opposite corners evenly using the special screw driver that was included with
the NQPACK. Be careful not to over-tighten the screws as this may result in bad connections.
Screws for securing HQPACK
HQPACK
Mass production MCU
User system
NQPACK
Figure 5 Mounting a mass production MCU
■ Disconnection
To remove the HQPACK, remove all four screws, and pull the HQPACK straight out of the NQPACK.
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6. Connector Pin Assignment
Tables 1 and 2 list the pin connections for the mass production MCU, the adapter I/F connectors, and
the evaluation MCU on the adapter board.
For detailed pin information for the mass production MCUs, refer to the data sheets or hardware
manuals.
The following notes are related to the tables.
: VDDE
The power supply (VDDE) pin numbers on the evaluation MCU are as follows.
VDDE = C3, E1, K1, T8, V14, V18, K17, A18, D12, D8, U2, U5, R6, V6, R1, R3
The power supply (VDDE) pin numbers on the mass production MCU are as follows.
VDDE = 4, 22, 35, 36, 54, 79
: VSS
The ground (VSS) pin numbers on the evaluation MCU are as follows.
VSS = D1, K4, R8, T12, T16, K15, C16, B12, B8, D4, T3, V3, T6, V7, N2, V1
The ground (VSS) pin numbers on the mass production MCU are as follows.
VSS = 3, 21, 37, 50, 53, 78
“ - ” : Unconnected (open circuit) pins.
*1 :
*2 :
*3 :
*4 :
Unconnected pin : connected to pull-up on the header board via a 100 kΩ resistance.
Connected to analog power supply pin (AVRH2) (pin number 38 for mass production MCU).
Connected to analog power supply pin (AVCC10) (pin number 37 for mass production MCU).
Connected to analog power supply pin (AVSS10) (pin number 39 for mass production MCU).
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Table 1 Pin assignment of adapter I/F connector 1
8
Connector pin
number
Evaluation MCU
pin number
Mass produced
MCU pin number
Connector pin
number
Evaluation MCU
pin number
Mass produced
MCU pin number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
C10
A10
A9
D9
C9
B9
A8
A7
VSS
VCC
C8
VSS
A6
B7
D7
C7
A5
B6
A4
D6
VSS
VCC
C6
B5
A3
B4
D5
C5
A2
B3
VSS
VSS
C4
A1
VSS
VSS
B2
D3
C2
B1
E3
E4
VCC
VCC
D2
E2
C1
F3
F4
F2
VSS
VCC
G3
G4
G2
F1
VSS
G1
VSS
*1
*1
*1
*1
*1
*1
*1
*1
38
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
49
48
80
81
82
83
84
85
86
87
88
*1
*1
*1
10
11
12
13
9
-
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
H4
H3
H2
H1
J2
J4
J3
J1
VCC
VSS
K3
K2
L1
M1
L4
L3
L2
N1
VSS
M2
M4
M3
VSS
VSS
P1
VSS
VSS
VCC
VCC
VSS
VCC
VSS
T4
U3
V2
T5
R5
U4
VCC
VSS
VSS
VCC
U6
V4
V5
T7
R7
U7
VCC
VSS
VSS
VCC
U8
V8
U9
R9
T9
V9
VSS
-
97
98
99
100
1
2
5
6
7
8
*1
*1
*1
*1
*1
*1
45
46
47
51
23
24
25
26
27
28
29
30
31
32
33
34
15
16
17
18
19
20
-
Table 2 Pin assignment of adapter I/F connector 2
Connector pin
number
Evaluation MCU
pin number
Mass produced
MCU pin number
Connector pin
number
Evaluation MCU
pin number
Mass produced
MCU pin number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
D10
B10
A11
B11
C11
D11
A12
A13
VSS
VCC
C12
VSS
VSS
B15
C13
VSS
VSS
A16
B14
VSS
VSS
D13
B13
VSS
VSS
A14
A15
B16
VSS
C15
B17
L18
L17
VCC
VSS
D16
D15
C17
B18
E16
E15
D17
C18
VSS
E17
F16
F15
D18
VSS
F17
E18
G16
G15
G17
F18
H17
H16
VSS
H15
G18
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
76
77
52
*1
*1
68
69
70
71
72
73
74
75
65*3
66*2
67*4
66*2
55
56
57
58
59
60
61
62
63
64
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
H18
J17
J16
J15
J18
K18
K16
VCC
VSS
L16
L15
M18
N18
R18
N17
N15
N16
VSS
M17
M15
M16
P18
R17
P15
P16
U18
T17
R16
U17
T15
VSS
VCC
R15
U16
V17
T14
VSS
R14
U15
V16
U14
T13
R13
V15
U13
VCC
VSS
R12
U12
V13
U11
T11
R11
VSS
V12
V11
U10
T10
R10
V10
*1
*1
*1
*1
*1
*1
66*2
*1
*1
*1
*1
*1
*1
*1
*1
65*3
66*2
67*4
66*2
*1
*1
*1
*1
*1
*1
*1
14
*1
*1
*1
*1
96
95
94
93
92
91
90
89
*1
*1
*1
*1
*1
*1
44
43
42
41
40
39
9
SS01-71141-1E
FUJITSU SEMICONDUCTOR • SUPPORT SYSTEM
DSU-FR EMULATOR
QFP-100P HEADER TYPE 4
MB2198-165-E
OPERATION MANUAL
June 2010 the first edition
Published FUJITSU SEMICONDUCTOR LIMITED
Edited
Sales Promotion Department
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