The following document contains information on Cypress products. FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71141-1E DSU-FR EMULATOR QFP-100P HEADER TYPE 4 MB2198-165-E OPERATION MANUAL PREFACE Thank you for purchasing the QFP-100P*1 header type 4 for the DSU-FR*2 emulator (model number : MB2198-165-E). The MB2198-165-E is used with the adapter unit for connecting to user systems that use the MB91480 (QFP-100P) series of Fujitsu FR microcontrollers, together with the DSU-FR emulator (model number : MB2198-01-E)*3 and DSU-FR cable (model number : MB2198-10-E)*4. The manual explains how to handle the MB2198-165-E. Before using the MB2198-165-E, be sure to read this manual. Please contact the sales or support representative for details on the mass production and evaluation MCU models that can be used with this product. *1 : Uses the FPT-100P-M06 package (lead pitch: 0.65mm, body size: 14mm × 20mm) *2 : FR, the abbreviation of FUJITSU RISC controller, is a line of products of Fujitsu Semiconductor Limited. *3 : Referred to as the “emulator”. *4 : Referred to as the “DSU cable”. ■ Handling and Use Please refer to the following manuals for information about how to handle and use this product and also for details on safety precautions. • • • • DSU-FR EMULATOR MB2198-01-E OPERATION MANUAL DSU-FR EMULATOR DSU-FR CABLE MB2198-10-E OPERATION MANUAL DSU-FR EMULATOR BGA-224P ADAPTER MB2198-160-E OPERATION MANUAL DSU-FR EMULATOR BGA-224P ADAPTER TYPE2 MB2198-160A-E OPERATION MANUAL ■ European RoHS Compliance Products with a -E suffix on the part number are European RoHS compliant products. ■ Notice on this document All information included in this document is current as of the date it is issued. Such information is subject to change without any prior notice. Please confirm the latest relevant information with the sales representatives. ■ Cautions Regarding the Products Described in this Document The following precautions apply to the product described in this document. CAUTION Indicates a feature that, if not used correctly, may result in minor or moderate injuries, and which may cause the customer system to malfunction. Cuts This product has parts with sharp points that are exposed. Do not touch edge of the product with your bare hands. Damage When connect the header board to the user system, correctly position the index mark (▲) on the NQPACK mounted on the user system with the index mark (▲) on the header board, otherwise the emulator system and user system might be damaged. Damage When mounting a mass production MCU, correctly position pin 1, otherwise the mass production MCU and user system might be damaged. i • The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. • The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU SEMICONDUCTOR semiconductor device; FUJITSU SEMICONDUCTOR does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU SEMICONDUCTOR assumes no liability for any damages whatsoever arising out of the use of the information. • Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU SEMICONDUCTOR or any third party or does FUJITSU SEMICONDUCTOR warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU SEMICONDUCTOR assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. • The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU SEMICONDUCTOR will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. • Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. • Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. • The company names and brand names herein are the trademarks or registered trademarks of their respective owners. Copyright ©2010 FUJITSU SEMICONDUCTOR LIMITED All rights reserved ii 1. Checking the Delivered Product Before using the MB2198-165-E, confirm that the following components are included in the box: • QFP-100P Header type 4*1 :1 • Screws for securing the header board (M2 × 10mm, 0.4mm pitch) :4 • Washers :4 • NQPACK100RB179-A*2 :1 3 • HQPACK100RB179* :1 • Operation manual (Japanese version) :1 • Operation manual (English version, this manual) :1 *1 : Referred to as the "header board". A YQPACK100RB-4W (manufactured by Tokyo Eletech Corporation, referred to as the “YQPACK” in this manual) is mounted on the header board. *2 : The IC socket (manufactured by Tokyo Eletech Corporation, referred to as the “NQPACK” in this manual). The NQPACK includes a specialized screw driver and three guide pins. A more reliable compatible socket, the NQPACK100RB179-SL-A (sold separately; manufactured by Tokyo Eletech Corporation), can be used by making a screw hole in the user system board for affixing the IC socket. For more information, contact Tokyo Eletech Corporation. *3 : The IC socket cover (manufactured by Tokyo Eletech Corporation, referred to as the “HQPACK” in this manual). Includes four screws (M2 × 6mm, 0.4mm pitch) for attaching the HQPACK. This product can function as an adapter unit when used in combination with an adapter board (sold separately) (model number : MB2198-160-E or MB2198-160A-E) . The product can also function as an emulator system when used in conjunction with an emulator. For details about the emulators and adapter boards that support this product, contact our Sales Department or Support Department. 2. Handling Precautions The adapter unit is precision-manufactured to improve dimensional accuracy and to ensure reliable contact, and is therefore mechanically weak. Take the following precautions to ensure that the header board is always used correctly in an appropriate environment. • Avoid placing any stress on the NQPACK that is mounted on the user system while the adapter unit is connected. 1 3. Notes on Designing ■ Notes on Printed Circuit Board for the User System If the header board is connected to the user system, the heights of parts mounted in the space around the header board are restricted. When the printed circuit board of the user system is designed, consider the height of the parts so that components mounted on the user system and the header board do not interfere within range of the header board as shown in Figure 1. 5.0mm 5.0mm 4-φ3.5mm 119 120 ADAPTER I/F CN1 ADAPTER I/F CN2 119 120 1 2 1 68.0mm CN1 CN2 CN3 2 13.0mm* 12.1mm 68.0mm * : The height differs slightly depending on how the YQPACK and the NQPACK are engaged. Figure 1 Header board dimensions 2 ■ MCU Footprint Design Notes Figure 2 shows the recommended dimensions of the footprint for mounting the NQPACK on the printed circuit board of the user system. The printed circuit board of the user system must be designed with due consideration given to this footprint as well as to the mass production MCU. For details on the footprint, contact Tokyo Eletech Corporation. 0.65mm × 19 = 12.35mm 0.65mm 7.0mm 19.8mm φ 3.2mm*2 3 - φ 1.0mm*1 0.65mm × 29 = 18.85mm 2.4mm 0.35mm 2.4mm No.1 pin 6.0mm 2.4mm 13.8mm 2.4mm *1 : The positions of the holes (φ1.0mm) for the guide pins when the NQPACK is mounted. These holes are not needed if the guide pins are not used. *2 : The position of the screw hole (φ3.2mm) used to affix the IC socket when the NQPACK100RB179-SL-A (sold separately, manufactured by Tokyo Eletech Corporation) is mounted. This hole is not needed if the NQPACK100RB179-SL-A is not used. Figure 2 Recommended dimensions of the footprint for mounting the NQPACK 3 4. Connecting to the User System Mount the attached NQPACK on the user system before using this product. The header board and adapter board are connected in a stack structure. ■ Connection 1. To connect the header board to the user system, match pin 1 indicated by the index mark (▲) on the NQPACK mounted on the user system with the index mark (▲) on the header board and then insert it (see “Figure 3”). The YQPACK pins are thin and easily bent. When you are connecting the YQPACK to the NQPACK, ensure that the YQPACK pins are not bent before pushing it all the way into the NQPACK. 2. Insert the screws for securing the header board through the washers into the four holes on the header board, and then tighten the screws in the opposite corners evenly using the special screw driver that was included with the NQPACK (see “Figure 4”). Be careful not to over-tighten the screws as this may result in bad connections. YQPACK (mounted on the soldered surface) 119 CN1 120 119 CN2 1 120 CN3 2 1 2 NQPACK index (▲) Adapter I/F connector 2 Adapter I/F connector 1 Header board index (▲) Figure 3 Index position 4 Screws for securing the header board Header board Washer YQPACK User system NQPACK Figure 4 Header board connection ■ Disconnection To disconnect the header board from the user system, remove all four screws, and then pull the header board straight out of the NQPACK. 5 5. Mounting Mass Production MCUs To mount a mass production MCU on the user system, use the supplied HQPACK. ■ Mounting 1. To mount a mass production MCU on the user system, match the index mark (▲) on the NQPACK mounted on the user system with the index mark (●) on the mass production MCU. 2. Confirm that the mass production MCU is correctly mounted on the NQPACK, and then align the index of the HQPACK with the index of the NQPACK (the corner that has a straight-line notch cut out of it) and insert the HQPACK into the NQPACK (see “Figure 5”). The HQPACK pins are thin and easily bent. When you are connecting the HQPACK to the NQPACK, ensure that the HQPACK pins are not bent before pushing it all the way into the NQPACK. 3. Insert the screws for securing the HQPACK into the four holes in the HQPACK, and then tighten the screws in the opposite corners evenly using the special screw driver that was included with the NQPACK. Be careful not to over-tighten the screws as this may result in bad connections. Screws for securing HQPACK HQPACK Mass production MCU User system NQPACK Figure 5 Mounting a mass production MCU ■ Disconnection To remove the HQPACK, remove all four screws, and pull the HQPACK straight out of the NQPACK. 6 6. Connector Pin Assignment Tables 1 and 2 list the pin connections for the mass production MCU, the adapter I/F connectors, and the evaluation MCU on the adapter board. For detailed pin information for the mass production MCUs, refer to the data sheets or hardware manuals. The following notes are related to the tables. : VDDE The power supply (VDDE) pin numbers on the evaluation MCU are as follows. VDDE = C3, E1, K1, T8, V14, V18, K17, A18, D12, D8, U2, U5, R6, V6, R1, R3 The power supply (VDDE) pin numbers on the mass production MCU are as follows. VDDE = 4, 22, 35, 36, 54, 79 : VSS The ground (VSS) pin numbers on the evaluation MCU are as follows. VSS = D1, K4, R8, T12, T16, K15, C16, B12, B8, D4, T3, V3, T6, V7, N2, V1 The ground (VSS) pin numbers on the mass production MCU are as follows. VSS = 3, 21, 37, 50, 53, 78 “ - ” : Unconnected (open circuit) pins. *1 : *2 : *3 : *4 : Unconnected pin : connected to pull-up on the header board via a 100 kΩ resistance. Connected to analog power supply pin (AVRH2) (pin number 38 for mass production MCU). Connected to analog power supply pin (AVCC10) (pin number 37 for mass production MCU). Connected to analog power supply pin (AVSS10) (pin number 39 for mass production MCU). 7 Table 1 Pin assignment of adapter I/F connector 1 8 Connector pin number Evaluation MCU pin number Mass produced MCU pin number Connector pin number Evaluation MCU pin number Mass produced MCU pin number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 C10 A10 A9 D9 C9 B9 A8 A7 VSS VCC C8 VSS A6 B7 D7 C7 A5 B6 A4 D6 VSS VCC C6 B5 A3 B4 D5 C5 A2 B3 VSS VSS C4 A1 VSS VSS B2 D3 C2 B1 E3 E4 VCC VCC D2 E2 C1 F3 F4 F2 VSS VCC G3 G4 G2 F1 VSS G1 VSS *1 *1 *1 *1 *1 *1 *1 *1 38 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 49 48 80 81 82 83 84 85 86 87 88 *1 *1 *1 10 11 12 13 9 - 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 H4 H3 H2 H1 J2 J4 J3 J1 VCC VSS K3 K2 L1 M1 L4 L3 L2 N1 VSS M2 M4 M3 VSS VSS P1 VSS VSS VCC VCC VSS VCC VSS T4 U3 V2 T5 R5 U4 VCC VSS VSS VCC U6 V4 V5 T7 R7 U7 VCC VSS VSS VCC U8 V8 U9 R9 T9 V9 VSS - 97 98 99 100 1 2 5 6 7 8 *1 *1 *1 *1 *1 *1 45 46 47 51 23 24 25 26 27 28 29 30 31 32 33 34 15 16 17 18 19 20 - Table 2 Pin assignment of adapter I/F connector 2 Connector pin number Evaluation MCU pin number Mass produced MCU pin number Connector pin number Evaluation MCU pin number Mass produced MCU pin number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 D10 B10 A11 B11 C11 D11 A12 A13 VSS VCC C12 VSS VSS B15 C13 VSS VSS A16 B14 VSS VSS D13 B13 VSS VSS A14 A15 B16 VSS C15 B17 L18 L17 VCC VSS D16 D15 C17 B18 E16 E15 D17 C18 VSS E17 F16 F15 D18 VSS F17 E18 G16 G15 G17 F18 H17 H16 VSS H15 G18 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 76 77 52 *1 *1 68 69 70 71 72 73 74 75 65*3 66*2 67*4 66*2 55 56 57 58 59 60 61 62 63 64 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 H18 J17 J16 J15 J18 K18 K16 VCC VSS L16 L15 M18 N18 R18 N17 N15 N16 VSS M17 M15 M16 P18 R17 P15 P16 U18 T17 R16 U17 T15 VSS VCC R15 U16 V17 T14 VSS R14 U15 V16 U14 T13 R13 V15 U13 VCC VSS R12 U12 V13 U11 T11 R11 VSS V12 V11 U10 T10 R10 V10 *1 *1 *1 *1 *1 *1 66*2 *1 *1 *1 *1 *1 *1 *1 *1 65*3 66*2 67*4 66*2 *1 *1 *1 *1 *1 *1 *1 14 *1 *1 *1 *1 96 95 94 93 92 91 90 89 *1 *1 *1 *1 *1 *1 44 43 42 41 40 39 9 SS01-71141-1E FUJITSU SEMICONDUCTOR • SUPPORT SYSTEM DSU-FR EMULATOR QFP-100P HEADER TYPE 4 MB2198-165-E OPERATION MANUAL June 2010 the first edition Published FUJITSU SEMICONDUCTOR LIMITED Edited Sales Promotion Department