Package Migration Between 3.0V Floating Gate and MirrorBit® Flash Devices Application Note 1. Introduction This application note illustrates migration options between 3V single bit Floating Gate and 3V MirrorBit® devices. Each drawing shows at least one migration path. A “migration path” is a logical progression from one density to another within a group of devices sharing a common voltage range, architecture, bus width. All drawings show the top view of packages. Publication Number Package_Migration_3V_FG_MirrorBit_AN Revision 01 Issue Date March 14, 2011 A pplication Note 2. 48-Pin TSOP: 3.0 Volt x8/x16 or x16-Only Devices 3V Standard 3V Sim R/W 3V MirrorBit S29GL064N (06, 07, V6, V7) S29AL032D (03, 04) S29JL064J S29GL064N (03, 04) S29JL032J S29GL032N (03, 04) S29AL016J A15 A14 A13 A12 A11 A10 A9 A8 A21 A20 WE# RESET# ACC WP# A19 A18 A17 A7 A6 A5 A4 A3 A2 A1 A15 A14 A13 A12 A11 A10 A9 A8 A19 A20 WE# RESET# A21 WP#/ACC RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 A15 A14 A13 A12 A11 A10 A9 A8 A19 A20 WE# RESET# NC WP#/ACC RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 A15 A14 A13 A12 A11 A10 A9 A8 NC WE# RESET# NC WP# RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48-Pin TSOP 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# VSS DQ15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0 A16 VIO VSS DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0 S29AL016J A19 S29AL008J NC Note: The S29GL064N Models 06, 07, V6, and V7 are x16-bit only devices. 2 Package_Migration_3V_FG_MirrorBit_AN_01 March 14, 2011 App l ic atio n 3. No t e 56-Pin TSOP: 3.0 Volt x8/x16 Devices 3V MirrorBit S29GL01P S29GL512P S29GL256P S29GL128P S29GL064N (01, 02, V1, V2) S29GL032N (01, 02, V1, V2) A23 A22 A15 A14 A13 A12 A11 A10 A9 A8 A19 A20 WE# RESET# A21 WP#/ACC RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 NC NC NC A22 A15 A14 A13 A12 A11 A10 A9 A8 A19 A20 WE# RESET# A21 WP#/ACC RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 NC NC NC NC NC NC A15 A15 A14 A14 A13 A13 A12 A12 A11 A11 A10 A10 A9 A9 A8 A8 A19 A19 A20 A20 WE# WE# RESET# RESET# A21 NC WP#/ACC WP#/ACC RY/BY# RY/BY# A18 A18 A17 A17 A7 A7 A6 A6 A5 A5 A4 A4 A3 A3 A2 A2 A1 A1 NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56-Pin TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48-Pin TSOP (Note) 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 NC NC A16 BYTE# VSS DQ15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0 NC VIO A24 NC A16 BYTE# VSS DQ15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0 NC VIO A24 A25 A16 BYTE# VSS DQ15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0 NC VIO Note: 1. Only S29GL032N and S29GL064N Models 03 and 04 are offered in 48-pin TSOP packages. March 14, 2011 Package_Migration_3V_FG_MirrorBit_AN_01 3 A pplication 4. Note 64-Ball Fortified BGA: 3.0 Volt x8/x16 Devices Top view shown, with balls facing down. 64-ball Grid Array A B C B 8 C D D E E 6 5 4 3 G G H H 6 NC 7 F F NC VSS 5 A13 A12 A14 A15 A16 BYTE# D15/A-1 VSS A9 A8 A10 A11 D7 D14 D13 D6 WE# RST A19 D5 D12 VCC D4 RY/BY# ACC/WP# A18 D2 D10 D11 D3 A7 A17 A6 A5 D0 D8 D9 D1 A3 A4 A2 A1 A0 CE# OE# VSS NC NC NC 4 3 2 1 2 1 NC 3V Standard 3V MirrorBit S29AL016J 4 NC B8 B1 C8 C5 D8 D4 F1 F8 G8 Package Body NC NC NC NC NC NC NC NC NC 9 x 9 mm 9 x 9 mm S29GL032N NC NC NC NC VIO A20 VIO NC NC S29GL064N NC NC NC A21 VIO A20 VIO NC NC 9 x 9 mm S29GL128P A22 NC NC A21 VIO A20 VIO NC NC 13 x 11 mm S29GL256P A22 NC A23 A21 VIO A20 VIO NC NC 13 x 11 mm S29GL512P A22 NC A23 A21 VIO A20 VIO A24 NC 13 x 11 mm S29GL01GP A22 NC A23 A21 VIO A20 VIO A24 A25 13 x 11 mm S70GL02GP A22 A26 A23 A21 VIO A20 VIO A24 A25 13 x 11 mm Package_Migration_3V_FG_MirrorBit_AN_01 March 14, 2011 App l ic atio n 5. No t e 48-Ball FBGA: 3.0 Volt x8/x16 or x16-Only Devices Top view shown, with balls facing down. All grid arrays have 0.8 mm pitch. 48-ball Grid Array A B C D E F G H 6 VSS A13 A12 A14 A15 A16 A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6 WE# RESET# DQ5 DQ12 VCC DQ4 DQ2 DQ10 DQ11 DQ3 5 4 3 RY/BY# 2 A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1 A3 A4 A2 A1 A0 CE# OE# VSS 1 B3 C3 C4 D4 D3 F6 G6 Package Body S29AL008J WP # A18 NC NC NC BYTE# DQ15/A-1 8.15 x 6.15 mm S29AL016J WP# A18 NC A19 NC BYTE# DQ15/A-1 8.15 x 6.15 mm WP#/ ACC A18 NC A19 A20 BYTE# DQ15/A-1 8.15 x 6.15 mm WP#/ ACC A18 NC A19 A20 NC DQ15 8.15 x 6.15 mm WP#/ ACC A18 A21 A19 A20 BYTE# DQ15/A-1 8.15 x 6.15 mm WP#/ ACC A18 A21 A19 A20 NC DQ15 8.15 x 6.15 mm 3V Standard 3V Sim R/W A29AL032D (1) S29JL032J 3V MirrorBit S29GL032N S29PL032J (2) S29JL064J S29PL064J (2) S29GL064N Notes: 1. S29AL032D Model 03, 04 with Package Body is 10 x 6 mm. 2. S29PL032J and S29PL064J are x16-bit only devices. March 14, 2011 Package_Migration_3V_FG_MirrorBit_AN_01 5 A pplication Note 6. Revision History Section Description Revision 01 (March 14, 2011) Initial release 6 Package_Migration_3V_FG_MirrorBit_AN_01 March 14, 2011 App l ic atio n No t e Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright © 2011 Spansion Inc. All rights reserved. Spansion®, the Spansion Logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™, EcoRAM™ and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners. March 14, 2011 Package_Migration_3V_FG_MirrorBit_AN_01 7