handling instruction

Handling Instructions
for flowSCREW 2 packages
Date:
09.07.2015
Revision:
Created by:
Zs. Gyimóthy
Rev. 01
Proprietary data, company confidential. All rights reserved.
Table of Contents
1
General instructions ........................................................................................... 5
2
Specification for the driver PCB ........................................................................... 6
2.1
Specification for mounting the module to the PCB .................................................. 6
2.2
Required PCB cutouts for screwing holes .............................................................. 6
3
Specifications for baseplate ................................................................................. 7
4
Specifications for heat sink ................................................................................. 8
5
Specification for thermal interface materials.......................................................... 9
6
Specifications for fastening screws to the heat sink ................................................ 9
7
Specification for fastening main terminals to bus bars ............................................ 9
8
Recommendation for soldering ...........................................................................10
8.1
Wave soldering of modules with solder pins .........................................................10
8.2
Hand soldering parameters ................................................................................10
9
ESD protection .................................................................................................11
10
Environmental conditions ...................................................................................11
10.1
Parameters of environment classes .....................................................................11
10.1.1
Climatic conditions ............................................................................................11
10.1.2
Biological conditions ..........................................................................................12
10.1.3
Chemically active substances .............................................................................12
10.1.4
Mechanically active substances ...........................................................................13
10.1.5
Mechanical Conditions .......................................................................................13
11
Disclaimer .......................................................................................................14
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Table of Figures
Figure 1: flowSCREW 2 module with driver connector ........................................................ 5
Figure 2: flowSCREW 2 module with driver pins mounted into driver PCB ............................. 5
Figure 3: PCB cutouts .................................................................................................... 6
Figure 4: Scratch dimensions .......................................................................................... 7
Figure 5: Polished surface............................................................................................... 8
Figure 6: Surface discoloration ........................................................................................ 8
Figure 7: Fingerprint on the surface ................................................................................. 8
Figure 8: The directions of the allowed forces ................................................................... 9
Figure 9: Platedthrough hole, good soldering .................................................................. 10
Figure 10: Typical profile for wave soldering ................................................................... 10
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Revision History
Date
09.07.2015
Revision
Level
01
Description
Page
Number(s)
New document
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Rev. 01
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1
General instructions
Figure 1 shows the basic structure of the flowSCREW 2 type module that is attached to a heat
sink. Electrical connections between the module and driver PCB are via connector. Fasten main
terminals to bus bars using the screw types specified in section 7. Figure 2 shows the basic
structure of the flowSCREW 2 with mid. PCB type module that is attached to a heat sink with
the driver PCB mounted on the top of the module. Electrical connections between the module
and driver PCB (driver pins and mid. PCB connection, see Figure 2) are made by soldering.
Figure 1: flowSCREW 2 module with driver connector
Figure 2: flowSCREW 2 with mid. PCB module mounted into driver PCB
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2
Specification for the driver PCB

Printed board material must comply with IEC 61249-2-7.

There is no limit as to the maximum number of conductive layers.
2.1





2.2
Specification for mounting the module to the PCB
The driver PCB attaches to the module with four (depends on the module type)
BN82428 type screws (D=2.5 mm and L=6 mm).
After screwing all pins must be soldered into the PCB
During assembly, at module temperature of 25 °C, the pins should not be drawn or
pushed over ± 0.2 mm or loaded with bigger force than 35 N.
At substrate-temperature of 100 °C the load of the pin should not exceed ± 5 N.
Vibration stress on pin is not allowed.
Required PCB cutouts for screwing holes
Figure 3: PCB cutouts
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3
Specifications for baseplate
The thermal properties are not affected if the dimensions of the surface imperfections are
within the following values.


Polishing is allowed on the whole nickel plated surface if copper doesn’t become visible.
If copper becomes visible, the unit is scratched and following acceptance criteria should
be used. The depth and width of the scratch can’t exceed 200 μm and 800 μm,
respectively. The length of the scratch does not matter but the total area of scratches
must not exceed 5 % of the total substrate surface.
Discolorations and fingerprints are only surface imperfections and do not affect the module's
functionality.
Substrate surface imperfections can be seen on the figures below.
Figure 4: Scratch dimensions
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Figure 5: Polished surface
Figure 6: Surface discoloration
Figure 7: Fingerprint on the surface
4
Specifications for heat sink
The whole heat sink surface under the module must be plane, clean and free of particles.

The flatness tolerance should be: < 50 µm in general.
(A flatness tolerance specifies a tolerance zone defined by two parallel planes within
which the surface must lie.)


The surface roughness should be less than: Rz < 10 µm.
Heat sink surface imperfections should be within the values described for the module
baseplate surface (please refer to section 3 Specifications for baseplate).
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5
Specification for thermal interface materials




6
The recommended means of applying paste is screen printing.
Apply a homogeneous layer of thermal conductive paste over the whole backside of the
module, with a roller or spatula, or via screen printing.
The recommended thermal paste thickness is 75 µm ± 25 µm.
Thermal paste thicker than recommended will increase thermal resistance ( Rth).
Specifications for fastening screws to the heat sink






7
Screws M5 (recommended screw type DIN 7984)
Flat washer D=max. 10 mm ISO 7092 (DIN 433)
Spring washer D=max. 10 mm (DIN127 or DIN 128)
Mounting torque: 3.8 Nm < Ma < 4.2 Nm
Maximum height of screw head plus washers: h=7mm
Maximal force between the PCB, the housing and the baseplate should not exceed
150 N at 25 °C for short time and continuously not more than 50 N at 100 °C max.
Specification for fastening main terminals to bus bars





M6 screw, L=10 mm
Mounting torque: 6.7 Nm < Ma < 7.4 Nm
Flat washer: ISO 7092 (DIN 433)
Spring washer: DIN127 or DIN 128
The allowed pulling forces for the main terminals
Directions
Maximum allowed force [N]
X-direction
100
Y-direction
100
Z-direction
100
-Z-direction
500
Figure 8: The directions of the allowed forces
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8
Recommendation for soldering
Figure 9: Platedthrough hole, good soldering
Plated through holes should exhibit a vertical solder fill of 100 %, with a fully formed fillet on
the solder side and evidence of 100 % wetting on the component side lead, barrel and pad.
8.1
Wave soldering of modules with solder pins
T
T3
T2
T1
t1
t2 t3 t4
t
Figure 10: Typical profile for wave soldering
8.2



Hand soldering parameters
Max. solder iron temperature:
350 °C
Max. contact time with component lead: 10 s
Number of heat cycles:
3
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9
ESD protection
Modules are sensitive to electrostatic discharge which can damage or destroy sensitive
semiconductors. All modules are ESD protected in the shipment box by semi conductive plastic
trays. During the handling and assembly of the modules it is recommended to wear a
conductive grounded wrist band and ensure a conductive grounded working place.
The modules have the following ESD sensitivity levels according the ESD Association
classification:
ESD STM5.1-1998 Human Body Model:
Class 0
ESD STM5.2-1999 Machine Model:
Class M1
ESD STM5.3.1-1999 Charged Device Model:
Class C1
Please take into consideration the following standards for handling electrostatic-sensitive
devices: EN61340-5-1, ANSI S20.20
10
Environmental conditions
The modules can be subjected to environmental conditions characterized by the following
classes:
Storage:
1K2 / 1B1 / 1C1 / 1S2 / 1M2
Transportation:
2K2 / 2B1 / 2C1 / 2S1 / 2M2
These classes are defined in the IEC 60721-3-1 and IEC 60721-3-2 standards. The modules
with wire pins have 1 year shelf life with the given storage conditions.
Flammability classification of the plastic material for flowSCREW 2 are V-0 and 5-VA (selfextinguishing, no dripping of flaming particles) according to UL 94, IEC 60695-11-10 and
IEC 60695-11-20 test methods.
10.1
Parameters of environment classes
The parameters detailed below are for informative purposes only. This section does not
substitute the above mentioned standards. Please read the IEC 60721-3-1 and IEC 60721-3-2
standards for the description of the environment classes.
10.1.1 Climatic conditions
1K2
Air temperature:
5 °C to 40 °C
Humidity:
5 % to 85 % RH but max. 1 g/m3 to 25 g/m3 absolute
Rate of change of temperature:
0.5 °C/min
Air pressure:
70 kPa to 106 kPa
Solar radiation:
700 W/m2
Movement of surrounding air:
1 m/s
Condensation:
No
Precipitation:
No
Water from other sources than rain:
No
Formation of ice and frost:
No
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2K2
Temperature:
−25 °C to 60 °C
Change of temperature air/air:
±25 °C
Relative humidity not combined
with rapid temperature changes:
max. 75 % (at 30 °C temperature)
Relative humidity combined
with rapid temperature changes:
No
Low air pressure:
70 kPa
Change of air pressure:
No
Solar radiation:
700 W/m2
Movement of surrounding air:
No
Precipitation:
No
Heat radiation:
No
Water from other sources than rain:
No
Wetness:
No
10.1.2 Biological conditions
1B1
Flora and fauna:
Negligible
2B1
Flora and fauna:
No
10.1.3 Chemically active substances
1C1
Sea and road salts:
No (Salt mist may be present in sheltered locations of coastal areas.)
Sulphur dioxide:
0.1 mg/m3
Hydrogen sulphide:
0.01 mg/m3
Chlorine:
0.01 mg/m3
Hydrogen chloride:
0.01 mg/m3
Hydrogen fluoride:
0.003 mg/m3
Ammonia:
0.3 mg/m3
Ozone:
0.01 mg/m3
Nitrogen oxides:
0.1 mg/m3 (Expressed in equivalent values of Nitrogen dioxide.)
2C2
Sea salts:
none
Sulphur dioxide:
0.1 mg/m3
Hydrogen sulphide:
0.01 mg/m3
Nitrogen oxides:
0.1 mg/m3 (Expressed in the equivalent values of Nitrogen dioxide.)
Ozone:
0.01 mg/m3
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Hydrogen chloride:
0.1 mg/m3
Hydrogen fluoride:
0.003 mg/m3
Ammonia:
0.3 mg/m3
10.1.4 Mechanically active substances
1S2
Sand:
30 mg/m3
Dust (suspension):
0.2 mg/m3
Dust (sedimentation):
1.5 mg/(m2h)
2S1
Sand in air:
No
Dust (sedimentation):
No
10.1.5 Mechanical Conditions
1M2
Stationary vibration, sinusoidal
Frequency range:
displacement amplitude:
Frequency range:
peak acceleration:
2 Hz to 9 Hz
1.5 mm
9 Hz to 200 Hz
5 m/s2
Non stationary vibration, including shock
Shock response spectrum type L
peak acceleration:
40 m/s2
Static load:
5 kPa
2M2
Stationary vibration, sinusoidal
Frequency range:
2 Hz to 9 Hz
displacement amplitude:
3.5 mm
Frequency range:
peak acceleration:
9 Hz to 200 Hz
10 m/s2
Frequency range:
peak acceleration:
200 Hz to 500 Hz
15 m/s2
Stationary vibration, random
Acceleration
spectral density:
1 m2/s3
Frequency range:
10 Hz to 200 Hz
and
Acceleration
spectral density:
0.3 m2/s3
Frequency range:
200 Hz to 2000 Hz
The later range can be neglected transporting with vehicles with high damping.
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Non stationary vibration, including shock
Shock response spectrum type I.
peak acceleration:
100 m/s2
and
Shock response spectrum type II.
peak acceleration:
300 m/s2
Free fall
1.2 m (mass of the object is less than or equal to 20 kg)
or
1 m (mass of the object is between 20 kg and 100 kg)
or
0.25 m (mass of the object is higher than or equal to 100 kg)
Toppling
Around any of the edges.
Rolling, pitching
Angle:
±35°
Period:
8s
35° may occur for short time periods but 22.5° may persist permanently.
Acceleration
Static load
11
20 m/s2
10 kPa
Disclaimer
The information and recommendations in this document are based on standards and common
engineering practices. Customer specific applications and specifications may require additional
processes and tests that may supersede those recommended in this document.
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