32 QFNS Pb-Free Device Material Content

Assembly: ASEM
Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
January, 2016
% of Total
Pkg. Wt.
Weight (g)
Die
0.36%
0.00026
Mold
46.61%
0.03352
Die attach
Wire
0.06%
0.36%
32 QFNS
0.072
Grams
% of Total
Pkg. Wt.
Weight (g)
with matte Sn Plating
ICE40LP
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Die size: 1.04 x 1.07 mm
55.79%
3.17%
3.17%
1.11%
0.16%
0.03347
0.00190
0.00190
0.00067
0.00010
Silica (fused)
Epoxy Resin
Phenol Resin
Metal Hydroxide
Carbon Black
60676-86-0
1333-86-4
Mold Compound: Sumitomo EME-G770
75 to 95% Fused silica filler (LSC uses 88% in our calculation)
2 to 10% Epoxy resin (LSC uses 5% in our calculation)
2 to 10% Phenol resin (LSC uses 5% in our calculation)
1 to 2% Metal Hydroxide (LSC uses 1.75% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.25% in our calculation)
0.01%
0.01%
0.00%
0.04%
0.000006
0.000006
0.000002
0.00003
Epoxy Resin
Phenol Resin
SiO2 Filler
(Meta)Acrylic Copolymer
99439-28-8
-
Die attach (tape): Hitachi FH-900 HR-9004 series
15%
15%
5%
65%
0.355%
0.006%
0.00026
0.000005
Copper (Cu)
Palladium (Pd)
7440-50-8
7440-05-3
Pd coated Cu - Assume 1 wire per lead
98.25%
1.75%
Tin (Sn)
7440-31-5
Tin plating is 400 to 800 microinches (LSC uses 600 microinches in our calculation)
Copper (Cu)
Iron (Fe)
Phosphorus (P)
Zinc (Zn)
7440-50-8
7439-89-6
7723-14-0
7440-66-6
C194
97.46%
2.35%
0.07%
0.12%
0.00004
0.00026
Plating
3.91%
0.00281
Leadframe
48.71%
0.03503
Notes / Assumptions:
47.48%
1.14%
0.03%
0.06%
0.03414
0.00082
0.00002
0.00004
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. D
Assembly: Unisem
Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
32 QFNS
Package:
Total Device Weight 0.1126
Grams
January, 2016
% of Total
Pkg. Wt.
Weight (g)
Die
1.70%
0.00192
Mold
68.90%
0.07760
Die attach
0.43%
% of Total
Pkg. Wt.
Weight (g)
with matte Sn Plating
PAC-POWR, PAC-CLK
MSL: 1
Peak Reflow Temp: 260°C
Substance
CAS #
Notes / Assumptions:
Silicon chip
7440-21-3
Die size: 1.80 x 1.75 x 0.254 mm
55.79%
3.17%
3.17%
1.11%
0.16%
0.03347
0.00190
0.00190
0.00067
0.00010
Silica (fused)
Epoxy Resin
Phenol Resin
Metal Hydroxide
Carbon Black
60676-86-0
1333-86-4
Mold Compound: Sumitomo G770
75 to 95% Fused silica filler (LSC uses 88% in our calculation)
2 to 10% Epoxy resin (LSC uses 5% in our calculation)
2 to 10% Phenol resin (LSC uses 5% in our calculation)
1 to 2% Metal Hydroxide (LSC uses 1.75% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.25% in our calculation)
0.32%
0.04%
0.06%
0.00036
0.00005
0.00007
Silver (Ag)
Epoxy Resin A
Organic esters and resins
7440-22-4
9003-36-5
-
Die attach epoxy: Sumitomo CRM1066 series
75.00%
10.00%
15.00%
0.00048
Wire
0.38%
0.00043
Gold (Au)
7440-57-5
1.0mil diameter. Assume 1 wire per lead
Plating
1.24%
0.00140
Tin (Sn)
7440-31-5
Tin plating is 400 to 800 microinches (LSC uses 600 microinches in our calculation)
Leadframe
27.35%
0.03080
Copper
Iron
Phosphorus
Zinc
Silver
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-22-4
A194
97.50%
2.19%
0.08%
0.12%
0.12%
26.66%
0.60%
0.02%
0.03%
0.03%
0.03003
0.00067
0.00002
0.00004
0.00004
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. D
Assembly: ASET
Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
January, 2016
% of Total
Pkg. Wt.
Weight (g)
Die
3.68%
0.0021
Mold
68.05%
0.0380
Die attach
0.64%
32 QFNS
0.056
Grams
% of Total
Pkg. Wt.
Weight (g)
with matte Sn Plating
LCMXO2
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 1.88 x 1.88 mm
5.44%
5.44%
47.63%
6.80%
2.04%
0.68%
0.0030
0.0030
0.0266
0.0038
0.0011
0.0004
Epoxy Resin
Phenol Resin
Silica(Amorphous) A
Silica(Amorphous) B
Metal Hydroxide
Carbon Black
60676-86-0
7631-86-9
1333-86-4
Mold Compound: Sumitomo G631H
8.00%
8.00%
70.00%
10.00%
3.00%
1.00%
0.10%
0.10%
0.03%
0.42%
0.00005
0.00005
0.00002
0.00023
Epoxy Resin
Phenol Resin
SiO2 Filler
(Meta)Acrylic Copolymer
99439-28-8
-
Die attach (tape): Hitachi FH-900 HR-9004 series
15%
15%
5%
65%
0.0004
Wire
1.29%
0.0007
Gold (Au)
7440-57-5
Assume 1 wire per lead
Plating
0.60%
0.0003
Tin (Sn)
7440-31-5
Tin plating is 400 to 800 microinches (LSC uses 600 microinches in our calculation)
Leadframe
33.07%
0.0185
Copper (Cu)
Iron (Fe)
Phosphorus (P)
Zinc (Zn)
7440-50-8
7439-89-6
7723-14-0
7440-66-6
C194
97.46%
2.35%
0.07%
0.12%
32.23%
0.78%
0.02%
0.04%
0.01802
0.00043
0.00001
0.00002
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. D
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