Application guide for USB 3.1 Protected connection for mobile devices TrEOS Protection – ESD protection without compromise A new technology delivering the ideal combination of low capacitance, high ESD robustness and low clamping voltage. Supporting high-speed data lines including USB3.1 at 10 Gbps. Protecting very sensitive system chips. Safeguard your system now and in the future with TrEOS Protection devices – from NXP, the global leader in ESD protection. More information on the following pages and www.nxp.com/circuit-protection Introducing USB The Universal Serial Bus (USB), one of the industry’s most widely used standard for data transfer This application guide covers: Solutions for USB ESD protection (USB 3.1, 2.0, Supply voltage configuration) ..................................................……................ p 4 ESD protection for the new Type-C connector ..................................................……................ p 8 Optimizing ESD protection for USB 3.1 ................................................……................ p 12 Common Mode filters for USB 2.0 and 3.0 ................................................……................ p 17 Standard Name Introduction year Max. data rate (Gbps) Max. data rate (Gbps) USB 3.1 SuperSpeed USB 10 Gbps 2013 10 Offers up to 10 Gbps on the same hardware as USB 3.0 5 Adds two differential line pairs to USB 2.0 for a 10x speed increase while keeping connections backward compatible 0.48 Uses one differential line pair and is upward compatible with USB 3.x. Still, the most widely used version of USB. USB 3.0 USB 2.0 SuperSpeed USB Hi-Speed USB 2008 2000 3 Solutions for USB ESD protection Package Size (LxBxH) 6 bidirectional 0.15 15 7 1x Tx+/-, Rx+/-, D +/- DFN2111-7 2.1 x 1.1 x 0.48 TrEOS Protection: Extremely low clamping (Rdyn=0.4 Ohm, very deep snap-back) PUSB3FR6 6 unidirectional 0.35 15 7 1x Tx+/-, Rx+/-, D +/- DFN2111-7 2.1 x 1.1 x 0.48 TrEOS Protection: Extremely low clamping (Rdyn=0.29 Ohm, extremely deep snap-back) PUSB3FR4 4 unidirectional 0.29 15 7 1x Tx+/-, Rx+/-, D +/- DFN2510A-10 2.5 x 1.0 x 0.48 TrEOS Protection: Extremely low clamping (Rdyn=0.27 Ohm, extremely deep snap-back) PESD5V0C1BSF 1 bidirectional 0.19 20 9 6x Tx+/-, Rx+/-, D +/- DSN0603-2 0.6 x 0.3 x 0.3 TrEOS Protection: Extremely low clamping (Rdyn=0.2 Ohm, very deep snap-back) PESD5V0C1USF 1 unidirectional 0.35 20 9 6x Tx+/-, Rx+/-, D +/- DSN0603-2 0.6 x 0.3 x 0.3 TrEOS Protection: Extremely low clamping (Rdyn=0.09 Ohm, extremely deep snap-back) PESD5V0H1BSF 1 bidirectional 0.14 15 7 6x Tx+/-, Rx+/-, D +/- DSN0603-2 0.6 x 0.3 x 0.3 TrEOS Protection: Extremely low clamping (Rdyn=0.2 Ohm, very deep snap-back) PESD5V0R1BSF 1 bidirectional 0.10 10 4.5 6 x Tx+/-, Rx+/-, D +/- DSN0603-2 0.6 x 0.3 x 0.3 TrEOS Protection: Extremely low clamping (Rdyn=0.45 Ohm, very deep snap-back) Remarks Needed for one Type-A port PUSB3AB6 Can be used for 8/20 IPP (A) USB 2.0 D+/- ESD ruggedness contact (kV) USB 3.1 R x # of protected lines USB 3.1 T x Device USB 3.1 uses the two additional line pairs associated with USB 3.0, but at double the data rate of 10 Gbps. To meet the requirements for signal integrity, the capacitance of ESD protection devices needs to be even lower. Capacitance (pF) typ @ 1.5 V Protecting SuperSpeed USB 3.1 4 Solutions for USB ESD protection Protecting Hi-Speed USB 2.0 Capacitance (pF) Needed for one port Package Size (LxBxH) (mm) VCC Can be used for D+ D- Number of protected lines GND Device USB 2.0 uses one differential line pair, the supply voltage, and a GND connection. Both lines of the differential pair can be protected by discrete ESD protection diodes or by an integrated array of protection diodes. PESD5V0C1USF 1 unidirectional D+, D- 0.3 2x DSN0603-2 0.6 x 0.3 x 0.3 PESD5V0UX1BCAL 1 bidirectional D+, D- 1 2x DFN1006-2 1.0 x 0.6 x 0.37 PESD5V0X1U(A)B 1 unidirectional D+, D- 0.95 (1.55) 2x SOT523 1.0 x 0.6 x 0.48 PESD5V0X2U(A)MB 2 unidirectional D+, D- 1 1x DFN1006-3 1.0 x 0.6 x 0.48 IP4369CX4 2 unidirectional D+, D- 0.8 1x WLCSP4 0.76 x 0.76 x 0.47 PUSB2X4Y 4 unidirectional D+, D- 0.8 Covers 2 ports SOT363 2.0 x 1.25 x 0.95 PUSB2X4D 4 unidirectional D+, D- 0.8 Covers 2 ports SOT457 2.9 x 1.5 x 1.0 5 Solutions for USB ESD protection VRWM (V) Package Size (LxBxH) (mm) Please visit www.nxp.com for NXP‘s entire portfolio of TVS protection devices PPPM (W) 10/1000 Vbus Number of lines The new USB 3.1 standard introduces higher power options. Power supply capacitors can be large, to support larger, more robust diodes. NXP offers a wide portfolio of power ratings to cover different regional requirements. NXP recommends protecting Vbus with dedicated devices. Series Protecting the supply voltage PTVSxZ1USK 1 200 5 to 26 DSN1608-2 1.6 x 0.8 x 0.25 PTVSxU1UPA 1 300 5 to 26 DFN2020-3 2.0 x 2.0 x 0.65 PTVSxS1UR 1 400 3.3 to 64 SOD123W 3.5 x 1.7 x 1.0 PTVSxP1UP 1 600 3.3 to 64 SOD128 4.7 x 2.5 x 1.0 6 Solutions for USB ESD protection Options for configuring USB 3.1 ESD protection PUSB3FR6, PUSB3AB6 PUSB3FR4 PUSB2X4x PUSBMxX4-TL PESD5V0X2U(A)MB USB 3.1 ports come always with USB 2.0 lines for downward compatibility IP3319CX6 To USB controller +5V C2 A1 A2 B1 PTVS… B2 C2 1 C1 IP3319CX6 C1 Micro USB connector Type B ESD protection and Common Mode Filtering 7 ESD protection for the new Type-C connector The new Type-C connector …was introduced as a part of the new USB 3.1 specification. USB Type-C plug …will make USB 3.x very attractive for portable devices: } V ery small outline } C onnector can be plugged in using either orientation } H igher charging currents possible } E liminates the need for a second data connector USB Type-C receptacle 8 Connector Connector can be plugged in using either orientation Connector Receptacle Receptacle ESD protection for the new Type-C connector Receptacle front view 9 ESD protection for the new Type-C connector Recommended devices for different pinout groups (receptacle front view) Device Function # of lines PUSB3FR4 ESD protection 4 PUSB3FR6 ESD protection 6 PESD5V0H1BSF ESD protection 1 PESD5V0H1USF ESD protection 1 PCMF1USB3S Common Mode Filter + ESD 2 PCMF2USB3S Common Mode Filter + ESD 4 PCMF3USB3S Common Mode Filter + ESD 6 PESD2USB3S ESD protection 2 PESD3USB3S ESD protection 6 VBUS: PTVS series, see page 6 SuperSpeed Differential Tx pair HighSpeed 2 x Differential pairs Side-Band Usage (SBU): Alternate Modes (other standards over USB) and Audio Adapter Accessory Mode. SuperSpeed Differential Rx pair Communication Channel (CC): Determination of plug orientation, host-to-device relationship, set up and manage power options Device Function # of lines IP4283CZ10-TBR ESD protection 4 PESD5V0V2BM ESD protection 2 PESD5V0X2UAM ESD protection 2 PESD5V0X1BCAL ESD protection 1 PESD5V0S1USF ESD protection 1 10 ESD protection for the new Type-C connector PUSB3FR6 for Type-C connector PTVS - diode. NXP offers a wide portfolio of Power Ratings to cover different regional requirements. To support customers, NXP offers exemplary board layouts with Gerber files. The total USB Type-C ecosystem from NXP includes microcontrollers, high speed switches, USB3 redrivers, ESD protection and filtering devices, USB PD PHY, CC logic controllers, authentication, load switches, AC/DC power solutions, MOSFETs and more. To learn more, please visit www.nxp.com/usb-type-c. 11 Optimizing ESD protection for USB 3.1: signal integrity Eye diagrams Rectangular differential signals are applied to the Device-Under-Test (DUT) An overlay of sweeps of different 0-1 and 1-0 transitions is shown in the eye diagram: } T he outgoing signal of a perfect system is rectangular } D ue to imperfections and suppression of higher harmonics, the flattened signal looks like an eye – hence the name of the measurement } A mask, that surrounds the eye but is not touched by it, defines the maximum allowed signal degradation that is acceptable to all receivers } D ifferential signals are measured after a comparator USB 3.1 10 Gbps USB 3.1 5 Gbps USB 2.0 12 Optimizing system-level ESD protection for USB 3.1 Protection of the SoC With system-level ESD protection, the greater part of an ESD pulse is kept away from the protected System-on-Chip (SoC) and signal integrity is maintained for all frequencies used in the application. System-level protection can be improved by providing fast diode reaction time, low dynamic resistance, and deep snap-back. An eye diagram for the highest frequency used by the application will show the signal integrity also with onboard. System-level test } S tresses the pins with an ESD gun until an increase in leakage current shows signs of failure which is the most straight forward way to measure system-level robustness } I n NXP tests on commonly available USB applications, the USB system chip failed but the ESD protection remained undamaged } S ystem level protection is achieved by reducing the ESD stress on the system: - Deep snap-back - Low dynamic resistance - Fast diode switching time USB connector Best-in-class protection diodes absorb as much of the pulse energy as possible to protect the SoC from damage ESD-protection USB system chip 13 Optimizing system-level ESD protection for USB 3.1 TLP measurements Transmission Line Pulse (TLP) measurements are a way to characterize the I(V) behaviour of ESD protection devices without overstressing them. First, a defined transmission-line is charged. Next, this line is discharged over the Device Under Test (DUT), which can be a single component or a complete system. Current and clamping voltage are recorded, with a pair of single current (voltage) measurements forming one point in the TLP diagram. The leakage current is measured after each discharge to establish any signs of damage to the DUT. The dynamic resistance Rdyn is derived from the steepness of the TLP graph: V/ I For each TLP measurement voltage and current, samples are averaged over 20 ns and denoted as a single point in the TLP graph. 14 Optimizing system-level ESD protection for USB 3.1 Continuous improvements in system protection Shortest switching time PUSB3FR4 Other supplier 1 Reduction of the dynamic resistance 6 ITLP (V) 5 PUSB3FR4 4 Other supplier 3 dl 2 dV 1 0 0 Other supplier 2 Other supplier 3 All measurements at 3 A TLP 1 2 3 4 5 VTLP (V) 6 Rdyn= dV dI The lower the dynamic resistance, the better the system protection 15 How to achieve System-Level ESD protection Protecting the USB 3 interface of an Z77 Motherboard ICH BD82Z77 protected by PUSB3FR4. System survives > 20 A TLP TLP behaviour of the I/O controller hub (ICH BD82Z77) without ESD protection Destruction level of the unprotected ICH BD82Z77 Both TLP measurements show that the PUSB3FR4 ESD protection clearly carries the main ESD load above 1A TLP. 16 Common Mode filters for USB 2.0 and USB 3.1 Common Mode filters for USB Differential mode signals will pass the ﬁlter Common-mode (noise) S-Parameter S21cc Differential Mode (signal) S-Parameter S21dd 0 Common Mode Filter http://www.nxp.com/documents/ leaflet/939775017547.pdf Attenuation |S21| (dB) } Increased integration, in portable devices, of different signals in the Gigahertz range has led to higher demands for EMI suppression } NXP offers a selection of Common Mode filters with integrated ESD protection to protect and filter USB 2.0 and 3.0 (in development) interfaces } Details are in our dedicated Application Guide for Common Mode filters 0.1 Unwanted Common Mode signals will be attenuated -3 dB loss Common-mode Pass-Band Differential Mode Pass-Band 1 10 100 1000 10000 frequency (MHz) 17 Common Mode filters for USB 2.0 and USB 3.1 IP3319CX6 for USB 2.0 OTG (On-The-Go) Key features: } C ommon Mode filter for one differential line pair } 3 -line ESD protection for one line pair plus one pin (ID for OTG) } B est Common Mode protection in this footprint } B est-in-class ESD protection due to deep snap-back and very low Rdyn } V ery compact WLCSP6 package : 0.95 x 1.34 x 0.57 mm IP3319CX6 insertion losses for differential and common modes αil (dB) aaa-006138 0 (1) -6 -12 (1) Differential mode (2) Common mode (2) (2) -18 -24 -30 105 106 107 108 109 f (Hz) 1010 Typical IP3319CX6 application using Micro USB connector Type B To USB controller +5V C2 A1 A2 B1 PTVS… B2 C2 1 C1 IP3319CX6 C1 Micro USB connector Type B USB 2.0 eye diagram with IP3319CX6 on test board 18 Common Mode filters for USB 2.0 and USB 3.1 PCMFxUSB3y for USB 3 Key features: } C ommon Mode filter with ESD protection for one, two, and three differential line-pairs } E xtremely wide differential pass band of 7 GHz } V ery wideband Common Mode suppression between 0.7 to 10 GHz } E xcellent system-level ESD protection due to - Very fast ESD diode switching speeds - Very deep snap-back - Very low dynamic resistance 0 Differential Passband -5 -10 Mag S21dd Mag S21cc Common-Mode rejection -15 -20 -25 -30 -35 -40 -45 1,0E+07 USB 3.1 eye @ 5 Gbps PCMFxUSB3y 1,0E+08 USB 3.1 eye @ 5 Gbps test board only 5-Ball CSP, 1 channel USB 3.1 eye @ 10 Gbps PCMFxUSB3y 0.8 x 1.2 mm 1,0E+09 frequency (Hz) 10-Ball CSP, 2 channels 15-Ball CSP, 3 channels 1.6 x 1.2 mm 2.4 x 1.2 mm 19 www.nxp.com © 2015 NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The Date of release: July 2015 information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and Document order number: 9397 750 17625 may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof Printed in the Netherlands does not convey nor imply any license under patent- or other industrial or intellectual property rights.