Data Sheet

TDA3661
Very low dropout voltage/quiescent current adjustable voltage
regulator
Rev. 05 — 28 June 2005
Product data sheet
1. General description
The TDA3661 is an adjustable voltage regulator with very low dropout voltage and
quiescent current, which operates over a wide supply voltage range.
2. Features
■
■
■
■
■
Output adjustable from 1.5 V to VP, 100 mA regulator
Supply voltage range up to 45 V
Very low quiescent current of 15 µA (typical value)
Very low dropout voltage
Protections:
◆ Reverse polarity safe (down to −25 V without high reverse current)
◆ Negative transient of 50 V (RS = 10 Ω, t < 100 ms)
◆ Able to withstand voltages up to 18 V at the output (supply line may be
short-circuited)
◆ ESD protection on all pins
◆ DC short-circuit safe to ground and VP of the regulator output
◆ Temperature protection (at Tj > 150 °C)
3. Quick reference data
Table 1:
Quick reference data
Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VP
supply voltage
regulator on
3
14.4
45
V
Iq
quiescent supply
current
VP = 14.4 V; IREG = 0 mA
-
15
30
µA
8 V ≤ VP ≤ 22 V; IREG = 0.5 mA
4.8
5.0
5.2
V
6 V ≤ VP ≤ 45 V; IREG = 0.5 mA
4.75
5.0
5.25
V
0.5 mA ≤ IREG ≤ 100 mA
4.75
5.0
5.25
V
Supply
Regulator; k = 4.01929 [1]
VREG
output voltage
Vref
reference voltage
VP = 14.4 V
1.181
1.244
1.306
V
VREG(drop)
dropout voltage
VP = 4.5 V; IREG = 50 mA;
Tamb ≤ 85 °C
-
0.18
0.3
V
[1]
VREG = Vref × k
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
4. Ordering information
Table 2:
Ordering information
Type number
TDA3661AT
Package
Name
Description
Version
SO8
plastic small outline package; 8 leads;
body width 3.9 mm
SOT96-1
5. Block diagram
VP
8
1
REGULATOR
5
BAND GAP
REG
ADJ
THERMAL
PROTECTION
TDA3661
2, 3, 6, 7
mgs579
GND
Fig 1. Block diagram
6. Pinning information
6.1 Pinning
REG
1
GND
2
8
VP
7
GND
TDA3661
GND
3
6
GND
n.c.
4
5
ADJ
001aac940
Fig 2. Pin configuration
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Product data sheet
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Rev. 05 — 28 June 2005
2 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
6.2 Pin description
Table 3:
Pin description
Symbol
Pin
Description
REG
1
regulator output
GND
2, 3, 6 and 7
ground [1]
n.c.
4
not connected
ADJ
5
feedback input
VP
8
supply voltage
[1]
All GND pins are connected to the lead frame and can also be used to reduce the total thermal resistance
Rth(j-a) by soldering these pins to a ground plane. The ground plane on the top side of the printed-circuit
board acts like a heat spreader.
7. Functional description
The TDA3661 is an adjustable voltage regulator with an output voltage that can be fixed
by means of an external resistor divider. The regulator can deliver output currents up to
100 mA. The regulator is available in an SO8 package. The regulator is intended for
portable, mains and telephone applications. To increase the lifetime of batteries, a
specially built-in clamp circuit keeps the quiescent current of this regulator very low, in
dropout and full load conditions.
The device remains operational down to very low supply voltages (typical 2 V) and below
this voltage it switches off. A temperature protection is included which switches off the
regulator output at a junction temperature above 150 °C.
8. Limiting values
Table 4:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VP
supply voltage
VP(rp)
reverse polarity supply
voltage
non-operating
-
45
V
-
−25
V
Ptot
total power dissipation
temperature of
copper area is
25 °C
-
4.1
W
Tstg
storage temperature
non-operating
−55
+150
°C
Tamb
ambient temperature
operating
−40
+125
°C
Tj
junction temperature
operating
−40
+150
°C
9. Thermal characteristics
Table 5:
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-c)
thermal resistance from junction to case
to center pins; soldered
30
K/W
Rth(j-a)
thermal resistance from junction to ambient
in free air; soldered
155
K/W
9397 750 15049
Product data sheet
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Rev. 05 — 28 June 2005
3 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
10. Characteristics
Table 6:
Characteristics
VP = 14.4 V; Tamb = 25 °C; k = 4.01929 [1]; measured with test circuit of Figure 15; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply voltage: pin VP
[2]
VP
supply voltage
regulator operating
3
14.4
45
V
Iq
quiescent supply current
VP = 4.5 V; IREG = 0 mA
-
10
30
µA
VP = 14.4 V; IREG = 0 mA
-
15
30
µA
6 V ≤ VP ≤ 24 V; IREG = 10 mA
-
0.2
0.5
mA
6 V ≤ VP ≤ 24 V; IREG = 50 mA
-
1.4
2.5
mA
8 V ≤ VP ≤ 22 V; IREG = 0.5 mA
4.8
5.0
5.2
V
0.5 mA ≤ IREG ≤ 100 mA
4.75
5.0
5.25
V
Regulator output: pin REG
VREG
output voltage
6 V ≤ VP ≤ 45 V; IREG = 0.5 mA
4.75
5.0
5.25
V
VREG(drop)
dropout voltage
VP = 4.5 V; Tamb ≤ 85 °C;
IREG = 50 mA
-
0.18
0.3
V
VREG(stab)
output voltage long-term
stability
per 1000 h
-
20
-
mV
VREG(adj)
output voltage adjustment
range
1.5
-
VP
V
∆VREG(line)
line input regulation voltage 7 V ≤ VP ≤ 22 V; IREG = 0.5 mA
-
1
30
mV
7 V ≤ VP ≤ 45 V; IREG = 0.5 mA
-
1
50
mV
∆VREG(load)
load output regulation
voltage
0.5 mA ≤ IREG ≤ 50 mA
-
10
50
mV
SVRR
supply voltage ripple
rejection
fi = 120 Hz; Vi(ripple) = 1 V (RMS);
IREG = 0.5 mA
50
60
-
dB
Vref
reference voltage
VP = 14.4 V
1.181
1.244
1.306
V
IREG(crl)
output current limit
VREG > 4 V
0.17
0.3
-
A
ILO(rp)
output leakage current at
reverse polarity
VP = −15 V; VREG = ≤ 0.3 V
-
1
500
µA
R1 + R2
R2
[1]
The output voltage can be calculated using the following formula: V REG = V ref × k where k = -------------------- and R1 + R2 ≤ 100 kΩ
[2]
The regulator output will follow VP if VP < VREG + VREG(drop)
11. Application information
11.1 Noise
The output noise is determined by the value of the output capacitor. The noise figure is
measured at a bandwidth of 10 Hz to 100 kHz; see Table 7.
Table 7:
Noise figures
Output current
IREG (mA)
Noise figure (µV)
C2 = 10 µF
C2 = 47 µF
C2 = 100 µF
0.5
550
320
300
50
650
400
400
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Product data sheet
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Rev. 05 — 28 June 2005
4 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
11.2 Stability
The regulator is stabilized with an external capacitor connected to the output.
For stable operation:
1. The output capacitor ESR should not exceed 22 Ω (worst case)
2. A maximum ESR may be required; see Table 8
3. It is recommended not to use below 1 mA output current because of reduced phase
margin
4. Use electrolytic capacitors for output capacitor values of 1 µF and above.
Table 8:
Minimum ESR values required
IREG (mA)
C2 = 100 nF
C2 = 1 µF
C2 = 10 µF
C2 = 100 µF
1
>0Ω
> 1.5 Ω
>0Ω
>0Ω
5
>0Ω
>0Ω
>0Ω
>0Ω
10
>0Ω
>0Ω
>0Ω
>0Ω
100
>0Ω
>0Ω
>0Ω
>0Ω
11.3 Application circuits
The maximum output current of the regulator equals:
150 – T amb
150 – T amb
I REG ( max ) = ---------------------------------------------------------- = ------------------------------------ ( mA )
100 × ( V P – 5 )
R th ( j – a ) × ( V P – V REG )
When Tamb = 21 °C, VP = 14 V and VREG = 5 V (k = 4.01929) the maximum output current
equals 140 mA.
For successful operation of the IC (maximum output current capability) special attention
has to be given to the copper area required as heatsink (connected to all GND pins), the
thermal capacity of the heatsink and its ability to transfer heat to the external environment.
It is possible to reduce the total thermal resistance from 155 K/W to 50 K/W.
11.3.1 Application circuit with backup function
Sometimes, a backup function is needed to supply, for example, a microcontroller for a
short period of time when the supply voltage spikes to 0 V (or even −1 V).
This function can easily be built with the TDA3661 by using an output capacitor with a
large value. When the supply voltage is 0 V (or −1 V), only a small current will flow into
pin REG from this output capacitor (a few µA).
The application circuit is given in Figure 3.
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TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
VP
8
C1(1)
1 µF
VREG
1
R1
75.1 kΩ
TDA3661
=5V
C2 (2)
5
R2
24.9 kΩ
2, 3, 6, 7
mgs582
(1) C1 is optional (to minimize supply noise only)
(2) C2 ≤ 4700 µF
Fig 3. Application circuit with backup function
11.3.2 Application circuit with enable function
An enable function can easily be built with the TDA3661 by connecting a diode to pin ADJ.
When the voltage on pin ADJ is forced above 1.3 V, the output will switch off. The standby
current is equal to the quiescent current of the TDA3661.
The application circuit is given in Figure 4.
VP
8
1 µF
VREG
=5V
1
C1(1)
R1
75.1 kΩ
TDA3661
C2
10 µF
enable
5
D1
R2
24.9 kΩ
2, 3, 6, 7
mgs583
C1 is optional (to minimize supply noise only)
Fig 4. Application circuit with enable function
11.4 Additional application information
This section gives typical curves for various parameters measured on the TDA3661AT.
Standard test conditions are: VP = 14.4 V, Tamb = 25 °C and k = 4.01929.
9397 750 15049
Product data sheet
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Rev. 05 — 28 June 2005
6 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
mda947
25
Iq
(µA)
mda949
4
Iq
(mA)
20
3
15
2
10
5
1
0
0
10
20
VP (V)
30
0
0
10
20
40
30
VP (V)
50
IREG = 0 mA.
Fig 5. Quiescent current as a function of the supply
voltage
Fig 6. Quiescent current increase as a function of
high supply voltage
mda951
2
mda948
0.48
Iq
(mA)
(1)
Iq
(mA)
1.5
0.44
1
0.40
0.5
(2)
0
−40
0
40
80
120
160
Tj (°C)
(1) Iq at 50 mA load.
0.36
5
10
15
20
VP (V)
25
IREG = 10 mA.
(2) Iq at 10 mA load.
Fig 7. Quiescent current as a function of the
junction temperature
Fig 8. Quiescent current as a function of the supply
voltage
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Rev. 05 — 28 June 2005
7 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
mda950
2
mda952
4
Iq
(mA)
Iq
(mA)
3
1.8
2
1.6
1
1.4
5
10
15
20
VP (V)
25
0
0
20
40
80
100
IREG (mA)
60
IREG = 50 mA.
Fig 9. Quiescent current as a function of the supply
voltage
mda955
6
Fig 10. Quiescent current as a function of the output
current
mda957
500
VREG(drop)
(mV)
VREG
(V)
400
4
300
2
200
0
−50
100
0
50
100
150
200
0
Tj (°C)
IREG = 0 mA.
80
IREG (mA)
120
IREG = 0 mA.
Fig 11. Output voltage thermal protection as a function
of the junction temperature
Fig 12. Dropout voltage as a function of the output
current
9397 750 15049
Product data sheet
40
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Rev. 05 — 28 June 2005
8 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
mda954
6
mda956
−30
(1)
SVRR
(dB)
VREG
(V)
−40
(2)
4
−50
(3)
2
(1)
−60
(2)
−70
10
0
0
200
100
IREG (mA)
300
(3)
102
103
104
f (Hz)
105
IREG = 10 mA; C2 = 10 µF.
VP = 8 V and pulsed load
(1) SVRR at RL = 100 Ω.
(2) SVRR at RL = 500 Ω.
(3) SVRR at RL = 10 kΩ.
Fig 13. Fold back protection mode
Fig 14. Supply voltage ripple rejection as a function of
the ripple frequency
12. Test information
12.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
12.2 Test circuit
VP
8
1 µF
VREG
1
C1(1)
R1
75.1 kΩ
TDA3661
C2 = 5 V
10 µF
5
R2
24.9 kΩ
2, 3, 6, 7
mgs581
C1 is optional (to minimize supply noise only)
Fig 15. Test circuit
9397 750 15049
Product data sheet
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Rev. 05 — 28 June 2005
9 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
inches
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 16. Package outline SOT96-1 (SO8)
9397 750 15049
Product data sheet
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Rev. 05 — 28 June 2005
10 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
• below 225 °C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called
thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
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11 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
14.5 Package related soldering information
Table 9:
Suitability of surface mount IC packages for wave and reflow soldering methods
Package [1]
Soldering method
Wave
Reflow [2]
BGA, HTSSON..T [3], LBGA, LFBGA, SQFP,
SSOP..T [3], TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable [4]
suitable
PLCC [5], SO, SOJ
suitable
suitable
not
recommended [5] [6]
suitable
SSOP, TSSOP, VSO, VSSOP
not
recommended [7]
suitable
CWQCCN..L [8], PMFP [9], WQCCN..L [8]
not suitable
LQFP, QFP, TQFP
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
9397 750 15049
Product data sheet
not suitable
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 28 June 2005
12 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
9397 750 15049
Product data sheet
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Rev. 05 — 28 June 2005
13 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
15. Revision history
Table 10:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
TDA3661_5
20050628
Product data sheet
-
9397 750 15049
TDA3661_4
Modifications:
•
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•
•
Paragraph removed from Section 7
Figure 3, Figure 4 and Figure 13 removed from the previous version
TDA3661_4
20001213
Product specification
-
9397 750 07864
TDA3661_3
TDA3661_3
20001208
Preliminary
specification
-
9397 750 07554
TDA3661_2
TDA3661_2
20000201
Preliminary
specification
-
9397 750 06797
TDA3661_1
TDA3661_1
19990920
Preliminary
specification
-
9397 750 06067
-
9397 750 15049
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 28 June 2005
14 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
16. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
19. Trademarks
18. Disclaimers
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
9397 750 15049
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 05 — 28 June 2005
15 of 16
TDA3661
Philips Semiconductors
Very low dropout voltage/quiescent current voltage regulator
21. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
11.1
11.2
11.3
11.3.1
11.3.2
11.4
12
12.1
12.2
13
14
14.1
14.2
14.3
14.4
14.5
15
16
17
18
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 4
Noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Stability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application circuits . . . . . . . . . . . . . . . . . . . . . . 5
Application circuit with backup function . . . . . . 5
Application circuit with enable function . . . . . . . 6
Additional application information . . . . . . . . . . . 6
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
Quality information . . . . . . . . . . . . . . . . . . . . . . 9
Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 11
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 12
Package related soldering information . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information . . . . . . . . . . . . . . . . . . . . 15
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 28 June 2005
Document number: 9397 750 15049
Published in The Netherlands
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