Data Sheet

INTEGRATED CIRCUITS
DATA SHEET
TDA3674
Low dropout voltage/quiescent
current 5 V voltage regulator with
enable
Preliminary specification
Supersedes data of 2000 Feb 01
File under Integrated Circuits, IC01
2001 Jan 24
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
TDA3674
FEATURES
– Negative transient of 50 V (RS = 10 Ω, t < 100 ms)
• Fixed 5 V, 100 mA regulator with enable function
– Able to withstand voltages up to 18 V at the output
(supply line may be short-circuited)
• Supply voltage range up to 45 V
– ESD protection on all pins
• Very low quiescent current of 15 µA (typical value)
– DC short-circuit safe to ground and VP of the
regulator output
• Very low dropout voltage
• High ripple rejection
– Temperature protection (at Tj > 150 °C).
• Very high stability:
– Electrolytic capacitors: Equivalent Series Resistance
(ESR) < 22 Ω at worst-case condition
GENERAL DESCRIPTION
– Other capacitors: 100 nF at 200 µA ≤ IREG ≤ 100 mA.
The TDA3674 is a fixed 5 V voltage regulator with very low
dropout voltage and quiescent current, which operates
over a wide supply voltage range.
• Pin compatible family TDA3672 to TDA3676
• Protections:
– Reverse polarity safe (down to −25 V without high
reverse current)
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
supply voltage
regulator on
3
14.4
45
V
Iq
quiescent supply current
VP = 14.4 V; IREG = 0 mA;
VI(EN) = 5 V
−
15
30
µA
Voltage regulator
VREG
VREG(drop)
regulator output voltage
dropout voltage
8 V ≤ VP ≤ 22 V; IREG = 0.5 mA
4.8
5.0
5.2
V
6 V ≤ VP ≤ 45 V; IREG = 0.5 mA
4.75
5.0
5.25
V
0.5 mA ≤ IREG ≤ 100 mA;
VP = 14.4 V
4.75
5.0
5.25
V
VP = 4.5 V; IREG = 50 mA;
Tamb ≤ 85 °C
−
0.18
0.3
V
ORDERING INFORMATION
TYPE
NUMBER
TDA3674AT
2001 Jan 24
PACKAGE
NAME
SO8
DESCRIPTION
plastic small outline package; 8 leads; body width 3.9 mm
2
VERSION
SOT96-1
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
TDA3674
BLOCK DIAGRAM
handbook, halfpage
VP
8
REGULATOR
EN
5
1
REG
BAND GAP
THERMAL
PROTECTION
TDA3674
2, 3, 6, 7
MGS597
GND
Fig.1 Block diagram.
PINNING
SYMBOL
PIN (SO8)
DESCRIPTION
REG
1
regulator output
GND
2, 3, 6 and 7
ground; note 1
n.c.
4
not connected
EN
5
enable input
VP
8
supply voltage
handbook, halfpage
Note
REG 1
1. All GND pins are connected to the lead frame and can
also be used to reduce the total thermal resistance
Rth(j-a) by soldering these pins to a ground plane.
The ground plane on the top side of the PCB acts like
a heat spreader.
8 VP
GND 2
7
GND
6
GND
5
EN
TDA3674
GND
3
n.c.
4
MGS598
Fig.2 Pin configuration.
2001 Jan 24
3
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
FUNCTIONAL DESCRIPTION
TDA3674
A temperature protection circuit is included, which
switches off the regulator output at a junction temperatures
above 150 °C.
The TDA3674 is a fixed 5 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
an SO8 package with fused centre pins connected to the
lead frame. The regulator is intended for portable, mains,
telephone and automotive applications. To increase the
lifetime of batteries, a specially built-in clamp circuit keeps
the quiescent current of this regulator very low, also in
dropout and full load conditions.
A new output circuit guarantees the stability of the
regulator for a capacitor output circuit with an ESR
(worst-case) up to 22 Ω, see Figs 4 and 5. If only a 100 nF
capacitor is used, the regulator is fully stable when
IREG > 200 µA. This is very attractive as the ESR of an
electrolytic capacitor increases strongly at low
temperatures (no expensive tantalum capacitor is
required).
The regulator remains operating down to very low supply
voltages and below it switches off.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
−
45
V
non-operating
−
−25
V
total power dissipation
temperature of copper area
is 25 °C
−
4.1
W
Tstg
storage temperature
non-operating
−55
+150
°C
Tamb
ambient temperature
operating
−40
+125
°C
Tj
junction temperature
operating
−40
+150
°C
VP
supply voltage
VP(rp)
reverse polarity supply voltage
Ptot
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air; soldered
125
K/W
Rth(j-c)
thermal resistance from junction to case
to centre pins; soldered
30
K/W
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611E”.
2001 Jan 24
4
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
TDA3674
CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; measured in test circuit of Fig.3; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply voltage: pin VP
VP
supply voltage
regulator operating; note 1
3
14.4
45
V
Iq
quiescent current
VP = 14.4 V; IREG = 0 mA;
VI(EN) = 0 V
−
4
15
µA
VP = 14.4 V; IREG = 0 mA;
VI(EN) = 5 V
−
15
30
µA
6 V ≤ VP ≤ 22 V; IREG = 10 mA
−
0.2
0.5
mA
6 V ≤ VP ≤ 22 V; IREG = 50 mA
−
1.4
2.5
mA
enable off; VREG ≤ 0.8 V
−1
−
+1.0
V
enable on; VREG ≥ 4.5 V
3.0
−
18
V
VI(EN) = 5 V
−
0.3
−
µA
Enable input: pin EN
VI(EN)
II(EN)
enable input voltage
enable input current
Regulator output: pin REG
VREG
output voltage
8 V ≤ VP ≤ 22 V; IREG = 0.5 mA
4.8
5.0
5.2
V
8 V ≤ VP ≤ 22 V; IREG = 0.5 mA;
Tamb ≤ 125 °C
4.75
5.0
5.25
V
0.5 mA ≤ IREG ≤ 100 mA
4.75
5.0
5.25
V
6 V ≤ VP ≤ 45 V; IREG = 0.5 mA
4.75
5.0
5.25
V
VP = 4.5 V; Tamb ≤ 85 °C;
IREG = 50 mA
−
0.18
0.3
V
−
20
−
mV/1000 h
VREG(drop)
dropout voltage
VREG(stab)
long-term stability
∆VREG(line)
line input regulation voltage 8 V ≤ VP ≤ 16 V; IREG = 0.5 mA
−
1
10
mV
7 V ≤ VP ≤ 22 V; IREG = 0.5 mA
−
1
30
mV
7 V ≤ VP ≤ 45 V
−
1
50
mV
∆VREG(load) load output regulation
voltage
0.5 mA ≤ IREG ≤ 50 mA
−
10
50
mV
SVRR
supply voltage ripple
rejection
fi = 120 Hz; Vi(ripple) = 1 V (RMS);
IREG = 0.5 mA
50
60
−
dB
IREG(crl)
current limit
VREG > 4.5 V
0.13
0.25
−
A
ILO(rp)
output leakage current at
reverse polarity
VP = −15 V; VREG ≤ 0.3 V
−
1
500
µA
Note
1. The regulator output will follow VP if VP < VREG + VREG(drop).
2001 Jan 24
5
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
TDA3674
TEST AND APPLICATION INFORMATION
MDA961
102
handbook, halfpage
ESR
(Ω)
(1)
10
andbook, halfpage
VP
8
C1(1)
1 µF
VI(EN)
VREG = 5 V
1
C2
10 µF
TDA3674
stable region
1
5
2, 3, 6, 7
MGS599
(2)
10−1
10−1
1
10
C2 (µF)
102
(1) Maximum ESR at 200 µA ≤ IREG ≤ 100 mA.
(2) Minimum ESR only when IREG ≤ 200 µA.
VI(EN) = 5 V.
(1) C1 is optional (to minimize supply noise only).
Fig.4
Graph for selecting the value of the output
capacitor.
Fig.3 Test circuit.
Noise
The output noise is determined by the value of the output
capacitor. The noise figure is measured at a bandwidth of
10 Hz to 100 kHz (see Table 1).
Table 1
ESR
(Ω)
Noise figures
OUTPUT
CURRENT
IREG (mA)
C2 = 10 µF
C2 = 47 µF
C2 = 100 µF
0.5
550
320
300
50
650
400
400
NOISE FIGURE (µV)
102
22
10
Stability
stable region
1
The regulator is stabilized with an external capacitor
connected to the output. The value of this capacitor can be
selected using the diagrams shown in Figs 4 and 5.
The following four examples show the effects of the
stabilization circuit using different values for the output
capacitor.
10−1
1
Fig.5
2001 Jan 24
MDA962
103
handbook, halfpage
6
10
102
IREG (mA)
103
ESR as a function of IREG for selecting the
value of the output capacitor.
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
TDA3674
When Tamb = 21 °C and VP = 14 V, the maximum output
current equals 140 mA.
EXAMPLE 1
The regulator is stabilized with an electrolytic capacitor of
68 µF (ESR = 0.5 Ω). At Tamb = −40 °C, the capacitor
value is decreased to 22 µF and the ESR is increased
to 3.5 Ω. The regulator will remain stable at a temperature
of Tamb = −40 °C.
For successful operation of the IC (maximum output
current capability) special attention has to be given to the
copper area required as heatsink (connected to all
GND pins), the thermal capacity of the heatsink and its
ability to transfer heat to the external environment. It is
possible to reduce the total thermal resistance from
120 to 50 K/W.
EXAMPLE 2
The regulator is stabilized with an electrolytic capacitor of
10 µF (ESR = 3.3 Ω). At Tamb = −40 °C, the capacitor
value is decreased to 3 µF and the ESR is increased to
20 Ω. The regulator will remain stable at a temperature of
Tamb = −40 °C.
APPLICATION CIRCUIT WITH BACKUP FUNCTION
Sometimes a backup function is needed to supply, for
example, a microcontroller for a short period of time when
the supply voltage spikes to 0 V (or even −1 V).
EXAMPLE 3
This function can easily be built with the TDA3674 by using
an output capacitor with a large value. When the supply
voltage is 0 V (or −1 V), only a small current will flow into
pin REG from this output capacitor (a few µA).
The regulator is stabilized with a 100 nF MKT capacitor
connected to the output. Full stability is guaranteed when
the output current is larger than 200 µA. Because the
thermal influence on this capacitor value is almost zero,
the regulator will remain stable at a temperature of
Tamb = −40 °C.
The application circuit is given in Fig.6.
EXAMPLE 4
The regulator is stabilized with a 100 nF capacitor in
parallel with a electrolytic capacitor of 10 µF connected to
the output.
The regulator is now stable under all conditions and
independent of:
handbook, halfpage
VP
• The ESR of the electrolytic capacitor
• The value of the electrolytic capacitor
C1(1)
1 µF
VI(EN)
• The output current.
8
VREG = 5 V
1
C2 (2)
TDA3674
5
2, 3, 6, 7
MGS600
Application circuits
The maximum output current of the regulator equals:
VI(EN) = 5 V.
(1) C1 is optional (to minimize supply noise only).
(2) C2 ≤ 4700 µF.
150 – T amb
I REG ( max ) = -----------------------------------------------------R th(j-a) × ( V P – V REG )
150 – T amb
= ------------------------------------- (mA)
100 × ( V P – 5 )
2001 Jan 24
Fig.6 Application circuit with backup function.
7
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
TDA3674
Additional application information
This section gives typical curves for various parameters measured on the TDA3674AT. Standard test conditions are:
VP = 14.4 V; Tamb = 25 °C.
MDA947
25
MDA949
4
handbook, halfpage
handbook, halfpage
Iq
(µA)
Iq
(mA)
20
3
15
2
10
1
5
0
0
0
20
10
VP (V)
0
30
10
20
40
30
VP (V)
50
IREG = 0 mA.
Fig.7
Quiescent current as a function of the
supply voltage.
Fig.8
MDA951
2
Quiescent current as a function of high
supply voltage.
MDA948
0.48
handbook, halfpage
handbook, halfpage
Iq
(mA)
(1)
Iq
(mA)
1.5
0.44
1
0.40
0.5
(2)
0
−40
0.36
0
40
80
120
160
Tj (°C)
5
(1) Iq at 50 mA load.
(2) Iq at 10 mA load.
Fig.9
15
20
VP (V)
25
IREG = 10 mA.
Quiescent current as a function of the
junction temperature.
2001 Jan 24
10
Fig.10 Quiescent current as a function of the
supply voltage.
8
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
MDA950
2
TDA3674
MDA952
4
handbook, halfpage
handbook, halfpage
Iq
(mA)
Iq
(mA)
3
1.8
2
1.6
1
1.4
0
5
10
20
15
VP (V)
25
0
20
40
60
80
100
IREG (mA)
IO = 50 mA.
Fig.11 Quiescent current as a function of the
supply voltage.
Fig.12 Quiescent current as a function of the load
current.
MDA953
5.10
handbook, halfpage
VREG
VREG
(V)
(V)
5.05
4
5.00
2
4.95
−50
0
50
100
150
MDA955
6
handbook, halfpage
0
−50
200
Tj (°C)
0
50
100
150
200
Tj (°C)
IREG = 0 mA.
IREG = 0 mA.
Fig.13 Output voltage as a function of the
junction temperature.
Fig.14 Output voltage thermal protection as a
function of the junction temperature.
2001 Jan 24
9
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
MDA957
500
TDA3674
MDA954
6
handbook, halfpage
handbook, halfpage
VREG(drop)
VREG
(mV)
(V)
400
4
300
2
200
0
100
0
80
40
IREG (mA)
0
120
100
200
IREG (mA)
VP = 8 V with pulsed load.
Fig.15 Dropout voltage as a function of the output
current.
Fig.16 Fold back protection mode.
MDA956
−30
handbook, halfpage
(1)
SVRR
(dB)
−40
(2)
−50
(3)
(1)
−60
(2)
−70
10
(3)
102
103
104
f (Hz)
105
IREG = 10 mA; C2 = 10 µF.
(1) SVRR at RL = 100 Ω.
(2) SVRR at RL = 500 Ω.
(3) SVRR at RL = 10 kΩ.
Fig.17 SVRR as a function of the ripple frequency.
2001 Jan 24
10
300
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
TDA3674
PACKAGE OUTLINE
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.244
0.039 0.028
0.050
0.041
0.228
0.016 0.024
inches
0.010 0.057
0.069
0.004 0.049
0.01
0.01
0.028
0.004
0.012
θ
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
2001 Jan 24
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-05-22
99-12-27
11
o
8
0o
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
SOLDERING
TDA3674
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2001 Jan 24
12
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
TDA3674
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
REFLOW(1)
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Jan 24
13
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
TDA3674
DATA SHEET STATUS
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2001 Jan 24
14
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
NOTES
2001 Jan 24
15
TDA3674
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: Philips Hungary Ltd., H-1119 Budapest, Fehervari ut 84/A,
Tel: +36 1 382 1700, Fax: +36 1 382 1800
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 71
© Philips Electronics N.V. 2001
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/03/pp16
Date of release: 2001
Jan 24
Document order number:
9397 750 07558
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