Data Sheet

INTEGRATED CIRCUITS
DATA SHEET
TDA3681
Multiple voltage regulator with
switch and ignition buffer
Product specification
Supersedes data of 2002 Apr 10
2004 Mar 31
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
FEATURES
• ESD protection on all pins
General
• Thermal protections
TDA3681
• Load dump protection
• Extremely low noise behaviour and good stability with
very small output capacitors
• Foldback current limit protection for regulators 1, 2, 3
and 4
• Second supply pin for regulators 3 and 4 to reduce
power dissipation (e.g. via a DC-to-DC converter)
• Delayed second current limit protection for the power
switch (at short-circuit)
• Three VP-state controlled regulators (regulators 1, 3
and 4) and a power switch
• The regulator outputs and the power switch are
DC short-circuit safe to ground and supply (VP).
• Regulator 2, reset and ignition buffer operational during
load dump and thermal shutdown
• Combined control pin for switching regulators 1 and 3
GENERAL DESCRIPTION
• Separate control pins for switching regulator 4 and the
power switch
The TDA3681 is a multiple output voltage regulator with a
power switch and an ignition buffer. It is intended for use in
car radios with or without a microcontroller. The TDA3681
contains the following:
• Supply voltage range from −18 to +50 V
• Low quiescent current in standby mode (when
regulators 1, 3 and 4 and power switch are switched off
and ignition input is low)
• Four fixed voltage regulators with a foldback current
protection (regulators 1, 2, 3 and 4). Regulator 2, which
is intended to supply a microcontroller, also operates
during load dump and thermal shutdown
• Hold output (open-collector output stage) for low VP
(regulators 1, 3 and 4 and power switch off)
• Regulators 3 and 4 have a second supply pin that can
be connected to a lower supply voltage (>6.5 V) to
reduce the power dissipation
• Hold output when one of regulators 1 and 3 and/or 4 is
out of regulation
• Hold output for foldback mode of power switch and
regulators 1, 3 and 4
• A power switch with protection, operated by a control
input
• Hold output for load dump and temperature protection
• Reset and hold outputs that can be used to interface
with the microcontroller; the reset signal can be used to
call up the microcontroller
• Reset (push-pull output stage) for regulator 2
• Adjustable reset delay time
• Both supply pins can withstand load dump pulses and
negative supply voltages
• High supply voltage ripple rejection
• Backup capacitor for regulator 2
• Regulator 2, which is in regulation at a backup voltage
above 6.5 V
• One independent ignition buffer (active HIGH).
• A provision for the use of a reserve supply capacitor that
will hold enough energy for regulator 2 (5 V continuous)
to allow a microcontroller to prepare for loss of voltage
Protections
• Reverse polarity safe (down to −18 V without high
reverse current)
• An ignition input Schmitt trigger with push-pull output
stage.
• Able to withstand voltages up to 18 V at the outputs
(supply line may be short-circuited)
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA3681J
DBS17P
plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm)
SOT243-3
TDA3681JR
DBS17P
plastic DIL-bent-SIL (special bent) power package; 17 leads
(lead length 12 mm)
SOT475-1
TDA3681TH
HSOP20
plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
2004 Mar 31
2
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VP1
supply voltage 1
operating
reverse polarity
non-operating
regulator 2 on
VP2
9.5
14.4
18
V
−
−
18
V
4
14.4
50
V
jump start
t ≤ 10 minutes
−
−
30
V
load dump protection
t ≤ 50 ms; tr ≥ 2.5 ms
−
−
50
V
6.5
14.4
18
V
supply voltage 2
operating
reverse polarity
−
−
18
V
0
−
50
V
t ≤ 10 minutes
−
−
30
V
t ≤ 50 ms; tr ≥ 2.5 ms
−
−
50
V
standby mode
−
110
150
µA
−
−
150
°C
non-operating
regulator 2 on
jump start
load dump protection
Iq(tot)
total quiescent supply current
Tj
junction temperature
Voltage regulators
Vo(REG1)
output voltage of regulator 1
1 mA ≤ IREG1 ≤ 600 mA; VP = 14.4 V
8.0
8.5
9.0
V
Vo(REG2)
output voltage of regulator 2
1 mA ≤ IREG2 ≤ 300 mA; VP = 14.4 V
4.75
5.0
5.25
V
Vo(REG3)
output voltage of regulator 3
1 mA ≤ IREG3 ≤ 1400 mA; VP = 14.4 V
4.75
5.0
5.25
V
Vo(REG4)
output voltage of regulator 4
1 mA ≤ IREG4 ≤ 1 A; VP = 14.4 V
3.14
3.3
3.46
V
ISW = 1 A; VP1 = 13.5 V
−
0.45
0.65
V
ISW = 1.8 A; VP1 = 13.5 V
−
1.0
1.8
V
3
−
−
A
Power switch
Vdrop(SW)
IM(SW)
2004 Mar 31
drop-out voltage
peak current
3
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
BLOCK DIAGRAMS
VP1
ENSW
(14.4 V)
17
11
POWER SWITCH
16
(14 V/
3 A)
SW
TEMPERATURE
LOAD DUMP
PROTECTION
&
(14 V/
14 100 mA)
BACKUP SWITCH
BU
BACKUP CONTROL
15
REGULATOR 2
VP2
(5 V/
300 mA)
REG2
3
(3.3 V/
4 1 A)
REGULATOR 4
&
REG4
9
EN4
2
REGULATOR 3
&
(5 V/
1400 mA)
REG3
TDA3681J
TDA3681JR
(8.5 V/
1 600 mA)
REGULATOR 1
&
REG1
10
EN1/3
12
+
OR
&
7
CRES
6
IGNITION BUFFER
13
GND
mgl902
Fig.1 Block diagram of TDA3681J and TDA3681JR.
2004 Mar 31
RES
8
5
IGNIN
HOLD
4
IGNOUT
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
VP1
ENSW
(14.4 V)
14
8
TDA3681
POWER SWITCH
16
(14 V/
3 A)
SW
TEMPERATURE
LOAD DUMP
PROTECTION
&
(14 V/
13 100 mA)
BACKUP SWITCH
BU
BACKUP CONTROL
12
REGULATOR 2
VP2
(5 V/
300 mA)
REG2
20
(3.3 V/
1 1 A)
REGULATOR 4
&
REG4
6
EN4
HEATTAB
n.c.
n.c.
11
15
18
19
REGULATOR 3
&
(5 V/
1400 mA)
REG3
TDA3681TH
(8.5 V/
17 600 mA)
REGULATOR 1
&
REG1
7
EN1/3
9
+
OR
&
4
CRES
IGNITION BUFFER
3
10
GND
Fig.2 Block diagram of TDA3681TH.
2004 Mar 31
RES
5
2
IGNIN
HOLD
5
mgu353
IGNOUT
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
PINNING
Pin description of TDA3681J and TDA3681JR
SYMBOL
PIN
handbook, halfpage
DESCRIPTION
REG1
1
REG3
2
VP2
3
regulator 4 output
REG4
4
5
ignition input
IGNIN
5
IGNOUT
6
ignition output (active HIGH)
IGNOUT
6
RES
7
reset output (active LOW)
RES
7
CRES
8
EN4
9
REG1
1
regulator 1 output
REG3
2
regulator 3 output
VP2
3
second supply voltage
REG4
4
IGNIN
CRES
8
reset delay capacitor
EN4
9
enable input for regulator 4
EN1/3
10
enable input for regulators 1 and 3
ENSW
11
enable input for power switch
HOLD
12
hold output (active LOW)
ENSW 11
GND
13
ground; note 1
HOLD 12
BU
14
backup switch output
REG2
15
regulator 2 output
SW
16
power switch output
VP1
17
supply voltage
EN1/3 10
GND 13
BU 14
REG2 15
SW 16
Note
VP1 17
1. The heat tab is internally connected to pin GND.
MGL903
Fig.3
2004 Mar 31
TDA3681J
TDA3681JR
6
Pin configuration for TDA3681J and
TDA3681JR.
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
Pin description of TDA3681TH
SYMBOL
PIN
DESCRIPTION
REG4
1
regulator 4 output
IGNIN
2
ignition input
IGNOUT
3
ignition output (active HIGH)
RES
4
reset output (active LOW)
CRES
5
reset delay capacitor
EN4
6
enable input for regulator 4
EN1/3
7
enable input for regulators 1 and 3
ENSW
8
enable input for power switch
HOLD
9
hold output (active LOW)
GND
10
ground
HEATTAB
11
heat tab connection; note 1
REG2
12
regulator 2 output
BU
13
backup switch output
VP1
14
supply voltage
n.c.
15
not connected
SW
16
power switch output
REG1
17
regulator 1 output
n.c.
18
not connected
handbook, halfpage
1
REG4
REG3 19
2
IGNIN
n.c. 18
3
IGNOUT
REG1 17
4
RES
5
CRES
n.c. 15
6
EN4
VP1 14
7
EN1/3
BU 13
8
ENSW
REG2 12
9
HOLD
SW 16
TDA3681TH
HEATTAB 11
10 GND
MGU329
REG3
19
regulator 3 output
VP2
20
second supply voltage
Fig.4 Pin configuration for TDA3681TH.
Note
1. The pin is used for final test purposes. In the
application it should be connected directly to ground.
2004 Mar 31
VP2 20
7
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
FUNCTIONAL DESCRIPTION
Therefore, regulator 1 is the most critical regulator with
respect to an out of regulation condition caused by a low
battery voltage.
The TDA3681 is a multiple output voltage regulator with a
power switch, intended for use in car radios with or without
a microcontroller. Because of the low voltage operation of
the car radio, low voltage drop regulators are used.
The hold function includes hysteresis to avoid oscillations
when the regulator voltage crosses the hold threshold
level. The hold output also becomes active when the
power switch is in foldback protection mode; see Fig.8.
The block diagram of the hold function is illustrated in
Fig.5.
Regulator 2 is in regulation when the backup voltage
exceeds 6.5 V for the first time. When regulator 2 is
switched on and its output voltage is within its voltage
range, the reset output is disabled to release the
microcontroller. The reset delay time before release can
be extended by an external capacitor (CRES). This start-up
feature is included to secure a smooth start-up of the
microcontroller at first connection, without uncontrolled
switching of regulator 2 during the start-up sequence.
All output pins are fully protected. The regulators are
protected against load dump (regulators 1, 3 and 4 switch
off at supply voltages >18 V) and short-circuit (foldback
current protection).
The power switch contains a current protection. However,
this protection is delayed at short-circuit by the reset delay
capacitor (it should be noted that this is the second
function of the reset delay capacitor CRES). During this
time, the output current is limited to a peak value of at least
3 A (after a delay, the power switch can deliver 1.8 A
continuous if VP ≤ 18 V).
The charge on the backup capacitor can be used to supply
regulator 2 for a short period when the external supply
voltage drops to 0 V (the time depends on the value of the
backup capacitor).
The output stages of all switchable regulators have an
extremely low noise behaviour and good stability, even for
small values of the output capacitors.
In a normal situation, the voltage on the reset delay
capacitor is approximately 3.5 V (depending on the
temperature). The power switch output is approximately
VP − 0.4 V. At operating temperature, the power switch
can deliver at least 3 A. At high temperature, the switch
can deliver approximately 2 A.
When both regulator 2 and the supply voltages (VP1 and
VP2 > 4.5 V) are available, regulators 1 and 3 can be
operated by means of one enable input.
Regulator 4 and the power switch have a separate enable
input.
During an overload condition or a short circuit
(VSW < VP − 3.7 V), the voltage on the reset delay
capacitor rises 0.6 V above the voltage of regulator 2. This
rise time depends on the capacitor connected to pin CRES.
During this time, the power switch can deliver more than
3 A. When regulator 2 is out of regulation and generates a
reset, the power switch can only deliver 2 A and will
immediately go into foldback protection.
Pin HOLD is normally HIGH but is active LOW. Pin HOLD
is connected to an open-collector NPN transistor and must
have an external pull-up resistor to operate. The hold
output is controlled by a low voltage detection circuit
which, when activated, pulls the hold output LOW
(enabled). The hold outputs of the regulators are
connected to an OR gate inside the IC so that the hold
circuit is activated when one or more regulators (1, 3 or 4)
are out of regulation for any reason. Each regulator enable
input controls its own hold triggering circuit, so that if a
regulator is disabled or switched off, the hold circuit for that
regulator is disabled.
At supply voltages >17 V, the power switch is clamped at
16 V maximum (to avoid externally connected circuits
being damaged by an overvoltage) and the power switch
will switch off at load dump.
Interfacing with the microcontroller (simple full or semi
on/off logic applications) can be realized with an
independent ignition Schmitt trigger and ignition output
buffer (push-pull output).
The hold circuit is also controlled by the temperature and
load dump protection. Activating the temperature or load
dump protection causes a hold (LOW) during the time that
the protection is activated. When all regulators are
switched off, the hold output is controlled by the battery
line VP1, temperature protection and load dump protection.
The timing diagrams are illustrated in Figs 6 and 7.
The second supply voltage VP2 is used for the switchable
regulators 3 and 4. This input can be connected to a lower
supply voltage of ≥6 V to reduce the power dissipation of
the TDA3681. A DC-to-DC converter could be used for this
purpose.
The hold circuit is enabled at low battery voltages. This
indicates that it is not possible to get regulator 1 into
regulation when switching it on: regulator 1 has the highest
output voltage (8.5 V) of all switchable regulators.
2004 Mar 31
TDA3681
8
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
handbook, full pagewidth
VP1
TDA3681
low battery
detector
internal
voltage reference 1
internal
voltage
reference 2
TDA3681
output stage
REG1
enable
output of
regulation
detector
EN1/3
REGULATOR 1
output stage
REG3
enable
output of
regulation
detector
&
OR
REGULATOR 3
output stage
REG4
OR
HOLD
enable
output of
regulation
detector
EN4
REGULATOR 4
buffer
TEMPERATURE
PROTECTION
LOAD DUMP
POWER SWITCH
FOLDBACK
MODE
MGL904
Fig.5 Block diagram of the hold circuit.
2004 Mar 31
9
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
load dump
VP1
VBU
regulator 2
6.5 V
5.4 V
5.0 V
0V
reset
delay
capacitor
reset
5.0 V
3.0 V
0V
5.0 V
Back-up Schmitt trigger and reset behaviour
load dump
VP1 = VP2
50 V
ignition
input
0V
−100 V
ignition
output
5.0 V
0V
Enable Schmitt trigger ignition
>22 V
VP1 = VP2
>1.8 V
enable
regulator 1/3 <1.3 V
enable
regulator 4
>1.8 V
<1.3 V
regulator 1
and 3
regulator 4
temperature active
protection
150 °C passive
HOLD
HIGH
LOW
Hold behaviour
Fig.6 Timing diagram of ignition Schmitt triggers and hold circuit.
2004 Mar 31
10
mgl905
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
load dump
handbook, full pagewidth
18 V
VP1 = VP2
8.9 V
7.0 V
4.0 V
≥1.8 V
enable
regulator 1/3 1.3 V
8.5 V
regulator 1
0V
5.0 V
regulator 3
0V
>1.8 V
enable
regulator 4
<1.3 V
3.3 V
regulator 4
0V
VP and enable Schmitt trigger
load dump
16.9 V
VP
7.0 V
4.0 V
enable
power
switch
>1.8 V
<1.3 V
16 V
power
switch
output
0V
Power switch behaviour
Fig.7 Timing diagram of regulators and power switch.
2004 Mar 31
11
MGL906
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VP1
PARAMETER
CONDITIONS
MAX.
UNIT
supply voltage 1
operating
VP2
MIN.
−
18
V
reverse polarity
non-operating
−
18
V
jump start
t ≤ 10 minutes
−
30
V
load dump protection
t ≤ 50 ms; tr ≥ 2.5 ms
−
50
V
supply voltage 2
−
18
V
reverse polarity
non-operating
−
18
V
jump start
t ≤ 10 minutes
−
30
V
load dump protection
t ≤ 50 ms; tr ≥ 2.5 ms
−
50
V
−
62
W
non-operating
−55
+150
°C
operating
Ptot
total power dissipation
Tstg
storage temperature
Tamb
ambient temperature
operating
−40
+85
°C
Tj
junction temperature
operating
−40
+150
°C
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth(j-c)
thermal resistance from junction to case
Rth(j-a)
thermal resistance from junction to ambient
CONDITIONS
VALUE
UNIT
1.3
K/W
50
K/W
in free air
QUALITY SPECIFICATION
In accordance with “General Quality Specification For Integrated Circuits (SNW-FQ-611D)”.
2004 Mar 31
12
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
CHARACTERISTICS
VP = VP1 = VP2 = 14.4 V; Tamb = 25 °C; measured in test circuits of Figs 10 and 11; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VP1
supply voltage 1
operating
VP2
9.5
14.4
18
V
reverse polarity
non-operating
−
−
18
V
regulator 2 on
note 1
4
14.4
50
V
jump start
t ≤ 10 minutes
−
−
30
V
load dump protection
t ≤ 50 ms; tr ≥ 2.5 ms
−
−
50
V
6.5
14.4
18
V
−
−
18
V
0
−
50
V
t ≤ 10 minutes
−
−
30
V
supply voltage 2
operating
reverse polarity
non-operating
regulator 2 on
jump start
t ≤ 50 ms; tr ≥ 2.5 ms
−
−
50
V
Vbat(loaddump) battery overvoltage
shutdown
VP1 and/or VP2
18
20
22
V
Iq(tot)
VP = 12.4 V; note 2
−
105
145
µA
VP = 14.4 V; note 2
−
110
150
µA
6.5
7.0
7.5
V
load dump protection
total quiescent supply
current
Schmitt trigger for power supply (regulators 1, 3 and 4)
Vth(r)
rising threshold voltage
VP1 rising
Vth(f)
falling threshold voltage
VP1 falling
Vhys
hysteresis voltage
4.0
4.5
5.0
V
−
2.5
−
V
Schmitt trigger for enable input (regulators 1, 3, 4 and power switch)
Vth(r)
rising threshold voltage
1.4
1.8
2.4
V
Vth(f)
falling threshold voltage
0.9
1.3
1.9
V
Vhys
hysteresis voltage
IREG = ISW = 1 mA
−
0.5
−
V
ILI
input leakage current
VEN = 5 V
1
5
20
µA
Reset trigger level of regulator 2
Vth(r)
rising threshold voltage
VP1 rising; IREG2 = 50 mA;
note 3
4.43
VREG2 − 0.15 VREG2 − 0.1
V
Vth(f)
falling threshold voltage
VP1 falling; IREG2 = 50 mA;
note 3
4.4
VREG2 − 0.25 VREG2 − 0.13
V
Schmitt triggers for hold circuit output
Vth(r)(REG1)
rising threshold voltage
of regulator 1
VP1 rising; note 3
−
VREG1 − 0.15 VREG1 − 0.075 V
Vth(f)(REG1)
falling threshold voltage
of regulator 1
VP1 falling; note 3
7.67
VREG1 − 0.35 −
V
Vhys(REG1)
hysteresis voltage due to
regulator 1
−
0.2
−
V
2004 Mar 31
13
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
SYMBOL
PARAMETER
CONDITIONS
TDA3681
MIN.
TYP.
MAX.
UNIT
Vth(r)(REG3)
rising threshold voltage
of regulator 3
VP2 rising; note 3
−
VREG3 − 0.15 VREG3 − 0.075 V
Vth(f)(REG3)
falling threshold voltage
of regulator 3
VP2 falling; note 3
4.3
VREG3 − 0.35 −
V
Vhys(REG3)
hysteresis voltage due to
regulator 3
−
0.2
−
V
Vth(r)(REG4)
rising threshold voltage
of regulator 4
VP2 rising; note 3
−
VREG4 − 0.15 VREG4 − 0.075 V
Vth(f)(REG4)
falling threshold voltage
of regulator 4
VP2 falling; note 3
2.7
VREG4 − 0.3
−
V
Vhys(REG4)
hysteresis voltage due to
regulator 4
−
0.15
−
V
Vth(r)(VP)
rising threshold voltage
of supply voltage
VEN = 0 V
9.1
9.7
10.3
V
Vth(f)(VP)
falling threshold voltage
of supply voltage
VEN = 0 V
9.0
9.4
9.8
V
Vhys(VP)
hysteresis voltage of
supply voltage
VEN = 0 V
−
0.3
−
V
Reset and hold buffer
Isink(L)
LOW-level sink current
VRES ≤ 0.8 V; VHOLD ≤ 0.8 V
2
−
−
mA
ILO
output leakage current
VP2 = 14.4 V; VHOLD = 5 V
−
0.1
5
µA
Isource(H)
HIGH-level source
current
VP2 = 14.4 V; VRES ≥ 4.5 V
240
400
900
µA
tr
rise time
note 4
−
7
50
µs
tf
fall time
note 4
−
1
50
µs
Ich
reset delay capacitor
charge current
VCRES = 0 V
2
4
8
µA
Idch
reset delay capacitor
discharge current
VCRES = 3 V;
VP1 = VP2 = 4.3 V
1.0
1.6
−
mA
Vth(r)(RES)
rising voltage threshold
reset signal
2.5
3.0
3.5
V
Vth(f)(RES)
falling voltage threshold
reset signal
1.0
1.2
1.4
V
td(RES)
delay reset signal
CRES = 47 nF; note 5
20
35
70
ms
td(SW)
delay power switch
foldback protection
CRES = 47 nF; note 6
8
17.6
40
ms
Reset delay
Regulator 1 (IREG1 = 5 mA; unless otherwise specified)
Vo(off)
output voltage off
Vo(REG1)
output voltage
−
1
400
mV
1 mA ≤ IREG1 ≤ 600 mA
8.0
8.5
9.0
V
9.5 V ≤ VP1 ≤ 18 V
8.0
8.5
9.0
V
∆Vline
line regulation
9.5 V ≤ VP1 ≤ 18 V
−
2
75
mV
∆Vload
load regulation
1 mA ≤ IREG1 ≤ 600 mA
−
20
85
mV
2004 Mar 31
14
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
SYMBOL
PARAMETER
CONDITIONS
TDA3681
MIN.
TYP.
MAX.
UNIT
Iq
quiescent current
IREG1 = 600 mA
−
25
60
mA
SVRR
supply voltage ripple
rejection
fi = 3 kHz; Vi = 2 V (p-p)
60
70
−
dB
Vdrop(REG1)
drop-out voltage
IREG1 = 550 mA; VP1 = 8.55 V; −
note 7
0.4
0.7
V
Im(REG1)
current limit
VREG1 > 7 V; note 8
0.65
1.2
−
A
Isc(REG1)
short-circuit current
RL ≤ 0.5 Ω; note 9
250
800
−
mA
0.5 mA ≤ IREG2 ≤ 300 mA
4.75
5.0
5.25
V
Regulator 2 (IREG2 = 5 mA; unless otherwise specified)
Vo(REG2)
output voltage
∆Vline
line regulation
∆Vload
load regulation
7 V ≤ VP1 ≤ 18 V
4.75
5.0
5.25
V
18 V ≤ VP1 ≤ 50 V;
IREG2 ≤ 150 mA
4.75
5.0
5.25
V
6 V ≤ VP1 ≤ 18 V
−
2
50
mV
6 V ≤ VP1 ≤ 50 V
−
15
75
mV
1 mA ≤ IREG2 ≤ 150 mA
−
20
50
mV
1 mA ≤ IREG2 ≤ 300 mA
−
−
100
mV
50
55
−
dB
SVRR
supply voltage ripple
rejection
fi = 3 kHz; Vi = 2 V (p-p)
Vdrop(REG2)
drop-out voltage
IREG2 = 100 mA; VP1 = 4.75 V; −
note 7
0.4
0.6
V
IREG2 = 200 mA; VP1 = 5.75 V; −
note 7
0.8
1.2
V
IREG2 = 100 mA; VBU = 4.75 V; −
note 10
0.2
0.5
V
IREG2 = 200 mA; VBU = 5.75 V; −
note 10
0.8
1.0
V
Im(REG2)
current limit
VREG2 > 4.5 V; note 8
0.32
0.37
−
A
Isc(REG2)
short-circuit current
RL ≤ 0.5 Ω; note 9
95
120
−
mA
−
1
400
mV
1 mA ≤ IREG3 ≤ 1400 mA
4.75
5.0
5.25
V
Regulator 3 (IREG3 = 5 mA; unless otherwise specified)
Vo(off)
output voltage off
Vo(REG3)
output voltage
7 V ≤ VP1 and/or VP2 ≤ 18 V
4.75
5.0
5.25
V
∆Vline
line regulation
7 V ≤ VP1 and/or VP2 ≤ 18 V
−
2
50
mV
∆Vload
load regulation
1 mA ≤ IREG3 ≤ 1400 mA
−
20
150
mV
Iq
quiescent current
IREG3 = 1400 mA
−
19
45
mA
SVRR
supply voltage ripple
rejection
fi = 3 kHz; Vi = 2 V (p-p)
60
70
−
dB
Vdrop(REG3)
drop-out voltage
IREG3 = 1400 mA ; VP2 = 6 V;
note 7
−
1
1.5
V
Im(REG3)
current limit
VREG3 > 4.5 V; note 8
1.5
1.7
−
A
Isc(REG3)
short-circuit current
RL ≤ 0.5 Ω; note 9
430
750
−
mA
2004 Mar 31
15
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
SYMBOL
PARAMETER
CONDITIONS
TDA3681
MIN.
TYP.
MAX.
UNIT
Regulator 4 (IREG4 = 5 mA; unless otherwise specified)
Vo(off)
output voltage off
Vo(REG4)
output voltage
−
1
400
mV
1 mA ≤ IREG4 ≤ 1 A
3.14
3.3
3.46
V
6.5 V ≤ VP1 and/or VP2 ≤ 18 V
3.14
3.3
3.46
V
∆Vline
line regulation
6.5 V ≤ VP1 and/or VP2 ≤ 18 V
−
2
50
mV
∆Vload
load regulation
1 mA ≤ IREG4 ≤ 1 A
−
20
50
mV
Iq
quiescent current
IREG4 = 1 A
−
15
40
mA
SVRR
supply voltage ripple
rejection
fi = 3 kHz; Vi = 2 V (p-p)
60
70
−
dB
Vdrop(REG4)
drop-out voltage
IREG4 = 1 A; VP2 = 5 V; note 7
−
1.7
2.4
V
Im(REG4)
current limit
VREG4 > 3.0 V; note 8
1.1
1.5
−
A
Isc(REG4)
short-circuit current
RL ≤ 0.5 Ω; note 9
470
750
−
mA
drop-out voltage
ISW = 1 A; VP1 = 13.5 V;
note 11
−
0.45
0.65
V
ISW = 1.8 A; VP1 = 13.5 V;
note 11
−
1.0
1.8
V
Power switch
Vdrop(SW)
IDC(SW)
continuous current
VP1 = 16 V; VSW = 13.5 V
1.8
2.0
−
A
Vclamp(SW)
clamping voltage
VP1 ≥ 17 V;
1 mA < ISW < 1.8 A
13.5
15.0
16.0
V
IM(SW)
peak current
VP1 < 17 V;
notes 6, 12 and 13
3
−
−
A
Vfb(SW)
flyback voltage
behaviour
ISW = −100 mA
−
VP1 + 3
22
V
Isc(SW)
short-circuit current
VP1 = 14.4 V; VSW < 1.2 V;
note 13
0.5
1.7
−
A
Backup switch
IDC(BU)
continuous current
VBU > 5 V
0.3
0.35
−
A
Vclamp(BU)
clamping voltage
VP1 ≥ 16.7 V; IREG2 = 100 mA
−
−
16
V
Ir(BU)
reverse current
VP1 = 0 V; VBU = 12.4 V
−
−
900
µA
Schmitt trigger for enable ignition input
Vth(r)(IGNIN)
rising threshold voltage
of ignition input
VP1 > 3.5 V
1.9
2.2
2.5
V
Vth(f)(IGNIN)
falling threshold voltage
of ignition input
VP1 > 3.5 V
1.7
2.0
2.3
V
Vhys(IGNIN)
hysteresis voltage
VP > 3.5 V
0.1
0.2
0.5
V
ILI
input leakage current
VIGNIN = 5 V
−
−
1.0
µA
Ii(clamp)
input clamp current
VIGNIN ≤ 50 V
−
−
50
mA
VIH(clamp)
HIGH-level input
clamping voltage
VP1
−
50
V
VIL(clamp)
LOW-level input
clamping voltage
−0.6
−
0
V
2004 Mar 31
VIGNIN ≥ −100 V
16
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
SYMBOL
PARAMETER
CONDITIONS
TDA3681
MIN.
TYP.
MAX.
UNIT
Ignition buffer
VOL
LOW-level output voltage IIGNOUT = 0 mA
0
0.2
0.8
V
VOH
HIGH-level output
voltage
IIGNOUT = 0 mA
4.5
5.0
5.25
V
IOL
LOW-level sink current
VIGNOUT ≤ 0.8 V
0.45
0.8
−
mA
IOH
HIGH-level source
current
VIGNOUT ≥ 4.5 V
0.45
2.0
−
mA
tPLH
LOW-to-HIGH
propagation time
VIGNIN rising from 1.7 to 2.5 V
−
−
500
µs
tPHL
HIGH-to-LOW
propagation time
VIGNIN falling from 2.5 to 1.7 V −
−
500
µs
Temperature protection
Tj(sd)
junction temperature for
shutdown
150
160
170
°C
Tj(hold)
junction temperature for
hold trigger
150
160
170
°C
Notes
1. Minimum operating voltage, only if VP1 has exceeded 6.5 V.
2. The total quiescent current is measured in the standby mode. Therefore, the enable inputs of regulators 1, 3, 4 and
the power switch are grounded and RL(REG2) = ∞ ; see Figs 10 and 11.
3. The voltage of the regulator drops as a result of a VP1 drop for regulators 1 and 2. Regulators 3 and 4 drop as a result
of VP2 drop.
4. The rise and fall times are measured with a 10 kΩ pull-up resistor and a 50 pF load capacitor.
C
3
5. The delay time depends on the value of the reset delay capacitor: t d(RES) = ------ × V C(th) = C × ( 750 × 10 ) [ s ]
I ch
C
3
6. The delay time depends on the value of the reset delay capacitor: t d(SW) = ------ × V C(th) = C × ( 375 × 10 ) [ s ]
I ch
7. The drop-out voltage of regulators 1 and 2 is measured between pins VP1 and REGn. The drop-out voltage of
regulators 3 and 4 is measured between pins VP2 and REGn.
8. At current limit, Im(REGn) is held constant (see Fig.8).
9. The foldback current protection limits the dissipated power at short-circuit (see Fig.8).
10. The drop-out voltage is measured between pins BU and REG2.
11. The drop-out voltage of the power switch is measured between pins VP1 and SW.
12. The maximum output current of the power switch is limited to 1.8 A when the supply voltage exceeds 18 V.
13. At short-circuit, Isc(SW) of the power switch is held constant to a lower value than the continuous current after a delay
of at least 10 ms.
2004 Mar 31
17
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
handbook, halfpage
TDA3681
handbook, halfpage
MGL907
8.5 V
Vo(REG2)
MGL908
5.0 V
Vo(REG1)
Im(REG2)
Isc(REG2)
IREG2
Isc(REG1)
Im(REG1)
IREG1
a. Regulator 1.
b. Regulator 2.
handbook, halfpage
handbook, halfpage
Vo(REG3)
Vo(REG4)
MGL909
5.0 V
MGL910
3.3 V
Isc(REG3)
Im(REG3)
Im(REG4)
Isc(REG4)
IREG3
IREG4
c. Regulator 3.
d. Regulator 4.
Fig.8 Foldback current protection of the regulators.
handbook, full pagewidth
MGR931
VSW
VP − 3.3 V
delayed
generates
hold
not
delayed
2VBE
>1.8 A
1A
>3 A
ISW
Fig.9 Current protection of the power switch.
2004 Mar 31
18
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
TEST AND APPLICATION INFORMATION
Test information
power switch output
supply voltage 1
16
17
VP1
C1
220 nF
C15
100 nF
C13
1000 µF
(1)
enable input power switch
15
11
regulator 2
output
enable input regulator 1/3
10
1
9
2
supply voltage 2
4
reset delay
capacitor
R6
VIGNIN
10 kΩ
C6
10 µF
hold output
14
ignition input
(3)
C9
50 pF
(3)
C12
50 pF
12
ignition output
5
6
mgl911
13
ground
(1) A minimum capacitor of 220 nF on the supply lines VP1 and VP2 is required for stability.
(2) A minimum capacitor of 1 µF for backup supply is required for stability.
(3) Capacitor represents the typical input capacitance of CMOS logic connected to the reset and hold outputs.
Fig.10 Test circuit of TDA3681J and TDA3681JR.
2004 Mar 31
5 kΩ
R3
10 kΩ
C10
100 µF
C11
1 nF
RL(REG4)
7
backup
(2)
5 kΩ
reset
output
8
C8
47 nF
VBU
RL(REG3)
3.3 V
C19
100 nF
C14
1000 µF
(1)
10 kΩ
C5
10 µF
regulator 4
output
3
C7
220 nF
RL(REG1)
5V
C18
100 nF
TDA3681J
TDA3681JR
5 kΩ
C4
10 µF
regulator 3
output
VEN4
RL(REG2)
8.5 V
C17
100 nF
enable input regulator 4
12 kΩ
C3
10 µF
regulator 1
output
VEN1/3
RL(SW)
5V
C16
100 nF
VENSW
VP2
C2
10 µF
19
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
power switch output
supply voltage 1
16
14
VP1
C1
220 nF
TDA3681
C15
100 nF
C13
1000 µF
(1)
enable input power switch
12
8
VENSW
enable input regulator 1/3
7
17
VEN1/3
enable input regulator 4
6
19
regulator 2
output
1
supply voltage 2
C3
10 µF
C17
100 nF
regulator 3
output
C4
10 µF
C18
100 nF
C5
10 µF
VP2
C7
220 nF
reset delay
capacitor
R6
VIGNIN
10 kΩ
RL(REG3)
5 kΩ
C6
10 µF
hold output
RL(REG4)
5 kΩ
13
ignition input
(3)
C9
50 pF
(3)
C12
50 pF
R3
10 kΩ
9
ignition output
2
3
11
mgu355
10
heat tab
ground
(1) A minimum capacitor of 220 nF on the supply lines VP1 and VP2 is required for stability.
(2) A minimum capacitor of 1 µF for backup supply is required for stability.
(3) Capacitor represents the typical input capacitance of CMOS logic connected to the reset and hold outputs.
Fig.11 Test circuit of TDA3681TH.
2004 Mar 31
10 kΩ
3.3 V
C10
100 µF
C11
1 nF
RL(REG1)
4
backup
(2)
5 kΩ
reset
output
5
C8
47 nF
VBU
RL(REG2)
5V
C19
100 nF
C14
1000 µF
(1)
12 kΩ
8.5 V
regulator 4
output
20
RL(SW)
5V
C16
100 nF
regulator 1
output
VEN4
TDA3681TH
C2
10 µF
20
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
The output capacitors can be selected by using the graphs
given in Figs 12 and 13. When an electrolytic capacitor is
used, its temperature behaviour can cause oscillations at
a low temperature. The two examples below show how an
output capacitor value is selected.
Application information
NOISE
Table 1
Noise figures
NOISE FIGURE (µV)(1)
REGULATOR
Co = 10 µF Co = 47 µF
Co = 100 µF
1
170
110
110
2
440
240
190
3
120
100
80
4
85
70
55
Example 1
Regulators 1, 3 and 4 are stabilized with an electrolytic
output capacitor of 220 µF (ESR = 0.15 Ω).
At Tamb = −30 °C, the capacitor value is decreased to
73 µF and the ESR is increased to 1.1 Ω. The regulator
remains stable at Tamb = −30 °C; see Fig.12.
Note
Example 2
1. Measured at a bandwidth of 30 kHz.
Regulator 2 is stabilized with a 10 µF electrolytic capacitor
(ESR = 3 Ω). At Tamb = −30 °C, the capacitor value is
decreased to 3 µF and the ESR is increased to 23.1 Ω.
As can be seen from Fig.13, the regulator will be unstable
at Tamb = −30 °C.
The noise on the supply line depends on the value of the
supply capacitor and is caused by a current noise (the
output noise of the regulators is translated to a current
noise by the output capacitors). The noise is minimal when
a high frequency capacitor of 220 nF in parallel with an
electrolytic capacitor of 100 µF is connected directly to the
supply pins VP1, VP2 and GND.
Solution
To avoid problems with stability at low temperatures, the
use of tantalum capacitors is recommended. Use a
tantalum capacitor of 10 µF or a larger electrolytic
capacitor.
STABILITY
The regulators are stabilized by the externally connected
output capacitors.
handbook, halfpage
MGL912
handbook, halfpage
20
TDA3681
MGL913
14
ESR
(Ω) 12
ESR
(Ω)
15
maximum ESR
10
8
maximum ESR
10
stable region
6
4
5
stable region
2
minimum ESR
0
0
0.1
1
10
C (µF)
−2
100
0.22
Fig.12 Curve for selecting the value of the output
capacitor for regulators 1, 3 and 4.
2004 Mar 31
1
10
C (µF)
100
Fig.13 Curve for selecting the value of the output
capacitor for regulator 2.
21
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
PACKAGE OUTLINES
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm)
SOT243-3
non-concave
Dh
x
D
Eh
view B: mounting base side
A2
d
B
j
E
A
L3
L
c
Q
1
v M
17
e1
Z
e2
m
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
bp
c
D (1)
d
Dh
E (1)
e
mm
17.0
15.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
2.54
e1
e2
1.27 5.08
Eh
j
L
L3
m
Q
v
w
x
Z (1)
6
3.4
3.1
8.4
7.0
2.4
1.6
4.3
2.1
1.8
0.6
0.25
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
99-12-17
03-03-12
SOT243-3
2004 Mar 31
EUROPEAN
PROJECTION
22
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
DBS17P: plastic DIL-bent-SIL (special bent) power package; 17 leads (lead length 12 mm)
SOT475-1
non-concave
Dh
x
D
Eh
view B: mounting base side
A2
d
B
j
E
A
L3
L
1
Q
17
e1
Z
bp
e
c
w M
m
0
5
v M
e2
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
bp
c
D (1)
d
Dh
E (1)
e
mm
17.0
15.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
2.54
e1
e2
1.27 5.08
Eh
j
L
L3
m
Q
v
w
x
Z (1)
6
3.4
3.1
12.4
11.0
2.4
1.6
4.3
2.1
1.8
0.8
0.4
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
99-12-17
03-03-12
SOT475-1
2004 Mar 31
EUROPEAN
PROJECTION
23
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
E
D
A
x
X
c
E2
y
HE
v M A
D1
D2
10
1
pin 1 index
Q
A
A2
E1
(A3)
A4
θ
Lp
detail X
20
11
Z
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
A2
max.
3.5
3.5
3.2
A3
0.35
A4(1)
D1
D2
E(2)
E1
E2
e
HE
Lp
Q
+0.08 0.53 0.32 16.0 13.0
−0.04 0.40 0.23 15.8 12.6
1.1
0.9
11.1
10.9
6.2
5.8
2.9
2.5
1.27
14.5
13.9
1.1
0.8
1.7
1.5
bp
c
D(2)
v
w
x
y
0.25 0.25 0.03 0.07
Z
θ
2.5
2.0
8°
0°
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
02-02-12
03-07-23
SOT418-3
2004 Mar 31
EUROPEAN
PROJECTION
24
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
SOLDERING
Surface mount packages
Introduction
REFLOW SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended. Driven by legislation and environmental
forces the worldwide use of lead-free solder pastes is
increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Through-hole mount packages
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
SOLDERING BY DIPPING OR BY SOLDER WAVE
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
– for all the BGA, HTSSON..T and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
The total contact time of successive solder waves must not
exceed 5 seconds.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
WAVE SOLDERING
MANUAL SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
2004 Mar 31
To overcome these problems the double-wave soldering
method was specifically developed.
25
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
If wave soldering is used the following conditions must be
observed for optimal results:
TDA3681
The adhesive can be applied by screen printing, pin
transfer or syringe dispensing. The package can be
soldered after the adhesive is cured.
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
MANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive.
2004 Mar 31
26
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
PACKAGE(1)
MOUNTING
WAVE
Through-hole mount CPGA, HCPGA
REFLOW(2) DIPPING
suitable
−
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable(3)
−
−
Through-holesurface mount
PMFP(4)
not suitable
not suitable
−
Surface mount
BGA, HTSSON..T(5), LBGA, LFBGA, SQFP,
SSOP-T(5), TFBGA, USON, VFBGA
not suitable
suitable
−
DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS
not suitable(6)
suitable
−
PLCC(7), SO, SOJ
suitable
suitable
−
not
recommended(7)(8)
suitable
−
SSOP, TSSOP, VSO, VSSOP
not
recommended(9)
suitable
−
CWQCCN..L(11), PMFP(10), WQCCN32L(11)
not suitable
not suitable
−
LQFP, QFP, TQFP
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. Hot bar soldering or manual soldering is suitable for PMFP packages.
5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
7. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
2004 Mar 31
27
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Mar 31
28
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
SCA76
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R32/06/pp29
Date of release: 2004
Mar 31
Document order number:
9397 750 12427
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