Data Sheet

NXP Semiconductors
Data sheet: Advance Information
Document Number: PF3000
Rev. 7.0, 3/2016
Power management integrated
circuit (PMIC) for i.MX 7 & i.MX 6SL/
SX/UL
PF3000
The PF3000 is a power management integrated circuit (PMIC) designed
specifically for use with the NXP i.MX 7 and i.MX 6SL/SX/UL application
processors. With up to four buck converters, six linear regulators, RTC supply,
and coin-cell charger, the PF3000 can provide power for a complete system,
including applications processors, memory, and system peripherals. This device
is powered by SMARTMOS technology.
Features:
• Four adjustable high efficiency buck regulators: 1.75 A, 1.5 A, 1.25 A, 1.0 A
• Selectable modes: PWM, PFM, APS
• 5.0 V, 600 mA boost regulator with PFM or auto mode
• Six adjustable general purpose linear regulators
• Input voltage range: 2.8 V to 4.5 V or 3.7 V to 5.5 V
• OTP (One Time Programmable) memory for device configuration
• Programmable start-up sequence and timing
• Selectable output voltage, frequency, soft start
• I2C control
• Coin cell charger and always ON RTC supply
• DDR reference voltage
• -40 °C to +125 °C operating junction temperature
PF3000
POWER MANAGEMENT
EP SUFFIX
98ASA00719D
48 QFN 7.0 X 7.0
ES SUFFIX
98ASA00933D
48 QFN 7.0 X 7.0
Applications:
• Tablets
• eReaders
• Wearables
• POS terminals
• Industrial control
• Medical monitoring
• Home automation
• Home security/energy management
i.MX
VREFDDR
Switching regulators
DDR MEMORY
INTERFACE
DDR Memory
SW3
0.90 to 1.65 V @ 1.5 A
SW1A
0.7 to 1.425 V, 1.8V, 3.3V @ 1.0 A
Processor
ARM Core
SW1B
0.70 to 1.475 V @ 1.75 A
Processor SOC
SW2
1.50 to 1.85 V @ 1.25 A
or 2.5 to 3.3 V @ 1.25 A
SWBST
5.00 to 5.15 V @ 0.6 A
SD-MMC/
NAND Mem.
SATA
HDD
RESETBMCU
PWRON
STANDBY
SD_VSEL
INTB
Linear
regulators
VCC_SD
1.80 to 1.85 V @ 100 mA
or 2.85 to 3.3 V @ 100 mA
V33
Li CELL
Charger
2.85 - 3.3 V @ 350 mA
Sensors
Camera
WAM
GPS/MIPI
GPS
MIPI
uPCIe
VLDO3
Camera
HDMI
LDVS Display
USB
Ethernet
CAN
1.8 - 3.3 V @ 100 mA
VLDO4
1.8 - 3.3 V @ 350 mA
Main Supply
2.8 – 5.5 V
Cluster/HUD
Front USB
POD
Rear Seat
Infotaiment
Figure 1. PF3000 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© 2016 NXP B.V.
Audio
Codec
I2C
I2C
VLDO2
0.80 to 1.55 V @ 250 mA
External AMP
Microphones
Speakers
Parallel control/GPIOS
VLDO1
1.8 to 3.3 V @ 100 mA
COINCELL
SATA - FLASH
NAND - NOR
Interfaces
Rear USB
POD
Table of Contents
1
2
3
4
Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Pinout diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5 General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6 Functional description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Functional description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6.2 Power generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.3.1 Control logic and interface signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.3.2 One-time-programmable memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.3.4 16 MHz and 32 kHz clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
6.3.5 Optional front-end input LDO regulator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.3.6 Internal core voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.3.7 VREFDDR voltage reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.3.8 Buck regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
6.3.9 Boost regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
6.3.10 LDO Regulators Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.3.11 VSNVS LDO/switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.4 Power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.5 Modes of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
6.5.1 State diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
6.5.2 State machine flow summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
6.5.3 Performance characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
6.6 Control Interface I2C block description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
6.6.1 I2C device ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
6.6.2 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
6.6.3 Interrupt handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
6.6.4 Interrupt bit summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
6.6.5 Specific registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
6.6.6 Register map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .102
7 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
7.1 Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
8 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
9 Thermal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
9.1 Rating data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
9.2 Estimation of junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
10 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
10.1Packaging dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
PF3000
2
NXP Semiconductors
ORDERABLE PARTS
1
Orderable parts
The PF3000 is available with pre-programmed OTP memory configurations. The devices are identified using the program codes from
Table 1. Details of the OTP programming for each device can be found in Table 42.
Table 1. Orderable part variations
Part number
Temperature (TA)
Package
Programming options
MC32PF3000A0EP
0 - Not programmed
MC32PF3000A1EP
1 (i.MX 7 with DDR3L)
MC32PF3000A2EP
MC32PF3000A3EP
MC32PF3000A4EP
2 (i.MX 7 with LPDDR3)
-40 °C to 85 °C
(For use in Consumer
applications)
98ASA00719D, 48 QFN 7.0 mm x
7.0 mm with exposed pad
3 (i.MX 6 Series with DDR3L)
4 (i.MX 6 Series with DDR3)
MC32PF3000A5EP
5 (i.MX 6 Series with LPDDR2)
MC32PF3000A6EP
6 (i.MX 6UL with LPDDR2)
MC32PF3000A7EP
7 (i.MX 6UL with DDR3L)
PC33PF3000A0ES
0 - Not programmed
PC33PF3000A3ES
3 (i.MX 6 Series with DDR3L)
PC33PF3000A4ES
PC33PF3000A5ES
-40 °C to 105 °C
(For use in Automotive
applications)
98ASA00933D, 48 QFN 7.0 mm x
7.0 mm WF-type (wettable flank)
4 (i.MX 6 Series with DDR3)
5 (i.MX 6 Series with LPDDR2)
PC33PF3000A6ES
6 (i.MX 6UL with LPDDR2)
PC33PF3000A7ES
7 (i.MX 6UL with DDR3L)
MC34PF3000A0EP
0 - Not programmed
MC34PF3000A1EP
1 (i.MX 7 with DDR3L)
MC34PF3000A2EP
MC34PF3000A3EP
MC34PF3000A4EP
Notes
(1)
(1)
2 (i.MX 7 with LPDDR3)
-40 °C to 105 °C
(For use in Industrial
applications)
98ASA00719D, 48 QFN 7.0 mm x
7.0 mm with exposed pad
3 (i.MX 6 Series with DDR3L)
4 (i.MX 6 Series with DDR3)
MC34PF3000A5EP
5 (i.MX 6 Series with LPDDR2)
MC34PF3000A6EP
6 (i.MX 6UL with LPDDR2)
MC34PF3000A7EP
7 (i.MX 6UL with DDR3L)
(1)
Notes
1. For Tape and Reel, add an R2 suffix to the part number.
PF3000
NXP Semiconductors
3
GENERAL DESCRIPTION
2
General description
The PF3000 is the power management integrated circuit (PMIC) designed primarily for use with NXP’s i.MX 7 series of multi-media
application processors. It is also capable of providing full power solution to i.MX 6SL/SX/UL processors.
2.1
Features
This section summarizes the PF3000 features.
• Input voltage range to PMIC: 2.8 V to 4.5 V, or 3.7 V to 5.5 V (2)
• Buck regulators
• Configurable three to four channels
• SW1A/B, 2.75 A (single); 0.7 V to 1.425 V, 1.8 V, 3.3 V
• SW1A, 1.0 A (independent); 0.7 V to 1.425 V, 1.8 V, 3.3 V
• SW1B 1.75 A (independent); 0.7 V to 1.475 V
• SW2, 1.25 A; 1.50 V to 1.85 V or 2.50 V to 3.30 V
• SW3, 1.5 A; 0.90 V to 1.65 V
•
•
•
•
•
•
•
•
•
•
•
•
Dynamic voltage scaling
Modes: PWM, PFM, APS
Programmable output voltage
Programmable current limit
Programmable soft start sequence
Programmable PWM switching frequency
• Boost regulator
• SWBST, 5.0 to 5.15 V, 0.6 A, OTG support
• Modes: PFM and Auto
• OCP fault interrupt
• LDOs
• VCC_SD, 1.8 V to 1.85 V or 2.85 V to 3.30 V, 100 mA based on SD_VSEL
• V33, 2.85 V to 3.30 V, 350 mA
• VLDO1, 1.8 V to 3.3 V, 100 mA
• VLDO2, 0.80 V to 1.55 V, 250 mA
• VLDO3, 1.8 V to 3.3 V, 100 mA
• VLDO4, 1.8 V to 3.3 V, 350 mA
Always ON RTC Regulator/Switch VSNVS 3.0 V, 1.0 mA
DDR memory reference voltage, VREFDDR, 0.5 V to 0.9 V, 10 mA
OTP (One time programmable) memory for device configuration, user-programmable start-up sequence and timing
Battery backed memory including coin cell charger
I2C interface
User programmable standby, sleep/LPSR, and Off modes
Notes
2. 2.8 V to 4.5 V when VIN is used at input. 3.7 V to 5.5 V when VPWR is used as input.
PF3000
4
NXP Semiconductors
GENERAL DESCRIPTION
2.2
Functional block diagram
PF3000 functional internal block diagram
Power generation
OTP startup configuration
OTP prototyping
(Try before burn)
Voltage
Sequence and
timing
Phasing and
frequency selection
Switching regulators
SW1A
(0.7 V to 1.425 V,
1.8 V, 3.3 V, 1.0 A)
Linear regulators
VCC_SD
(1.80 V or 1.85 V, 100 mA)
or (2.85 V or 3.3 V, 100 mA)
V33
( 2.85 V to 3.30 V, 350 mA)
Bias & references
Internal core voltage reference
SW1B
(0.70 V to 1.475 V , 1.75 A)
DDR voltage reference
Logic and control
Parallel MCU interface
VLDO1
(1.8 V to 3.3 V, 100 mA)
SW2
VLDO2
(1.50 V to 1.85 V, 1.25 A)
or (2.50 V to 3.30 V, 1.25 A)
(0.80 V to 1.55 V, 250 mA)
VLDO3
Regulator control
I2C communication & registers
SW3
(0.90 V to 1.65 V, 1.5 A)
(1.8 V to 3.3 V, 100 mA)
VLDO4
(1.8 V to 3.3 V, 350 mA)
Fault detection and protection
Thermal
Current limit
Boost regulator
(5.0 V to 5.15 V, 600 mA)
USB OTG Supply
VPWR front end LDO overvoltage indicator
VSNVS
(1.0 V to 3.0 V, 1.0 mA)
RTC supply with coin cell
charger
Figure 2. Functional block diagram
PF3000
NXP Semiconductors
5
INTERNAL BLOCK DIAGRAM
3
Internal block diagram
PF3000
VLDO1
VLDO1IN
100 mA
VLDO1
SW1A
1.0 A
Buck
VLDO2
VLDO2IN
SW1AFB
O/P
Drive
SW1AIN
SW1ALX
250 mA
VLDO2
VLDO3
VLDO34IN
SW1B
100 mA
VLDO3
1.75 A
Buck
VLDO4
VLDO4
O/P
Drive
SW1BFB
SW1BLX
SW1BIN
GNDREF1
350 mA
Core Control logic
VCC_SD
1.8 V/3.15V
100 mA
VCC_SD
Initialization State Machine
SW2
V33
2.85 V3.30 V
350 mA
V33
VIN2
O/P
Drive
SW2LX
SW2IN
SW2FB
1.25 A
Buck
GNDREF2
Supplies
Control
OTP
SW3FB
VDDOTP
CONTROL
I2C
Interface
VDDIO
SCL
SW3
1.5 A
Buck
SDA
O/P
Drive
SW3IN
SW3LX
GNDREF2
DVS CONTROL
DVS Control
VIN2
SWBST
I2C Register
map
VCOREDIG
VCOREREF
Trim-In-Package
O/P
Drive
SWBSTLX
SWBSTFB
Reference
Generation
VCORE
600 mA
Boost
Clocks and
resets
GNDREF
VPWR
LDOG
VREF
LDO
VIN
Li Cell
Charger
LICELL
Clocks
32 kHz and
16 MHz
Best
of
Supply
VSNVS
VREFDDR
VINREFDDR
INTB
RESETBMCU
SD_VSEL
STANDBY
ICTEST
PWRON
VSNVS
VHALF
Figure 3. PF3000 simplified internal block diagram
PF3000
6
NXP Semiconductors
37 SWBSTFB
38 VIN2
39 VDDOTP
40 GNDREF
41 VCORE
42 VIN
48 PWRON
Transparent Top View
43 VCOREDIG
Pinout diagram
44 VCOREREF
4.1
45 SDA
Pin connections
47 VDDIO
4
46 SCL
PIN CONNECTIONS
INTB
1
36 LICELL
SD_VSEL
2
35 SWBSTLX
RESETBMCU
3
34 VSNVS
STANDBY
4
33 VCC_SD
ICTEST
5
32 V33
SW1AFB
6
31 VPWR
EP
SW1BFB
11
26 GNDREF2
GNDREF1
12
25 VREFDDR
VINREFDDR 24
27 SW3FB
VHALF 23
10
VLDO4 22
SW1BIN
VLDO34IN 21
28 SW3IN
VLDO3 20
9
SW2FB 19
SW1BLX
SW2IN 18
29 SW3LX
SW2LX 17
8
VLDO2IN 16
SW1ALX
VLDO2 15
30 LDOG
VLDO1 14
7
VLDO1IN 13
SW1AIN
Figure 4. Pinout diagram
PF3000
NXP Semiconductors
7
PIN CONNECTIONS
4.2
Pin definitions
Table 2. Pin definitions
Pin number
Pin name
Pin
function
Type
1
INTB
O
Digital
Open drain interrupt signal to processor
2
SD_VSEL
I/O
Digital
Input from i.MX processor to select VCC_SD regulator voltage
• SD_VSEL=0, VCC_SD = 2.85 V to 3.3 V
• SD_VSEL= 1, VCC_SD = 1.8 V to 1.85 V
3
RESETBMCU
O
Digital
Open drain reset output to processor
4
STANDBY
I
Digital
Standby input signal from processor
5
ICTEST
I
Digital and
Analog
6
SW1AFB (3)
I
Analog
SW1A output voltage feedback pin. Route this trace separately from the high current
path and terminate at the output capacitance or near the load, if possible for best
regulation
7
SW1AIN (3)
I
Analog
Input to SW1A regulator. Bypass with at least a 4.7 µF ceramic capacitor and a 0.1 µF
decoupling capacitor as close to the pin as possible
8
SW1ALX (3)
O
Analog
Switcher 1A switch node connection. Connect to SW1A inductor when used in SW1A
independent mode. Connect to SW1BLX and connect to SW1AB inductor when using
SW1A/B as a single regulator
9
SW1BLX (3)
O
Analog
Switcher 1B switch node connection. Connect to SW1B inductor when used in SW1B
independent mode. Connect to SW1ALX and connect to SW1AB inductor when using
SW1A/B as a single regulator
10
SW1BIN (3)
I
Analog
Input to SW1B regulator. Bypass with at least a 4.7 µF ceramic capacitor and a 0.1 µF
decoupling capacitor as close to the pin as possible
11
SW1BFB (3)
I
Analog
SW1B output voltage feedback pin. Route this trace separately from the high current
path and terminate at the output capacitor or near the load, if possible for best regulation
12
GNDREF1
GND
GND
Ground reference for SW1A/B. Connect to GND. Keep away from high current ground
return paths
13
VLDO1IN
I
Analog
VLDO1 input supply. Bypass with a 1.0 µF decoupling capacitor as close to the pin as
possible
14
VLDO1
O
Analog
VLDO1 regulator output. Bypass with a 2.2 µF ceramic output capacitor
15
VLDO2
O
Analog
VLDO2 regulator output. Bypass with a 4.7 µF ceramic output capacitor
16
VLDO2IN
I
Analog
VLDO2 input supply. Bypass with a 1.0 µF decoupling capacitor as close to the pin as
possible
17
SW2LX (3)
O
Analog
Switcher 2 switch node connection.Connect to SW2 inductor
18
SW2IN (3)
I
Analog
Input to SW2 regulator. Bypass with at least a 4.7 µF ceramic capacitor and a 0.1 µF
decoupling capacitor as close to the pin as possible
19
SW2FB (3)
I
Analog
SW2 output voltage feedback pin. Route this trace separately from the high current path
and terminate at the output capacitor or near the load, if possible for best regulation
20
VLDO3
O
Analog
VLDO3 regulator output. Bypass with a 2.2 µF ceramic output capacitor
21
VLDO34IN
I
Analog
VLDO3 and VLDO4 input supply. Bypass with a 1.0 µF decoupling capacitor as close to
the pin as possible
22
VLDO4
O
Analog
VLDO4 regulator output. Bypass with a 2.2 µF ceramic output capacitor
23
VHALF
I
Analog
Half supply reference for VREFDDR. Bypass with 0.1 µF to ground.
24
VINREFDDR
I
Analog
VREFDDR regulator input. Connect a 0.1 µF capacitor between VINREFDDR and
VHALF pin. Ensure there is at least 1.0 µF net capacitance from VINREFDDR to ground
25
VREFDDR
O
Analog
VREFDDR regulator output.Bypass with 1.0 µF to ground
Definition
Reserved pin. Connect to GND in application
PF3000
8
NXP Semiconductors
PIN CONNECTIONS
Table 2. Pin definitions (continued)
26
GNDREF2
GND
GND
Reference ground for SW2 and SW3 regulators. Connect to GND. Keep away from high
current ground return paths
27
SW3FB (3)
I
Analog
SW3 output voltage feedback pin. Route this trace separately from the high current path
and terminate at the output capacitor or near the load, if possible for best regulation
28
SW3IN (3)
I
Analog
Input to SW3 regulator. Bypass with at least a 4.7 µF ceramic capacitor and a 0.1 µF
decoupling capacitor as close to the pin as possible
29
SW3LX (3)
O
Analog
Switcher 3 switch node connection. Connect the SW3 inductor
30
LDOG
O
Analog
Connect to gate of front-end LDO external pass P-MOSFET. Leave floating if VPWR
LDO is not used
31
VPWR
I
Analog
Input to optional front-end VPWR LDO for systems with input voltage > 4.5 V
32
V33
O
Analog
V33 regulator output. Bypass with a 4.7 µF ceramic output capacitor
33
VCC_SD
O
Analog
Output of VCC_SD regulator. Bypass with a 2.2 µF ceramic output capacitor.
34
VSNVS
O
Analog
VSNVS regulator/switch output. Bypass with 0.47 µF capacitor to ground.
35
SWBSTLX (3)
I/O
Analog
SWBST switch node connection. Connect to SWBST inductor and anode of Schottky
diode
36
LICELL
I/O
Analog
Coin cell supply input/output. Bypass with 0.1 µF capacitor. Connect to optional coin cell.
37
SWBSTFB (3)
I
Analog
SWBST output voltage feedback pin. Route this trace separately from the high current
path and terminate at the output capacitor
38
VIN2
I
Analog
Input to VCC_SD, V33 regulators and SWBST control circuitry. Connect to VIN rail and
bypass with 10 µF capacitor
39
VDDOTP
I
Digital &
Analog
40
GNDREF
GND
GND
41
VCORE
O
Analog
Internal analog core supply. Bypass with 1 µF capacitor to ground
42
VIN
I
Analog
Main IC supply. Bypass with 1.0 µF capacitor to ground. Connect to system input supply
if voltage ≤ 4.5 V. Connect to drain of external PFET when VPWR LDO is used for
systems with input voltage > 4.5 V
Supply to program OTP fuses. Connect VDDOTP to GND during normal application
Ground reference for IC core circuitry. Connect to ground. Keep away from high current
ground return paths
43
VCOREDIG
O
Analog
Internal digital core supply. Bypass with 1.0 µF capacitor to ground
44
VCOREREF
O
Analog
Main band gap reference. Bypass with 220 nF capacitor to ground
45
SDA
I/O
Digital
I2C data line (open drain). Pull up to VDDIO with a 4.7 kΩ resistor
46
SCL
I
Digital
I2C clock. Pull up to VDDIO with a 4.7 kΩ resistor
47
VDDIO
I
Analog
Supply for I2C bus. Bypass with 0.1 µF ceramic capacitor. Connect to 1.7 to 3.6 V
supply. Ensure that VDDIO is always lesser than or equal to VIN
48
PWRON
I
Digital
Power ON/OFF input from processor
-
EP
GND
GND
Expose pad. Functions as ground return for buck and boost regulators. Tie this pad to
the inner and external ground planes through vias to allow effective thermal dissipation
Notes
3. Unused switching regulators should be connected as follows: Pins SWxLX and SWxFB should be unconnected and Pin SWxIN should be
connected to VIN with a 0.1 μF bypass capacitor.
PF3000
NXP Semiconductors
9
GENERAL PRODUCT CHARACTERISTICS
5
General product characteristics
5.1
Absolute maximum ratings
Table 3. Absolute maximum voltage ratings
All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause malfunction or permanent damage
to the device. The detailed maximum voltage rating per pin can be found in the pin list section.
Symbol
Description
Value
Unit
Notes
Electrical ratings
VPWR, ICTEST, LDOG, SWBSTLX
–
-0.3 to 7.5
V
VIN, VIN2, VLDO1IN, SW1AIN, SW1BIN,
SW2IN, SW3IN, SW1ALX, SW1BLX, SW2LX,
SW3LX
–
-0.3 to 4.8
V
OTP programming input supply voltage
-0.3 to 10.0
V
Boost switcher feedback
-0.3 to 5.5
V
–
-0.3 to 3.6
V
VLDO2 linear regulator output
-0.3 to 2.5
V
VCOREDIG
Digital core supply voltage output
-0.3 to 1.65
V
VCOREREF
Bandgap reference voltage output
-0.3 to 1.5
V
±2000
±500
V
VDDOTP
SWBSTFB
INTB, SD_VSEL, RESETBMCU, STANDBY,
SW1AFB, SW1BFB, SW2FB, SW3FB, VLDO1,
VLDO2IN, VLDO3, VLDO34IN, VLDO4, VHALF,
VINREFDDR, VREFDDR, V33, VCC_SD,
VSNVS, LICELL, VCORE, SDA, SCL, VDDIO,
PWRON
VLDO2
VESD
ESD ratings
• Human body model
• Charge device model
(4)
(5)
Notes
4. 10 V maximum voltage rating during OTP fuse programming. 7.5 V maximum DC voltage rated otherwise.
5. ESD testing is performed in accordance with the human body model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), and the charge device model (CDM),
robotic (CZAP = 4.0 pF).
PF3000
10
NXP Semiconductors
GENERAL PRODUCT CHARACTERISTICS
5.2
Thermal Characteristics
Table 4. Thermal ratings
Symbol
Description (rating)
Min.
Max.
Unit
Notes
Thermal Ratings
TA
Ambient operating temperature range
• Industrial version
• Consumer version
-40
-40
105
85
°C
TJ
Operating junction temperature range
-40
125
°C
Storage temperature range
-65
150
°C
–
(8)
°C
(7) (8)
TST
TPPRT
Peak package reflow temperature
(6)
QFN48 thermal resistance and package dissipation ratings
RθJA
Junction to ambient, natural convection
• Four layer board (2s2p)
• Eight layer board (2s6p)
–
–
24
15
°C/W
(9) (10)
(11)
RθJB
Junction to board
–
11
°C/W
(12)
RΘJCBOTTOM
Junction to case bottom
–
1.4
°C/W
(13)
ΨJT
Junction to package top
• Natural convection
–
1.3
°C/W
(14)
Notes
6. Do not operate beyond 125 °C for extended periods of time. Operation above 150 °C may cause permanent damage to the IC. See Thermal
Protection Thresholds for thermal protection features.
7. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause a
malfunction or permanent damage to the device.
8. NXP's package reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For peak package reflow temperature and
moisture sensitivity levels (MSL), Go to www.nxp.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all
orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics..
9. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
10. The Board uses the JEDEC specifications for thermal testing (and simulation) JESD51-7 and JESD51-5.
11. Per JEDEC JESD51-6 with the board horizontal.
12. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the
board near the package.
13. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
14. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC
JESD51-2. When Greek letters (Ψ) are not available, the thermal characterization parameter is written as Psi-JT.
PF3000
NXP Semiconductors
11
GENERAL PRODUCT CHARACTERISTICS
5.3
Current consumption
The current consumption of the individual blocks is described in detail in the following table.
Table 5. Current consumption summary
TA= -40 °C to 105 °C, VPWR= 0 V (External pass FET is not populated), VIN = 3.6 V, VDDIO = 1.7 V to 3.6 V, LICELL = 1.8 V to 3.3 V,
VSNVS = 3.0 V, typical external component values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VPWR = 0 V,
VDDIO = 3.3 V, LICELL = 3.0 V, VSNVS = 3.0 V and 25 °C, unless otherwise noted.
Mode
PF3000 conditions
Coin cell
VSNVS from LICELL, All other blocks
off, VIN = 0.0 V
Off
Sleep LPSR
Standby
ON
System conditions
Typ.
Max.
Unit
Notes
No load on VSNVS
4.0
7.0
μA
(15) (16)
VSNVS from VIN or LICELL
Wake-up from PWRON active
32 kHz RC on
All other blocks off
VIN ≥ UVDET
No load on VSNVS, PMIC able to
wake-up
16
25
μA
(15) (16)
VSNVS from VIN
Wake-up from PWRON active
Trimmed reference active
SW3 PFM. All other regulators off.
Trimmed 16 MHz RC off
32 kHz RC on
VREFDDR disabled
No load on any of the regulators.
130 (15)
200 (18)
220 (15)
μA
(17)
LDO1 & LDO3 activated in addition to
SW3
No load on any of the regulators.
170 (15)
260 (18)
248 (15)
μA
(17)
VSNVS from either VIN or LICELL
SW1A in PFM
SW1B in PFM
SW2 in PFM
SW3 in PFM
SWBST off
Trimmed 16 MHz RC enabled
Trimmed reference active
VLDO1-4 enabled
V33 enabled
VCC_SD enabled
VREFDDR enabled
No load on any of the regulators.
297
450
μA
(17)
VSNVS from VIN
SW1A in APS
SW1B in APS
SW2 in APS
SW3 in APS
SWBST off
Trimmed 16 MHz RC enabled
Trimmed reference active
VLDO1-4 enabled
V33 enabled
VCC_SD enabled
VREFDDR enabled
No load on any of the regulators.
1.2
mA
Notes
15. At 25 °C only.
16. When VIN is below the UVDET threshold, in the range of 1.8 V ≤ VIN < 2.65 V, the quiescent current increases by 50 μA, typically.
17.
18.
For PFM operation, headroom should be 300 mV or greater.
At 105 °C only.
PF3000
12
NXP Semiconductors
GENERAL PRODUCT CHARACTERISTICS
5.4
Electrical characteristics
Table 6. Electrical characteristics – front-end input LDO
All parameters are specified at TA = -40 °C to 105 °C, VPWR = 5.0 V, VIN = 4.4 V, IVIN = 300 mA, typical external component values, unless
otherwise noted. Typical values are characterized at VPWR = 5.0 V, VIN = 4.4 V, IVIN = 300 mA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
4.6
3.7
–
–
5.5
4.6
V
(19)
Front end input LDO (VPWR LDO)
VPWR
Operating input voltage
• In regulation
• In dropout operation
VIN
On mode output voltage, 4.6 V < VPWR < 5.5 V,
0.0 mA < IVIN < 3000 mA
4.3
4.4
4.55
V
IVIN
Operating load current at VIN, 3.7 V < VPWR < 5.5 V
0.0
–
3.0
A
–
5.0
10
mA
ILDOGQ
ON mode quiescent current, no load,
Low-power mode output voltage, 4.6 V < VPWR < 5.5 V
0.0 mA < IVIN < 1.0 mA
3.7
4.5
V
VIN_OFF
Off mode output voltage, (CL = 100 μF) 4.6 V < VPWR < 5.5 V,
0.0 mA < IVIN < 35 μA
3.2
4.8
V
ILDOQLP
Low-power mode quiescent current, no load (Standby/Sleep/LPSR
states)
VPWRUV
VPWROV
VIN
–
150
300
μA
VPWR undervoltage threshold (upon undervoltage condition the
external pass FET is turned off)
3.1
–
3.7
V
VPWR overvoltage threshold (upon overvoltage condition interrupt is
asserted at INTB)
5.5
–
6.5
V
IVINUVILIMIT
VPWR LDO current limit under VIN short-circuit (VIN < UVDET)
–
–
300
mA
IVINLEAKAGE
Reverse leakage current from VIN to VPWR, No external pass FET,
VPWR is grounded, device is in OFF state
–
–
1.0
µA
VPWR LDO Off mode quiescent current
–
–
75
μA
IVPWROFF
(20)
Notes
19. While the front end LDO can handle spikes up to 7.5 V at VPWR for as long as 200 µs, the circuit is not expected to be continuously operated
when VPWR is above 5.5 V.
20. This specification gives the leakage current in the VPWR LDO block. Total OFF mode current includes the quiescent current from the other blocks
as specified in Table 5.
PF3000
NXP Semiconductors
13
GENERAL PRODUCT CHARACTERISTICS
Table 7. Static electrical characteristics – SW1
All parameters are specified at TA = -40 °C to 105 °C, VIN = VSW1xIN = 3.6 V, VSW1x = 1.2 V, ISW1x = 100 mA, typical external component
values, fSW1x = 2.0 MHz, unless otherwise noted. Typical values are characterized at VIN = VSW1xIN = 3.6 V, VSW1x = 1.2 V,
ISW1x = 100 mA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
(21), (22)
Switch mode supply SW1A/B (single phase)
VSW1AIN
VSW1BIN
Operating input voltage
2.8
–
4.5
V
VSW1AB
Nominal output voltage
–
Table 53
–
V
-25
25
mV
-25
35
mV
45
mV
-6.0
6.0
%
-6.0
6.0
%
Output voltage accuracy
PWM, APS, 2.8 V < VSW1xIN < 4.5 V, 0 < ISW1AB < 2.75 A
0.7 V ≤ VSW1AB ≤ 1.2 V
• PFM, APS, 2.8 V < VSW1xIN < 4.5 V, 0 < ISW1AB < 2.75A
1.225 V < VSW1AB < 1.425 V
• PFM, steady state, 2.8 V < VSW1xIN < 4.5 V, 0 < ISW1AB < 150 mA
1.8 V ≤ VSW1AB ≤ 1.425 V
• PWM, APS, 2.8 V < VSW1xIN < 4.5 V, 0 < ISW1AB < 2.75A
1.8 V < VSW1AB < 3.3 V
• PFM, steady state, 2.8 V < VSW1xIN < 4.5 V, 0 < ISW1AB < 150 mA
1.8 V ≤ VSW1AB ≤ 3.3 V
•
VSW1ABACC
Rated output load current,
• 2.8 V ≤ VSW1xIN ≤ 4.5 V, 0.7 V < VSW1AB < 1.425 V, 1.8V, 3.3V
ISW1AB
Quiescent current
• PFM mode
• APS mode
ISW1ABQ
-45
–
2750
–
–
mA
–
–
22
300
–
–
µA
3.5
2.6
5.5
4.0
7.5
5.4
A
ISW1ABLIM
Current limiter peak current detection , current through inductor
• SW1xILIM = 0
• SW1xILIM = 1
ΔVSW1AB
Output ripple
–
5.0
–
mV
Discharge resistance
–
600
–
Ω
RSW1ABDIS
Switch mode supply SW1A (independent)
VSW1AIN
Operating input voltage
2.8
–
4.5
V
VSW1A
Nominal output voltage
–
Table 53
–
V
-25
25
mV
-25
35
mV
45
mV
-6.0
6.0
%
-6.0
6.0
%
–
mA
Output voltage accuracy
PWM, APS, 2.8 V < VSW1AIN < 4.5 V, 0 < ISW1A < 1.0 A
0.7 V ≤ VSW1A ≤ 1.2 V
• PFM, APS, 2.8 V < VSW1AIN < 4.5 V, 0 < ISW1A < 1.0 A
1.225 V < VSW1A < 1.425 V
• PFM, steady state, 2.8 V < VSW1AIN < 4.5 V, 0 < ISW1A < 50 mA
0.7 V ≤ VSW1A ≤ 1.425V
• PWM, APS, 2.8 V < VSW1AIN < 4.5 V, 0 < ISW1A < 1.0 A
1.8 V < VSW1A < 3.3 V
• PFM, steady state, 2.8 V < VSW1AIN < 4.5 V, 0 < ISW1A < 50 mA
1.8 V ≤ VSW1A ≤ 3.3 V
•
VSW1AACC
ISW1A
Rated output load current
2.8 V < VSW1AIN < 4.5 V, 0.7 V < VSW1A < 1.425 V, 1.8V, 3.3V
-45
1000
–
–
(21), (22)
Notes
21. The maximum operating input voltage is 4.55 V when VPWR LDO is used
22. Minimum operating voltage is 2.8 V with a valid LICELL voltage (1.8 V to 3.3 V). Minimum operating voltage is 3.1 V when no voltage is applied
at the LICELL pin. If operation down to 2.8 V is required for systems without a coin cell, connect the LICELL pin to any system voltage between
1.8 V and 3.3 V. This voltage can be an output from any PF3000 regulator, or external system supply.
PF3000
14
NXP Semiconductors
GENERAL PRODUCT CHARACTERISTICS
Table 7. Static electrical characteristics – SW1 (continued)
All parameters are specified at TA = -40 °C to 105 °C, VIN = VSW1xIN = 3.6 V, VSW1x = 1.2 V, ISW1x = 100 mA, typical external component
values, fSW1x = 2.0 MHz, unless otherwise noted. Typical values are characterized at VIN = VSW1xIN = 3.6 V, VSW1x = 1.2 V,
ISW1x = 100 mA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
–
–
50
250
–
–
µA
1.78
1.3
2.75
2.0
3.7
2.7
A
Notes
Switch mode supply SW1a (independent) (Continued)
ISW1AQ
Quiescent current
• PFM mode
• APS mode
ISW1ALIM
Current limiter peak current detection, current through inductor
• SW1AILIM = 0
• SW1AILIM = 1
ΔVSW1A
Output Ripple
–
5.0
–
mV
RONSW1AP
SW1A P-MOSFET RDSON, at VSW1AIN = 3.3 V
–
265
295
mΩ
RONSW1AN
SW1A N-MOSFET RDSON, at VSW1AIN = 3.3 V
–
300
370
mΩ
ISW1APQ
SW1A P-MOSFET leakage current, VSW1AIN = 4.5 V
–
–
10.5
µA
ISW1ANQ
SW1A N-MOSFET leakage current, VSW1AIN = 4.5 V
–
–
3.5
µA
RSW1ADIS
Discharge resistance
–
600
–
Ω
Switch mode supply SW1B (independent)
VSW1BIN
Operating input voltage
2.8
–
4.5
V
VSW1B
Nominal output voltage
–
Table 53
–
V
VSW1BACC
ISW1B
ISW1BQ
Output voltage accuracy
• PWM, APS, 2.8 V < VSW1BIN < 4.5 V, 0 < ISW1B < 1.75 A
0.7 V < VSW1B < 1.2 V
• PWM, APS, 2.8 V < VSW1BIN < 4.5 V, 0 < ISW1B < 1.75 A
1.225 V < VSW1B < 1.475 V
• PFM, steady state 2.8 V < VSW1BIN < 4.5 V, 0 < ISW1B < 50 mA
0.7 V < VSW1B < 1.475 V
Rated output load current
2.8 V < VSW1BIN < 4.5 V, 0.7 V < VSW1B < 1.475 V
Quiescent current
• PFM mode
• APS mode
-25
-25
(23), (24)
25
–
-45
35
mV
45
1750
–
–
mA
–
–
50
150
–
–
µA
2.4
1.725
3.50
2.65
4.725
3.575
A
ISW1BLIM
Current limiter peak current detection, current through inductor
• SW1BILIM = 0
• SW1BILIM = 1
ΔVSW1B
Output ripple
–
5.0
–
mV
RONSW1BP
SW1B P-MOSFET RDSON, at VSW1BIN = 3.3 V
–
195
225
mΩ
RONSW1BN
SW1B N-MOSFET RDSON, at VSW1BIN = 3.3 V
–
228
295
mΩ
ISW1BPQ
SW1B P-MOSFET leakage current, VSW1BIN = 4.5 V
–
–
12
µA
ISW1BNQ
SW1B N-MOSFET leakage current, VSW1BIN = 4.5 V
–
–
4.0
µA
RSW1BDIS
Discharge resistance during OFF mode
–
600
–
Ω
Notes
23. The maximum operating input voltage is 4.55 V when VPWR LDO is used.
24. Minimum operating voltage is 2.8 V with a valid LICELL voltage (1.8 V to 3.3 V). Minimum operating voltage is 3.1 V when no voltage is applied
at the LICELL pin. If operation down to 2.8 V is required for systems without a coin cell, connect the LICELL pin to any system voltage between
1.8 V and 3.3 V. This voltage can be an output from any PF3000 regulator, or external system supply.
PF3000
NXP Semiconductors
15
GENERAL PRODUCT CHARACTERISTICS
Table 8. Dynamic electrical characteristics - SW1
All parameters are specified at TA = -40 °C to 105 °C, VIN = VSW1xIN = 3.6 V, VSW1x = 1.2 V, ISW1x = 100 mA, typical external component
values, fSW1x = 2.0 MHz, unless otherwise noted. Typical values are characterized at VIN = VSW1xIN = 3.6 V, VSW1x = 1.2 V, ISW1x =
100 mA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Start-up overshoot, ISW1AB = 0 mA, DVS clk = 25 mV/4 μs, VIN =
VSW1xIN = 4.5 V, VSW1AB = 1.425 V
–
–
66
mV
Turn-on time, enable to 90% of end value, ISW1AB = 0 mA, DVS clk =
25 mV/4 μs, VIN = VSW1xIN = 4.5 V, VSW1AB = 1.425 V
–
–
500
µs
Notes
Switch mode supply SW1A/B (single phase)
VSW1ABOSH
tONSW1AB
Switch mode supply SW1A (independent)
VSW1AOSH
Start-up overshoot, ISW1A = 0 mA, DVS clk = 25 mV/4.0 μs, VIN =
VSW1AIN = 4.5 V, VSW1A = 1.425 V
–
–
66
mV
tONSW1A
Turn-on time, enable to 90% of end value, ISW1A = 0 mA, DVS clk =
25 mV/4.0 μs, VIN = VSW1AIN = 4.5 V, VSW1A = 1.425 V
–
–
500
µs
Start-up overshoot, ISW1B = 0 mA, DVS clk = 25 mV/4.0 μs, VIN =
VSW1BIN = 4.5 V, VSW1B = 1.475 V
–
–
66
mV
Turn-on time, enable to 90% of end value, ISW1B = 0 mA, DVS clk =
25 mV/4 μs, VIN = VSW1BIN = 4.5 V, VSW1B = 1.475 V
–
–
500
µs
Switch mode supply SW1B (independent)
VSW1BOSH
tONSW1B
Table 9. Static electrical characteristics – SW2
All parameters are specified at TA = -40 °C to 105 °C, VIN = VSW2IN = 3.6 V, VSW2 = 3.15 V, ISW2 = 100 mA, typical external component
values, fSW2 = 2.0 MHz, unless otherwise noted. Typical values are characterized at VIN = VSW2IN = 3.6 V, VSW2 = 3.15 V, ISW2 = 100 mA,
and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
(25), (26)
Switch mode supply SW2
VSW2IN
Operating input voltage
2.8
–
4.5
V
VSW2
Nominal output voltage
–
Table 55
–
V
-3.0%
-6.0%
–
–
3.0%
6.0%
-6.0%
-6.0%
–
–
6.0%
6.0%
1250
–
–
–
–
–
23
145
305
–
–
–
VSW2ACC
ISW2
ISW2Q
Output voltage accuracy
• PWM, APS, 2.8 V ≤ VSW2IN ≤ 4.5 V, 0 ≤ ISW2 ≤ 1.25 A
• 1.50 V ≤ VSW2 ≤ 1.85 V
• 2.5 V ≤ VSW2 ≤ 3.3 V
• PFM, 2.8 V ≤ VSW2IN ≤ 4.5 V, 0 ≤ ISW2 ≤ 50 mA
• 1.50 V ≤ VSW2 ≤ 1.85 V
• 2.5 V ≤ VSW2 ≤ 3.3 V
Rated output load current, 2.8 V < VSW2IN < 4.5 V,
1.50 V < VSW2 < 1.85 V, 2.5 V < VSW2 < 3.3 V
Quiescent current
• PFM mode
• APS mode (low output voltage settings)
• APS mode (high output voltage settings, SW2_HI=1)
%
mA
(27)
µA
Notes
25. The maximum operating input voltage is 4.55 V when VPWR LDO is used.
26. Minimum operating voltage is 2.8 V with a valid LICELL voltage (1.8 V to 3.3 V). Minimum operating voltage is 3.1 V when no voltage is applied at
the LICELL pin. If operation down to 2.8 V is required for systems without a coin cell, connect the LICELL pin to any system voltage between 1.8 V
and 3.3 V. This voltage can be an output from any PF3000 regulator, or external system supply.
27. The higher output voltages available depend on the voltage drop in the conduction path as given by the following equation: (VSW2IN - VSW2) = ISW2*
(DCR of Inductor +RONSW2P + PCB trace resistance).
PF3000
16
NXP Semiconductors
GENERAL PRODUCT CHARACTERISTICS
Table 9. Static electrical characteristics – SW2 (continued)
All parameters are specified at TA = -40 °C to 105 °C, VIN = VSW2IN = 3.6 V, VSW2 = 3.15 V, ISW2 = 100 mA, typical external component
values, fSW2 = 2.0 MHz, unless otherwise noted. Typical values are characterized at VIN = VSW2IN = 3.6 V, VSW2 = 3.15 V, ISW2 = 100 mA,
and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
1.625
1.235
2.5
1.9
3.375
2.565
A
Notes
Switch mode supply SW2 (continued)
ISW2LIM
Current limiter peak current detection, current through inductor
• SW2ILIM = 0
• SW2ILIM = 1
ΔVSW2
Output ripple
–
5.0
–
mV
RONSW2P
SW2 P-MOSFET RDSON at VIN = VSW2IN = 3.3 V
–
215
245
mΩ
RONSW2N
SW2 N-MOSFET RDSON at VSW2IN = VSW2IN = 3.3 V
–
258
326
mΩ
ISW2PQ
SW2 P-MOSFET leakage current, VIN = VSW2IN = 4.5 V
–
–
10.5
µA
ISW2NQ
SW2 N-MOSFET leakage current, VIN = VSW2IN = 4.5 V
–
–
3.0
µA
RSW2DIS
Discharge resistance during OFF mode
–
600
–
Ω
Table 10. Dynamic electrical characteristics - SW2
All parameters are specified at TA = -40 °C to 105 °C, VIN = VSW2IN = 3.6 V, VSW2 = 3.15 V, ISW2 = 100 mA, typical external component
values, fSW2 = 2.0 MHz, unless otherwise noted. Typical values are characterized at VIN = VSW2IN = 3.6 V, VSW2 = 3.15 V, ISW2 = 100 mA,
and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Start-up overshoot, ISW2 = 0.0 mA, DVS clk = 25 mV/4 μs, VIN =
VSW2IN = 4.5 V
–
–
66
mV
Turn-on time, enable to 90% of end value, ISW2 = 0.0 mA, DVS clk =
25 mV/4 μs, VIN = VSW2IN = 4.5 V
–
–
500
µs
Notes
Switch mode supply SW2
VSW2OSH
tONSW2
Table 11. Static electrical characteristics – SW3
All parameters are specified at TA = -40 °C to 105 °C, VIN = VSW3IN = 3.6 V, VSW3 = 1.5 V, ISW3 = 100 mA, typical external component
values, fSW3 = 2.0 MHz. Typical values are characterized at VIN = VSW3IN = 3.6 V, VSW3 = 1.5 V, ISW3 = 100 mA, and 25 °C, unless
otherwise noted.
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
(28), (29)
Switch mode supply SW3
VSW3IN
Operating input voltage
2.8
–
4.5
V
VSW3
Nominal output voltage
–
Table 57
–
V
-3.0%
–
3.0%
-6.0%
–
6.0%
1500
–
–
VSW3ACC
ISW3
Output voltage accuracy
• PWM, APS, 2.8 V < VSW3IN < 4.5 V, 0 < ISW3 < 1.5 A, 0.9 V < VSW3
< 1.65 V
• PFM, steady state (2.8 V < VSW3IN < 4.5 V, 0 < ISW3 < 50 mA), 0.9 V
< VSW3 < 1.65 V
Rated output load current, 2.8 V < VSW3IN < 4.5 V, 0.9 V < VSW3 <
1.65 V, PWM, APS mode
%
mA
(30)
Notes
28. The maximum operating input voltage is 4.55 V when VPWR LDO is used.
29. Minimum operating voltage is 2.8 V with a valid LICELL voltage (1.8 V to 3.3 V). Minimum operating voltage is 3.1 V when no voltage is applied at
the LICELL pin. If operation down to 2.8 V is required for systems without a coin cell, connect the LICELL pin to any system voltage between 1.8 V
and 3.3 V. This voltage can be an output from any PF3000 regulator, or external system supply.
30. The higher output voltages available depend on the voltage drop in the conduction path as given by the following equation: (VSW3IN - VSW3) =
ISW3* (DCR of Inductor +RONSW3P + PCB trace resistance).
PF3000
NXP Semiconductors
17
GENERAL PRODUCT CHARACTERISTICS
Table 11. Static electrical characteristics – SW3 (continued)
All parameters are specified at TA = -40 °C to 105 °C, VIN = VSW3IN = 3.6 V, VSW3 = 1.5 V, ISW3 = 100 mA, typical external component
values, fSW3 = 2.0 MHz. Typical values are characterized at VIN = VSW3IN = 3.6 V, VSW3 = 1.5 V, ISW3 = 100 mA, and 25 °C, unless
otherwise noted.
Parameter
Symbol
Min.
Typ.
Max.
Unit
–
–
50
150
–
–
µA
1.95
1.45
3.0
2.25
4.05
3.05
A
Notes
Switch mode supply SW3 (continued)
ISW3Q
Quiescent current
• PFM mode
• APS mode
ISW3LIM
Current limiter peak current detection, current through inductor
• SW3ILIM = 0
• SW3ILIM = 1
ΔVSW3
Output ripple
–
5.0
–
mV
RONSW3P
SW3 P-MOSFET RDSON at VIN = VSW3IN = 3.3 V
–
205
235
mΩ
RONSW3N
SW3 N-MOSFET RDSON at VIN = VSW3IN = 3.3 V
–
250
315
mΩ
ISW3PQ
SW3 P-MOSFET leakage current, VIN = VSW3IN = 4.5 V
–
–
12
µA
ISW3NQ
SW3 N-MOSFET leakage current, VIN = VSW3IN = 4.5 V
–
–
4.0
µA
RSW3DIS
Discharge resistance during Off mode
–
600
–
Ω
Table 12. Dynamic electrical characteristics - SW3
All parameters are specified at TA = -40 °C to 105 °C, VIN = VSW3IN = 3.6 V, VSW3 = 1.5 V, ISW3 = 100 mA, typical external component
values, fSW3 = 2.0 MHz. Typical values are characterized at VIN = VSW3IN = 3.6 V, VSW3 = 1.5 V, ISW3 = 100 mA, and 25 °C, unless
otherwise noted.
Symbol
VSW3OSH
tONSW3
Parameter
Min.
Typ.
Max.
Unit
Start-up overshoot, ISW3 = 0.0 mA, DVS clk = 25 mV/4 μs, VIN =
VSW3IN = 4.5 V
–
–
66
mV
Turn-on time, enable to 90% of end value, ISW3 = 0 mA, DVS clk =
25 mV/4 μs, VIN = VSW3IN = 4.5 V
–
–
500
µs
Notes
Table 13. Static electrical characteristics - SWBST
All parameters are specified at TA = -40 °C to 105 °C, VIN = VSWBSTIN = 3.6 V, VSWBST = 5.0 V, ISWBST = 100 mA, typical external
component values, fSWBST = 2.0 MHz, otherwise noted. Typical values are characterized at VIN = VSWBSTIN = 3.6 V, VSWBST = 5.0 V,
ISWBST = 100 mA, and 25 °C, unless otherwise noted.
Symbol
Parameters
Min.
Typ.
Max.
Unit
Notes
2.8
–
4.5
V
(31), (32)
Switch mode supply SWBST
VSWBSTIN
Input voltage range
VSWBST
Nominal output voltage
–
Table 59
–
V
ISWBST
Continuous load current
• 2.8 V ≤ VIN ≤ 3.0 V
• 3.0 V ≤ VIN ≤ 4.5 V
500
600
–
–
–
–
mA
-4.0
–
3.0
%
–
222
289
μA
VSWBSTACC
ISWBSTQ
Output voltage accuracy, 2.8 V ≤ VIN ≤ 4.5 V, 0 < ISWBST
< ISWBSTMAX
Quiescent current (auto mode)
Notes
31. The maximum operating input voltage is 4.55 V when VPWR LDO is used.
32. Minimum operating voltage is 2.8 V with a valid LICELL voltage (1.8 V to 3.3 V). Minimum operating voltage is 3.1 V when no voltage is applied at
the LICELL pin. If operation down to 2.8 V is required for systems without a coin cell, connect the LICELL pin to any system voltage between 1.8 V
and 3.3 V. This voltage can be an output from any PF3000 regulator, or external system supply.
PF3000
18
NXP Semiconductors
GENERAL PRODUCT CHARACTERISTICS
Table 13. Static electrical characteristics - SWBST (continued)
All parameters are specified at TA = -40 °C to 105 °C, VIN = VSWBSTIN = 3.6 V, VSWBST = 5.0 V, ISWBST = 100 mA, typical external
component values, fSWBST = 2.0 MHz, otherwise noted. Typical values are characterized at VIN = VSWBSTIN = 3.6 V, VSWBST = 5.0 V,
ISWBST = 100 mA, and 25 °C, unless otherwise noted.
Symbol
Parameters
Min.
Typ.
Max.
Unit
ΔVSWBST
Output ripple, 2.8 V ≤ VIN ≤ 4.5 V, 0 < ISWBST < ISWBSTMAX, excluding
reverse recovery of Schottky diode
–
–
120
mVp-p
ISWBSTLIM
Peak Current Limit
1400
2200
3200
mA
RDS(on)BST
MOSFET on resistance
–
206
306
mΩ
ISWBSTHSQ
NMOS Off leakage, VSWBST = 4.5 V, SWBSTMODE [1:0] = 00
–
1.0
5.0
µA
Notes
Switch mode supply SWBST (continued)
(33)
Notes
33. Only in Auto and APS modes.
Table 14. Dynamic electrical characteristics - SWBST
All parameters are specified at TA = -40 °C to 105 °C, VIN = VSWBSTIN = 3.6 V, VSWBST = 5.0 V, ISWBST = 100 mA, typical external
component values, fSWBST = 2.0 MHz, otherwise noted. Typical values are characterized at VIN = VSWBSTIN = 3.6 V, VSWBST = 5.0 V,
ISWBST = 100 mA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Start-up overshoot, ISWBST = 0.0 mA
–
–
500
mV
Turn-on time, enable to 90% of VSWBST, ISWBST = 0.0 mA
–
–
2.0
ms
Notes
Switch mode supply SWBST
VSWBSTOSH
tONSWBST
Table 15. Static electrical characteristics - VSNVS
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VSNVS = 3.0 V, ISNVS = 5.0 μA, typical external component values,
unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VSNVS = 3.0 V, ISNVS = 5.0 μA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
Operating input voltage
• Valid coin cell range
• Valid VIN
1.8
2.25
–
–
3.3
4.5
V
(34)
ISNVS
Operating load current, VINMIN < VIN < VINMAX
1.0
–
1000
μA
VSNVS
Output voltage
-5.0%
• 5.0 μA < ISNVS < 1000 μA (OFF), 3.20 V < VIN < 4.5 V
-5.0%
• 5.0 μA < ISNVS < 1000 μA (ON), 3.20 V < VIN < 4.5 V
• 5.0 μA < ISNVS < 1000μA (Coin cell mode), 2.84 V < VCOIN < 3.3 V VCOIN-0.10
3.0
3.0
–
7.0%
5.0%
VCOIN
–
–
110
mV
1100
–
6750
μA
VSNVS
VIN
VSNVSDROP
ISNVSLIM
Dropout voltage, 2.85 V < VIN < 2.9 V, 1.0 μA < ISNVS < 1000 μA
Current limit, VIN > VTH1
V
VSNVS DC, SWITCH
VLiCell
Operating input voltage, valid coin cell range
1.8
–
3.3
V
ISNVS
Operating load current
1.0
–
1000
μA
–
–
100
Ω
RDS(on)SNVS
Internal switch RDS(on), VCOIN = 2.6 V
Notes
34. The maximum operating input voltage is 4.55 V when VPWR LDO is used
PF3000
NXP Semiconductors
19
GENERAL PRODUCT CHARACTERISTICS
Table 16. Dynamic electrical characteristics - VSNVS
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VSNVS = 3.0 V, ISNVS = 5.0 μA, typical external component values, unless
otherwise noted. Typical values are characterized at VIN = 3.6 V, VSNVS = 3.0 V, ISNVS = 5.0 μA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
(35),(36)
VSNVS
VSNVSTON
Turn-on time (load capacitor, 0.47 μF), from VIN = VTH1 to 90% of
VSNVS, VCOIN = 0.0 V, ISNVS = 5.0 μA
–
–
24
ms
VSNVSOSH
Start-up overshoot, ISNVS = 5.0 μA
–
40
70
mV
VSNVSLOTR
Transient load response, 3.2 < VIN ≤ 4.5 V, ISNVS = 100 to 1000 μA
2.8
–
–
V
VTL1
VIN falling threshold (VIN powered to coin cell powered)
2.45
2.70
3.05
V
VTH1
VIN rising threshold (coin cell powered to VIN powered)
2.50
2.75
3.10
V
VIN threshold hysteresis for VTH1-VTL1
5.0
–
–
mV
Output voltage during crossover, VCOIN > 2.9 V, Switch to LDO: VIN >
VTH1, ISNVS = 100 μA, LDO to Switch: VIN < VTL1, ISNVS = 100 μA
2.45
–
–
V
VHYST1
VSNVSCROSS
Notes
35. The start-up of VSNVS is not monotonic. It first rises to 1.0 V and then settles to 3.0 V.
36.
From coin cell insertion to VSNVS = 1.0 V, the delay time is typically 400 ms.
Table 17. Static electrical characteristics - VLDO1
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VLDO1IN = 3.6 V, VLDO1 = 3.3 V, ILDO1 = 10 mA, typical external
component values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VLDO1IN = 3.6 V, VLDO1 = 3.3 V, ILDO1 = 10 mA,
and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
2.8
VLDO1NOM
+0.250
–
–
4.5
4.5
V
(37), (38)
–
Table 62
–
V
Rated output load current
100
–
–
mA
VLDO1TOL
Output voltage tolerance, VLDO1INMIN < VLDO1IN < 4.5 V, 0.0 mA <
ILDO1 < 100 mA, VLDO1 = 1.8 V to 3.3 V
-3.0
–
3.0
%
ILDO1Q
Quiescent current, no load, change in IVIN, when VLDO1 enabled
–
13
–
μA
122
167
280
mA
VLDO1 linear regulator
VLDO1IN
VLDO1NOM
ILDO1
ILDO1LIM
Operating input voltage
• 1.8 V ≤ VLDO1NOM ≤ 2.5 V
• 2.6 V ≤ VLDO1NOM ≤ 3.3 V
Nominal output voltage
Current limit, ILDO1 when VLDO1 is forced to VLDO1NOM/2
Notes
37. The maximum operating input voltage is 4.55 V when VPWR LDO is used.
38. Minimum operating voltage is 2.8 V with a valid LICELL voltage (1.8 V to 3.3 V). Minimum operating voltage is 3.1 V when no voltage is applied
at the LICELL pin. If operation down to 2.8 V is required for systems without a coin cell, connect the LICELL pin to any system voltage between
1.8 V and 3.3 V. This voltage can be an output from any PF3000 regulator, or external system supply.
PF3000
20
NXP Semiconductors
GENERAL PRODUCT CHARACTERISTICS
Table 18. Dynamic electrical characteristics - VLDO1
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VLDO1IN = 3.6 V, VLDO1 = 3.3 V, ILDO1 = 10 mA, typical external
component values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VLDO1IN = 3.6 V, VLDO1 = 3.3 V, ILDO1 = 10 mA,
and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
35
52
40
60
–
–
dB
–
–
–
-114
-129
-135
-102
-123
-130
Notes
VLDO1 linear regulator
PSRRVLDO1
PSRR, ILDO1 = 75 mA, 20 Hz to 20 kHz
• VLDO1 = 1.8 V to 3.3 V, VLDO1IN = VLDO1INMIN + 100 mV
• VLDO1 = 1.8 V to 3.3 V, VLDO1IN = VLDO1NOM + 1.0 V
Output noise density, VLDO1IN = VLDO1INMIN, ILDO1 = 75 mA
NOISEVLDO1
• 100 Hz to <1.0 kHz
• 1.0 kHz to <10 kHz
• 10 kHz to 1.0 MHz
dBV/ √Hz
tONLDO1
Turn-on time, enable to 90% of end value, VLDO1IN = VLDO1INMIN to
4.5 V, ILDO1 = 0.0 mA, all output voltage settings
60
–
500
μs
tOFFLDO1
Turn-off time, disable to 10% of initial value, VLDO1IN = VLDO1INMIN,
ILDO1 = 0.0 mA
–
–
10
ms
LDO1OSHT
Start-up overshoot, VLDO1IN = VLDO1INMIN to 4.5 V, ILDO1 = 0.0 mA
–
1.0
2.0
%
Table 19. Static electrical characteristics - VLDO2
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VLDO2IN = 3.0 V, VLDO2 = 1.55 V, ILDO2 = 10 mA, typical external
component values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VLDO2IN = 3.0 V, VLDO2 = 1.55 V, ILDO2 =
10 mA and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
VLDO2 linear regulator
VLDO2IN
Operating input voltage
1.75
–
3.40
V
VLDO2NOM
Nominal output voltage
–
Table 63
–
V
Rated output load current
250
–
–
mA
VLDO2TOL
Output voltage tolerance, 1.75 V < VLDOIN1 < 3.40 V, 0.0 mA < ILDO2
< 250 mA, VLDO2 = 0.8 V to 1.55 V
-3.0
–
3.0
%
ILDO2Q
Quiescent current, no load, change in IVIN and IVLDO2IN, when VLDO2
enabled
–
16
–
μA
333
417
612
mA
ILDO2
ILDO2LIM
Current limit, ILDO2 when VLDO2 is forced to VLDO2NOM/2
Table 20. Dynamic electrical characteristics - VLDO2
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VLDO2IN = 3.0 V, VLDO2 = 1.55 V, ILDO2 = 10 mA, typical external
component values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VLDO2IN = 3.0 V, VLDO2 = 1.55 V, ILDO2 =
10 mA and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
dB
Notes
VLDO2 linear regulator
PSRRVLDO2
PSRR, ILDO2 = 187.5 mA, 20 Hz to 20 kHz
• VLDO2 = 0.8 V to 1.55 V
• VLDO2 = 1.1 V to 1.55 V
50
37
60
45
–
–
NOISEVLDO2
Output noise density, VLDO2IN = 1.75 V, ILDO2 = 187.5 mA
• 100 Hz to <1.0 kHz
• 1.0 kHz to <10 kHz
• 10 kHz to 1.0 MHz
–
–
–
-108
-118
-124
-100
-108
-112
dBV/√Hz
PF3000
NXP Semiconductors
21
GENERAL PRODUCT CHARACTERISTICS
Table 20. Dynamic electrical characteristics - VLDO2 (continued)
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VLDO2IN = 3.0 V, VLDO2 = 1.55 V, ILDO2 = 10 mA, typical external
component values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VLDO2IN = 3.0 V, VLDO2 = 1.55 V, ILDO2 =
10 mA and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
tONLDO2
Turn-on time, enable to 90% of end value, VLDO2IN = 1.75 V to 3.4 V,
ILDO2 = 0.0 mA
60
–
500
μs
tOFFLDO2
Turn-off time, disable to 10% of initial value, VLDO2IN = 1.75 V,
ILDO2 = 0.0 mA
–
–
10
ms
LDO2OSHT
Start-up overshoot, VLDO2IN = 1.75 V to 3.4 V, ILDO2 = 0.0 mA
–
1.0
2.0
%
Notes
VLDO2 linear regulator (continue)
Table 21. Static electrical characteristics – VCC_SD
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VCC_SD = 1.85 V, IVCC_SD = 10 mA, typical external component values,
unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VCC_SD = 1.85 V, IVCC_SD = 10 mA, and 25 °C, unless otherwise
noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
2.8
–
4.5
V
(39), (40),
(40)
VCC_SD linear regulator
VIN
Operating input voltage
VCC_SDNOM
Nominal output voltage
–
Table 65
–
V
Rated output load current
100
–
–
mA
VCC_SDTOL
Output voltage accuracy, 2.8 V < VIN < 4.5 V, 0.0 mA < IVCC_SD <
100 mA, VCC_SD[1:0] = 00 to 11
-3.0
–
3.0
%
IVCC_SDQ
Quiescent current, no load, change in IVIN and IVIN2, when VCC_SD
enabled
–
13
–
μA
122
167
280
mA
IVCC_SD
IVCC_SDLIM
Current limit, IVCC_SD when VCC_SD is forced to VCC_SDNOM/2
Notes
39. When the LDO output voltage is set above 2.6 V, the minimum allowed input voltage needs to be at least the output voltage plus 0.25 V.
40. The maximum operating input voltage is 4.55 V when VPWR LDO is used.
41. Minimum operating voltage is 2.8 V with a valid LICELL voltage (1.8 V to 3.3 V). Minimum operating voltage is 3.1 V when no voltage is applied
at the LICELL pin. If operation down to 2.8 V is required for systems without a coin cell, connect the LICELL pin to any system voltage between
1.8 V and 3.3 V. This voltage can be an output from any PF3000 regulator, or external system supply.
Table 22. Dynamic electrical characteristics - VCC_SD
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VCC_SD = 1.85 V, IVCC_SD = 10 mA, typical external component
values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VCC_SD = 1.85 V, IVCC_SD = 10 mA, and 25 °C, unless
otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
35
52
40
60
–
–
dB
–
–
–
-114
-129
-135
-102
-123
-130
60
–
500
Notes
VCC_SD linear regulator
PSRR, IVCC_SD = 75 mA, 20 Hz to 20 kHz
PSRRVCC_SD
NOISEVCC_SD
tONVCC_SD
• VCC_SD[1:0] = 00 - 10, VIN = 2.8 V + 100 mV
• VCC_SD[1:0] = 10 - 11, VIN = VCC_SDNOM + 1.0 V
Output noise density, VIN = 2.8V, IVCC_SD = 75 mA
• 100 Hz – <1.0 kHz
• 1.0 kHz – <10 kHz
• 10 kHz – 1.0 MHz
Turn-on time, enable to 90% of end value, VIN = 2.8 V to 4.5 V,
IVCC_SD = 0.0 mA
dBV/√Hz
μs
PF3000
22
NXP Semiconductors
GENERAL PRODUCT CHARACTERISTICS
Table 22. Dynamic electrical characteristics - VCC_SD (continued)
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VCC_SD = 1.85 V, IVCC_SD = 10 mA, typical external component
values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VCC_SD = 1.85 V, IVCC_SD = 10 mA, and 25 °C, unless
otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Turn-off time, disable to 10% of initial value, VIN = 2.8 V,
IVCC_SD = 0.0 mA
–
–
10
ms
Start-up overshoot, VIN = 2.8 V to 4.5 V, IVCC_SD = 0.0 mA
–
1.0
2.0
%
Notes
VCC_SD linear regulator (continued)
tOFFVCC_SD
VCC_SDOSHT
Table 23. Static electrical characteristics – V33
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, V33 = 3.3 V, IV33 = 10 mA, typical external component values, unless
otherwise noted. Typical values are characterized at VIN = 3.6 V, V33 = 3.3 V, IV33 = 10 mA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
2.8
–
4.5
V
(42), (43),
(44)
–
Table 64
–
V
Rated output load current
350
–
–
mA
Output voltage tolerance, 2.8 V < VIN < 4.5 V, 0.0 mA < IV33 < 350 mA,
V33[1:0] = 00 to 11
-3.0
–
3.0
%
–
13
–
μA
435
584.5
950
mA
V33 linear regulator
VIN
V33NOM
IV33
V33TOL
IV33Q
IV33LIM
Operating input voltage, 2.9 V ≤ V33NOM ≤ 3.6 V
Nominal output voltage
Quiescent current, no load, change in IVIN, when V33 enabled
Current limit, IV33 when V33 is forced to V33NOM/2
Notes
42. When the LDO output voltage is set above 2.6 V the minimum allowed input voltage need to be at least the output voltage plus 0.25 V for proper
regulation due to the dropout voltage generated through the internal LDO transistor.
43. The maximum operating input voltage is 4.55 V when VPWR LDO is used.
44. Minimum operating voltage is 2.8 V with a valid LICELL voltage (1.8 V to 3.3 V). Minimum operating voltage is 3.1 V when no voltage is applied at
the LICELL pin. If operation down to 2.8 V is required for systems without a coin cell, connect the LICELL pin to any system voltage between 1.8 V
and 3.3 V. This voltage can be an output from any PF3000 regulator, or external system supply.
Table 24. Dynamic electrical characteristics – V33
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, V33 = 3.3 V, IV33 = 10 mA, typical external component values, unless
otherwise noted. Typical values are characterized at VIN = 3.6 V, V33 = 3.3 V, IV33 = 10 mA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
52
60
–
dB
(45)
–
–
–
-114
-129
-135
-102
-123
-130
60
–
500
V33 linear regulator
PSRRV33
PSRR, IV33 = 262.5 mA, 20 Hz to 20 kHz, V33[1:0] = 00 - 11, VIN =
V33NOM + 1.0 V
NOISEV33
Output noise density, VIN = 2.8 V, IV33 = 262.5 mA
• 100 Hz to <1.0 kHz
• 1.0 kHz to <10 kHz
• 10 kHz to 1.0 MHz
tONV33
Turn-on time, enable to 90% of end value, VIN = 2.8 V, to 4.5 V,
IV33 = 0.0 mA
dBV/√Hz
μs
PF3000
NXP Semiconductors
23
GENERAL PRODUCT CHARACTERISTICS
Table 24. Dynamic electrical characteristics – V33 (continued)
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, V33 = 3.3 V, IV33 = 10 mA, typical external component values, unless
otherwise noted. Typical values are characterized at VIN = 3.6 V, V33 = 3.3 V, IV33 = 10 mA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
tOFFV33
Turn-off time, disable to 10% of initial value, VIN = 2.8 V, IV33 = 0.0 mA
–
–
10
ms
V33OSHT
Start-up overshoot, VIN = 2.8 V to 4.5 V, IV33 = 0.0 mA
–
1.0
2.0
%
Notes
V33 linear regulator (continued)
Notes
45. When the LDO Output voltage is set above 2.6 V the minimum allowed input voltage need to be at least the output voltage plus 0.25 V for proper
regulation due to the dropout voltage generated through the internal LDO transistor.
Table 25. Static electrical characteristics – VLDO3
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VLDO34IN = 3.6 V, VLDO3 = 3.3 V, ILDO3 = 10 mA, typical external
component values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VLDO34IN = 3.6 V, VLDO3 = 3.3 V,
ILDO3 = 10 mA, and 25 °C, unless otherwise noted.
Min.
Typ.
Max.
Unit
Notes
2.8
VLDO3NOM
+0.250
–
–
3.6
3.6
V
(46), (47)
–
Table 63
–
V
Rated output load current
100
–
–
mA
VLDO3TOL
Output voltage tolerance, VLDO34INMIN < VLDO34IN < 4.5 V, 0.0 mA <
ILDO3 < 100 mA, VLDO3 = 1.8 V to 3.3 V
-3.0
–
3.0
%
ILDO3Q
Quiescent current, no load, change in IVIN and IVLDO34IN, when VLDO3
enabled
–
13
–
μA
122
167
280
mA
Symbol
Parameter
VLDO3 linear regulator
VLDO34IN
VLDO3NOM
ILDO3
ILDO3LIM
Operating input voltage
• 1.8 V ≤ VLDO3NOM ≤ 2.5 V
• 2.6 V ≤ VLDO3NOM ≤ 3.3 V
Nominal output voltage
Current limit, ILDO3 when VLDO3 is forced to VLDO3NOM/2
Notes
46. The maximum operating input voltage is 4.55 V when VPWR LDO is used.
47. Minimum operating voltage is 2.8 V with a valid LICELL voltage (1.8 V to 3.3 V). Minimum operating voltage is 3.1 V when no voltage is applied at
the LICELL pin. If operation down to 2.8 V is required for systems without a coin cell, connect the LICELL pin to any system voltage between 1.8 V
and 3.3 V. This voltage can be an output from any PF3000 regulator, or external system supply.
Table 26. Dynamic electrical characteristics – VLDO3
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VLDO34IN = 3.6 V, VLDO3 = 3.3 V, ILDO3 = 10 mA, typical external
component values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VLDO34IN = 3.6 V, VLDO3 = 3.3 V,
ILDO3 = 10 mA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
35
52
40
60
–
–
dB
–
–
–
-114
-129
-135
-102
-123
-130
Notes
VLDO3 linear regulator
PSRRVLDO3
PSRR, ILDO3 = 75 mA, 20 Hz to 20 kHz
• VLDO3 = 1.8 V to 3.3 V, VLDO34IN = VLDO34INMIN + 100 mV
• VLDO3 = 1.8 V to 3.3 V, VLDO34IN = VLDO3NOM + 1.0 V
Output noise density, VLDO34IN = VLDO34INMIN, ILDO3 = 75 mA
NOISEVLDO3
• 100 Hz to <1.0 kHz
• 1.0 kHz to <10 kHz
• 10 kHz to 1.0 MHz
dBV/√Hz
PF3000
24
NXP Semiconductors
GENERAL PRODUCT CHARACTERISTICS
Table 26. Dynamic electrical characteristics – VLDO3 (continued)
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VLDO34IN = 3.6 V, VLDO3 = 3.3 V, ILDO3 = 10 mA, typical external
component values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VLDO34IN = 3.6 V, VLDO3 = 3.3 V,
ILDO3 = 10 mA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
tONLDO3
Turn-on time, enable to 90% of end value, VLDO34IN = VLDO34INMIN to
4.5 V, ILDO3 = 0.0 mA
60
–
500
μs
tOFFLDO3
Turn-off time, disable to 10% of initial value, VLDO34IN = VLDO34INMIN,
ILDO3 = 0.0 mA
–
–
10
ms
LDO3OSHT
Start-up overshoot, VLDO34IN = VLDO34IN2MIN to 4.5 V, ILDO3 = 0.0 mA
–
1.0
2.0
%
Notes
VLDO3 linear regulator (continued)
Table 27. Static electrical characteristics - VLDO4
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VLDO34IN = 3.6 V, VLDO4 = 3.3 V, ILDO4 = 10 mA, typical external
component values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VLDO34IN = 3.6 V, VLDO4 = 3.3 V,
ILDO4 = 10 mA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
2.8
VLDO4NOM
+0.250
–
–
3.6
3.6
V
(48), (49)
–
Table 63
–
V
Rated output load current
350
–
–
mA
VLDO4TOL
Output voltage tolerance, VLDO34INMIN < VLDO34IN < 4.5 V, 0.0 mA <
ILDO3 < 100 mA, VLDO4 = 1.9 V to 3.3 V
-3.0
–
3.0
%
ILDO4Q
Quiescent current, no load, change in IVIN and IVLDO34IN, when VLDO4
enabled
–
13
–
μA
Current limit, ILDO4 when VLDO4 is forced to VLDO4NOM/2
435
584.5
950
mA
PSRR, ILDO4 = 262.5 mA, 20 Hz to 20 kHz
• VLDO4 = 1.9 V to 3.3 V, VLDO34IN = VLDO34INMIN + 100 mV
• VLDO4 = 1.9 V to 3.3 V, VLDO34IN = VLDO4NOM + 1.0 V
35
52
40
60
–
–
dB
VLDO4 linear regulator
VLDO34IN
VLDO4NOM
ILDO4
ILDO4LIM
PSRRVLDO4
Operating input voltage
• 1.8 V ≤ VLDO4NOM ≤ 2.5 V
• 2.6 V ≤ VLDO4NOM ≤ 3.3 V
Nominal output voltage
Notes
48. The maximum operating input voltage is 4.55 V when VPWR LDO is used.
49. Minimum operating voltage is 2.8 V with a valid LICELL voltage (1.8 V to 3.3 V). Minimum operating voltage is 3.1 V when no voltage is applied
at the LICELL pin. If operation down to 2.8 V is required for systems without a coin cell, connect the LICELL pin to any system voltage between
1.8 V and 3.3 V. This voltage can be an output from any PF3000 regulator, or external system supply.
PF3000
NXP Semiconductors
25
GENERAL PRODUCT CHARACTERISTICS
Table 28. Dynamic electrical characteristics - VLDO4
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, VLDO34IN = 3.6 V, VLDO4 = 3.3 V, ILDO4 = 10 mA, typical external
component values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, VLDO34IN = 3.6 V, VLDO4 = 3.3 V,
ILDO4 = 10 mA, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
–
–
–
-114
-129
-135
-102
-123
-130
Unit
Notes
VLDO4 linear regulator
Output noise density, VLDO34IN2 = VLDO34INMIN, ILDO4 = 262.5 mA
NOISEVLDO4
• 100 Hz to <1.0 kHz
• 1.0 kHz to <10 kHz
• 10 kHz to 1.0 MHz
dBV/√Hz
tONLDO4
Turn-on time, enable to 90% of end value, VLDO34IN = VLDO34INMIN,
4.5 V, ILDO4 = 0.0 mA
60
–
500
μs
tOFFLDO4
Turn-off time, disable to 10% of initial value, VLDO34IN = VLDO34INMIN,
ILDO4 = 0.0 mA
–
–
10
ms
Start-up overshoot, VLDO34IN = VLDO34INMIN, 4.5 V, ILDO4 = 0.0 mA
–
1.0
2.0
%
LDO4OSHT
Table 29. Static electrical characteristics - coin cell
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, typical external component values, unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Unit
Notes
Coin cell
VCOINACC
Charge voltage accuracy
-100
–
-100
mV
ICOINACC
Charge current accuracy
-30
–
30
%
ICOIN
Coin cell charge current
• ICOINHI (in on mode)
• ICOINLO (in on mode)
–
–
60
10
–
–
μA
Table 30. Static electrical characteristics - VREFDDR
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, IREFDDR = 0.0 mA, VINREFDDR = 1.5 V, and typical external component
values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, IREFDDR = 0.0 mA, VINREFDDR = 1.5 V, and 25 °C, unless
otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
1.2
–
1.65
V
(50)
VREFDDR linear regulator
VINREFDDR
Operating input voltage range
VREFDDR
Output voltage, 1.2 V < VINREFDDR < 1.65 V, 0.0 mA < IREFDDR <
10 mA
–
VINREFDDR/
2
–
V
VREFDDRTOL
Output voltage tolerance, as a percentage of VINREFDDR, 1.2 V <
VINREFDDR < 1.65 V, 0.6 mA < IREFDDR < 10 mA
49.5
50
50.5
%
Rated output load current
10
–
–
mA
IREFDDRQ
Quiescent current
–
12
–
μA
IREFDDRLM
Current limit, IREFDDR when VREFDDR is forced to VINREFDDR/4
10.5
15
25
mA
IREFDDR
(51)
Notes
50. When using SW3 as input, the VINREFDDR input voltage range specification refers to the voltage set point of SW3 and not the absolute value
51. When VREFDDR is off there is a quiescent current of a typical 2.0 μA.
PF3000
26
NXP Semiconductors
GENERAL PRODUCT CHARACTERISTICS
Table 31. Dynamic electrical characteristics - VREFDDR
All parameters are specified at TA = -40 °C to 105 °C, VIN = 3.6 V, IREFDDR = 0.0 mA, VINREFDDR = 1.5 V, and typical external component
values, unless otherwise noted. Typical values are characterized at VIN = 3.6 V, IREFDDR = 0.0 mA, VINREFDDR = 1.5 V, and 25 °C, unless
otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
VREFDDR linear regulator
tONREFDDR
Turn-on time, enable to 90% of end value, VINREFDDR = 1.2 V to
1.65 V, IREFDDR = 0.0 mA
–
–
100
μs
tOFFREFDDR
Turn-off time, disable to 10% of initial value, VINREFDDR = 1.2 V to
1.65 V, IREFDDR = 0.0 mA
–
–
10
ms
VREFDDROSH
Start-up overshoot, VINREFDDR = 1.2 V to 1.65 V, IREFDDR = 0.0 mA
–
1.0
6.0
%
Table 32. Static electrical characteristics - Digital I/O
All parameters are specified at TA = -40 °C to 105 °C, VDDIO = 1.7 V to 3.6 V, VPWR = 0 V (external FET not populated), and typical external
component values and full load current range, unless otherwise noted.
Pin name
PWRON
RESETBMCU
Parameter
• VL
• VH
• VOL
• VOH
Load condition
Min
Max
Unit
–
–
0.0
0.2 * VSNVS
3.6
0.8 * VSNVS
V
-2.0 mA
Open drain
0.0
0.4 * VDDIO
VDDIO
0.7 * VDDIO
V
–
–
0.0
0.2 * VDDIO
3.6
0.8 * VDDIO
V
SCL
• VL
• VH
SDA
• VL
• VH
• VOL
• VOH
–
–
-2.0 mA
Open drain
0.0
0.2 * VDDIO
3.6
0.8 * VDDIO
0.0
0.4 * VDDIO
VDDIO
0.7 * VDDIO
V
INTB
• VOL
• VOH
-2.0 mA
Open drain
0.0
0.4 * VDDIO
VDDIO
0.7 * VDDIO
V
STANDBY
• VL
• VH
–
–
0.0
0.2 * VSNVS
3.6
0.8 * VSNVS
V
SD_VSEL
• VL
• VH
–
–
0.0
0.2 * VDDIO
3.6
0.8 * VDDIO
V
VDDOTP
• VL
• VH
–
–
0.0
1.1
0.3
1.7
Notes
V
PF3000
NXP Semiconductors
27
GENERAL PRODUCT CHARACTERISTICS
Table 33. Static electrical characteristics - internal supplies
All parameters are specified at TA = -40 °C to 105 °C, VIN = 2.8 V to 4.5 V, LICELL = 1.8 V to 3.3 V, and typical external component values.
Typical values are characterized at VIN = 3.6 V, LICELL = 3.0 V, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
–
–
1.5
1.3
–
–
V
(52)
–
–
2.775
0.0
–
–
V
(52)
(52)
VCOREDIG (digital core supply)
VCOREDIG
Output voltage
• ON mode
• Coin cell mode and OFF mode
VCORE (analog core supply)
VCORE
Output voltage
• ON mode and charging
• Coin cell mode and OFF mode
VCOREREF (bandgap regulator reference)
VCOREREF
Output voltage at 25 °C
–
1.2
–
V
VCOREREFACC
Absolute trim accuracy
–
0.5
–
%
VCOREREFTACC
Temperature Drift
–
0.25
–
%
Notes
52. 3.1 V < VIN < 4.5 V, no external loading on VCOREDIG, VCORE, or VCOREREF.
Table 34. Static electrical characteristics - UVDET threshold
All parameters are specified at TA = -40 °C to 105 °C, VIN = 2.8 V to 4.5 V, LICELL = 1.8 V to 3.3 V, and typical external component values.
Typical values are characterized at VIN = 3.6 V, LICELL = 3.0 V, and 25 °C, unless otherwise noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
–
2.5
–
–
3.1
–
V
Notes
VIN UVDET threshold
VUVDET
• Rising
• Falling
PF3000
28
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6
Functional description and application information
6.1
Introduction
The PF3000 is a highly integrated, low quiescent current power management IC featuring four buck regulators, one boost regulator, seven
LDO regulators, and a DDR voltage reference. The PF3000 provides all the necessary rails to power a complete system including the
application processor, memory and peripherals. The PF3000 operates from an input voltage of up to 5.5 V. Output voltage, startup
sequence, and other functions are set using integrated one-time-programmable (OTP) memory, thus providing flexibility and reducing
external component count.
6.2
Power generation
The buck regulators in the PF3000 provide supply to the processor cores and to other voltage domains, such as I/O and memory. Dynamic
voltage scaling is provided to allow controlled supply rail adjustments for the processor cores and other circuitry. The SW1A and SW1B
buck regulators can either be used as independent 1.0 A and 1.75 A regulators, or can be combined as a single 2.75 A regulator.
The linear regulators in the PF3000 can be used as general purpose regulators to power peripherals and lower power processor rails. The
VCC_SD LDO regulator supports the dual voltage requirement by high speed SD card readers. Depending on the system power path
configuration, the LDO regulators can be directly supplied from the main input supply or from the switching regulators to power peripherals,
such as audio, camera, Bluetooth, and Wireless LAN, etc.
A specific VREFDDR voltage reference is included to provide accurate reference voltage for DDR memories. The VSNVS block behaves
as an LDO, or as a bypass switch to supply the SNVS/SRTC circuitry on the i.MX processors; VSNVS may be powered from VIN, or from
a coin cell.
To accommodate applications that are powered by main supplies of voltages higher than 4.5 V and up to 5.5 V, the PF3000 incorporates
a front-end LDO regulator using an external pass FET to keep the maximum regulator input voltage of the regulators at 4.5 V. Applications
with an input voltage lower than 4.5 V can directly power the regulators without using the front-end LDO.
PF3000 shows a summary of the voltage regulators in the PF3000.
Table 35. PF3000 power tree
Supply
Output voltage (V)
Programming Step size (mV)
Maximum load current (mA)
SW1A
0.70 to 1.425
1.8 to 3.3
25
(N/A)
1000
SW1B
0.70 to 1.475
25
1750
SW2
1.50 to 1.85
2.50 to 3.30
50
variable
1250
SW3
0.90 to 1.65
50
1500
SWBST
5.00 to 5.15
50
600
VLDO1
1.8 to 3.3
50
100
VLDO2
0.80 to 1.55
50
250
VCC_SD
2.85 to 3.30
1.80 to 1.85
150
50
100
V33
2.85 to 3.30
150
350
VLDO3
1.8 to 3.3
100
100
VLDO4
1.8 to 3.3
100
350
VSNVS
3.0
NA
1.0
VREFDDR
0.5*SW3_OUT
NA
10
PF3000
NXP Semiconductors
29
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
PF3000
VIN
4.5 V (typ.)
SW1A
0.700 to 3.3 V
1.0 A
1.1 V
SW1B
0.700 to 1.475 V
1.75 A
1.0 V
SW2
1.50 to 1.85 V
or 2.25 to 3.30 V
1.25 A
1.8 V
SW3
0.90 to 1.65 V
1.5 A
VCC_SD
1.80 to 1.85 V
or 2.85 to 3.3 V
100 mA
V33
2.85 to 3.30 V
350 mA
VDD_ARM
(A7 Core)
VDD_SOC
(SOC Logic)
VDDA_1P8
(I/O)
1.35 V
NVCC_DRAM_CKE
(DDR IO)
3.3 V
3.3 V
SWBST
5.0 to 5.15 V
0.6 A
VREFDDR
0.5*VDDR
10 mA
SW3
MUX /
COIN
CHRG
Coincell
VIN
NVCC_3P3
(3.3 V GPIO PAD)
VDDA_USBx_3P3
(USB OTG PHY)
0.675 V
VDD_LPSR
VLDO2INMAX = 3.4 V
VSNVS
1.0 to 3.0 V
1 mA
VSNVS_IN
VLDO1
1.8 to 3.3 V
100 mA
1.8 V
VLDO2
0.80 to 1.55 V
250 mA
1.5 V
VLDO3
1.8 to 3.3 V
100 mA
VIN
VCC_SD_IO
NVCC_GPIOx
VIN
SW2
i.MX 7
MCU
VLDO4
1.8 to 3.3 V
350 mA
0.7 V to 1.425 V,
1.8 V, 3.3 V, 1.0 A
OTG
DDR3L
Peripherals
3.3 V
3.3 V
Figure 5. PF3000 typical power map
Figure 5 shows a simplified power map with various recommended options to supply the different block within the PF3000, as well as the
typical application voltage domain on the i.MX 7 processors. Note that each application power tree is dependent upon the system’s voltage
and current requirements, therefore a proper input voltage should be selected for the regulators.
PF3000
30
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.3
Functional description
6.3.1
Control logic and interface signals
The PF3000 is fully programmable via the I2C interface. Additional communication is provided by direct logic interfacing including INTB,
RESETBMCU, STANDBY, PWRON, and SD_VSEL. Refer to Table 30 for logic levels for these pins.
6.3.1.1
PWRON
PWRON is an input signal to the IC that generates a turn-on event. A turn-on event brings the PF3000 out of OFF and sleep modes and
into the ON mode. Refer to Modes of operation for the various modes (states) of operation of the IC. The PWRON pin can be configured
using OTP to detect a level, or an edge using the PWRON_CFG bit.
• If PWRON_CFG = 0, the PWRON signal is high and VIN > UVDET, the PMIC turns on; the interrupt and sense bits, PWRONI and
PWRONS respectively, is set.
• If PWRON_CFG = 1, VIN > UVDET and PWRON transitions from high to low, the PMIC turns on; the interrupt and sense bits, PWRONI
and PWRONS respectively, is set.
Any regulator enabled in the sleep mode remains enabled when transitioning from Sleep to ON, i.e., the regulator is not turned off and
then on again to match the start-up sequence.
When PWRON_CFG = 1, the PWRON input can be a mechanical switch debounced through a programmable debouncer
PWRONDBNC[1:0], to avoid a response to a very short key press. The interrupt is generated for both the falling and the rising edge of
the PWRON pin. By default, a 31.25 ms interrupt debounce is applied to both falling and rising edges. The falling edge debounce timing
can be extended with PWRONDBNC[1:0] as defined in the table below. The interrupt is cleared by software, or when cycling through the
OFF mode.
Table 36. PWRON hardware debounce bit settings (53)
Bits
PWRONDBNC[1:0]
State
Turn on debounce (ms)
Falling edge INT debounce (ms)
Rising edge INT debounce (ms)
00
0.0
31.25
31.25
01
31.25
31.25
31.25
10
125
125
31.25
11
750
750
31.25
Notes
53. The sense bit, PWRONS, is not debounced and follows the state of the PWRON pin.
6.3.1.2
STANDBY
STANDBY is an input signal to the IC. When it is asserted the part enters standby mode and when de-asserted, the part exits standby
mode. STANDBY can be configured as active high or active low using the STANDBYINV bit. See Standby mode for more details.
Note: When operating the PMIC at VIN ≤ 2.85 V a coin cell must be present to provide VSNVS, or the PMIC does not reliably enter and
exit the STANDBY mode.
6.3.1.3
RESETBMCU
RESETBMCU is an open-drain, active low output OTP configurable for two modes of operation. In its default mode, it is de-asserted 2.0
ms after the last regulator in the start-up sequence is enabled. In this mode, the signal can be used to bring the processor out of reset
(POR), or as an indicator that all supplies have been enabled; it is only asserted during a turn-off event. In the default mode, the
RESETBMCU signal is internal timer based and does not monitor the regulators. When configured for its fault mode, RESETBMCU is deasserted after the start-up sequence is completed only if no faults occurred during start-up. At any time, if a fault occurs and persists for
1.8 ms, RESETBMCU is asserted LOW. The PF3000 is turned off if the fault persists for more than 100 ms. The PWRON signal can be
used to restart the part, though if the fault persists, the sequence described above is repeated. To enter the fault mode, set bit
OTP_PG_EN of register OTP PWRGD EN to “1” during OTP programming.
PF3000
NXP Semiconductors
31
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.3.1.4
INTB
INTB is an open drain, active low output. It is asserted when any fault occurs, provided that the fault interrupt is unmasked. INTB is deasserted after the fault interrupt is cleared by software, which requires writing a “1” to the fault interrupt bit.
6.3.1.5
SD_VSEL
SD_VSEL is an input pin that sets the output voltage range of the VCC_SD regulator. When SD_VSEL = HIGH, the VCC_SD regulator
operates in the lower output voltage range. When SD_VSEL = LOW, the VCC_SD regulator operates in the higher output voltage range.
The SD_VSEL input buffer is powered by the VDDIO supply. When a valid VDDIO voltage is not present, the output of the SD_VSEL buffer
defaults to a logic high thus keeping the VCC_SD regulator output in the lower voltage range.
6.3.2
One-time-programmable memory
One-time-programmable memory is used to store key startup parameters and regulators’ configuration information. This eliminates the
need to set regulator voltage and sequence using external components. The following parameters are programmable in the PF3000.
General: I2C slave address, PWRON pin configuration, RESETBMCU configuration
Buck regulators: Output voltage, single phase or independent mode configuration for SW1A and SW1B regulators, switching frequency,
regulator start-up sequence and timing
Boost regulator and LDOs: Output voltage, regulator start-up sequence and timing
The PF3000 starts up based on the contents of the TBBOTP registers. During power up, contents of the OTP memory are loaded on to
the TBBOTP registers. There is an optional Try-before-buy mode of operation available which bypasses loading of the OTP memory onto
the TBBOTP registers. Instead, regulators directly start up based on the current contents of the TBBOTP registers during this mode of
operation. This mode is useful when trying to determine a suitable OTP configuration for the system. TBB mode can also be used in lieu
of OTP programming provided a microcontroller can initiate the TBB sequence is available in the system.
6.3.2.1
Register naming convention
Register and bit names for the TBBOTP registers are prefixed with “OTP”. This is to differentiate them from “functional registers” which
are responsible for real-time control of regulator settings. For example, “OTP_SW1A_VOLT” refers to the TBBOTP register associated
with the voltage setting for SW1A regulator. “SW1AVOLT” refers to the functional register which is fed into the SW1A regulator block.
During power up, contents of the OTP fuses are copied onto the “OTP_SW1A_VOLT” register which is further copied on to the
“SW1AVOLT” register. During normal operation, writes to the “OTP_SW1A_VOLT” register has no effect on the output voltage of the SW1A
regulator. Writes to the “SW1AVOLT” register do have an effect.
6.3.2.2
Regulator startup sequence programming
Each regulator has 3-bits or 4-bits allocated to program its start-up time slot from a turn-on event; therefore, each can be placed from
position one to seven or one to fifteen in the start-up sequence as shown in Table 37. When the sequence is code is set to 0, the regulator
remains off during the startup sequence. It can be enabled using I2C after the start up sequence is completed. The delay between each
position can be programmed to be 0.5 ms or 2.0 ms as shown in Table 38. The start-up sequence terminates at the last programmed
regulator. RESETBMCU pin is de-asserted HIGH 2.0 ms after the last utilized startup slot.
Table 37. Start-up sequence
OTP_SWx_SEQ[2:0]/
OTP_V33_SEQ[2:0]/
OTP_VLDOx_SEQ[3:0]/
OTP_VCC_SD_SEQ[2:0]
Sequence
000
0000
Off
001
0001
SEQ_CLK_SPEED * 1
010
0010
SEQ_CLK_SPEED * 2
011
0011
SEQ_CLK_SPEED * 3
100
0100
SEQ_CLK_SPEED * 4
101
0101
SEQ_CLK_SPEED * 5
110
0110
SEQ_CLK_SPEED * 6
PF3000
32
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 37. Start-up sequence (continued)
OTP_SWx_SEQ[2:0]/
OTP_V33_SEQ[2:0]/
OTP_VLDOx_SEQ[3:0]/
OTP_VCC_SD_SEQ[2:0]
Sequence
111
0111
SEQ_CLK_SPEED * 7
–
1000
SEQ_CLK_SPEED * 8
–
1001
SEQ_CLK_SPEED * 9
–
1010
SEQ_CLK_SPEED * 10
–
1011
SEQ_CLK_SPEED * 11
–
1100
SEQ_CLK_SPEED * 12
–
1101
SEQ_CLK_SPEED * 13
–
1110
SEQ_CLK_SPEED * 14
–
1111
SEQ_CLK_SPEED * 15
Table 38. Start-up sequence clock speed
SEQ_CLK_SPEED
Time (μs)
0
500
1
2000
6.3.2.3
PWRON pin configuration
The PWRON pin can be configured as either a level sensitive input (PWRON_CFG = 0), or as an edge sensitive input (PWRON_CFG = 1).
As a level sensitive input, an active high signal turns on the part and an active low signal turns off the part, or puts it into sleep mode. As
an edge sensitive input, such as when connected to a mechanical switch, a falling edge turns on the part and if the switch is held low for
greater than or equal to 4.0 seconds, the part turns off or enters sleep mode.
Table 39. PWRON configuration
PWRON_CFG
Mode
0
PWRON pin HIGH = ON
PWRON pin LOW = OFF or sleep mode
1
PWRON pin pulled LOW momentarily = ON
PWRON pin LOW for 4.0 seconds = OFF or sleep mode
I2C address configuration
6.3.2.4
The I2C device address can be programmed from 0x08 to 0x0F. This allows flexibility to change the I2C address to avoid bus conflicts.
Address bit, I2C_SLV_ADDR[3] in OTP_I2C_ADDR register is hard coded to “1” while the lower three LSBs of the I2C address
(I2C_SLV_ADDR[2:0]) are programmable as shown in Table 40. The I2C address of the PF3000 immediately changes after write
instructions to the OTP_I2C_ADDR register are complete. To continue using the default address of 0x08, set bit 7 (USE_DEFAULT_ADD)
of the OTP_I2C_ADDR register.
Table 40. I2C address configuration
I2C_SLV_ADDR[3] Hard
Coded
I2C_SLV_ADDR[2:0]
I2C Device Address (Hex)
1
000
0x08
1
001
0x09
1
010
0x0A
1
011
0x0B
1
100
0x0C
PF3000
NXP Semiconductors
33
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 40. I2C address configuration (continued)
I2C_SLV_ADDR[3] Hard
Coded
I2C_SLV_ADDR[2:0]
I2C Device Address (Hex)
1
101
0x0D
1
110
0x0E
1
111
0x0F
6.3.2.5
Buck regulator soft start ramp rate
The start-up ramp rate ramp rate or soft start ramp rate of buck regulators can be chosen by using the SWDVS_CLK bit during OTP.
Table 41 shows the startup ramp rate options for the buck regulators in the PF3000.
Table 41. DVS speed selection for SWx
SWDVS_CLK
6.3.3
Function
0
25 mV step each 2.0 μs
1
25 mV step each 4.0 μs
Start-up
Regulators in the PF3000 start up based on the contents of the TBBOTP registers. During cold start, contents from the OTP memory are
loaded into the TBBOTP registers when VIN > UVDET irrespective of whether the PMIC is powered using the VIN or the VPWR path.
Contents of the TBBOTP registers are reloaded from the fuses during a turn-on event.
The PF3000 is available in a number of pre-programmed flavors to suit a wide variety of system configurations. Refer to Table 42 for
programming details of the different flavors. Refer to Section 6.3.2 for a detailed explanation of the OTP block.
PF3000
34
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 42. Start-up configuration (54)
OTP registers
Default
Nonconfiguration programmed
All Devices
2
A0
Pre-programmed OTP configuration
A1
A2
A3
A4
A5
A6
A7
Default I C Address
0x08
0x08
0x08
0x08
0x08
0x08
0x08
0x08
0x08
OTP_VSNVS_VOLT
3.0 V
1.0 V
3.0 V
3.0 V
3.0 V
3.0 V
3.0 V
3.0 V
3.0 V
OTP_SW1A_VOLT
1.15 V
0.7 V
1.10 V
1.10 V
1.375 V
1.375 V
1.375 V
3.3 V
3.3 V
OTP_SW1A_SEQ
1
OFF
1
1
2
1
1
3
3
OTP_SW1B_VOT
1.15 V
0.7 V
1.0 V
1.0 V
1.375 V
1.375 V
1.375 V
1.4 V
1.4 V
OTP_SW1B_SEQ
1
OFF
1
1
2
1
1
3
3
OTP_SW2_VOLT
1.8 V
1.5 V
1.8 V
1.8 V
3.3 V
3.3 V
3.15 V
3.3 V
3.3 V
OTP_SW2_SEQ
2
OFF
2
2
4
2
2
3
3
OTP_SW3_VOLT
1.2 V
0.9 V
1.35 V
1.2 V
1.35 V
1.5 V
1.2 V
1.2 V
1.35 V
OTP_SW3_SEQ
3
OFF
5
5
3
3
4
3
3
OTP_SWBST_VOLT
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
OTP_SWBST_SEQ
OFF
OFF
OFF
OFF
OFF
OFF
6
OFF
OFF
OTP_VLDO1_VOLT
1.8 V
1.8 V
1.8 V
1.8 V
3.3 V
1.8 V
1.8 V
3.3 V
3.3 V
OTP_VLDO1_SEQ
2
OFF
4
4
OFF
OFF
3
3
3
OTP_VLDO2_VOLT
1.2 V
0.8 V
1.5 V
1.5 V
1.5 V
1.2 V
1.5 V
1.5 V
1.5 V
OTP_VLDO2_SEQ
OFF
OFF
4
4
OFF
3
OFF
OFF
OFF
OTP_VLDO3_VOLT
1.8 V
1.8 V
3.3 V
3.3 V
2.5 V
1.8 V
3.1 V
1.8 V
1.8 V
OTP_VLDO3_SEQ
2
OFF
3
3
OFF
OFF
2
3
3
OTP_VLDO4_VOLT
1.8 V
1.8 V
3.3 V
3.3 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
OTP_VLDO4_SEQ
OFF
OFF
3
3
4
3
3
3
3
OTP_V33_VOLT
3.15 V
2.85 V
3.3 V
3.3 V
3.0 V
3.3 V
2.85 V
3.3 V
3.3 V
OTP_V33_SEQ
2
OFF
3
3
1
2
OFF
2
2
OTP_VCC_SD_VOLT
3.15 V/1.80 V
2.85 V/1.80 V
3.3 V/1.85 V
3.3 V/1.85 V
3.3 V/1.85 V
3.0 V/1.80 V
3.15 V/1.80 V
3.3 V/1.85 V
3.3 V/1.85 V
OTP_VCC_SD_SEQ
3
OFF
4
4
5
3
2
3
3
OTP_SEQ_CLK_SPEED
500 µs
500 µs
2000 µs
2000 µs
500 µs
2000 µs
2000 µs
2000 µs
2000 µs
OTP_SWDVS_CLK
6.25 mV/μs
12.5 mV/µs
12.5 mV/µs
12.5 mV/µs
6.25 mV/μs
12.5 mV/µs
12.5 mV/µs
12.5 mV/µs
12.5 mV/µs
OTP_PWRON_CFG
Level sensitive
Level sensitive
Level
sensitive
Level
sensitive
Level sensitive
Level
sensitive
Level sensitive
Level
sensitive
Level
sensitive
OTP_SW1_CONFIG
SW1A, SW1B
Independent
Mode, 2.0 MHz
SW1A, SW1B
Independent
Mode, 1.0 MHz
OTP_SW2_FREQ
2.0 MHz
1.0 MHz
2.0 MHz
2.0 MHz
2.0 MHz
2.0 MHz
2.0 MHz
2.0 MHz
2.0 MHz
OTP_SW3_FREQ
2.0 MHz
1.0 MHz
2.0 MHz
2.0 MHz
2.0 MHz
2.0 MHz
2.0 MHz
2.0 MHz
2.0 MHz
OTP_PG_EN
RESETBMCU in RESETBMCU
Default Mode
in Default Mode
SW1A,
SW1A, SW1B SW1A, SW1B SW1A, SW1B SW1A, SW1B SW1A, SW1B SW1A, SW1B
SW1B
Independent
Independent
Independent
Independent Independent
Independent Independent
Mode, 2.0
Mode, 2.0
Mode, 2.0
Mode, 2.0
Mode, 2.0
Mode, 2.0
Mode, 2.0
MHz
MHz
MHz
MHz
MHz
MHz
MHz
RESETBMC RESETBMCU RESETBMCU RESETBMCU RESETBMCU RESETBMCU RESETBMCU
U in Default
in Default
in Default
in Default
in Default
in Default
in Default
Mode
Mode
Mode
Mode
Mode
Mode
Mode
Notes
54. This table specifies the default output voltage of the LDOs and SWx after start-up and/or when the LDOs and SWx are enabled. VREFDDR_SEQ
is internally fixed to be same as SW3_SEQ. VCC_SD voltage depends on the state of the SD_VSEL pin.
PF3000
NXP Semiconductors
35
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.3.3.1
Start-up timing diagram
The startup timing of the regulators is programmable through OTP and seq_clk_speed. Figure 6 shows the startup timing of the regulators
as determined by their OTP sequence. The trimmed 32 kHz clock controls all the start up timing.
UVDET
VIN
tr1
3V
td1 is time from VIN > UVDET to VSNVS
starting to rise. td1 is typically 5 ms
tr1 is time VSNVS takes to go from 1
V to 3 V. Typically it is 650 μs.
td1
1V
VSNVS
td2
td2 is user determined delay. Can be
zero if PWRON pulled up to VSNVS
PWRON
td3 is delay of regulator(s) whose OTP sequence is set to 1.
With SEQ_CLK_SPEED = 0.5 ms, td3 is typically 2 ms with a
minimum of 1 ms and maximum of 3 ms
With SEQ_CLK_SPEED = 2 ms, td3 is typically 4.5 ms with a
minimum of 2.5 ms and maximum of 6.5 ms
td3
Regulator
Outputs
td4
td4 is controlled by the OTP
sequence setting of the
regulator(s). Refer to Table 33.
Regulator
Outputs
td5 is the time for RESETBMCU to go high from the
regulator(s) with the last OTP sequence. It is typically
2 ms with a minimum of 1.8 ms and maximum of 2.2 ms.
td5
RESETBMCU
Figure 6. Startup timing diagram
6.3.4
16 MHz and 32 kHz clocks
The PF3000 incorporates two clocks: a trimmed 16 MHz RC oscillator and an untrimmed 32 kHz RC oscillator. The 32 kHz untrimmed
clock is only used in the following conditions:
• VIN < UVDET
• All regulators are in sleep mode
• All regulators are in PFM switching mode
A 32 kHz clock, derived from the 16 MHz trimmed clock, is used when accurate timing is needed under the following conditions:
• During start-up, VIN > UVDET
• PWRON_CFG = 1, for power button debounce timing
When the 16 MHz is active in the ON mode, the debounce times are referenced to the 32 kHz derived from the 16 MHz clock. The
exceptions are the LOWVINI and PWRONI interrupts, which are referenced to the 32 kHz untrimmed clock. Switching frequency of the
switching regulators is derived from the trimmed 16 MHz clock.
The 16 MHz clock and hence the switching frequency of the regulators, can be adjusted to improve the noise integrity of the system. By
changing the factory trim values of the 16 MHz clock, the user may add an offset as small as ±3.0% of the nominal frequency. Contact
your NXP representative for detailed information on this feature.
PF3000
36
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.3.5
6.3.5.1
Optional front-end input LDO regulator
LDO regulator description
This section describes the optional front-end LDO regulator provided by the PF3000 in order to facilitate the operation with supply voltages
higher than 4.5 V and up to 5.5 V.
For non-battery operated applications, when the input supply voltage exceeds 4.5 V, the front-end LDO can be activated by populating
the external PMOS pass FET MP1 in Figure 7 and connecting the VPWR pin to the main supply. Under this condition, the LDO control
block self-starts with a local bandgap reference. When the VIN pin reaches UVDET rising threshold, the reference is switched to the main
trimmed bandgap reference to maintain the required VIN accuracy. In applications using an input supply voltage of 4.5 V or lower, the
PMOS pass FET should not be populated, VPWR pin should be grounded externally and the VIN pin should be used instead as the main
supply input pin. The input pins of the switching regulators should always be connected to the VIN net.
The main components of the LDO regulator are an external power P-channel MOSFET and an internal differential error amplifier. One
input of the amplifier monitors a fraction of the output voltage at VIN determined by the resistor ratio of R1 and R2 as shown in Figure 7.
The second input to the differential amplifier is from a stable bandgap voltage reference. If the output voltage rises too high relative to the
reference voltage, the gate voltage of the power FET is changed to maintain a constant output voltage.
In order to maintain the power consumption at reasonable levels during PF3000 standby and sleep modes, the LDO circuit enters lowpower mode of operation using an embedded pass FET while the external pass FET is kept off. When the STBY_LOWPOWER_B bit in
register LDOGCTL is set the activation of the low-power mode during IC standby mode is disabled; however the LDO low-power mode is
always activated during the IC sleep mode. Moreover, during IC Off mode, an even simpler internal circuit is used to further reduce the
power consumption. Refer to Modes of operation for different modes of operation of the IC.
VP WR
VPWR
VR EF
LDOG
_
MP1
+
VIN
R1
CVI N
R2
VP WR
Figure 7. Front-end LDO block diagram
6.3.5.2
Undervoltage/short-circuit and overvoltage detection
Short-circuit to GND at VIN is detected using an under voltage monitor at VIN that would sense excessive droop on the VIN line and
consequently turn off (disable) the external PMOS pass FET. Overvoltage at VPWR is detected if VPWR exceeds the VPWROV threshold
(typically 6.0 V). Upon the detection of an overvoltage event an interrupt is generated and bit 2 is set in INTSTAT3 register. The INTB pin
is pulled low if the VPWROVM mask bit is cleared. The interrupt is filtered using a 122 μs debouncing circuit. The VPWROV interrupt is
not asserted if the overvoltage event occurs during start up. The VPWROVS bit can be read using I2C to detect an overvoltage condition.
PF3000
NXP Semiconductors
37
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.3.5.3
External components
Table 43 lists the typical component values for the general purpose LDO regulators.
Table 43. Input LDO external components
Component
Value
Minimum output capacitor on VIN rail
100 μF (55)
MP1
Fairchild FDMA908PZ, Vishay SiA447DJ, or comparable
Notes
55. Use X5R/X7R ceramic capacitors with a voltage rating at least two times the nominal voltage. The 100 μF capacitance is the
total capacitance on the VIN rail including the capacitance at the various regulator inputs. For example, 2 x 22 μF capacitors can
be used along with 10 μF capacitors at all the SWx and LDOx inputs to achieve a total of 100 μF capacitance.
6.3.6
Internal core voltages
All regulators use the main bandgap as the reference. The main bandgap is bypassed with a capacitor at VCOREREF. VCOREDIG is a
1.5 V regulator that powers all the digital logic in the PF3000. VCOREDIG is regulated at 1.28 V in Off and coin cell modes. The VCORE
supply is used to bias internal analog rails and the OTP fuses. No external DC loading is allowed on VCORE, VCOREDIG, or VCOREREF.
VCOREDIG is kept powered as long as there is a valid supply and/or valid coin cell.
6.3.7
VREFDDR voltage reference
VREFDDR is an internal PMOS half supply voltage follower capable of supplying up to 10 mA. The output voltage is at one half the input
voltage. It is typically used as the reference voltage for DDR memories. A filtered resistor divider is utilized to create a low frequency pole.
This divider then uses a voltage follower to drive the load.
Figure 8. VREFDDR block diagram
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FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.3.7.1
VREFDDR external components
Table 44. VREFDDR external components (56)
Capacitor
Capacitance (μF)
VINREFDDR (57) to VHALF
0.1
VHALF to GND
0.1
VREFDDR
1.0
Notes
56. Use X5R or X7R capacitors.
57. VINREFDDR to GND, 1.0 μF minimum capacitance is provided by buck regulator output.
6.3.8
Buck regulators
The PF3000 integrates four independent buck regulators: SW1A, SW1B, SW2, and SW3. Regulators SW1A and SW1B regulators can
be configured as a single regulator through OTP. Output of the buck regulators during start up is programmable through OTP. Each
regulator has associated registers that control its output voltage during On, standby, and sleep modes. During start-up, contents of the
OTP_SWx_VOLT register is copied onto the SWxVOLT[4:0], SWxSTBY[4:0] and SWxOFF[4:0]. After boot up, contents of the SWxVOLT,
SWxSTBY and SWxOFF registers can be set through I2C to set the output voltage during On, standby, and sleep modes respectively.
VIN
SWxIN
CINSWx
SWxMODE
ISENSE
CINSWxHF
SWx
Controller
SWxLX
Driver
LSWx
COSWx
SWxFAULT
EP
Internal
Compensation
SWxFB
I2C
Interface
Z2
Z1
EA
VREF
DAC
Discharge
Figure 9. Generic SWx block diagram
Table 45. SWx regulators external components
Components
CINSWx
CINSWxHF
COSWx
LSWx
Description
SWx input capacitor
SWx decoupling input capacitor
SWx output capacitor
SWx inductor
Values
4.7 μF
0.1 μF
2 x 22 μF (10 V or higher voltage
rated capacitors) or 3 x 22 μF
(6.3 V rated capacitors)
1.5 μH
Use X5R or X7R capacitors with voltage rating at least two times the nominal voltage.
PF3000
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FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.3.8.1
Switching modes
To improve system efficiency the buck regulators can operate in different switching modes. Changing between switching modes can occur
by any of the following means: I2C programming, exiting/entering the standby mode, exiting/entering sleep mode, and load current
variation. Available switching modes for buck regulators are presented in Table 45.
Table 46. Switching mode description
Mode
Description
OFF
The regulator is switched off and the output voltage is discharged using an internal resistor
PFM
In this mode, the regulator operates in forced PFM mode. The main error amplifier is turned
off and a hysteretic comparator is used to regulate output voltage. Use this mode for load
currents less than 50 mA.
PWM
In this mode, the regulator operates in forced PWM mode.
APS
In this mode, the regulator operates in pulse skipping mode at light loads and switches over
to PWM modes for heavier load conditions. This is the default mode in which the regulators
power up during a turn-on event.
During soft-start of the buck regulators, the controller transitions through the PFM, APS, and PWM switching modes. 3.0 ms after the
output voltage reaches regulation, the controller transitions to the selected switching mode. Depending on the particular switching mode
selected, additional ripple may be observed on the output voltage rail as the controller transitions between switching modes. The operating
mode of the regulator in On and standby modes is controlled using the SWxMODE[3:0] bits associated with each regulator. Table 46
summarizes the buck regulator programmability for normal and standby modes.
Table 47. Regulator mode control
SWxMODE[3:0]
Normal mode
Standby mode
0000
Off
Off
0001
PWM
Off
0010
Reserved
Reserved
0011
PFM
Off
0100
APS
Off
0101
PWM
PWM
0110
PWM
APS
0111
Reserved
Reserved
1000 (default)
APS
APS
1001
Reserved
Reserved
1010
Reserved
Reserved
1011
Reserved
Reserved
1100
APS
PFM
1101
PWM
PFM
1110
Reserved
Reserved
1111
Reserved
Reserved
Transitioning between normal and standby modes can affect a change in switching modes as well as output voltage. When in standby
mode, the regulator outputs the voltage programmed in its standby voltage register and operates in the mode selected by the
SWxMODE[3:0] bits. Upon exiting standby mode, the regulator returns to its normal switching mode and its output voltage programmed
in its voltage register.
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NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Any regulators whose SWxOMODE bit is set to “1” enters sleep mode if a PWRON turn-off event occurs, and any regulator whose
SWxOMODE bit is set to “0” is turned off. In sleep mode, the regulator outputs the voltage programmed in SWxOFF registers and operates
in the PFM mode. The regulator exits the sleep mode when a turn-on event occurs. Any regulator whose SWxOMODE bit is set to “1”
remains on and changes to its normal configuration settings when exiting the Sleep state to the ON state. Any regulator whose
SWxOMODE bit is set to “0” is powered up with the same delay in the start-up sequence as when powering ON from Off. At this point, the
regulator returns to its default ON state output voltage and switch mode settings.
When sleep mode is activated by the SWxOMODE bit, the regulator uses the set point as programmed by SW1xOFF[4:0] for
SW1A/B and by SW2OFF[2:0] for SW2, and SW3OFF[3:0] for SW3.
6.3.8.2
Dynamic voltage scaling
To reduce overall power consumption, processor core voltages can be varied depending on the mode or activity level of the processor.
1. Normal operation: The output voltage is selected by I2C bits SW1x[4:0] for SW1A/B and SW2[2:0] for SW2, and SW3[3:0] for SW3.
A voltage transition initiated by I2C is governed by the DVS stepping rates shown in Table 48.
2. Standby mode: The output voltage can be selected by I2C bits SW1xSTBY[4:0] for SW1A/B and by bits SW2STBY[2:0] for SW2,
and SW3STBY[3:0] for SW3. Voltage transitions initiated by a Standby event are governed by the DVS stepping rates shown in
Table 48.
3. Sleep mode: The output voltage can be higher or lower than in normal operation, but is typically selected to be the lowest state
retention voltage of a given processor; it is selected by I2C bits SW1xOFF[4:0] for SW1A/B and by bits SW2OFF[2:0] for SW2,
and SW3OFF[3:0] for SW3. Voltage transitions initiated by a turn-off event are governed by the DVS stepping rates shown in
Table 48.
Table 48. DVS speed selection for SWx
SWxDVSSPEED
Function
0
25 mV step each 2.0 μs
1
25 mV step each 4.0 μs
The regulators have a strong sourcing capability and sinking capability in PWM mode, therefore the fastest rising and falling slopes are
determined by the regulator in PWM mode. However, if the regulators are programmed in PFM or APS mode during a DVS transition, the
falling slope can be influenced by the load. Additionally, as the current capability in PFM mode is reduced, controlled DVS transitions in
PFM mode could be affected. Critically timed DVS transitions are best assured with PWM mode operation.
Figure 10 shows the general behavior for the regulators when initiated with I2C programming, or standby control. During the DVS period
the overcurrent condition on the regulator should be masked.
Figure 10. Voltage stepping with DVS
Note: In SW1A independent and SW1AB single phase modes, DVS to and from the 1.8 V and 3.3 V output voltage settings is not allowed.
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FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.3.8.3
Regulator phase clock
The SWxPHASE[1:0] bits select the phase of the regulator clock as shown in Table 49. By default, each regulator is initialized at 90 ° out
of phase with respect to each other. For example, SW1x is set to 0 °, SW2 is set to 90 °, and SW3 is set to 180 ° by default at power up.
Table 49. Regulator phase clock selection
SWxPHASE[1:0]
Phase of clock sent to
regulator (degrees)
00
0
01
90
10
90
11
270
The SWxFREQ[1:0] register is used to set the desired switching frequency for each one of the buck regulators. Table 51 shows the
selectable options for SWxFREQ[1:0]. For each frequency, all phases are available, this allows regulators operating at different
frequencies to have different relative switching phases. However, not all combinations are practical. For example, 2.0 MHz, 90 ° and
4.0 MHz, 180 ° are the same in terms of phasing. Table 50 shows the optimum phasing when using more than one switching frequency.
Table 50. Optimum phasing
Frequencies
Optimum Phasing
1.0 MHz
2.0 MHz
0°
180°
1.0 MHz
4.0 MHz
0°
180°
2.0 MHz
4.0 MHz
0°
180°
1.0 MHz
2.0 MHz
4.0 MHz
0°
90°
90°
Table 51. Regulator frequency configuration
SWxFREQ[1:0]
Frequency
00
1.0 MHz
01
2.0 MHz (default)
10
4.0 MHz
11
Reserved
6.3.8.4
SW1A/B
SW1A/B are 1 to 2.75 A buck regulators that can be configured in various phasing schemes, depending on the desired cost/performance
trade-offs. The following configurations are available:
• SW1A/B single phase with one inductor
• SW1A in independent with one inductor and SW1B in independent mode with a second inductor
The desired configuration is programmed by OTP by using OTP_SW1_CONFIG[1:0] bits in the register map, as shown below in Table 52.
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FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 52. SW1 configuration
OTP_SW1_CONFIG[1:0]
Description
00
Unused
01
A/B Single Phase
6.3.8.5
10
Unused
11
A Independent mode
B Independent mode
SW1A/B single phase
In this configuration, the phases SW1ALX, and SW1BLX, are connected together to a single inductor, thus, providing up to 2.75 A current
capability for high current applications. The feedback and all other controls are accomplished by use of pin SW1AFB and SW1A control
registers, respectively. However, the same configuration settings for frequency, phase, and DVS speed setting on SW1B registers should
be used. The SW1BFB pin should be left floating in this configuration.
VIN
SW1AIN
CINSW1A
SW1A/B
SW1AMODE
ISENSE
CINSW1AHF
Controller
SW1ALX
Driver
LSW1A
COSW1A
SW1AFAULT
EP
Internal
Compensation
SW1AFB
Z2
Z1
VREF
EA
DAC
I2C
Interface
Discharge
VIN
SW1BIN
CINSW1B
SW1BMODE
ISENSE
CINSW1BHF
SW1BLX
Controller
Driver
SW1BFAULT
EP
SW1BFB
(Floating)
Figure 11. SW1A/B single phase diagram
6.3.8.6
SW1A - SW1B
Independent mode In this configuration, SW1A is connected as an independent output with a single inductor, while SW1B is used as
another independent output, using another inductor and configuration parameters. They can be operated with a different voltage set point
for normal, standby, and sleep modes, as well as switching mode selection and on/off control.
6.3.8.7
SW1A/B setup and control registers
SW1A and SW1AB output voltages are programmable from 0.700 V to 1.425 V in steps of 25 mV. They can additionally be programmed
at 1.8 V or 3.3 V. SW1B output voltage is programmable from 0.700 V to 1.475 V in steps of 25 mV. The output voltage set point is
independently programmed for normal, standby, and sleep mode by setting the SW1x[4:0], SW1xSTBY[4:0], and SW1xOFF[4:0] bits
respectively. Table 53 shows the output voltage coding for SW1A, SW1B or SW1A/B. Values shown in Table 53 are also to be used during
OTP programming by setting the OTP_SW1A_VOLT and OTP_SW1B_VOLT registers appropriately.
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FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 53. SW1A/B output voltage configuration
Set point
SW1x[4:0]
SW1xSTBY[4:0]
SW1xOFF[4:0]
SW1x output (V)
Set point
SW1x[4:0]
SW1xSTBY[4:0]
SW1xOFF[4:0]
SW1x output (V)
0
00000
0.700
16
10000
1.100
1
00001
0.725
17
10001
1.125
2
00010
0.750
18
10010
1.150
3
00011
0.775
19
10011
1.175
4
00100
0.800
20
10100
1.200
5
00101
0.825
21
10101
1.225
6
00110
0.850
22
10110
1.250
7
00111
0.875
23
10111
1.275
8
01000
0.900
24
11000
1.300
9
01001
0.925
25
11001
1.325
10
01010
0.950
26
11010
1.350
11
01011
0.975
27
11011
1.375
12
01100
1.000
28
11100
1.400
13
01101
1.025
29
11101
1.425
14
01110
1.050
30
11110
1.450 (SW1B), 1.8
(SW1A/SW1AB)
15
01111
1.075
31
11111
1.475 (SW1B), 3.3
(SW1A/SW1AB)
Table 54 provides a list of registers used to configure and operate SW1A/B regulator(s).
Table 54. SW1A/B register summary
Register
Address
Output
SW1AVOLT
0x20
SW1A output voltage set point in normal operation
SW1ASTBY
0x21
SW1A output voltage set point on standby
SW1AOFF
0x22
SW1A output voltage set point on sleep
SW1AMODE
0x23
SW1A switching mode selector register
SW1ACONF
0x24
SW1A DVS, phase, and frequency configuration
SW1BVOLT
0x2E
SW1B output voltage set point in normal operation
SW1BSTBY
0x2F
SW1B output voltage set point in standby
SW1BOFF
0x30
SW1B output voltage set point in sleep
SW1BMODE
0x31
SW1B switching mode selector register
SW1BCONF
0x32
SW1B DVS, phase, and frequency configuration
6.3.8.8
SW2 setup and control registers
SW2 is a single phase, 1.25 A rated buck regulator. SW2 output voltage is programmable from 1.500 V to 1.850 V in 50 mV steps if the
OTP_SW2_HI bit is low or from 2.500 V to 3.300 V in 150 mV steps if the bit OTP_SW2_HI is set high. During normal operation, output
voltage of the SW2 regulator can be changed through I2C only within the range set by the OTP_SW2_HI bit. The output voltage set point
is independently programmed for normal, standby, and sleep mode by setting the SW2[2:0], SW2STBY[2:0] and SW2OFF[2:0] bits,
respectively. Table 55 shows the output voltage coding valid for SW2.
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NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 55. SW2 output voltage configuration
Low output voltage range
(OTP_SW2_HI= 0)
High output voltage range
(OTP_SW2_HI=1)
SW2[2:0]
SW2STBY[2:0]
SW2OFF[2:0]
SW2 output
SW2[2:0]
SW2STBY[2:0]
SW2OFF[2:0]
SW2 output
000
1.500
000
2.500
001
1.550
001
2.800
010
1.600
010
2.850
011
1.650
011
3.000
100
1.700
100
3.100
101
1.750
101
3.150
110
1.800
110
3.200
111
1.850
111
3.300
Setup and control of SW2 is done through the I2C registers listed in Table 56.
Table 56. SW2 register summary
Register
Address
Description
SW2VOLT
0x35
Output voltage set point on normal operation
SW2STBY
0x36
Output voltage set point on Standby
SW2OFF
0x37
Output voltage set point on Sleep
SW2MODE
0x38
Switching mode selector register
SW2CONF
0x39
DVS, phase, frequency, and ILIM configuration
6.3.8.9
SW3 setup and control registers
SW3 output voltage is programmable from 0.90 V to 1.65 V in 50 mV steps to support different types of DDR memory as listed in Table 57.
Table 57. SW3 output voltage configuration
SW3[3:0]
SW3 Output (V)
SW3[3:0]
SW3 Output (V)
0000
0.90
1000
1.30
0001
0.95
1001
1.35
0010
1.00
1010
1.40
0011
1.05
1011
1.45
0100
1.10
1100
1.50
0101
1.15
1101
1.55
0110
1.20
1110
1.60
0111
1.25
1111
1.65
Table 58 provides a list of registers used to configure and operate SW3.
PF3000
NXP Semiconductors
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FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 58. SW3 register summary
Register
Address
Output
SW3VOLT
0x3C
SW3 output voltage set point on normal operation
SW3STBY
0x3D
SW3 output voltage set point on Standby
SW3OFF
0x3E
SW3 output voltage set point on Sleep
SW3MODE
0x3F
SW3 switching mode selector register
SW3CONF
0x40
SW3 DVS, phase, frequency and ILIM configuration
6.3.9
Boost regulator
SWBST is a boost regulator with a programmable output from 5.0 V to 5.15 V. SWBST can supply the VUSB regulator for the USB PHY
in OTG mode, as well as the VBUS voltage. Note that the parasitic leakage path for a boost regulator causes the SWBSTOUT and
SWBSTFB voltage to be a Schottky drop below the input voltage whenever SWBST is disabled. A load switch is recommended on the
output path to isolate the output for applications where this is not desired. The switching NMOS transistor is integrated on-chip. Figure 12
shows the block diagram and component connection for the boost regulator.
VIN
CINBST
LBST
VOBST
SWBSTIN
SWBSTMODE
SWBSTLX
Driver
DBST
EP
OC
RSENSE
VREFSC
Controller
SWBSTFAULT
I2C
Interface
SC
VREFUV
UV
SWBSTFB
COSWBST
Internal
Compensation Z2
Z1
EA
VREF
Figure 12. Boost regulator architecture
PF3000
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NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.3.9.1
SWBST setup and control
Boost regulator control is done through a single register SWBSTCTL described in Table 59. SWBST is included in the power-up sequence
if its OTP power-up timing bits, OTP_SWBST_SEQ[2:0], are not all zeros.
Table 59. Register SWBSTCTL - ADDR 0x66
Name
Bit #
SWBST1VOLT
1:0
SWBST1MODE
R/W
R/W
3:2
R
Default
Description
Set the output voltage for SWBST
00 = 5.000 V
01 = 5.050 V
10 = 5.100 V
11 = 5.150 V
0b00
Set the switching mode on normal operation
00 = OFF
01 = PFM
0b10
10 = Auto (Default) (58)
11 = APS
Unused
4
SWBST1STBYMODE
6:5
–
R/W
0b0
Unused
0b10
Set the switching mode on standby
00 = OFF
01 = PFM
10 = Auto (Default) (58)
11 = APS
Unused
7
–
0b0
Unused
Notes
58. In auto mode, the controller automatically switches between PFM and APS modes depending on the load current.
Regulator switches in auto mode if enabled in the startup sequence.
6.3.9.2
SWBST external components
Table 60. SWBST external component requirements
Components
Description
Values
CINBST (59)
SWBST input capacitor
10 μF
CINBSTHF (59)
SWBST decoupling input capacitor
0.1 μF
COSWBST (59)
SWBST output capacitor
LSBST
SWBST inductor
DBST
SWBST boost diode
2 x 22 μF
2.2 μH
1.0 A, 20 V Schottky
Notes
59. Use X5R or X7R capacitors.
PF3000
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47
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.3.10 LDO Regulators Description
This section describes the LDO regulators provided by the PF3000. All regulators use the main bandgap as reference. When a regulator
is disabled, the output is discharged by an internal pull-down resistor.
VINx
VINx
VREF
_
VLDOxEN
+
VLDOxLPWR
VLDOx
VLDOx
2
IC
Interface
CLDOx
VLDOx
Discharge
Figure 13. General LDO block diagram
6.3.10.1
External components
Table 61 lists the typical component values for the general purpose LDO regulators.
Table 61. LDO External Components
Regulator
Output capacitor (μF)(60)
VLDO1
2.2
VLDO2
4.7
VLDO3
2.2
VLDO4
4.7
V33
4.7
VCC_SD
2.2
Notes
60. Use X5R/X7R ceramic capacitors.
6.3.10.2
Current limit protection
All the LDO regulators in the PF3000 have current limit protection. In the event of an overload condition, the regulators transitions from a
voltage regulator to a current regulator that regulates output current per the current limit threshold.
Additionally, if the REGSCPEN bit in Table 124 is set, the LDO is turned off if the current limit event lasts for more than 8.0 ms. The LDO
is disabled by resetting its VLDOxEN bit, while at the same time, an interrupt VLDOxFAULTI is generated to flag the fault to the system
processor. The VLDOxFAULTI interrupt is maskable through the VLDOxFAULTM mask bit. By default, the REGSCPEN is not set;
therefore, at start-up none of the regulators is disabled if an overloaded condition occurs. A fault interrupt, VLDOxFAULTI, is generated in
an overload condition regardless of the state of the REGSCPEN bit.
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NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.3.10.3
LDO voltage control
Each LDO is fully controlled through its respective VLDOxCTL register. This register enables the user to set the LDO output voltage
according toTable 62 for VLDO1 and VLDO2; and uses the voltage set point on Table 63 for VLDO3 and VLDO4. Table 64 lists the voltage
set points for the V33 LDO and Table 65 provides the output voltage set points for the VCC_SD LDO based on SD_VSEL control signal.
During power-up, contents of the OTP_VLDO_VOLT register is copied to the VLDOxCTL registers.
Table 62. VLDO1, VLDO2 output voltage configuration
VLDO1[3:0]
VLDO2[3:0]
VLDO1 Output (V)
VLDO2 Output (V)
0000
1.80
0.80
0001
1.90
0.85
0010
2.00
0.90
0011
2.10
0.95
0100
2.20
1.00
0101
2.30
1.05
0110
2.40
1.10
0111
2.50
1.15
1000
2.60
1.20
1001
2.70
1.25
1010
2.80
1.30
1011
2.90
1.35
1100
3.00
1.40
1101
3.10
1.45
1110
3.20
1.50
1111
3.30
1.55
Table 63. VLDO3, VLDO4 output voltage configuration
VLDO3[3:0]
VLDO4[3:0]
VLDO3 or VLDO4 output (V)
0000
1.80
0001
1.90
0010
2.00
0011
2.10
0100
2.20
0101
2.30
0110
2.40
0111
2.50
1000
2.60
1001
2.70
1010
2.80
1011
2.90
1100
3.00
1101
3.10
1110
3.20
1111
3.30
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FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 64. V33 output voltage configuration
V33[1:0]
V33 Output (V)
00
2.85
01
3.00
10
3.15
11
3.30
Table 65. VCC_SD output voltage configuration
VCC_SD[1:0]
VCC_SD output (V)
VSD_VSEL= 0
VCC_SD output (V)
VSD_VSEL= 1
00
2.85
1.80
01
3.00
1.80
10
3.15
1.80
11
3.30
1.85
Along with the output voltage configuration, the LDOs can be enabled or disabled at anytime during normal mode operation, as well as
programmed to stay “ON” or be disabled when the PMIC enters standby mode. Each regulator has associated I2C bits for this. Table 66
presents a summary of all valid combinations of the control bits on VLDOxCTL register and the expected behavior of the LDO output.
Table 66. LDO control
VLDOxEN/
V33EN/
VCC_SDEN
VLDOxSTBY/
V33STBY/
VCC_SDSTBY
0
X
X
Off
1
0
X
On
1
1
0
On
1
1
1
Off
STANDBY (61)
VLDOxOUT/
V33OUT/
VCC_SDOUT
Notes
61. STANDBY refers to a standby event as described earlier.
6.3.11 VSNVS LDO/switch
VSNVS powers the low-power, SNVS/RTC domain on the processor. It derives its power from either VIN, or coin cell, and cannot be
disabled. When powered by both, VIN takes precedence when above the appropriate comparator threshold. When powered by VIN,
VSNVS is an LDO capable of supplying 3.0 V. When powered by coin cell, the VSNVS output tracks the coin cell voltage by means of a
switch, whose maximum resistance is 100 Ω. In this case, the VSNVS voltage is simply the coin cell voltage minus the voltage drop across
the switch, which is 100 mV at a rated maximum load current of 1000 μA.
When the coin cell is applied for the very first time, VSNVS outputs 1.0 V. Only when VIN is applied thereafter does VSNVS transition to its
default value. Upon subsequent removal of VIN, with the coin cell attached, VSNVS changes configuration from an LDO to a switch,
provided certain conditions are met as described in Table 67.
PF3000
50
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
PF3000
VIN
VIN
VTLI
2.25 V
(VTL0) 4.5 VV
4.5
LDO /SWITCH
In pu t
Se nse /
Sel ecto r
LICELL
Charger
VREF
LDO\
_
+
Coin Cell
1.8 - 3.3 V
Z
VSNVS
2
I C In terface
Figure 14. VSNVS supply switch architecture
Table 67 provides a summary of the VSNVS operation at different input voltage VIN and with or without coin cell connected to the system.
Table 67. SNVS modes of operation
VSNVSVOLT[2:0]
VIN
MODE
110
> VTH1
VIN LDO 3.0 V
110
< VTL1
Coin cell switch
6.3.11.1
VSNVS control
The VSNVS output level is configured through the VSNVSVOLT[2:0] bits on VSNVSCTL register as shown in table Table 68.
Table 68. Register VSNVSCTL - ADDR 0x6B
Name
Bit #
R/W
Default
VSNVSVOLT
2:0
R/W
0b000
Unused
7:3
–
0b00000
Description
Configures VSNVS output voltage.(62)
000 = RSVD
001 = RSVD
010 = RSVD
011 = RSVD
100 = RSVD
101 = RSVD
110 = 3.0 V (default)
111 = RSVD
Unused
Notes
62. Only valid when a valid input voltage is present.
6.3.11.2
VSNVS external components
Table 69. VSNVS external components
Capacitor
Value (μF)
VSNVS
0.47
PF3000
NXP Semiconductors
51
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.3.11.3
Coin cell battery backup
The LICELL pin provides for a connection of a coin cell backup battery or a “super” capacitor. If the voltage at VIN goes below the VIN
threshold (VTL1), contact-bounced, or removed, the coin cell maintained logic is powered by the voltage applied to LICELL. The supply
for internal logic and the VSNVS rail switches over to the LICELL pin when VIN goes below VTL1, even in the absence of a voltage at the
LICELL pin, resulting in clearing of memory and turning off VSNVS. Applications concerned about this behavior can tie the LICELL pin to
any system voltage between 1.8 V and 3.0 V. A 0.47 μF capacitor should be placed from LICELL to ground under all circumstances.
6.3.11.4
Coin cell charger control
The coin cell charger circuit functions as a current-limited voltage source, resulting in the CC/CV taper characteristic typically used for
rechargeable Lithium-Ion batteries. The coin cell charger is enabled via the COINCHEN bit while the coin cell voltage is programmable
through the VCOIN[2:0] bits on register COINCTL on Table 70. The coin cell charger voltage is programmable. In the ON state, the charger
current is fixed at ICOINHI. In sleep and standby modes, the charger current is reduced to a typical 10 μA. In the OFF state, coin cell
charging is not available as the main battery could be depleted unnecessarily. The coin cell charging is stopped when VIN is below UVDET.
Table 70. Coin cell charger voltage
VCOIN[2:0]
VCOIN (V) (63)
000
2.50
001
2.70
010
2.80
011
2.90
100
3.00
101
3.10
110
3.20
111
3.30
Notes
63. Coin cell voltages selected based on the type of LICELL used on the system.
Table 71. Register COINCTL - ADDR 0x1A
Name
Bit #
R/W
Default
VCOIN
2:0
R/W
0x00
Coin cell charger output voltage selection.
See Table 70 for all options selectable through these bits.
COINCHEN
3
R/W
0x00
Enable or disable the coin cell charger
Unused
7:4
–
0x00
Unused
6.3.11.5
Description
External components
Table 72. Coin cell charger external components
Component
LICELL bypass capacitor
Value
Units
100
nF
PF3000
52
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.4
Power dissipation
During operation, the temperature of the die should not exceed the operating junction temperature noted in Table 4. To optimize the
thermal management and to avoid overheating, the PF3000 provides thermal protection. An internal comparator monitors the die
temperature. Interrupts THERM110, THERM120, THERM125, and THERM130 is generated when the respective thresholds specified in
Table 73 are crossed in either direction. The temperature range can be determined by reading the THERMxxxS bits in register
INTSENSE0.
In the event of excessive power dissipation, thermal protection circuitry shuts down the PF3000. This thermal protection acts above the
thermal protection threshold listed in Table 73. To avoid any unwanted power downs resulting from internal noise, the protection is
debounced for 8.0 ms. This protection should be considered as a fail-safe mechanism and therefore the system should be configured
such that this protection is not tripped under normal conditions.
Table 73. Thermal protection thresholds
Parameter
Min.
Typ.
Max.
Units
Thermal 110 °C threshold (THERM110)
100
110
120
°C
Thermal 120 °C threshold (THERM120)
110
120
130
°C
Thermal 125 °C threshold (THERM125)
115
125
135
°C
Thermal 130 °C threshold (THERM130)
120
130
140
°C
Thermal warning hysteresis
2.0
–
4.0
°C
Thermal protection threshold
130
140
150
°C
PF3000
NXP Semiconductors
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FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.5
Modes of operation
6.5.1
State diagram
The operation of the PF3000 can be reduced to five states, or modes: ON, OFF, Sleep, Standby, and Coin Cell. Figure 15 shows the state
diagram of the PF3000, along with the conditions to enter and exit from each state.
Coin Cell
VIN < UVDET
VIN < UVDET
VIN > UVDET
PWRON=0 held >= 4sec
Any SWxOMODE bits=1
& PWRONRSTEN = 1
(PWRON_CFG=1)
Thermal shudown
Sleep/LPSR
VIN < UVDET
(LPSR if
VLDO1OMODE &
VLDO3OMODE =1)
VIN < UVDET
PWRON = 0
Any SWxOMODE bits=1
(PWRON_CFG=0)
Or
PWRON=0 held >= 4sec
Any SWxOMODE bits=1
& PWRONRSTEN = 1
(PWRON_CFG=1)
PWRON = 0
Any SWxOMODE bits=1
(PWRON_CFG=0)
Or
PWRON=0 held >= 4sec
Any SWxOMODE bits=1
& PWRONRSTEN = 1
(PWRON_CFG=1)
PWRON=1
& VIN > UVDET
(PWRON_CFG =0)
Or
PWRON= 0 < 4sec
& VIN > UVDET
(PWRON_CFG=1)
OFF
PWRON=1
& VIN > UVDET
(PWRON_CFG =0)
Or
PWRON= 0 < 4sec
& VIN > UVDET
(PWRON_CFG=1)
PWRON = 0
All SWxOMODE bits= 0
(PWRON_CFG = 0)
Or
PWRON = 0 held >=4 sec
All SWxOMODE bits= 0
& PWRONRSTEN = 1
(PWRON_CFG = 1)
ON
Thermal shudown
STANDBY asserted
STANDBY de-asserted
PWRON = 0
All SWxOMODE bits= 0
(PWRON_CFG = 0)
Or
PWRON = 0 held >=4 sec
All SWxOMODE bits= 0
& PWRONRSTEN = 1
(PWRON_CFG = 1)
Standby
(Suspend)
Thermal shudown
* VIN should be above UVDET to allow a power up and VIN must have crossed above the UVDET rising threshold without decaying below the
UVDET falling threshold.
Figure 15. State diagram
To complement the state diagram in Figure 15, a description of the states is provided in following sections. Note that VIN must exceed the
rising UVDET threshold to allow a power up. Refer to Table 32 for the UVDET thresholds. Additionally, I2C control is not possible in the
coin cell mode and the interrupt signal, INTB, is only active in sleep, standby, and ON states.
6.5.1.1
ON mode
The PF3000 enters the On mode after a turn-on event. RESETBMCU is de-asserted, and pulled high via an external pull-up resistor, in
this mode of operation. To enter the On mode, VIN voltage must surpass the rising UVDET threshold and PWRON must be asserted. From
the On mode, when the voltage at VIN drops below the undervoltage falling threshold, UVDET, the state machine transitions to the coin
cell mode.
PF3000
54
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.5.1.2
OFF mode
The PF3000 enters the Off mode after a turn-off event. Only VCOREDIG and VSNVS are powered in the mode of operation. To exit the
Off mode, a valid turn-on event is required. RESETBMCU is asserted, LOW, in this mode. Turn off events can be achieved using the
PWRON pin, thermal protection, as described below.
6.5.1.3
PWRON pin
The PWRON pin is used to power off the PF3000. The PWRON pin can be configured with OTP to power off the PMIC under the following
two conditions:
1. PWRON_CFG bit = 0, SWxOMODE bit = 0 and PWRON pin is low.
2. PWRON_CFG bit = 1, SWxOMODE bit = 0, PWRONRSTEN = 1 and PWRON is held low for longer than 4.0 seconds.
Alternatively, the system can be configured to restart automatically by setting the RESTARTEN bit.
6.5.1.4
Thermal protection
If the die temperature surpasses a given threshold, the thermal protection circuit powers off the PMIC to avoid damage. A turn-on event
does not power on the PMIC while it is in thermal protection. The part remains in Off mode until the die temperature decreases below a
given threshold. See Power dissipation section for more detailed information.
6.5.1.5
Standby mode
• Depending on STANDBY pin configuration, Standby is entered when the STANDBY pin is asserted. This is typically used for low-power
mode of operation.
• When STANDBY is de-asserted, standby mode is exited.
A product may be designed to go into a low-power mode after periods of inactivity. The STANDBY pin is provided for board level control
of going in and out of such deep sleep modes (DSM). When a product is in DSM, it may be able to reduce the overall platform current by
lowering the regulator output voltage, changing the operating mode of the regulators or disabling some regulators. The configuration of
the regulators in standby is pre-programmed through the I2C interface. Note that the STANDBY pin is programmable for Active High or
Active Low polarity, and that decoding of a standby event takes into account the programmed input polarity as shown in Table 74. When
the PF3000 is powered up first, regulator settings for the standby mode are mirrored from the regulator settings for the ON mode. To
change the STANDBY pin polarity to Active Low, set the STANDBYINV bit via software first, and then change the regulator settings for
standby mode as required. For simplicity, STANDBY is generally be referred to as active high throughout this document.
Table 74. Standby pin and polarity control
STANDBY (Pin) (65)
STANDBYINV (I2C bit) (66)
STANDBY Control (64)
0
0
0
0
1
1
1
0
1
1
1
0
Notes
64. STANDBY = 0: System is not in standby, STANDBY = 1: system is in standby
65. The state of the STANDBY pin only has influence in On mode.
66. Bit 6 in Power Control register (ADDR - 0x1B)
Since STANDBY pin activity is driven asynchronously to the system, a finite time is required for the internal logic to qualify and respond
to the pin level changes. A programmable delay is provided to hold off the system response to a standby event. This allows the processor
and peripherals some time after a standby instruction has been received to terminate processes to facilitate seamless entering into
standby mode.
When enabled (STBYDLY = 01, 10, or 11) per Table 75, STBYDLY delays the standby initiated response for the entire IC, until the
STBYDLY counter expires. An allowance should be made for three additional 32 kHz cycles required to synchronize the standby event.
PF3000
NXP Semiconductors
55
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 75. STANDBY delay - initiated response
STBYDLY[1:0] (67)
Function
00
No delay
01
One 32 kHz period (default)
10
Two 32 kHz periods
11
Three 32 kHz periods
Notes
67. Bits [5:4] in Power Control register (ADDR - 0x1B)
6.5.1.6
Sleep/LPSR mode
• Depending on PWRON pin configuration, sleep mode is entered when PWRON is de-asserted and SWxOMODE bit is set.
• To exit sleep mode, assert the PWRON pin.
In the sleep mode, the regulator uses the set point as programmed by SW1xOFF[3:0] for SW1A/B and by SWxOFF[2:0] for SW2 and SW3.
The activated regulators maintains settings for this mode and voltage until the next turn-on event. Table 76 shows the control bits in sleep
mode. During sleep mode, interrupts are active and the INTB pin reports any unmasked fault event. If LPSR is activated by requesting
VDD_LPSR and VCC_GPIO to stay ON, LDO1 and LDO3 enables in low-power mode.
Table 76. Regulator mode control
SWxOMODE
Off operational mode (sleep) (68)
0
Off
1
PFM
Notes
68. For sleep mode, activated switching regulators, should use the Off mode
set point as programmed by SW1xOFF[4:0] for SW1A/B and
SW2OFF[2:0] for SW2, and SW3OFF[3:0] for SW3.
6.5.1.7
Coin cell mode
In the Coin Cell state, the coin cell is the only valid power source to the PMIC. No turn-on event is accepted in the Coin Cell state. Transition
to the OFF state requires that VIN surpasses UVDET threshold. RESETBMCU is held low in this mode. If the coin cell is depleted, a
complete system reset occurs. At the next application of power and the detection of a turn-on event, the system re-initializes with all I2C
bits including, those that reset on COINPORB are restored to their default states.
PF3000
56
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.5.2
State machine flow summary
Table 77 provides a summary matrix of the PF3000 flow diagram to show the conditions needed to transition from one state to another.
Table 77. State machine flow summary
Next state
STATE
OFF
Coin cell
Sleep
Standby
ON
OFF
X
VIN < UVDET
X
X
PWRON_CFG = 0
PWRON = 1 & VIN > UVDET
or
PWRON_CFG = 1
PWRON = 0 < 4.0 s
& VIN > UNDET
Coin cell
VIN > UVDET
X
X
X
X
X
PWRON_CFG = 0
PWRON = 1 & VIN > UVDET
or
PWRON_CFG = 1
PWRON = 0 < 4.0 s &
VIN > UNDET
VIN < UVDET
PWRON_CFG = 0
PWRON = 0
Any SWxOMODE = 1
or
PWRON_CFG = 1
PWRON = 0 ≥ 4.0 s
Any SWxOMODE = 1 &
PWRONRSTEN = 1
X
Standby de-asserted
VIN < UVDET
PWRON_CFG = 0
PWRON = 0
Any SWxOMODE = 1
or
PWRON_CFG = 1
PWRON = 0 ≥ 4.0 s
Any SWxOMODE = 1 &
PWRONRSTEN = 1
Standby asserted
X
Initial state
Sleep/
LPSR
Thermal shutdown
X
PWRON_CFG = 1
PWRON = 0 ≥ 4.0 s
Any SWxOMODE = 1 &
PWRONRSTEN = 1
LPSR (LDO1 & LDO3 or
V33 Enabled) if
VLDO1OMODE =1
& VLDO3OMODE=1 or
V33OMODE=1
VIN < UVDET
Thermal shutdown
Standby
PWRON_CFG = 0
PWRON = 0
All SWxOMODE = 0
or
PWRON_CFG = 1
PWRON = 0 ≥ 4.0 s
All SWxOMODE = 0 &
PWRONRSTEN = 1
Thermal shutdown
ON
PWRON_CFG = 0
PWRON = 0
All SWxOMODE = 0
or
PWRON_CFG = 1
PWRON = 0 ≥ 4.0 s
All SWxOMODE = 0 &
PWRONRSTEN = 1
PF3000
NXP Semiconductors
57
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.5.3
Performance characteristics curves
(VIN = 3.6 V, SW1AOUT = 1.0 V; SW1BOUT = 1.0 V, SW2OUT = 1.8 V, SW3OUT = 1 V, SWBSTOUT = 5.0 V Switching frequency = 2.0 MHz,
Mode = APS; LDO1OUT = 1.8 V, LDO2OUT = 1.0 V, LDO3OUT = 1.8 V, LDO4OUT = 1.8 V, V33OUT = 3.3 V, VCC_SDOUT = 3.3 V, unless
otherwise noted)
Figure 18. Load transient response - LDO2
Figure 16. Typical startup waveforms
Figure 19. Load transient response - LDO4 and V33
Figure 17. Load transient response - LDO1, LDO3 and
VCC_SD
PF3000
58
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Figure 21. Load transient response - SWBST
Figure 22. Switching frequency vs. temperature
Figure 20. Load transient response - buck regulators
Figure 23. Quiescent current - buck regulators in APS mode
PF3000
NXP Semiconductors
59
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
31
29
SW1A, SW1B
Quiescent current (uA)
27
25
23
SW2, Vout = 3.3 V
21
SW3
19
SW2, Vout = 1.5 V
17
15
-60
-40
-20
0
20
40
60
80
100
120
140
Temperature (Ԩ)
Figure 24. Quiescent current - buck regulators in PFM mode
Figure 27. Load regulation - LDOs
Figure 25. Quiescent current - LDOs
Figure 28. SW1A efficiency - APS and PWM modes
Figure 26. Load regulation - buck regulators
Figure 29. SW1A efficiency - PFM mode
PF3000
60
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Figure 30. Dropout voltage - VLDO1, VLDO3, VCC_SD VOUT = 3.3 V
Figure 32. Dropout voltage - VLDO4, V33 - VOUT = 3.3 V
Figure 31. Dropout voltage - VLDO1, VLDO3,
VCC_SD - VOUT = 1.8 V
Figure 33. Dropout voltage - VLDO4 - VOUT = 1.8 V
6.6
Control Interface I2C block description
The PF3000 contains an I2C interface port which allows access by a processor, or any I2C master, to the register set. Via these registers
the resources of the IC can be controlled. The registers also provide status information about how the IC is operating.
The SCL and SDA lines should be routed away from noisy signals and planes to minimize noise pick up. To prevent reflections in the SCL
and SDA traces from creating false pulses, the rise and fall times of the SCL and SDA signals must be greater than 20 ns. This can be
accomplished by reducing the drive strength of the I2C master via software. It is recommended to use a drive strength of 80 Ω or higher
to increase the edge times. Alternatively, this can be accomplished by using small capacitors from SCL and SDA to ground. For example,
use 5.1 pF capacitors from SCL and SDA to ground for bus pull-up resistors of 4.8 kΩ.
6.6.1
I2C device ID
I2C interface protocol requires a device ID for addressing the target IC on a multi-device bus. The I2C address is set to 0x08.
PF3000
NXP Semiconductors
61
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.2
I2C operation
The I2C mode of the interface is implemented generally following the fast mode definition which supports up to 400 kbits/s operation
(exceptions to the standard are noted to be 7-bit only addressing and no support for general call addressing.)
The I²C interface is configured as “Slave”.
Timing diagrams, electrical specifications, and further details can be found in the I2C specification, which is available for download at:
http://www.nxp.com/acrobat_download/literature/9398/39340011.pdf
I2C read operations are also performed in byte increments separated by an ACK. Read operations also begin with the MSB and each byte
is sent out unless a STOP command or NACK is received prior to completion.
PF3000 only supports single-byte I2C transactions for read and write. The host initiates and terminates all communication. The host sends
a master command packet after driving the start condition. The device responds to the host if the master command packet contains the
corresponding slave address. In the following examples, the device is shown always responding with an ACK to transmissions from the
host. If at any time a NACK is received, the host should terminate the current transaction and retry the transaction.
PF3000 uses the “repeated start” operation for reads as shown in Figure 35
.
Figure 34. Data transfer on the I2C bus
Figure 35. Read operation
PF3000
62
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.3
Interrupt handling
The system is informed about important events based on interrupts. Unmasked interrupt events are signaled to the processor by driving
the INTB pin low. Each interrupt is latched so that even if the interrupt source becomes inactive, the interrupt remains set until cleared.
Each interrupt can be cleared by writing a “1” to the appropriate bit in the Interrupt Status register; this causes the INTB pin to go high. If
there are multiple interrupt bits set the INTB pin remains low until all are either masked or cleared. If a new interrupt occurs while the
processor clears an existing interrupt bit, the INTB pin remains low.
Each interrupt can be masked by setting the corresponding mask bit to a 1. As a result, when a masked interrupt bit goes high, the INTB
pin does not go low. A masked interrupt can still be read from the Interrupt Status register. This gives the processor the option of polling
for status from the IC. The IC powers up with all interrupts masked, so the processor must initially poll the device to determine if any
interrupts are active. Alternatively, the processor can unmask the interrupt bits of interest. If a masked interrupt bit was already high, the
INTB pin goes low after unmasking.
The sense registers contain status and input sense bits so the system processor can poll the current state of interrupt sources. They are
read only, and not latched or clearable. Interrupts generated by external events are debounced; therefore, the event needs to be stable
throughout the debounce period before an interrupt is generated. Nominal debounce periods for each event are documented in the INT
summary Table 78. Due to the asynchronous nature of the debounce timer, the effective debounce time can vary slightly.
6.6.4
Interrupt bit summary
Table 78 summarizes all interrupt, mask, and sense bits associated with INTB control. For more detailed behavioral descriptions, refer to
the related chapters.
Table 78. Interrupt, mask, and sense bits
Interrupt
Mask
Sense
LOWVINI
LOWVINM
LOWVINS
PWRONI
PWRONM
PWRONS
Purpose
Trigger
Debounce time (ms)
Low input voltage detect
Sense is 1 if below 2.70 V threshold
H to L
3.9 (69)
Power on button event
H to L
31.25 (69)
Sense is 1 if PWRON is high.
L to H
31.25
Dual
3.9
THERM110
THERM110M
THERM110S
Thermal 110 °C threshold
Sense is 1 if above threshold
THERM120
THERM120M
THERM120S
Thermal 120 °C threshold
Sense is 1 if above threshold
Dual
3.9
THERM125
THERM125M
THERM125S
Thermal 125 °C threshold
Sense is 1 if above threshold
Dual
3.9
THERM130
THERM130M
THERM130S
Thermal 130 °C threshold
Sense is 1 if above threshold
Dual
3.9
SW1AFAULTI
SW1AFAULTM
SW1AFAULTS
Regulator 1A overcurrent limit
Sense is 1 if above current limit
L to H
8.0
SW1BFAULTI
SW1BFAULTM
SW1BFAULTS
Regulator 1C overcurrent limit
Sense is 1 if above current limit
L to H
8.0
SW2FAULTI
SW2FAULTM
SW2FAULTS
Regulator 2 overcurrent limit
Sense is 1 if above current limit
L to H
8.0
SW3FAULTI
SW3FAULTM
SW3FAULTS
Regulator 3 overcurrent limit
Sense is 1 if above current limit
L to H
8.0
SWBSTFAULTI
SWBSTFAULTM
SWBSTFAULTS
SWBST overcurrent limit
Sense is 1 if above current limit
L to H
8.0
VLDO1FAULTI
VLDO1FAULTM
VLDO1FAULTS
VLDO1 overcurrent limit
Sense is 1 if above current limit
L to H
8.0
VLDO2FAULTI
VLDO2FAULTM
VLDO2FAULTS
VLDO2 overcurrent limit
Sense is 1 if above current limit
L to H
8.0
VCC_SDFAULTI
VCC_SDFAULTM
VCC_SDFAULTS
VCC_SD overcurrent limit
Sense is 1 if above current limit
L to H
8.0
PF3000
NXP Semiconductors
63
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 78. Interrupt, mask, and sense bits (continued)
Interrupt
Mask
Sense
Purpose
Trigger
Debounce time (ms)
V33FAULTI
V33FAULTM
V33FAULTS
V33 overcurrent limit
Sense is 1 if above current limit
L to H
8.0
VLDO3FAULTI
VLDO3FAULTM
VLDO1FAULTS
VLDO3 overcurrent limit
Sense is 1 if above current limit
L to H
8.0
VLDO4FAULTI
VLDO4FAULTM
VLDO4FAULTS
VLDO4 overcurrent limit
Sense is 1 if above current limit
L to H
8.0
OTP_ECCI
OTP_ECCM
OTP_ECCS
1 or 2 bit error detected in OTP registers
Sense is 1 if error detected
L to H
-
OTP_AUTO_BLOW OTP_AUTO_BLOWM
OTP_AUTO_BLOWS
Interrupt to indicate completion of fuse
auto blow
L to H
-
VPWROVI
VPWROVS
VPWR pin overvoltage interrupt
L to H
0.122
VPWROVM
Notes
69. Debounce timing for the falling edge can be extended with PWRONDBNC[1:0].
A full description of all interrupt, mask, and sense registers is provided in Table 79 to Table 90.
Table 79. Register INTSTAT0 - ADDR 0x05
Bit #
R/W
Default
PWRONI
Name
0
R/W1C
0
Power on interrupt bit
LOWVINI
1
R/W1C
0
Low-voltage interrupt bit
THERM110I
2
R/W1C
0
110 °C Thermal interrupt bit
THERM120I
3
R/W1C
0
120 °C Thermal interrupt bit
THERM125I
4
R/W1C
0
125 °C Thermal interrupt bit
THERM130I
5
R/W1C
0
130 °C Thermal interrupt bit
7:6
–
0b00
Unused
Description
Unused
Table 80. Register INTMASK0 - ADDR 0x06
Name
Bit #
R/W
Default
PWRONM
0
R/W1C
0
Power on interrupt mask bit
LOWVINM
1
R/W1C
0
Low-voltage interrupt mask bit
THERM110M
2
R/W1C
0
110 °C thermal interrupt mask bit
THERM120M
3
R/W1C
0
120 °C thermal interrupt mask bit
THERM125M
4
R/W1C
0
125 °C thermal interrupt mask bit
THERM130M
5
R/W1C
0
130 °C thermal interrupt mask bit
7:6
–
0b00
Unused
Description
Unused
PF3000
64
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 81. Register INTSENSE0 - ADDR 0x07
Name
Bit #
R/W
Default
Description
PWRONS
0
R
0
Power on sense bit
0 = PWRON low
1 = PWRON high
LOWVINS
1
R
0
Low-voltage sense bit
0 = VIN > 2.7 V
1 = VIN ≤ 2.7 V
THERM110S
2
R
0
110 °C thermal sense bit
0 = Below threshold
1 = Above threshold
THERM120S
3
R
0
120 °C thermal sense bit
0 = Below threshold
1 = Above threshold
THERM125S
4
R
0
125 °C thermal sense bit
0 = Below threshold
1 = Above threshold
THERM130S
5
R
0
130 °C thermal sense bit
0 = Below threshold
1 = Above threshold
ICTESTS
6
R
0
0 = ICTEST pin is grounded
1 = ICTEST to VCOREDIG or greater
VDDOTPS
7
R
0
Additional VDDOTP voltage sense pin
0 = VDDOTP grounded
1 = VDDOTP to VCOREDIG or greater
Table 82. Register INTSTAT1 - ADDR 0x08
Name
Bit #
R/W
Default
Description
SW1AFAULTI
0
R/W1C
0
SW1A overcurrent interrupt bit
SW1BFAULTI
1
R/W1C
0
SW1B overcurrent interrupt bit
Unused
2
R/W1C
0
Unused
SW2FAULTI
3
R/W1C
0
SW2 Overcurrent interrupt bit
SW3FAULTI
4
R/W1C
0
SW3 Overcurrent interrupt bit
Unused
5
R/W1C
0
Unused
Unused
6
R/W1C
0
Unused
Unused
7
–
0
Unused
Table 83. Register INTMASK1 - ADDR 0x09
Bit #
R/W
Default
SW1AFAULTM
Name
0
R/W
1
SW1A overcurrent interrupt mask bit
Description
SW1BFAULTM
1
R/W
1
SW1B overcurrent interrupt mask bit
Unused
2
R/W
1
Unused
SW2FAULTM
3
R/W
1
SW2 overcurrent interrupt mask bit
SW3FAULTM
4
R/W
1
SW3 overcurrent interrupt mask bit
Unused
5
R/W
1
Unused
Unused
6
R/W
1
Unused
Unused
7
–
0
Unused
PF3000
NXP Semiconductors
65
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 84. Register INTSENSE1 - ADDR 0x0A
Name
Bit #
R/W
Default
Description
SW1AFAULTS
0
R
0
SW1A overcurrent sense bit
0 = Normal operation
1 = Above current limit
Unused
1
R
0
Unused
SW1BFAULTS
2
R
0
SW1B overcurrent sense bit
0 = Normal operation
1 = Above current limit
SW2FAULTS
3
R
0
SW2 overcurrent sense bit
0 = Normal operation
1 = Above current limit
SW3FAULTS
4
R
0
SW3 overcurrent sense bit
0 = Normal operation
1 = Above current limit
Unused
5
R
0
Unused
Unused
6
R
0
Unused
Unused
7
–
0
Unused
Table 85. Register INTSTAT3 - ADDR 0x0E
Name
Bit #
R/W
SWBSTFAULTI
0
R/W1C
0
Unused
1
–
0b0
Unused
0b0
High when overvoltage event is detected in the
front-end LDO circuit. This bit defaults to 0b1
when VPWR is grounded and the VIN path is
used to power the PF3000.
VPWROVI
Unused
2
R/W1C
Default
Description
SWBST overcurrent limit interrupt bit
5:3
–
0b0
Unused
OTP AUTO BLOW
6
R/W1C
0b0
High after auto fuse blow sequence is completed
OTP_ECCI
7
R/W1C
0
OTP error interrupt bit
Table 86. Register INTMASK3 - ADDR 0x0F
Name
Bit #
R/W
Default
SWBSTFAULTM
0
R/W
1
SWBST overcurrent limit interrupt mask bit
Unused
1
–
0
Unused
VPWROVM
2
R/W
1
VPWR overvoltage interrupt mask bit
Unused
Description
5:3
–
0b000
OTP_AUTO_BLOW_
DONE_M
Unused
6
R/W
1
OTP auto blow mask bit
OTP_ECCM
7
R/W
1
OTP error interrupt mask bit
PF3000
66
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 87. Register INTSENSE3 - ADDR 0x10
Name
Bit #
R/W
Default
SWBSTFAULTS
0
R
0
Unused
1
–
0b0
VPWROVS
2
R
0
5:3
–
0b000
OTP_AUTO_BLOW_
DONE_S
6
R
0
OTP auto blow sense bit. This bit is high while
the auto blow sequence is running. Do not read/
write the OTP TBB registers while this bit is 1.
OTP_ECCS
7
R
0
OTP error sense bit
0 = No error detected
1 = OTP error detected
Unused
Description
SWBST overcurrent limit sense bit
0 = Normal operation
1 = Above current limit
Unused
VPWR overvoltage interrupt sense bit
Unused
Table 88. Register INTSTAT4 - ADDR 0x11
Name
Bit #
R/W
Default
VLDO1FAULTI
0
R/W1C
0
VLDO1 overcurrent interrupt bit
VLDO2FAULTI
1
R/W1C
0
VLDO2 overcurrent interrupt bit
VCC_SDFAULTI
2
R/W1C
0
VCC_SD overcurrent interrupt bit
V33FAULTI
3
R/W1C
0
V33 overcurrent interrupt bit
VLDO3FAULTI
4
R/W1C
0
VLDO3 overcurrent interrupt bit
5
R/W1C
0
VLDO4 overcurrent interrupt bit
7:6
–
0b00
VLDO4FAULTI
Unused
Description
Unused
Table 89. Register INTMASK4 - ADDR 0x12
Name
Bit #
R/W
Default
VLDO1FAULTM
0
R/W
1
VLDO1 overcurrent interrupt mask bit
VLDO2FAULTM
1
R/W
1
VLDO2 overcurrent interrupt mask bit
VCC_SDFAULTM
2
R/W
1
VCC_SD overcurrent interrupt mask bit
V33FAULTM
3
R/W
1
V33 overcurrent interrupt mask bit
VLDO3FAULTM
4
R/W
1
VLDO3 overcurrent interrupt mask bit
5
R/W
1
VLDO4 overcurrent interrupt mask bit
7:6
–
0b00
VLDO4FAULTM
Unused
Description
Unused
Table 90. Register INTSENSE4 - ADDR 0x13
Name
Bit #
R/W
Default
Description
VLDO1FAULTS
0
R
0
VLDO1 overcurrent sense bit
0 = Normal operation
1 = Above current limit
VLDO2FAULTS
1
R
0
VLDO2 overcurrent sense bit
0 = Normal operation
1 = Above current limit
VCC_SDFAULTS
2
R
0
VCC_SD overcurrent sense bit
0 = Normal operation
1 = Above current limit
PF3000
NXP Semiconductors
67
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 90. Register INTSENSE4 - ADDR 0x13 (continued)
Name
Bit #
R/W
Default
V33FAULTS
3
R
0
V33 overcurrent sense bit
0 = Normal operation
1 = Above current limit
VLDO3FAULTS
4
R
0
VLDO3 overcurrent sense bit
0 = Normal operation
1 = Above current limit
VLDO4FAULTS
5
R
0
VLDO4 overcurrent sense bit
0 = Normal operation
1 = Above current limit
7:6
–
0b00
Unused
6.6.5
Description
Unused
Specific registers
6.6.5.1
IC and version identification
The IC and other version details can be read via identification bits. These are hard-wired on the chip and described in Table 91 to Table 93.
Table 91. Register DEVICEID - ADDR 0x00
Name
Bit #
R/W
Default
Description
DEVICEID
3:0
R
0x0
0000 = PF3000
FAMILY
7:4
R
0x3
0011 = PF3000
Table 92. Register SILICON REV- ADDR 0x03
Name
METAL_LAYER_REV
FULL_LAYER_REV
Bit #
3:0
7:4
R/W
R
R
Default
Description
0x0
Represents the metal mask revision
Pass 0.0 = 0000
…
Pass 0.15 = 1111
0x1
Represents the full mask revision
Pass 1.0 = 0001
…
Pass 15.0 = 1111
Table 93. Register FABID - ADDR 0x04
Name
Bit #
R/W
Default
Description
FIN
1:0
R
0b00
Allows for characterizing different options within
the same reticule
FAB
3:2
R
0b00
Represents the wafer manufacturing facility
Unused
7:4
R
0b0000
Unused
PF3000
68
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.2
Embedded memory
There are four register banks of general purpose embedded memory to store critical data. The data written to MEMA[7:0], MEMB[7:0],
MEMC[7:0], and MEMD[7:0] is maintained by the coin cell when the main battery is deeply discharged, removed, or contact-bounced. The
contents of the embedded memory are reset by COINPORB. The banks can be used for any system need for bit retention with coin cell
backup.
Table 94. Register MEMA ADDR 0x1C
Name
MEMA
Bit #
R/W
Default
7:0
R/W
0x00
Description
Memory bank A
Table 95. Register MEMB ADDR 0x1D
Name
MEMB
Bit #
R/W
Default
7:0
R/W
0x00
Description
Memory bank B
Table 96. Register MEMC ADDR 0x1E
Name
MEMC
Bit #
R/W
Default
7:0
R/W
0x00
Description
Memory bank C
Table 97. Register MEMD ADDR 0x1F
Name
MEMD
6.6.5.3
Bit #
R/W
Default
7:0
R/W
0x00
Description
Memory bank D
Register descriptions
This section describes all the PF3000 registers and their individual bits. Address order is as listed in Register map.
6.6.5.3.1
Interrupt status register 0 (INTSTAT0)
INSTAT0 is one of the four status interrupt registers. This register contains six status flags. Write a logic 1 to clear a flag.
Table 98. Status interrupt register 0 (INTSTAT0)
Access: User read/write (70)
Address: 0x05 functional page
7
6
R
W
Default
0
0
5
4
3
2
1
0
THERM130I
THERM125I
THERM120I
THERM110I
LOWVINI
PWRONI
0
0
0
0
0
0
= Unimplemented or Reserved
Notes
70. Read: Anytime
Write: Anytime
PF3000
NXP Semiconductors
69
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 99. INTSTAT0 field descriptions
Field
Description
5
THERM130I
130 °C Thermal interrupt bit — THERM130I is set to 1 when the THERM130 threshold specified in is crossed in either direction (bidirectional). This flag can only be cleared by writing a 1. Writing a 0 has no effect.
0 Die temperature has not crossed THERM130 threshold.
1 Die temperature has crossed THERM130 threshold.
4
THERM125I
125 °C Thermal interrupt bit — THERM125I is set to 1 when the THERM125 threshold specified in is crossed in either direction (bidirectional). This flag can only be cleared by writing a 1. Writing a 0 has no effect.
0 Die temperature has not crossed THERM125 threshold.
1 Die temperature has crossed THERM125 threshold.
3
THERM120I
120 °C Thermal interrupt bit — THERM120I is set to 1 when the THERM120 threshold specified in is crossed in either direction (bidirectional). This flag can only be cleared by writing a 1. Writing a 0 has no effect.
0 Die temperature has not crossed THERM120 threshold.
1 Die temperature has crossed THERM120 threshold.
110 °C Thermal interrupt bit — THERM110I is set to 1 when the THERM110 threshold specified in
2
THERM110I
is crossed in either direction (bi-directional). This flag can only be cleared by writing a 1. Writing a 0 has no effect.
0 Die temperature has not crossed THERM110 threshold.
1 Die temperature has crossed THERM110 threshold.
1
LOWVINI
Low-voltage interrupt bit — LOWVINI is set to 1 when a low-voltage event occurs on VIN. This flag can only be cleared by writing a
1. Writing a 0 has no effect.
0 VIN > 2.7 V (typical)
1 VIN < 2.7 V (typical)
0
PWRONI
Power on interrupt bit —PWRONI is set to 1 when the turn on event occurs. This flag can only be cleared by writing a 1. Writing a 0
has no effect.
0 Power on has not occurred.
1 Power on has occurred.
6.6.5.3.2
Interrupt status mask register 0 (INTMASK0)
INTMASK0 is the mask register for the status interrupt register INTSTAT0. Write a logic 0 to a bit to unmask the corresponding interrupt.
When unmasked, the corresponding interrupt state is reflected on the INTB pin.
Table 100. Interrupt status mask register 0 (INTMASK0)
Access: User read/write (71)
Address: 0x06 functional page
7
6
R
W
Default
0
0
5
4
3
2
1
0
THERM130M
THERM125M
THERM120M
THERM110M
LOWVINM
PWRONM
1
1
1
1
1
1
= Unimplemented or Reserved
Notes
71. Read: Anytime
Write: Anytime
PF3000
70
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 101. INTMASK0 field descriptions
Field
Description
5
THERM130M
130 °C Thermal interrupt mask bit
0 THERM130I Unmasked
1 THERM130I Masked
4
THERM125M
125 °C Thermal interrupt mask bit
0 THERM125I Unmasked
1 THERM125I Masked
3
THERM120M
120 °C Thermal interrupt mask bit
0 THERM120I Unmasked
1 THERM120I Masked
2
THERM110M
110 °C Thermal interrupt mask bit
0 THERM110I Unmasked
1 THERM110I Masked
1
LOWVINM
Low-voltage interrupt mask bit
0 LOWVINI Unmasked
1 LOWVINI Masked
0
PWRONM
Power on interrupt mask bit
0 PWRONI Unmasked
1 PWRONI Masked
6.6.5.3.3
Interrupt sense register 0 (INTSENSE0)
This register has seven read-only sense bits. These sense bits reflects the actual state of the corresponding function.
Table 102. Interrupt sense register 0 (INTSENSE0)
Access: User read-only (72)
Address: 0x07 functional page
7
R
6
VDDOTPS
5
4
3
2
1
0
THERM130S
THERM125S
THERM120S
THERM110S
LOWVINS
PWRONS
X (75)
X (75)
X (75)
X (75)
X (74)
X (73)
W
Default
X (76)
0
= Unimplemented or Reserved
Notes
72.
73.
74.
75.
76.
Read: Anytime
Default value depends on the initial PWRON pin state.
Default value depends on the initial VIN voltage.
Default value depends on the initial temperature of the die.
Default value depends on the initial VDDOTP pin state.
Table 103. INTSENSE0 field descriptions
Field
7
VDDOTPS
Description
VDDOTP voltage sense bit
0 VDDOTP grounded.
1 VDDOTP to VCOREDIG or greater.
5
THERM130S
130 °C thermal interrupt sense bit
0 Die temperature below THERM130 threshold.
1 Die temperature above THERM130 threshold.
4
THERM125S
125 °C thermal interrupt sense bit
0 Die temperature below THERM125 threshold.
1 Die temperature has crossed THERM125 threshold.
PF3000
NXP Semiconductors
71
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 103. INTSENSE0 field descriptions (continued)
Field
Description
3
THERM120S
120 °C thermal interrupt sense bit
0 Die temperature below THERM120 threshold.
1 Die temperature has crossed THERM120 threshold.
2
THERM110S
110 °C thermal interrupt sense bit
0 Die temperature below THERM110 threshold.
1 Die temperature has crossed THERM110 threshold.
1
LOWVINS
Low-voltage interrupt sense bit
0 VIN > 2.7 V (typical)
1 VIN < 2.7 V (typical)
0
PWRONS
Power on interrupt sense bit
0 PWRON low.
1 PWRON high.
6.6.5.3.4
Interrupt status register 1 (INTSTAT1)
INSTAT1 is one of the four status interrupt registers. This register contains four status flags. Write a logic 1 to clear a flag.
Table 104. Status interrupt register 1 (INTSTAT1)
Access: User read/write (77)
Address: 0x08 functional page
7
6
5
R
W
Default
0
0
0
4
3
SW3FAULTI
SW2FAULTI
0
0
2
0
1
0
SW1BFAULTI
SW1AFAULTI
0
0
= Unimplemented or Reserved
Notes
77. Read: Anytime
Write: Anytime
Table 105. INTSTAT1 field descriptions
Field
Description
4
SW3FAULTI
SW3 overcurrent interrupt bit — SW3FAULTI is set to 1 when the SW3 regulator is in current limit protection. This flag can only be
cleared by writing a 1. Writing a 0 has no effect.
0 SW3 in normal operation
1 SW3 above current limit
3
SW2FAULTI
SW2 overcurrent interrupt bit — SW2FAULTI is set to 1 when the SW2 regulator is in current limit protection. This flag can only be
cleared by writing a 1. Writing a 0 has no effect.
0 SW2 in normal operation
1 SW2 above current limit
1
SW1BFAULTI
SW1B overcurrent interrupt bit — SW1BFAULTI is set to 1 when the SW1B regulator is in current limit protection. This flag can only
be cleared by writing a 1. Writing a 0 has no effect.
0 SW1B in normal operation
1 SW1B above current limit
0
SW1AFAULTI
SW1A overcurrent interrupt bit — SW1AFAULTI is set to 1 when the SW1A regulator is in current limit protection. This flag can only
be cleared by writing a 1. Writing a 0 has no effect.
0 SW1A in normal operation
1 SW1A above current limit
PF3000
72
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.5
Interrupt status mask register 1 (INTMASK1)
INTMASK1 is the mask register for the status interrupt register INTSTAT1. Write a logic 0 to a bit to unmask the corresponding interrupt.
When unmasked, the corresponding interrupt state is reflected on the INTB pin.
Table 106. Interrupt status mask register 1 (INTMASK1)
Access: User read/write (78)
Address: 0x09 functional page
7
6
5
R
W
Default
0
0
0
4
3
SW3FAULTM
SW2FAULTM
1
1
2
1
0
SW1BFAULTM SW1AFAULTM
0
1
1
= Unimplemented or Reserved
Notes
78. Read: Anytime
Write: Anytime
Table 107. INTMASK1 field descriptions
Field
Description
4
SW3FAULTM
SW3 overcurrent interrupt mask bit
0 SW3FAULTI Unmasked
1 SW3FAULTI Masked
3
SW2FAULTM
SW2 overcurrent interrupt mask bit
0 SW2FAULTI Unmasked
1 SW2FAULTI Masked
1
SW1BFAULTM
SW1B overcurrent interrupt mask bit
0 SW1BFAULTI Unmasked
1 SW1BFAULTI Masked
0
SW1AFAULTM
SW1A overcurrent interrupt mask bit
0 SW1AFAULTI Unmasked
1 SW1AFAULTI Masked
6.6.5.3.6
Interrupt sense register 1 (INTSENSE1)
This register has four read-only sense bits. These sense bits reflect the actual state of the corresponding function.
Table 108. Interrupt sense register 1 (INTSENSE1)
Access: User read-only (79)
Address: 0x0A functional page
7
6
5
R
4
3
SW3FAULTS
SW2FAULTS
X (80)
X (80)
2
1
0
SW1BFAULTS
SW1AFAULTS
X (80)
X (80)
W
Default
0
0
0
0
= Unimplemented or Reserved
Notes
79. Read: Anytime
80. Default value depends on the regulator initial state
PF3000
NXP Semiconductors
73
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 109. INTSENSE1 field descriptions
Field
Description
4
SW3FAULTS
SW3 overcurrent sense bit
0 SW3 in normal operation
1 SW3 above current limit
3
SW2FAULTS
SW2 overcurrent sense bit
0 SW2 in normal operation
1 SW2 above current limit
1
SW1BFAULTS
SW1B overcurrent sense bit
0 SW1B in normal operation
1 SW1B above current limit
0
SW1AFAULTS
SW1A overcurrent sense bit
0 SW1A in normal operation
1 SW1A above current limit
6.6.5.3.7
Interrupt status register 3 (INTSTAT3)
INSTAT3 is one of the four status interrupt registers. This register contains four status flags. Write a logic 1 to clear a flag.
Table 110. Status Interrupt Register 3 (INTSTAT3)
Access: User read/write (81)
Address: 0x0E functional page
R
W
7
6
OTP_ECCI
OTP_AUTO_BL
OW_DONEI
0
0
Default
5
4
3
2
1
VPWROVI
0
0
0
0
0
SWBSTFAULTI
0
0
= Unimplemented or Reserved
Notes
81. Read: Anytime
Write: Anytime
Table 111. INTSTAT3 field descriptions
Field
Description
7
OTP_ECCI
OTP error interrupt bit — OTP_ECCI is set to 1 when an error is detected in OTP registers. This flag can only be cleared by writing
a 1. Writing a 0 has no effect.
0 No error detected
1 OTP error detected
6
OTP_AUTO_BL
OW_DONEI
OTP auto fuse blow interrupt bit — OTP_AUTO_BLOW_DONEI is set to 1 after the auto fuse blow sequence is completed. This
flag can only be cleared by writing a 1. Writing a 0 has no effect.
0 OTP auto fuse blow sequence not completed
1 OTP auto fuse blow sequence completed
2
VPWROVI
VPWR overvoltage interrupt bit — High when an overvoltage event is detected in the front-end LDO circuit. This flag can only be
cleared by writing a 1. Writing a 0 has no effect.
0 VPWR in normal operation range.
1 VPWR in overvoltage range.
0
SWBSTFAULTI
SWBST overcurrent limit interrupt bit — SWBSTFAULTI is set to 1 when the SWBST regulator is in current limit protection. This
flag can only be cleared by writing a 1. Writing a 0 has no effect.
0 SWBST in normal operation
1 SWBST above current limit
PF3000
74
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.8
Interrupt status mask register 3 (INTMASK3)
INTMASK3 is the mask register for the status interrupt register INTSTAT3. Write a logic 0 to a bit to unmask the corresponding interrupt.
When unmasked, the corresponding interrupt state is reflected on the INTB pin.
Table 112. Interrupt status mask register 3 (INTMASK3)
Access: User read/write (82)
Address: 0x0F functional page
R
W
7
6
OTP_ECCM
OTP_AUTO_BL
OW_DONEM
1
1
Default
5
4
3
2
1
VPWROVM
0
0
0
1
0
SWBSTFAULTM
0
1
= Unimplemented or Reserved
Notes
82. Read: Anytime
Write: Anytime
Table 113. INTMASK3 field descriptions
Field
Description
OTP error interrupt mask bit
0 OTP_ECCI Unmasked
1 OTP_ECCI Masked
7
OTP_ECCM
OTP auto blow mask bit
0 OTP_AUTO_BLOW_DONEI Unmasked
1 OTP_AUTO_BLOW_DONEI Masked
6
OTP_AUTO_BLO
W_DONEM
VPWR overvoltage interrupt mask bit
0 VPWROVI Unmasked
1 VPWROVI Masked
2
VPWROVM
SWBST overcurrent limit interrupt mask bit
0 SWBSTFAULTI Unmasked
1 SWBSTFAULTI Masked
0
SWBSTFAULTM
6.6.5.3.9
Interrupt sense register 3 (INTSENSE3)
This register has four read-only sense bits. These sense bits reflect the actual state of the corresponding function.
Table 114. Interrupt sense register 3 (INTSENSE3)
Access: User read-only (83)
Address: 0x10 functional page
R
7
6
OTP_ECCS
OTP_AUTO_B
LOW_DONES
0
0
5
4
3
2
1
VPWROVS
0
SWBSTFAULTS
W
Default
0
0
0
0
0
X (84)
= Unimplemented or Reserved
Notes
83. Read: Anytime
84. Default value depends on the regulator initial state
PF3000
NXP Semiconductors
75
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 115. INTSENSE3 field descriptions
Field
Description
OTP error sense bit
0 No error detected
1 OTP error detected
7
OTP_ECCS
OTP auto blow sense bit — This bit is high while the auto blow sequence is running. Do not read/write the OTP TBB registers
while this bit is 1.
0 SW2 in normal operation
1 SW2 at current limit
6
OTP_AUTO_BLO
W_DONES
VPWR overvoltage interrupt sense bit
0 VPWR in normal operation range.
1 VPWR in overvoltage range.
2
VPWROVS
SWBST overcurrent limit sense bit
0 SWBST in normal operation
1 SWBST above current limit
0
SWBSTFAULTS
6.6.5.3.10
Interrupt status register 4 (INTSTAT4)
INSTAT4 is one of the four status interrupt registers. This register contains six status flags. Write a logic 1 to clear a flag.
Table 116. Status interrupt register 4 (INTSTAT4)
Access: User read/write (85)
Address: 0x11 functional page
7
6
R
W
Default
0
0
5
4
3
VLDO4FAULTI
VLDO3FAULTI
V33FAULTI
0
0
0
2
1
0
VCC_SDFAULT
VLDO2FAULTI
I
0
0
VLDO1FAULTI
0
= Unimplemented or Reserved
Notes
85. Read: Anytime
Write: Anytime
Table 117. INTSTAT4 field descriptions
Field
Description
5
VLDO4FAULTI
VLDO4 overcurrent interrupt bit — VLDO4FAULTI is set to 1 when the VLDO4 regulator is in current limit protection. This flag can
only be cleared by writing a 1. Writing a 0 has no effect.
0 VLDO4 in normal operation
1 VLDO4 above current limit
4
VLDO3FAULTI
VLDO3 overcurrent interrupt bit — VLDO3FAULTI is set to 1 when the VLDO3 regulator is in current limit protection. This flag can
only be cleared by writing a 1. Writing a 0 has no effect.
0 VLDO3 in normal operation
1 VLDO3 above current limit
3
V33FAULTI
V33 overcurrent interrupt bit — V33FAULTI is set to 1 when the V33 regulator is in current limit protection. This flag can only be
cleared by writing a 1. Writing a 0 has no effect.
0 V33 in normal operation
1 V33 above current limit
PF3000
76
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 117. INTSTAT4 field descriptions (continued)
Field
Description
2
VCC_SDFAULTI
VCC_SD overcurrent interrupt bit — VCC_SDFAULTI is set to 1 when the VCC_SD regulator is in current limit protection. This
flag can only be cleared by writing a 1. Writing a 0 has no effect.
0 VCC_SD in normal operation
1 VCC_SD above current limit
1
VLDO2FAULTI
VLDO2 overcurrent interrupt bit — VLDO2FAULTI is set to 1 when the VLDO2 regulator is in current limit protection. This flag can
only be cleared by writing a 1. Writing a 0 has no effect.
0 VLDO2 in normal operation range.
1 VLDO2 above current limit
0
VLDO1FAULTI
VLDO1 overcurrent interrupt bit — SWBSTFAULTI is set to 1 when the SWBST regulator is in current limit protection. This flag
can only be cleared by writing a 1. Writing a 0 has no effect.
0 VLDO1 in normal operation range.
1 VLDO1 above current limit
6.6.5.3.11
Interrupt status mask register 4 (INTMASK4)
INTMASK4 is the mask register for the status interrupt register INTSTAT4. Write a logic 0 to a bit to unmask the corresponding interrupt.
When unmasked, the corresponding interrupt state is reflected on the INTB pin.
Table 118. Interrupt status mask register 4 (INTMASK4)
Access: User read/write (86)
Address: 0x12 functional page
7
6
R
W
Default
0
5
4
3
2
1
0
VLDO4FAULT
M
VLDO3FAULT
M
V33FAULTM
VCC_SDFAUL
TM
VLDO2FAULT
M
VLDO1FAULTM
1
1
1
1
1
1
0
= Unimplemented or Reserved
Notes
86. Read: Anytime
Write: Anytime
Table 119. INTMASK4 field descriptions
Field
Description
5
VLDO4FAULTM
VLDO4 overcurrent interrupt mask bit
0 VLDO4FAULTI Unmasked
1 VLDO4FAULTI Masked
4
VLDO3FAULTM
VLDO3 overcurrent interrupt mask bit
0 VLDO3FAULTI Unmasked
1 VLDO3FAULTI Masked
3
V33FAULTM
V33 overcurrent interrupt mask bit
0 V33FAULTI Unmasked
1 V33FAULTI Masked
2
VCC_SDFAULTM
VCC_SD overcurrent interrupt mask bit
0 VCC_SDFAULTI Unmasked
1 VCC_SDFAULTI Masked
1
VLDO2FAULTM
VLDO2 Overcurrent interrupt mask bit
0 VLDO2FAULTI Unmasked
1 VLDO2FAULTI Masked
0
VLDO1FAULTM
VLDO1 overcurrent interrupt mask bit
0 VLDO1FAULTI Unmasked
1 VLDO1FAULTI Masked
PF3000
NXP Semiconductors
77
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.12
Interrupt sense register 4 (INTSENSE4)
This register has four read-only sense bits. These sense bits reflect the actual state of the corresponding function.
Access: User read-only (87)
Address: 0x13 functional page
7
6
R
5
4
3
VLDO4FAULTS VLDO3FAULTS
V33FAULTS
2
1
0
VCC_SDFAULT
VLDO2FAULTS VLDO1FAULTS
S
W
Default
0
0
X (88)
X (88)
X (88)
X (88)
X (88)
X (88)
= Unimplemented or Reserved
Notes
87. Read: Anytime
88. Default value depends on the regulator initial state
Table 120. INTSENSE4 Field Descriptions
Field
Description
5
VLDO4FAULTS
VLDO4 overcurrent sense bit
0 VLDO4 in normal operation
1 VLDO4 above current limit
4
VLDO3FAULTS
VLDO3 overcurrent sense bit
0 VLDO3 in normal operation
1 VLDO3 above current limit
3
V33FAULTS
V33 overcurrent sense bit
0 V33 in normal operation
1 V33 above current limit
2
VCC_SDFAULT
S
VCC_SD overcurrent sense bit
0 VCC_SD in normal operation
1 VCC_SD above current limit
1
VLDO2FAULTS
VLDO2 overcurrent sense bit
0 VLDO2 in normal operation
1 VLDO2 above current limit
0
VLDO1FAULTS
VLDO1 overcurrent sense bit
0 VLDO1 in normal operation
1 VLDO1 above current limit
PF3000
78
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.13
Coin cell control register (COINCTL)
This register is used to control the coin cell charger.
Table 121. Coin cell control register (COINCTL)
Access: User read/write (89)
Address: 0x1A functional page
7
6
5
4
3
R
2
1
COINCHEN
W
Default
0
0
0
0
0
0
VCOIN
0
0
0
= Unimplemented or Reserved
Notes
89. Read: Anytime
Write: Anytime
Table 122. COINCTL field descriptions
Field
3
COINCHEN
2:0
VCOIN
6.6.5.3.14
Description
Coin cell charger enable bit
0 Coin cell charger disabled.
1 Coin cell charger enabled.
Coin cell charger output voltage selection — This field is used to set the coin cell charging voltage from 2.50 V to 3.30 V. See
Table 70 for all options selectable through these bits.
Power control register (PWRCTL)
Table 123. Power control register (PWRCTL)
Access: User read/write (90)
Address: 0x1B functional page
R
W
7
6
REGSCPEN
STANDBYINV
0
0
Default
5
4
STBYDLY
0
3
2
PWRONBDBNC
1
0
0
1
0
PWRONRSTE
N
RESTARTEN
0
0
= Unimplemented or Reserved
Notes
90. Read: Anytime
Write: Anytime
PF3000
NXP Semiconductors
79
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 124. PWRCTL field descriptions
Field
Description
7
REGSCPEN
Short-circuit protection enable bit — When REGSCPEN is set to 1, whenever a current limit event occurs on a LDO regulator, this
regulator is shutdown.
0 Short-circuit protection disabled
1 Short-circuit protection enabled
6
STANDBYINV
4:3
STBYDLY
STANDBY inversion bit —STANDBYINV is used to control the polarity of the STANDBY pin.
0 STANDBY pin is active high
1 STANDBY pin is active low
STANDBY delay bits — STBYDLY is used to set the delay between a standby request from the STANDBY pin and the entering in
standby mode.
00 No delay
01 One 32 kHz period (default)
10 Two 32 kHz periods
11 Three 32 kHz periods
3:2
PWRONDBNC
PWRON programmable debouncer bits — PWRONDBNC is used to set the debounce time for the PWRON input pin. For
configuration, see Table 36.
1
PWRONRSTEN
PWRON reset enable bit — When set to 1, the PF3000 can enter OFF mode when the PWRON pin is held low for 4 seconds or
longer. See PWRON Pin section for details.
0 Disallow OFF mode after PWRON held low
1 Allow OFF mode after PWRON held low
0
RESTARTEN
6.6.5.3.15
Restart enable bit — When set to 1, the PF3000 restarts automatically after a power off event generated by the PWRON (held low
for 4 seconds or longer) when PWR_CFG bit = 1.
0 Automatic restart disabled.
1 Automatic restart enabled.
Embedded memory register A (MEMA)
Table 125. Embedded memory register A (MEMA)
Access: User read/write (91)
Address: 0x1C functional page
7
6
5
4
R
2
1
0
0
0
0
0
MEMA
W
Default
3
0
0
0
0
= Unimplemented or Reserved
Notes
91. Read: Anytime
Write: Anytime
Table 126. MEMA field descriptions
Field
Description
7:0
MEMA
Memory bank A — This register is maintained in case of a main battery loss as long as the coin cell is present. The contents of the
embedded memory are reset by COINPORB.
PF3000
80
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.16
Embedded memory register B (MEMB)
Table 127. Embedded memory register B (MEMB)
Address: 0x1D functional page
7
6
5
Access: User read/write
4
R
2
1
0
0
0
0
0
MEMB
W
Default
3
0
0
0
0
= Unimplemented or Reserved
Notes
92. Read: Anytime
Write: Anytime
Table 128. MEMB field descriptions
Field
Description
7:0
MEMB
Memory bank B — This register is maintained in case of a main battery loss as long as the coin cell is present. The contents of the
embedded memory are reset by COINPORB.
6.6.5.3.17
Embedded memory register C (MEMC)
Table 129. Embedded Memory Register C (MEMC)
Access: User read/write (93)
Address: 0x1E functional page
7
6
5
4
R
2
1
0
0
0
0
0
MEMC
W
Default
3
0
0
0
0
= Unimplemented or Reserved
Notes
93. Read: Anytime
Write: Anytime
Table 130. MEMC field descriptions
Field
Description
7:0
MEMC
Memory bank C — This register is maintained in case of a main battery loss as long as the coin cell is present. The contents of the
embedded memory are reset by COINPORB.
PF3000
NXP Semiconductors
81
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.18
Embedded memory register D (MEMD)
Table 131. Embedded memory register D (MEMD)
Access: User read/write (94)
Address: 0x1F functional page
7
6
5
4
R
3
2
1
0
0
0
0
0
MEMD
W
Default
0
0
0
0
= Unimplemented or Reserved
Notes
94. Read: Anytime
Write: Anytime
Table 132. MEMD field descriptions
Field
Description
7:0
MEMD
Memory bank D — This register is maintained in case of a main battery loss as long as the coin cell is present. The contents of the
embedded memory are reset by COINPORB.
6.6.5.3.19
SW1A voltage control register (SW1AVOLT)
This register is used to set the output voltage of the SW1A regulator in normal operation.
Table 133. SW1A voltage control register (SW1AVOLT)
Access: User read/write (95)
Address: 0x20 functional page
7
6
5
4
3
R
1
0
X (96)
X (96)
SW1A
W
Default
2
0
0
0
X (96)
X (96)
X (96)
= Unimplemented or Reserved
Notes
95. Read: Anytime
Write: Anytime
96. Default value depends on OTP content.
Table 134. SW1AVOLT field descriptions
Field
4:0
SW1A
Description
SW1A output voltage — Refer to Table 53
PF3000
82
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.20
SW1A standby voltage control register (SW1ASTBY)
This register is used to set the output voltage of the SW1A regulator in standby operation.
Table 135. SW1A standby voltage control register (SW1ASTBY)
Access: User read/write (97)
Address: 0x21 functional page
7
6
5
4
3
R
1
0
X (98)
X (98)
SW1ASTBY
W
Default
2
0
0
0
X (98)
X (98)
X (98)
= Unimplemented or Reserved
Notes
97. Read: Anytime
Write: Anytime
98. Default value depends on OTP content.
Table 136. SW1ASTBY field descriptions
Field
4:0
SW1ASTBY
6.6.5.3.21
Description
SW1A standby output voltage — Refer to Table 53
SW1A sleep mode voltage control register (SW1AOFF)
This register is used to set the output voltage of the SW1A regulator in sleep mode operation.
Table 137. SW1A sleep mode voltage control register (SW1AOFF)
Access: User read/write (99)
Address: 0x22 functional page
7
6
5
4
3
R
1
0
X (100)
X (100)
SW1AOFF
W
Default
2
0
0
0
X (100)
X (100)
X (100)
= Unimplemented or Reserved
Notes
99. Read: Anytime
Write: Anytime
100. Default value depends on OTP content.
Table 138. SW1AOFF field descriptions
Field
4:0
SW1ASTBY
Description
SW1A sleep mode output voltage — Refer to Table 53
PF3000
NXP Semiconductors
83
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.22
SW1A switching mode selector register (SW1AMODE)
This register is used to set the switching mode of the SW1A regulator.
Table 139. SW1A switching mode selector register (SW1AMODE)
Access: User read/write (101)
Address: 0x23 functional page
7
6
R
5
4
3
2
SW1AOMODE
W
Default
0
0
0
1
0
X (102)
X (102)
SW1AMODE
X (102)
0
X (102)
= Unimplemented or Reserved
Notes
101. Read: Anytime
Write: Anytime
102. Default value depends on OTP content.
Table 140. SW1AMODE field descriptions
Field
5
SW1AOMODE
3:0
SW1AMODE
6.6.5.3.23
Description
SW1A Off mode bit— This bit configures the mode entered by SW1A after a turn-off event
0 OFF mode entered after a turn-off event.
1 Sleep mode entered after a turn-off event.
SW1A switching mode selector — Refer to Table 47
SW1A configuration register (SW1ACONF)
This register is used to configure DVS, switching frequency, phase and current limit settings of the SW1A regulator.
Table 141. SW1A configuration register (SW1ACONF)
Access: User read/write (103)
Address: 0x24 functional page
7
R
5
SW1ADVSSPE
ED
W
Default
6
0
X (104)
4
SW1APHASE
0
3
2
1
SW1AILIM
SW1AFREQ
0
X (104)
X (104)
0
0
X (104)
= Unimplemented or Reserved
Notes
103. Read: Anytime
Write: Anytime
104. Default value depends on OTP content.
PF3000
84
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 142. SW1ACONF field descriptions
Field
Description
SW1A DVS speed bit— This bit configures the DVS stepping rates speed for SW1A. Refer to the Table 48.
0 25 mV step each 2.0 μs.
1 25 mV step each 4.0 μs.
6
SW1ADVSSPEED
5:4
SW1APHASE
SW1A phase clock bit— SW1APHASE is used to set the phase clock for SW1A. Refer to Table 49.
3:2
SW1AFREQ
SW1A switching frequency— SW1APHASE is used to set the desired switching frequency for SW1A. Refer to Table 51.
SW1A current limiter bit— This bit configures the current limit for SW1A.
0 2.75 A (typ).
1 2.0 A (typ).
0
SW1AILIM
6.6.5.3.24
SW1B voltage control register (SW1BVOLT)
This register is used to set the output voltage of the SW1B regulator in normal operation.
Table 143. SW1B voltage control register (SW1BVOLT)
Access: User read/write (105)
Address: 0x2E functional page
7
6
5
4
3
R
1
0
X (106)
X (106)
SW1B
W
Default
2
0
0
0
X (106)
X (106)
X (106)
= Unimplemented or Reserved
Notes
105. Read: Anytime
Write: Anytime
106. Default value depends on OTP content.
Table 144. SW1BVOLT field descriptions
Field
4:0
SW1B
Description
SW1B output voltage — Refer to Table 53.
PF3000
NXP Semiconductors
85
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.25
SW1B standby voltage control register (SW1BSTBY)
This register is used to set the output voltage of the SW1B regulator in standby operation.
Table 145. SW1B standby voltage control register (SW1BSTBY)
Access: User read/write (107)
Address: 0x2F functional page
7
6
5
4
3
R
1
0
X (108)
X (108)
SW1BSTBY
W
Default
2
0
0
0
X (108)
X (108)
X (108)
= Unimplemented or Reserved
Notes
107. Read: Anytime
Write: Anytime
108. Default value depends on OTP content.
Table 146. SW1BSTBY field descriptions
Field
4:0
SW1BSTBY
6.6.5.3.26
Description
SW1B standby output voltage — Refer to Table 53.
SW1B sleep mode voltage control register (SW1BOFF)
This register is used to set the output voltage of the SW1B regulator in sleep mode operation.
Table 147. SW1B sleep mode voltage control register (SW1BOFF)
Access: User read/write (109)
Address: 0x30 functional page
7
6
5
4
3
R
1
0
X (110)
X (110)
SW1BOFF
W
Default
2
0
0
0
X (110)
X (110)
X (110)
= Unimplemented or Reserved
Notes
109. Read: Anytime
Write: Anytime
110. Default value depends on OTP content.
Table 148. SW1BOFF field descriptions
Field
4:0
SW1BSTBY
Description
SW1B sleep mode output voltage — Refer to Table 53.
PF3000
86
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.27
SW1B switching mode selector register (SW1BMODE)
This register is used to set the switching mode of the SW1B regulator.
Table 149. SW1B switching mode selector register (SW1BMODE)
Access: User read/write (111)
Address: 0x31 functional page
7
6
5
R
3
2
SW1BOMOD
E
W
Default
4
0
0
1
0
X (112)
X (112)
SW1BMODE
0
X (112)
0
X (112)
= Unimplemented or Reserved
Notes
111. Read: Anytime
Write: Anytime
112. Default value depends on OTP content.
Table 150. SW1BMODE field descriptions
Field
5
SW1BOMODE
3:0
SW1BMODE
6.6.5.3.28
Description
SW1B Off mode bit— This bit configures the mode entered by SW1B after a turn-off event
0 OFF mode entered after a turn-off event.
1 Sleep mode entered after a turn-off event.
SW1B switching mode selector — Refer to Table 47.
SW1B configuration register (SW1BCONF)
This register is used to configure DVS, switching frequency, phase and current limit settings of the SW1B regulator.
Table 151. SW1B configuration register (SW1BCONF)
Access: User read/write X (113)
Address: 0x32 functional page
7
R
W
Default
6
5
SW1BDVSSPEED
0
X (114)
4
SW1BPHASE
0
3
2
1
SW1BFREQ
0
X (114)
X (114)
0
SW1BILIM
0
X (114)
= Unimplemented or Reserved
Notes
113. Read: Anytime
Write: Anytime
114. Default value depends on OTP content.
PF3000
NXP Semiconductors
87
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 152. SW1BCONF field descriptions
Field
Description
SW1B DVS speed bit— This bit configures the DVS stepping rates speed for SW1B. Refer to the Table 48.
0 25 mV step each 2.0 μs.
1 25 mV step each 4.0 μs.
6
SW1BDVSSPEED
5:4
SW1BPHASE
SW1B phase clock bit— SW1BPHASE is used to set the phase clock for SW1B. Refer to Table 49.
3:2
SW1BFREQ
SW1B switching frequency— SW1BPHASE is used to set the desired switching frequency for SW1B. Refer to Table 51.
SW1B current limiter bit— This bit configures the current limit for SW1B.
0 2.75 A (typ).
1 2.0 A (typ).
0
SW1BILIM
6.6.5.3.29
SW2 voltage control register (SW2VOLT)
This register is used to set the output voltage of the SW2 regulator in normal operation.
Table 153. SW2 voltage control register (SW2VOLT)
Access: User read/write (115)
Address: 0x35 functional page
7
6
R
4
3
SW2_HI
W
Default
5
0
0
X (116)
2
1
0
X (116)
X (116)
SW2
X (116)
X (116)
X (116)
= Unimplemented or Reserved
Notes
115. Read: Anytime
Write: Anytime
116. Default value depends on OTP content.
Table 154. SW2VOLT field descriptions
Field
4:0
SW2
5
SW2_HI
Description
SW2 output voltage — Refer to Table 55.
SW2 Output voltage range —This bit configures the range of SW2 Output voltage. Refer to Table 55.
0 Low output voltage settings
1 High output voltage settings
PF3000
88
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.30
SW2 standby voltage control register (SW2STBY)
This register is used to set the output voltage of the SW2 regulator in standby operation.
Table 155. SW2 standby voltage control register (SW2STBY)
Access: User read/write (117)
Address: 0x36 functional page
7
6
R
4
3
SW2_HI
W
Default
5
0
0
X (118)
2
1
0
X (118)
X (118)
SW2STBY
X (118)
X (118)
X (118)
= Unimplemented or Reserved
Notes
117. Read: Anytime
Write: Anytime
118. Default value depends on OTP content.
Table 156. SW2STBY field descriptions
Field
4:0
SW2STBY
5
SW2_HI
6.6.5.3.31
Description
SW2 standby output voltage — Refer to Table 55.
SW2 output voltage range —This bit configures the range of SW2 Output voltage. Refer to Table 55.
0 Low output voltage settings
1 High output voltage settings
SW2 sleep mode voltage control register (SW2OFF)
This register is used to set the output voltage of the SW2 regulator in sleep mode operation.
Table 157. SW2 sleep mode voltage control register (SW2OFF)
Access: User read/write (119)
Address: 0x37 functional page
7
6
R
4
3
SW2_HI
W
Default
5
0
0
X (120)
2
1
0
X (120)
X (120)
SW2OFF
X (120)
X (120)
X (120)
= Unimplemented or Reserved
Notes
119. Read: Anytime
Write: Anytime
120. Default value depends on OTP content.
PF3000
NXP Semiconductors
89
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 158. SW2OFF field descriptions
Field
4:0
SW2STBY
5
SW2_HI
6.6.5.3.32
Description
SW2 sleep mode output voltage — Refer to Table 55.
SW2 output voltage range —This bit configures the range of SW2 Output voltage. Refer to Table 55.
0 Low output voltage settings
1 High output voltage settings
SW2 switching mode selector register (SW2MODE)
This register is used to set the switching mode of the SW2 regulator.
Table 159. SW2 switching mode selector register (SW2MODE)
Access: User read/write (121)
Address: 0x38 functional page
7
6
R
4
3
2
SW2OMODE
W
Default
5
0
0
0
1
0
X (122)
X (122)
SW2MODE
0
X (122)
X (122)
= Unimplemented or Reserved
Notes
121. Read: Anytime
Write: Anytime
122. Default value depends on OTP content.
Table 160. SW2MODE field descriptions
Field
5
SW2OMODE
3:0
SW2MODE
Description
SW2 Off mode bit— This bit configures the mode entered by SW2 after a turn-off event
0 OFF mode entered after a turn-off event.
1 Sleep mode entered after a turn-off event.
SW2 switching mode selector — Refer to Table 47.
PF3000
90
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.33
SW2 configuration register (SW2CONF)
This register is used to configure DVS, switching frequency, phase and current limit settings of the SW2 regulator.
Table 161. SW2 configuration register (SW2CONF)
Access: User read/write (123)
Address: 0x39 functional page
7
6
R
5
SW2DVSSPEE
D
W
Default
X (124)
0
4
3
SW2PHASE
0
2
1
SW2FREQ
X (124)
0
0
SW2ILIM
X (124)
0
X (124)
= Unimplemented or Reserved
Notes
123. Read: Anytime
Write: Anytime
124. Default value depends on OTP content.
Table 162. SW2CONF field descriptions
Field
Description
SW2 DVS speed bit- This bit configures the DVS stepping rates speed for SW2. Refer to the Table 48.
0 25 mV step each 2.0 μs.
1 25 mV step each 4.0 μs.
6
SW2DVSSPEED
5:4
SW2PHASE
SW2 phase clock bit— SW2PHASE is used to set the phase clock for SW2. Refer to Table 49.
3:2
SW2FREQ
SW2 switching frequency— SW2PHASE is used to set the desired switching frequency for SW2. Refer to Table 51.
SW2 current limiter bit— This bit configures the current limit for SW2.
0 2.75 A (typ).
1 2.0 A (typ).
0
SW2ILIM
6.6.5.3.34
SW3 voltage control register (SW3VOLT)
This register is used to set the output voltage of the SW3 regulator in normal operation.
Table 163. SW3 voltage control register (SW3VOLT)
Access: User read/write (125)
Address: 0x3C functional page
7
6
5
4
3
R
1
0
X (126)
X (126)
SW3
W
Default
2
0
0
0
X (126)
X (126)
X (126)
= Unimplemented or Reserved
Notes
125. Read: Anytime
Write: Anytime
126. Default value depends on OTP content.
PF3000
NXP Semiconductors
91
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 164. SW3VOLT field descriptions
Field
4:0
SW3
6.6.5.3.35
Description
SW3 output voltage — Refer to Table 57.
SW3 standby voltage control register (SW3STBY)
This register is used to set the output voltage of the SW3 regulator in standby operation.
Table 165. SW3 standby voltage control register (SW3STBY)
Access: User read/write (127)
Address: 0x3D functional page
7
6
5
4
3
R
1
0
X (128)
X (128)
SW3STBY
W
Default
2
0
0
0
X (128)
X (128)
X (128)
= Unimplemented or Reserved
Notes
127. Read: Anytime
Write: Anytime
128. Default value depends on OTP content.
Table 166. SW3STBY field descriptions
Field
4:0
SW3STBY
6.6.5.3.36
Description
SW3 standby output voltage — Refer to Table 57.
SW3 sleep mode voltage control register (SW3OFF)
This register is used to set the output voltage of the SW3 regulator in sleep mode operation.
Table 167. SW3 sleep mode voltage control register (SW3OFF)
Access: User read/write (129)
Address: 0x3E functional page
7
6
5
4
3
R
1
0
X (130)
X (130)
SW3OFF
W
Default
2
0
0
0
X (130)
X (130)
X (130)
= Unimplemented or Reserved
Notes
129. Read: Anytime
Write: Anytime
130. Default value depends on OTP content.
PF3000
92
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 168. SW3OFF field descriptions
Field
4:0
SW3STBY
6.6.5.3.37
Description
SW3 sleep mode output voltage — Refer to Refer to Table 57.
SW3 switching mode selector register (SW3MODE)
This register is used to set the switching mode of the SW3 regulator.
Table 169. SW3 switching mode selector register (SW3MODE)
Access: User read/write (131)
Address: 0x3F functional page
7
6
R
4
3
2
SW3OMODE
W
Default
5
0
0
0
1
0
X (132)
X (132)
SW3MODE
X (132)
0
X (132)
= Unimplemented or Reserved
Notes
131. Read: Anytime
Write: Anytime
132. Default value depends on OTP content.
Table 170. SW3MODE field descriptions
Field
5
SW3OMODE
3:0
SW3MODE
6.6.5.3.38
Description
SW3 Off mode bit— This bit configures the mode entered by SW3 after a turn-off event
0 OFF mode entered after a turn-off event.
1 Sleep mode entered after a turn-off event.
SW3 switching mode selector — Refer to Table 47.
SW3 configuration register (SW3CONF)
This register is used to configure DVS, switching frequency, phase and current limit settings of the SW3 regulator.
Table 171. SW3 configuration register (SW3CONF)
Access: User read/write (133)
Address: 0x40 functional page
7
R
5
SW3DVSSPEE
D
W
Default
6
0
X (134)
4
SW3PHASE
0
3
2
1
SW3FREQ
0
X (134)
X (134)
0
SW3ILIM
0
X (134)
= Unimplemented or Reserved
Notes
133. Read: Anytime
Write: Anytime
134. Default value depends on OTP content.
PF3000
NXP Semiconductors
93
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 172. SW3CONF field descriptions
Field
Description
SW3 DVS speed bit— This bit configures the DVS stepping rates speed for SW3. Refer to the Table 48.
0 25 mV step each 2.0 μs.
1 25 mV step each 4.0 μs.
6
SW3DVSSPEED
5:4
SW3PHASE
SW3 phase clock bit— SW3PHASE is used to set the phase clock for SW3. Refer to Table 49.
3:2
SW3FREQ
SW3 switching frequency— SW3PHASE is used to set the desired switching frequency for SW3. Refer to Table 51.
SW3 current limiter bit— This bit configures the current limit for SW3.
0 2.75 A (typ).
1 2.0 A (typ).
0
SW3ILIM
6.6.5.3.39
SWBST setup and control register (SWBSTCTL)
This register is used to configure both the output voltage and switching modes of the SWBST regulator.
Table 173. SWBST configuration register (SWBSTCTL)
Access: User read/write (135)
Address: 0x66 functional page
7
R
6
5
4
SWBST1STBYMODE
W
Default
0
X (136)
X (136)
3
2
SWBST1MODE
0
X (136)
X (136)
1
0
SWBST1VOLT
X (136)
X (136)
= Unimplemented or Reserved
Notes
135. Read: Anytime
Write: Anytime
136. Default value depends on OTP content.
Table 174. SWBSTCTL field descriptions
Field
6:5
SWBST1STBYMODE
Description
SWBST switching mode in standby— SWBST1MODE is used to set the switching mode in standby mode.
00 OFF
01 PFM
10 Auto (137)
11 APS
3:2
SWBST1MODE
SWBST switching mode in normal operation— SWBST1MODE is used to set the switching mode on normal operation.
00 OFF
01 PFM
10 Auto (137)
11 APS
1:0
SWBST1VOLT
SWBST output voltage— SWBST1VOLT is used to set the output voltage for SWBST.
00 5.000 V (typ.)
01 5.050 V (typ.)
10 5.100 V (typ.)
11 5.150 V (typ.)
Notes
137. In auto mode, the controller automatically switches between PFM and APS modes depending on the load current. Regulator switches in auto mode
if enabled in the startup sequence.
PF3000
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NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.40
Front-end LDO control register (LDOGCTL)
This register is used to configure the front-end LDO standby mode operation.
Table 175. Front-end LDO control register (LDOGCTL)
Access: User read/write (138)
Address: 0x69 functional page
7
6
5
4
3
2
1
R
0
STBY_LOWPO
WER_B
W
Default
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Notes
138. Read: Anytime
Write: Anytime
Table 176. LDOGCTL field descriptions
Field
Description
0
STBY_LOWPOWER_B
Front-end LDO standby mode operation bit— When STBY_LOWPOWER_B bit is set to 1, the front-end LDO does not enter
in low-power mode during IC standby mode.
0 Low-power mode enabled during IC standby mode.
1 Low-power mode disabled during IC standby mode.
6.6.5.3.41
VREFDDR control register (VREFDDRCTL)
This register is used to control the VREFDDR supply operation.
Table 177. VREFDDR control register (VREFDDRCTL)
Access: User read/write (139)
Address: 0x6A functional page
7
6
5
4
3
2
1
0
R
VREFDDREN
W
Default
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Notes
139. Read: Anytime
Write: Anytime
Table 178. VREFDDR field descriptions
Field
0
VREFDDREN
Description
VREFDDR supply enable bit— VREFDDREN is used to enable or disable the VREFDDR supply.
0 VREFDDR supply disabled
1 VREFDDR supply enabled
PF3000
NXP Semiconductors
95
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.42
VSNVS control register (VSNVSCTL)
This register is used to control the VSNVS supply operation.
Table 179. VSNVS control register (VSNVSCTL)
Access: User read/write (140)
Address: 0x6B functional page
7
6
5
4
3
2
1
0
R
VSNVSVOLT
W
Default
0
0
0
0
X (141)
0
X (141)
X (141)
= Unimplemented or Reserved
Notes
140. Read: Anytime
Write: Anytime
141. Default value depends on OTP content.
Table 180. VSNVSCTL field descriptions
Field
Description
VSNVS output voltage configuration— VSNVSVOLT is used to configure the VSNVS output voltage. Values below are
typical voltages.
000 = RSVD
001 = RSVD
010 = RSVD
011 = RSVD
100 = RSVD
101 = RSVD
110 = 3.0 V (default)
111 = RSVD
2:0
VSNVSVOLT
6.6.5.3.43
VLDO1 control register (VLDO1CTL)
This register is used to configure output voltage, normal and standby mode operation of the VLDO1 regulator.
Table 181. VLDO1 control register (VLDO1CTL)
Access: User read/write (142)
Address: 0x6C functional page
R
W
Default
7
6
5
4
LDO1OMODE
VLDO1LPWR
VLDO1STBY
VLDO1EN
0
0
0
X (143)
3
2
1
0
X (143)
X (143)
VLDO1
X (143)
X (143)
= Unimplemented or Reserved
Notes
142. Read: Anytime
Write: Anytime
143. Default value depends on OTP content.
PF3000
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NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 182. VLDO1CTL field descriptions
Field
Description
7
LDO1OMODE
VLDO1 OFF mode bit—LDO1OMODE is used to configure VLDO1 operating mode when a PWRON turn-off event occurs.
0 VLDO1 in OFF mode if a PWRON turn off event occurs
1 VLDO1 in sleep mode if a PWRON turn off event occurs
6
VLDO1LPWR
VLDO1 Low-power mode enable bit— When VLDO1LPWR is set to 1, VLDO1 can enter Low-power mode per the conditions in
the Table 66.
0 Low-power mode disabled
1 Low-power mode enabled
5
VLDO1STBY
VLDO1 standby enable bit— When VLDO1STBY is set to 1, VLDO1 is turned off during standby mode. Refer to Table 66.
0 VLDO1 is ON during standby mode.
1 VLDO1 is OFF during standby mode.
VLDO1 enable bit — VLDO1EN is used to enable or disable the VLDO1 regulator.
0 VLDO1 disabled
1 VLDO1 enabled
4
VLDO1EN
3:0
VLDO1
6.6.5.3.44
VLDO1 output voltage configuration— Refer to Table 62.
VLDO2 control register (VLDO2CTL)
This register is used to configure output voltage, normal, and standby mode operation of the VLDO2 regulator.
Table 183. VLDO2 control register (VLDO2CTL)
Access: User read/write (144)
Address: 0x6D functional page
R
W
Default
7
6
5
4
LDO2OMODE
VLDO2LPWR
VLDO2STBY
VLDO2EN
0
0
0
X (145)
3
2
1
0
X (145)
X (145)
VLDO2
X (145)
X (145)
= Unimplemented or Reserved
Notes
144. Read: Anytime
Write: Anytime
145. Default value depends on OTP content.
PF3000
NXP Semiconductors
97
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 184. VLDO2CTL field descriptions
Field
Description
7
LDO2OMODE
VLDO2 OFF mode bit—LDO2OMODE is used to configure VLDO2 operating mode when a PWRON turn-off event occurs.
0 VLDO2 in OFF mode if a PWRON turn off event occurs
1 VLDO2 in Sleep mode if a PWRON turn off event occurs
6
VLDO2LPWR
VLDO2 low-power mode enable bit— When VLDO2LPWR is set to 1, VLDO2 can enter low-power mode per the conditions in
the LDO control table.
0 Low-power mode disabled
1 Low-power mode enabled
5
VLDO2STBY
VLDO2 standby enable bit— When VLDO2STBY is set to 1, VLDO2 is turned off during standby mode. Refer to Table 66.
0 VLDO2 is ON during standby mode.
1 VLDO2 is OFF during standby mode.
VLDO2 enable bit — VLDO2EN is used to enable or disable the VLDO2 regulator.
0 VLDO2 disabled
1 VLDO2 enabled
4
VLDO2EN
3:0
VLDO2
6.6.5.3.45
VLDO2 output voltage configuration— Refer to Table 62.
VCC_SD control register (VCC_SDCTL)
This register is used to configure output voltage, normal and standby mode operation of the VCC_SD regulator.
Table 185. CC_SD control register (VCC_SDCTL)
Access: User read/write (146)
Address: 0x6E functional page
7
R
W
Default
6
5
VCC_SDOMOD
VCC_SDLPWR VCC_SDSTBY
E
0
0
0
4
3
2
1
0
VCC_SDEN
X (147)
VCC_SD
0
0
X (147)
X (147)
= Unimplemented or Reserved
Notes
146. Read: Anytime
Write: Anytime
147. Default value depends on OTP content.
PF3000
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NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 186. VCC_SDCTL field descriptions
Field
Description
7
VCC_SDOMODE
VCC_SD OFF mode bit— VCC_SDOMODE is used to configure VCC_SD operating mode when a PWRON turn-off event occurs.
0 VCC_SD in OFF mode if a PWRON turn off event occurs
1 VCC_SD in Sleep mode if a PWRON turn off event occurs
6
VCC_SDLPWR
VCC_SD low-power mode enable bit— When VCC_SDLPWR is set to 1, VCC_SD can enter low-power mode per the conditions
in the Table 66.
0 Low-power mode disabled
1 Low-power mode enabled
5
VCC_SDSTBY
VCC_SD standby enable bit— When VCC_SDSTBY is set to 1, VCC_SD is turned off during standby mode. Refer to Table 66.
0 VCC_SD is ON during standby mode.
1 VCC_SD is OFF during standby mode.
VCC_SD enable bit — VCC_SDEN is used to enable or disable the VCC_SD regulator.
0 VCC_SD disabled
1 VCC_SD enabled
4
VCC_SDEN
1:0
VCC_SD
6.6.5.3.46
VCC_SD output voltage configuration— Refer to Table 65.
V33 control register (V33CTL)
This register is used to configure output voltage, normal, and standby mode operation of the V33 regulator.
Table 187. V33 control register (V33CTL)
Access: User read/write (148)
Address: 0x6F functional page
R
W
7
6
5
4
V33OMODE
V33LPWR
V33STBY
V33EN
0
0
0
X (149)
Default
3
2
1
0
V33
0
0
X (149)
X (149)
= Unimplemented or Reserved
Notes
148. Read: Anytime
Write: Anytime
149. Default value depends on OTP content.
Table 188. V33CTL field descriptions
Field
7
V33OMODE
Description
V33 OFF mode bit— V33OMODE is used to configure V33 operating mode when a PWRON turn-off event occurs.
0 V33 in OFF mode if a PWRON turn off event occurs
1 V33 in sleep mode if a PWRON turn off event occurs
6
V33LPWR
V33 low-power mode enable bit— When V33LPWR is set to 1, V33 can enter low-power mode per the conditions in the Table 66.
0 Low-power mode disabled
1 Low-power mode enabled
5
V33STBY
V33 standby enable bit— When V33STBY is set to 1, V33 is turned off during standby mode. Refer to Table 66.
0 V33 is ON during standby mode.
1 V33 is OFF during standby mode.
4
V33EN
1:0
V33
V33 Enable bit — V33EN is used to enable or disable the VLDO2 regulator.
0 V33 disabled
1 V33 enabled
V33 output voltage configuration— Refer to Table 64.
PF3000
NXP Semiconductors
99
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.47
VLDO3 control register (VLDO3CTL)
This register is used to configure output voltage, normal, and standby mode operation of the VLDO3 regulator.
Table 189. VLDO3 control register (VLDO3CTL)
Access: User read/write (150)
Address: 0x70 functional page
R
W
7
6
5
4
LDO3OMODE
VLDO3LPWR
VLDO3STBY
VLDO3EN
0
0
0
X (151)
Default
3
2
1
0
X (151)
X (151)
VLDO3
X (151)
X (151)
= Unimplemented or Reserved
Notes
150. Read: Anytime
Write: Anytime
151. Default value depends on OTP content.
Table 190. VLDO3CTL field descriptions
Field
Description
7
LDO3OMODE
VLDO3 OFF mode bit—LDO3OMODE is used to configure VLDO3 operating mode when a PWRON turn-off event occurs.
0 VLDO3 in OFF mode if a PWRON turn off event occurs
1 VLDO3 in sleep mode if a PWRON turn off event occurs
6
VLDO3LPWR
VLDO3 low-power mode enable bit— When VLDO3LPWR is set to 1, VLDO3 can enter low-power mode per the conditions in
the Table 66.
0 Low-power mode disabled
1 Low-power mode enabled
5
VLDO3STBY
VLDO3 standby enable bit— When VLDO3STBY is set to 1, VLDO3 is turned off during standby mode. Refer to Table 66.
0 VLDO3 is ON during standby mode.
1 VLDO3 is OFF during standby mode.
4
VLDO3EN
3:0
VLDO3
VLDO3 enable bit — VLDO3EN is used to enable or disable the VLDO3 regulator.
0 VLDO3 disabled
1 VLDO3 enabled
VLDO3 output voltage configuration— Refer to Table 63.
PF3000
100
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.5.3.48
VLDO4 control register (VLDO4CTL)
This register is used to configure output voltage, normal, and standby mode operation of the VLDO4 regulator.
Table 191. VLDO4 control register (VLDO4CTL)
Access: User read/write (152)
Address: 0x71 functional page
R
W
7
6
5
4
LDO4OMODE
VLDO4LPWR
VLDO4STBY
VLDO4EN
0
0
0
X (153)
Default
3
2
1
0
X (153)
X (153)
VLDO4
X (153)
X (153)
= Unimplemented or Reserved
Notes
152. Read: Anytime
Write: Anytime
153. Default value depends on OTP content.
Table 192. VLDO4CTL field descriptions
Field
Description
7
LDO4OMODE
VLDO4 OFF mode bit—LDO4OMODE is used to configure VLDO4 operating mode when a PWRON turn-off event occurs.
0 VLDO4 in OFF mode if a PWRON turn off event occurs
1 VLDO4 in sleep mode if a PWRON turn off event occurs
6
VLDO4LPWR
VLDO4 low-power mode enable bit— When VLDO4LPWR is set to 1, VLDO4 can enter low-power mode per the conditions in
the Table 66.
0 Low-power mode disabled
1 Low-power mode enabled
5
VLDO4STBY
VLDO4 standby enable bit— When VLDO4STBY is set to 1, VLDO4 is turned off during standby mode. Refer to Table 66.
0 VLDO4 is ON during standby mode.
1 VLDO4 is OFF during standby mode.
VLDO4 enable bit — VLDO4EN is used to enable or disable the VLDO4 regulator.
0 VLDO4 disabled
1 VLDO4 enabled
4
VLDO4EN
3:0
VLDO4
6.6.5.3.49
VLDO4 output voltage configuration— Refer to Table 63.
Page selection register
This register is used to access the extended register pages.
Table 193. Page selection register
Access: User read/write (154)
Address: 0x7F functional page
7
6
5
4
3
2
R
0
0
0
PAGE
W
Default
1
0
0
0
0
0
0
= Unimplemented or Reserved
Notes
154. Read: Anytime
Write: Anytime
PF3000
NXP Semiconductors
101
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 194. Page register field descriptions
Field
Description
3:0
PAGE
6.6.6
Register page selection — The PAGE field is used to select one of the three available register pages.
0000 Functional page selected
0001 Extended page 1 selected
0010 Extended page 2 selected
Register map
The register map is comprised of thirty-two pages, and its address and data fields are each eight bits wide. Only the first two pages can
be accessed. On each page, registers 0 to 0x7F are referred to as 'functional', and registers 0x80 to 0xFF as 'extended'. On each page,
the functional registers are the same, but the extended registers are different. To access registers in Extended page 1, one must first write
0x01 to the page register at address 0x7F, and to access registers Extended page 2, one must first write 0x02 to the page register at
address 0x7F. To access the Functional page from one of the extended pages, no write to the page register is necessary.
Registers that are missing in the sequence are reserved; reading from them returns a value 0x00, and writing to them has no effect. The
contents of all registers are given in the tables defined in this chapter; each table is structure as follows:
Name: Name of the bit
Bit #: The bit location in the register (7-0)
R/W: Read / Write access and control
• R is read-only access
• R/W is read and write access
• RW1C is read and write access with write 1 to clear
Reset: Reset signals are color coded based on the following legend.
Bits reset by SC and VCOREDIG_PORB
Bits reset by PWRON or loaded default or OTP configuration
Bits reset by DIGRESETB
Bits reset by PORB or RESETBMCU
Bits reset by VCOREDIG_PORB
Bits reset by POR or OFFB
Default: The value after reset, as noted in the default column of the memory map.
• Fixed defaults are explicitly declared as 0 or 1.
• “X” corresponds to Read/Write bits that are initialized at start-up, based on the OTP fuse settings or default if VDDOTP = 1.5 V. Bits are
subsequently I2C modifiable, when their reset has been released. “X” may also refer to bits that may have other dependencies. For
example, some bits may depend on the version of the IC, or a value from an analog block, for instance the sense bits for the interrupts.
PF3000
102
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
6.6.6.1
Register map
Table 195. Functional page
BITS[7:0]
Add
Register
name
R/W
Default
00
DeviceID
R
8'b0011_0000
03
04
05
06
07
08
09
0A
0E
0F
10
11
12
13
1A
R
FABID
R
INTMASK0
INTSENSE0
INTSTAT1
INTMASK1
INTSENSE1
INTSTAT3
INTMASK3
INTSENSE3
INTSTAT4
INTMASK4
INTSENSE4
COINCTL
6
5
4
–
–
–
–
0
0
1
1
3
2
RW1C
R/W
R
RW1C
R/W
R
RW1C
R/W
R
RW1C
R/W
R
R/W
1
0
DEVICE ID [3:0]
0
0
FULL_LAYER_REV[3:0]
SILICONREVI
D
INTSTAT0
7
0
0
METAL_LAYER_REV[3:0]
8'b0001_0000
0
0
0
1
0
0
0
–
–
–
–
0
0
0
0
0
0
0
0
–
–
THERM130I
THERM125I
THERM120I
THERM110I
LOWVINI
PWRONI
0
0
0
0
0
0
0
0
–
–
THERM130M
THERM125M
THERM120M
THERM110M
LOWVINM
PWRONM
0
0
1
1
1
1
1
1
VDDOTPS
ICTESTS
THERM130S
THERM125S
THERM120S
THERM110S
LOWVINS
PWRONS
0
0
x
x
x
x
x
x
–
–
–
SW3FAULTI
SW2FAULTI
–
SW1BFAULTI
SW1AFAULTI
0
0
0
0
0
x
0
0
–
–
–
SW3FAULTM
SW2FAULTM
–
0
1
1
1
1
1
–
–
–
SW3FAULTS
SW2FAULTS
–
0
x
x
x
x
x
FAB[1:0]
0
FIN[1:0]
8'b0000_0000
8'b0000_0000
8'b0011_1111
8'b00xx_xxxx
8'b0000_0000
SW1BFAULTM SW1AFAULTM
8'b0111_1111
1
1
SW1BFAULTS SW1AFAULTS
8'b0xxx_xxxx
x
x
OTP_ECCI
OTP AUTO
BLOW DONE
–
–
–
VPWROVI
–
SWBSTFAULT
I
0
0
0
0
0
0
0
0
OTP_ECCM
OTP_AUTO_B
LOW_DONEM
–
–
–
VPWROVI
–
SWBSTFAULT
M
1
1
0
0
0
1
0
1
OTP_ECCS
OTP_AUTO_B
LOW_DONES
–
–
–
VPWROVS
–
SWBSTFAULT
S
0
0
0
0
0
0
0
0
–
–
0
0
0
0
0
–
–
VLDO4
FAULTM
VLDO3
FAULTM
V33
FAULTM
0
0
1
1
1
1
1
1
–
–
VLDO4
FAULTS
VLDO3
FAULTS
V33
FAULTS
VCC_SD
FAULTS
VLDO2
FAULTS
VLDO1
FAULTS
0
0
x
x
x
x
x
x
–
–
–
–
COINCHEN
0
0
0
0
0
8'b0000_0000
8'b1100_0101
8'b0000_000x
VLDO4FAULTI VLDO3FAULTI
V33FAULTI
8'b0000_0000
8'b0011_1111
8'b00xx_xxxx
VCC_SDFAUL
VLDO2FAULTI VLDO1FAULTI
TI
0
0
VCC_SDFAUL VLDO2FAULT
TM
M
0
VLDO1FAULT
M
VCOIN[2:0]
8'b0000_0000
0
0
0
PF3000
NXP Semiconductors
103
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 195. Functional page (continued)
BITS[7:0]
Add
Register
name
R/W
Default
1B
PWRCTL
R/W
8'b0001_0000
7
6
REGSCPEN
STANDBYINV
0
0
5
4
3
STBYDLY[1:0]
0
2
PWRONBDBNC[1:0]
1
1
0
PWRONRSTE
N
RESTARTEN
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
–
–
–
–
–
–
MEMA[7:0]
1C
MEMA
R/W
8'b0000_0000
0
0
0
0
MEMB[7:0]
1D
MEMB
R/W
8'b0000_0000
0
0
0
0
0
0
0
0
MEMC[7:0]
1E
MEMC
R/W
8'b0000_0000
MEMD[7:0]
1F
20
21
22
23
24
2E
2F
30
31
32
35
36
37
MEMD
SW1AVOLT
SW1ASTBY
SW1AOFF
SW1AMODE
SW1ACONF
SW1BVOLT
SW1BSTBY
SW1BOFF
SW1BMODE
SW1BCONF
SW2VOLT
SW2STBY
SW2OFF
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
8'b0000_0000
0
0
0
0
–
–
–
0
0
0
–
–
–
0
0
0
–
–
–
0
0
0
–
SW1A[4:0]
8'b000x_xxxx
–
–
–
SW1ASTBY[4:0]
8'b000x_xxxx
–
–
–
SW1AOFF[4:0]
8'b000x_xxxx
–
–
–
–
–
–
SW1APHASE[1:0]
SW1AFREQ[1:0]
–
SW1AILIM
–
0
0
0
0
1
0
1
0
–
–
SW1AOMODE
–
0
0
0
x
–
SW1ADVSSP
EED
x
-1
0
–
–
–
0
x
x
–
–
–
SW1AMODE[3:0]
8'b0000_xxxx
8'bxx00_0100
0
–
SW1B[4:0]
8'b0xx1_0010
1
0
0
SW1BSTBY[4:0]
8'b0xx1_0010
0
x
x
–
–
–
1
0
x
x
1
–
–
SW1BOMODE
–
0
0
0
–
–
SW1BDVS
SPEED
x
0
0
SW1BOFF[4:0]
8'b0xx1_0010
0
0
SW1BMODE[3:0]
8'b0001_1000
–
–
–
SW1BPHASE[1:0]
SW1BFREQ[1:0]
–
SW1BILIM
–
0
0
–
0
0
–
–
–
–
SW2_HI
0
x
x
x
–
–
–
–
–
SW2_HI
0
x
x
x
–
–
–
–
–
SW2_HI
0
x
x
x
–
8'bx100_0100
–
–
SW2[2:0]
8'b0xxx_0110
–
–
–-
SW2STBY[2:0]
8'b0xxx_xxxx
–
–
–-
SW2STBY[2:0]
8'b0xxx_xxxx
–
–
–-
PF3000
104
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 195. Functional page (continued)
BITS[7:0]
Add
Register
name
R/W
Default
38
SW2MODE
R/W
8'b0010_1000
39
3C
3D
3E
3F
40
SW2CONF
SW3VOLT
SW3STBY
SW3OFF
SW3MODE
SW3CONF
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
–
–
SW2OMODE
–
0
0
1
0
–
SW2DVS
SPEED
x
–
0
1
–
–
–
–
0
x
x
x
–
–
–
–
0
x
x
x
–
–
–
–
8'bxx01_0100
69
6A
6B
6C
6D
6E
6F
70
71
7F
SWBSTCTL
LDOGCTL
VREFDDRCTL
VSNVSCTL
VLDO1CTL
VLDO2CTL
VCC_SDCTL
V33CTL
VLDO3CTL
VLDO4CTL
Page Register
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
2
1
0
SW2MODE[3:0]
1
SW2PHASE[1:0]
0
SW2FREQ[1:0]
–
–
0
0
–
SW2ILIM
0
0
–
–
–
–
–
–
SW3[3:0]
8'b0xxx_1100
–
–
SW3STBY[3:0]
8'b0xxx_1100
–
–
SW3OFF[3:0]
8'b0xxx_1100
0
x
x
x
–
–
SW3OMODE
–
0
0
1
1
–
SW3DVS
SPEED
x
–
–
–
SW3MODE[3:0]
8'b0011_1000
8'bxx10_0100
–
66
3
1
SW3PHASE[1:0]
1
SWBST1STBYMODE[1:0]
0
–
8'b0xx0_10xx
0
SW3FREQ[1:0]
–
–
SWBST1MODE[1:0]
–
0
0
–
SW3ILIM
0
0
SWBST1VOLT[1:0]
0
–
–
0
–
–
–
–
–
–
–
–
–
–
–
STBY_LP_B
0
x
x
x
x
x
x
x
–
–
–
VREFDDREN
–
–
–
–
0
0
0
–
0
0
0
0
–
–
–
–
–
0
0
0
0
0
LDO1OMODE
VLDO1LPWR
VLDO1STBY
VLDO1EN
0
0
0
–
LDO2OMODE
VLDO2LPWR
VLDO2STBY
VLDO2EN
0
0
0
VCC_SDOMO
DE
VCC_SDLPW
R
0
8'b0xxx_xxx0
8'b000x_0000
VSNVSVOLT[2:0]
8'b0000_0110
1
1
0
–
–-
–
–-
VLDO1[3:0]
8'b010x_1110
–
–
–
–
–
VCC_SDSTBY
VCC_SDEN
–
–
0
0
–
x
x
V33OMODE
V33LPWR
V33STBY
V33EN
–
–
0
0
0
–
x
x
VLDO3OMOD
E
VLDO3LPWR
VLDO3STBY
VLDO3EN
0
0
0
–
VLDO4OMOD
E
VLDO4LPWR
VLDO4STBY
VLDO4EN
0
0
0
–
–
–
–
0
0
0
VLDO2[3:0]
8'b000x_1000
8'b000x_xx10
VCC_SD[1:0]
–
–
V33[1:0]
8'b000x_xx10
8'b010x_0000
8'b000x_xxxx
–
–
–
–
–
–
0
0
VLDO3[3:0]
–
–
VLDO4[3:0]
–
–
PAGE[4:0]
8'b0000_0000
0
0
0
PF3000
NXP Semiconductors
105
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 196. Extended page 1
Address
80
84
8A
BITS[7:0]
Register
Name
TYPE
OTP FUSE
READ EN
R/W
OTP LOAD
MASK
OTP ECC SE1
R/W
R
Default
8'bxxx0_0000
8C
OTP ECC DE1
R
8'bxxx0_0000
8D
RSVD
R
8'bxxx0_0000
A0
OTP SW1A
VOLT
R/W
8'b00xx_xxxx
3
2
1
0
–
–
–
–
–
–
–
OTP FUSE
READ EN
0
0
0
x
x
x
x
x
START
RL PWBRTN
FORCE
PWRCTL
RL PWRCTL
RL OTP
RL OTP ECC
RL OTP
FUSE
RL TRIM FUSE
0
0
0
0
0
0
0
0
–
–
–
ECC5_SE
ECC4_SE
ECC3_SE
ECC2_SE
ECC1_SE
x
x
x
0
0
0
0
0
–
–
–
ECC5_DE
ECC4_DE
ECC3_DE
ECC2_DE
ECC1_DE
x
x
x
0
0
0
0
0
x
x
OTP_SW1A_VOLT[4:0]
x
x
x
x
x
x
OTP_SW1A_SEQ[2:0]
A1
OTP SW1A
SEQ
A2
OTP SW1x
CONFIG
R/W
OTP SW1B
VOLT
R/W
OTP SW1B
SEQ
R/W
RSVD
R/W
AC
4
8'bxxx0_0000
R
AA
5
8'b0000_0000
RSVD
A9
6
8'b000x_xxx0
8B
A8
7
–
–
–
–
x
x
x
x
OTP_SW1_CONFIG[1:0]
x
x
AE
B0
x
x
x
x
x
x
BC
x
x
OTP_SW1B_SEQ[2:0]
8'b00xx_xxxx
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
8'b00xx_xxxx
OTP_SW2_HI
OTP SW2
VOLT
R/W
OTP SW2 SEQ
R/W
OTP_SW2_VOLT[2:0]
8'b0xxx_xxxx
x
x
x
x
x
x
x
x
x
x
x
x
OTP SW2
CONFIG
R/W
–
–
–
–
–
–
0
0
0
x
x
0
OTP SW3
VOLT
R/W
OTP SW3 SEQ
R/W
OTP_SW2_SEQ[2:0]
R/W
x
OTP_SW2_FREQ[1:0]
x
x
OTP_SW3_VOLT[3:0]
x
x
x
x
x
x
x
OTP_SW3_SEQ[2:0]
8'b0xxx_xxxx
x
x
x
x
x
–
OTP SWBST
VOLT
x
8'b0xxx_xxxx
x
R/W
x
8'b0000_00xx
–
OTP SW3
CONFIG
x
8'b0xxx_xxxx
x
B2
x
OTP_SW1B_VOLT[4:0]
–
B1
x
8'b00xx_xxxx
–
AD
OTP_SW1x_FREQ[1:0]
8'b000x_xxXx
x
x
OTP_SW3_FREQ[1:0]
8'b0xxx_xxxx
x
x
x
x
x
x
–
–
–
–
–
–
0
0
0
0
0
0
x
x
OTP_SWBST_VOLT[1:0]
8'b0000_00xx
0
0
PF3000
106
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 196. Extended page 1 (continued)
Address
BD
C0
C4
C8
C9
CC
CD
D0
D1
D4
BITS[7:0]
Register
Name
TYPE
OTP SWBST
SEQ
R/W
OTP VSNVS
VOLT
R/W
RSVD
R/W
OTP VLDO1
VOLT
Default
7
6
5
4
3
2
1
0
–
–
–
–
–
0
0
0
0
0
–
–
–
–
–
0
0
0
0
0
0
0
0
–
–
–
–
–
–
–
–
0
0
0
x
x
x
x
x
OTP_SWBST_SEQ[2:0]
8'b0000_xxxx
0
0
0
OTP_VSNVS_VOLT[2:0]
8'b0000_0xxx
8'b000x_x0xx
OTP_VLDO1_VOLT[3:0]
R/W
8'b0000_xxxx
0
0
0
0
x
x
x
x
OTP_VLDO1_SEQ[3:0]
OTP VLDO1
SEQ
R/W
OTP VLDO2
VOLT
R/W
OTP VLDO2
SEQ
R/W
OTP VCC_SD
VOLT
R/W
OTP VCC_SD
SEQ
R/W
8'b0000_xxxx
0
0
0
0
x
x
x
x
OTP_VLDO2_VOLT[3:0]
8'b0000_xxxx
0
0
0
0
x
x
x
x
OTP_VLDO2_SEQ[3:0]
8'b0000_xxxx
0
0
0
0
x
x
x
–
x
OTP_VCC_SD_VOLT[2:0]
8'b0000_xxxx
0
0
0
0
x
x
x
x
OTP_VCC_SD_SEQ[2:0]
8'b0000_xxxx
0
0
0
0
0
x
x
x
OTP_V33_VOLT[2:0]
OTP V33
VOLT
R/W
OTP V33 SEQ
R/W
8'b0000_xxxx
0
0
0
0
x
x
x
x
OTP_V33_SEQ[3:0]
D5
8'b0000_xxxx
0
D8
D9
DC
DD
E0
E4
E5
E6
0
0
x
x
x
x
OTP_VLDO3_VOLT[3:0]
OTP VLDO3
VOLT
R/W
OTP VLDO3
SEQ
R/W
OTP VLDO4
VOLT
R/W
8'b0000_xxxx
0
0
0
0
x
x
x
x
OTP_VLDO3_SEQ[3:0]
8'b0000_xxxx
0
0
0
0
x
x
x
x
OTP_VLDO4_VOLT[3:0]
8'b0000_xxxx
0
0
0
0
x
x
x
x
OTP_VLDO4_SEQ[3:0]
OTP VLDO4
SEQ
R/W
OTP PU
CONFIG1
R/W
8'b0000_xxxx
0
OTP FUSE
POR1
R/W
RSVD
R/W
RSVD
0
R/W
0
0
0
x
OTP_PWRON
_CFG
8'b000x_xxxx
x
x
OTP_SWDVS
_CLK
x
OTP_SEQ_CL
K_SPEED
x
x
x
x
x
x
x
x
TBB_POR
–
–
–
–
–
–
–
0
0
0
0
0
0
x
0
–
–
–
–
–
–
–
0
0
0
0
0
0
0
–
–
–
–
–
–
–
0
0
0
0
0
0
0
8'b0000_00x0
8'b0000_00x0
8'b0000_00x0
PF3000
NXP Semiconductors
107
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 196. Extended page 1 (continued)
Address
E7
E8
F0
F1
F7
FF
BITS[7:0]
Register
Name
TYPE
RSVD
R
OTP PWRGD
EN
R/W/M
RSVD
R/W
RSVD
OTP BLOWN
OTP I2C
ADDR
R/W
R/W
R/W
Default
7
6
5
4
3
2
1
0
–
–
–
–
–
–
–
0
0
0
0
0
0
0
–
–
–
–
–
–
–
OTP_PG_EN
0
0
0
0
0
0
x
0
–
–
–
0
0
0
x
x
x
x
x
–
–
–
0
0
0
x
x
x
x
x
8'b0000_00x0
8'b0000_000x
8'b000x_xxxx
8'b000x_xxxx
–
–
–
–
–
–
–
OTP_BLOWN
0
0
0
0
0
0
0
x
8'b0000_000x
8'b0000_1xxx
USE_DEFAUL
T_ADD
I2C_SLV
ADDR[3]
–
0
0
0
0
OTP_I2C_SLV ADDR[2:0]
1
x
x
x
2
1
0
Table 197. Extended page 2
Address
81
83
84
85
BITS[7:0]
Register
Name
TYPE
SW1A
PWRSTG
R/W
SW1B
PWRSTG
SW2 PWRSTG
SW3 PWRSTG
R
R
R
Default
8'b1111_1111
8'b1111_1111
8'b1111_1111
8'b1111_1111
88
PWRCTRL
OTP CTRL
8D
I2C WRITE
ADDRESS
TRAP
R/W
8'b0000_0000
8E
I2C TRAP
PAGE
R/W
8'b0000_0000
R
8'b0000_0001
8F
I2C TRAP
CNTR
R/W
8'b0000_0000
90
IO DRV
R/W
8'b00xx_xxxx
D0
OTP AUTO
ECC0
R/W
8'b0000_0000
D8
Reserved
–
8'b0000_0000
D9
Reserved
–
8'b0000_0000
7
6
5
4
3
RSVD
RSVD
RSVD
RSVD
RSVD
1
1
1
1
1
RSVD
RSVD
RSVD
RSVD
RSVD
1
1
1
1
1
RSVD
RSVD
RSVD
RSVD
RSVD
1
1
1
1
1
RSVD
RSVD
RSVD
1
1
1
1
1
–
0
0
0
1
1
1
SW2_PWRSTG[2:0]
RSVD
1
RSVD
–
1
SW1B_PWRSTG[2:0]
RSVD
1
RSVD
–
SW1A_PWRSTG[2:0]
1
1
1
SW3_PWRSTG[2:0]
RSVD
1
1
1
PG_SHDWN_
EN
–
–
–
OTP_PWRGD
_EN
0
0
0
0
1
0
0
0
0
0
0
0
0
0
I2C_WRITE_ADDRESS_TRAP[7:0]
0
0
0
LET_IT_ ROLL
RSVD
RSVD
0
0
0
0
0
0
0
I2C_TRAP_PAGE[4:0]
I2C_WRITE_ADDRESS_COUNTER[7:0]
0
0
0
0
0
0
x
x
x
x
x
x
AUTO_ECC
_BANK5
AUTO_ECC
_BANK4
AUTO_ECC_B
ANK3
AUTO_ECC
_BANK2
AUTO_ECC_B
ANK1
0
0
0
0
0
0
0
0
SDA_DRV[1:0]
0
RSVD
–
–
–
0
0
0
INTB_DRV[1:0]
RESETBMCU_DRV[1:0]
AUTO_BLOW_TIME[7:0]
0
0
0
START
RELOAD
EN_RW
0
0
0
0
0
AUTO_FUSE_ AUTO_FUSE_ AUTO_FUSE_ AUTO_FUSE_ AUTO_FUSE_
BLOW5
BLOW4
BLOW3
BLOW2
BLOW1
0
0
0
0
0
PF3000
108
NXP Semiconductors
FUNCTIONAL DESCRIPTION AND APPLICATION INFORMATION
Table 197. Extended page 2 (continued)
Address
E1
E2
E3
E4
E5
F1
F2
F3
F4
F5
BITS[7:0]
Register
Name
TYPE
OTP ECC
CTRL1
R/W
OTP ECC
CTRL2
OTP ECC
CTRL3
OTP ECC
CTRL4
OTP ECC
CTRL5
OTP FUSE
CTRL1
OTP FUSE
CTRL2
OTP FUSE
CTRL3
OTP FUSE
CTRL4
OTP FUSE
CTRL5
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Default
8'b0000_0000
8'b0000_0000
8'b0000_0000
8'b0000_0000
8'b0000_0000
8'b0000_0000
8'b0000_0000
8'b0000_0000
8'b0000_0000
8'b0000_0000
7
6
RSVD
ECC1_CALC_
CIN
0
0
RSVD
ECC2_CALC_
CIN
0
0
RSVD
ECC3_CALC_
CIN
0
0
RSVD
ECC4_CALC_
CIN
0
0
RSVD
ECC5_CALC_
CIN
0
0
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
0
ECC1_CIN_TBB[5:0]
0
0
0
0
ECC2_CIN_TBB[5:0]
0
0
0
0
ECC3_CIN_TBB[5:0]
0
0
0
0
ECC4_CIN_TBB[5:0]
0
0
0
0
ECC5_CIN_TBB[5:0]
0
0
–
–
–
–
0
0
0
0
–
–
–
–
0
0
0
0
–
–
–
–
0
0
0
0
–
–
–
–
0
0
0
0
–
–
–
–
0
0
0
0
0
0
ANTIFUSE1_E ANTIFUSE1_L ANTIFUSE1_R
N
OAD
W
0
0
0
ANTIFUSE2_E ANTIFUSE2_L ANTIFUSE2_R
N
OAD
W
0
0
0
ANTIFUSE3_E ANTIFUSE3_L ANTIFUSE3_R
N
OAD
W
0
0
0
ANTIFUSE4_E ANTIFUSE4_L ANTIFUSE4_R
N
OAD
W
0
0
0
ANTIFUSE5_E ANTIFUSE5_L ANTIFUSE5_R
N
OAD
W
0
0
0
BYPASS1
0
BYPASS2
0
BYPASS3
0
BYPASS4
0
BYPASS5
0
PF3000
NXP Semiconductors
109
TYPICAL APPLICATIONS
7
Typical applications
7.1
Application diagram
SW1AOUT
1.0uF
VIN
VLDO1IN
2.2uF
1.0uF
SW1A
1.0 A
Buck
VLDO2IN
4.7uF
1.0uF
PF3000
VLDO1
100 mA
VLDO1
V33
VLDO2
250 mA
VLDO2
O/P
Drive
1.5uH
SW1ALX
SW1AIN
VIN
100nF
4.7uF
2 x 22uF
SW1AFB
VIN
VLDO34IN
SW1BOUT
VLDO3
100 mA
VLDO3
2.2uF
4.7uF
SW1B
1.75 A
Buck
VLDO4
350 mA
VLDO4
Core Control logic
4.7uF
100nF
2 x 22uF
GNDREF1
SW2OUT
V33
350 mA
V33
VIN
10uF
VIN
SW1BFB
Initialization State Machine
4.7uF
1.5uH
SW1BLX
SW1BIN
VCC_SD
100 mA
VCC_SD
2.2uF
O/P
Drive
SW2
1.25 A
Buck
Supplies
Control
OTP
VIN2
O/P
Drive
1.5uH
SW2LX
SW2IN
VIN
4.7uF
100nF
2 x 22uF
SW2FB
VDDOTP
VDDIO
VDDIO
CONTROL
I2C
Interface
4.7k
4.7k
100nF
SCL
To
MCU
SDA
DVS CONTROL
DVS Control
SW3OUT
O/P
Drive
SW3
1.5 A
Buck
1.5uH
SW3LX
SW3IN
VIN
4.7uF
100nF
2 x 22uF
SW3FB
GNDREF2
1.0uF
I2C
Register
map
VCOREDIG
220nF
VCOREREF
1.0uF
Reference
Generation
VCORE
VIN
VIN2
Trim-In-Package
SWBST
600 mA
Boost
Clocks and
resets
O/P
Drive
2.2uH
SWBSTLX
10uF
SWBSTOUT
2 x 22uF
SWBSTFB
GNDREF
1.0uF
VREFDDR
SW3OUT
VINREFDDR
Clocks
100nF
32kHz and 16MHz
VHALF
1.0uF
100nF
+5V
VPWR
VREF
2 x 47uF
4.7uF
100nF
LDOG
Package Pin Legend
Output Pin
LDO
Input Pin
Bi-directional Pin
VIN*
VDDIO
100k
VDDIO
100k
0.47uF
To/From Processor
SD_VSEL
VSNVS
INTB
220nF
Best
of
Supply
VSNVS
Coin Cell
Battery
Li Cell
Charger
STANDBY
LICELL
RESETBMCU
1.0uF
ICTEST
100nF
PWRON
2 x 47uF
VIN
Notes:
*: The PF3000 can also be powered through VIN directly (ie. 3.7V Li-ion Battery
application). In this case, the Front-End LDO regulator is not used : the external
MOSFET has to be unpopulated and VPWR pin must be connected to GND .
The capacitors on VPWR can be removed and only a 2.2uF capacitor on VIN to
ground is necessary in this case.
- Unused BUCK and BOOST: Connect input pin SWxIN to VIN with a 0.1 uF
bypass capacitor to ground. Leave LX and FB pins floating.
- Unused LDO: output can be left floating . Connect input pin to GND if not shared
with other LDOs.
Figure 36. Typical application schematic
PF3000
110
NXP Semiconductors
BILL OF MATERIALS
8
Bill of materials
The following table provides a complete list of the recommended components on a full featured system using the PF3000 Device for
-40 °C to 85 °C applications. Components are provided with an example part number; equivalent components may be used.
Table 198. Bill of materials for -40 °C to 85 °C applications
Value
Qty
Description
Part#
Manufacturer
Component/Pin
PMIC
N/A
1
Power management IC
PF3000
NXP
IC
IND PWR 1.5 μH at 1.0 MHz 2.9 A
20% 2016
DFE201610E-1R5M
TOKO INC.
SW1A, SW1B, SW2, SW3
inductors
IND PWR 1.5 μH at 1.0 MHz 2.2 A
20% 1210
BRL3225T1R5M
Taiyo Yuden
Alternate for low-power
applications
Buck regulators
1.5 µH
4
4.7 µF
4
CAP CER 4.7 µF 10 V 20% X5R
0402
GRM155R61A475MEAA
Murata
SW1A, SW1B, SW2, SW3 input
capacitors
0.1 µF
4
CAP CER 0.1 µF 10 V 20% X5R
0201
GRM033R61A104ME84
Murata
SW1A, SW1B, SW2, SW3 input
capacitors (optional)
22 µF
8
CAP CER 22 µF 10 V 20% X5R
0603
GRM188R61A226ME15
Murata
SW1A, SW1B, SW2, SW3 output
capacitors
IND PWR 2.2 µH at 1.0 MHz 2.4 A
20% 2016
DFE201610E-2R2M
TOKO INC.
SWBST inductor
IND PWR 2.2 µH at 1.0 MHz
1.85 A 20% 1210
BRL3225T2R2M
Taiyo Yuden
Alternate for low-power
applications
Boost regulator
2.2 µH
1
10 µF
1
CAP CER 10 µF 10 V 20% X5R
0402
GRM155R61A106ME11
Murata
SWBST input capacitor
N/A
1
DIODE SCH PWR RECT 1.0 A
20 V SMT
MBR120LSFT3G
ON Semi
SWBST diode
22 µF
2
CAP CER 22 µF 10 V 20% X5R
0603
GRM188R61A226ME15D
Murata
SWBST output capacitors
Linear regulators
1.0 µF
3
CAP CER 1.0 µF 10 V 20% X5R
0201
GRM033R61A105ME44
Murata
VLDO1, VLDO2, VLDO3 and
VLDO4 input capacitors
2.2 µF
3
CAP CER 2.2 µF 10 V 20% X5R
0201
GRM033R61A225ME47
Murata
VLDO1, VLDO3, VCC_SD
output capacitors
10 µF
1
CAP CER 10 µF 10 V 20% X5R
0402
GRM155R61A106ME11
Murata
V33 and VCC_SD input
capacitor
4.7 µF
3
CAP CER 4.7 µF 10 V 20% X5R
0402
GRM155R61A475MEAA
Murata
VLDO2, VLDO4, V33 output
capacitors
1.0 µF
4
CAP CER 1.0 µF 10 V 20% X5R
0201
GRM033R61A105ME44
Murata
VCORE, VCOREDIG,
VREFDDR, VINREFDDR
capacitors
0.22 µF
2
CAP CER 0.22 µF 10 V 20% X5R
0201
GRM033R61A224ME90
Murata
VCOREREF and Coin Cell
output capacitors
0.47 µF
1
CAP CER 0.47 µF 10 V 20% X5R
0201
GRM033R61A474ME90
Murata
VSNVS output capacitor
47 µF
4
CAP CER 47 µF 10 V 20% X5R
0805
GRM21BR61A476ME15
Murata
Front-end LDO capacitors for
VIN and VPWR.
Miscellaneous
PF3000
NXP Semiconductors
111
BILL OF MATERIALS
Table 198. Bill of materials for -40 °C to 85 °C applications (continued)
Value
Qty
Description
Part#
Manufacturer
Component/Pin
2.2 µF
1
CAP CER 2.2 µF 10 V 20% X5R
0201
GRM033R61A225ME47
Murata
VIN input capacitor when not
using Front-end LDO
0.1 µF
5
CAP CER 0.1 µF 10 V 10% X5R
0201
GRM033R61A104KE84
Murata
VDDIO, VHALF, VPWR, VIN
input capacitors (optional)
N/A
1
TRAN PMOS 11. A 12 V 12 SOT1220
PMPB15XP
NXP
External MOSFET
100 k
2
RES MF 100 k 1/16 W 1% 0402
RC0402FR-07100KL
Yageo America
Pull-up resistors
4.7 k
2
RES MF 4.70 k 1/20 W 1% 0201
RC0201FR-074K7L
Yageo America
I²C pull-up resistors
The following table provides a complete list of the recommended components on a full featured system using the PF3000 Device for
-40 °C to 105 °C applications. Components are provided with an example part number, equivalent components may be used.
Table 199. Bill of materials for -40 °C to 105 °C applications
Value
Qty
Description
Part#
Manufacturer
Component/Pin
PMIC
N/A
1
Power management IC
PF3000
NXP
IC
IND PWR 1.5 µH at 1.0 MHz 2.9 A
20% 2016
DFE201610E-1R5M
Toko Inc.
SW1A, SW1B, SW2, SW3
inductors
IND PWR 1.5 µH at 1.0 MHz 2.2 A
20% 1210
BRL3225T1R5M
Taiyo Yuden
Alternate for low-power
applications
Buck regulators
1.5 µH
4
4.7 µF
4
CAP CER 4.7 µF 10 V 10% X7S
0603
GRM188C71A475KE11
Murata
SW1A, SW1B, SW2, SW3 input
capacitors
0.1 µF
4
CAP CER 0.1 µF 10 V 10% X7S
0201
GRM033C71A104KE14
Murata
SW1A, SW1B, SW2, SW3 input
capacitors (optional)
22 µF
8
CAP CER 22 µF 10 V 20% X7T
0805
GRM21BD71A226ME44
Murata
SW1A, SW1B, SW2, SW3 output
capacitors
IND PWR 2.2 µH at 1.0 MHz 2.4 A
20% 2016
DFE201610E-2R2M
Toko Inc.
SWBST Inductor
IND PWR 2.2 µH at 1.0 MHz
1.85 A 20% 1210
BRL3225T2R2M
Taiyo Yuden
Alternate for low-power
applications
Boost regulator
2.2 µH
1
10 µF
1
CAP CER 10 µF 10 V 20% X7T
0603
GRM188D71A106MA73
Murata
SWBST input capacitor
N/A
1
DIODE SCH PWR RECT 1.0 A
20 V SMT
MBR120LSFT3G
ON Semi
SWBST diode
22 µF
2
CAP CER 22 µF 10 V 20% X5R
0603
GRM188R61A226ME15D
Murata
SWBST output capacitors
Linear regulators
1.0 µF
3
CAP CER 1.0 µF 10 V 10% X7S
0402
GRM155C71A105KE11
Murata
VLDO1, VLDO2, VLDO3 and
VLDO4 input capacitors
2.2 µF
3
CAP CER 2.2 µF 10 V 10% X7S
0402
GRM155C71A225KE11
Murata
VLDO1, VLDO3, VCC_SD
output capacitors
10 µF
1
CAP CER 10 µF 10 V 20% X7T
0603
GRM188D71A106MA73
Murata
V33 and VCC_SD input capacitor
PF3000
112
NXP Semiconductors
BILL OF MATERIALS
Table 199. Bill of materials for -40 °C to 105 °C applications (continued)
Value
Qty
Description
Part#
Manufacturer
Component/Pin
4.7 µF
3
CAP CER 4.7 µF 10 V 10% X7S
0603
GRM188C71A475KE11
Murata
VLDO2, VLDO4, V33 output
capacitors
1.0 µF
4
CAP CER 1.0 µF 10 V 10% X7R
0402
GRM155C71A105KE11
Murata
VCORE, VCOREDIG,
VREFDDR, VINREFDDR
capacitors
0.22 µF
2
CAP CER 0.22 µF 10 V 10% X7R
0402
GRM155R71A224KE01
Murata
VCOREREF and coin cell output
capacitors
0.47 µF
1
CAP CER 0.47 µF 10 V 20% X5R
0201
GRM155R71A474KE01
Murata
VSNVS output capacitor
47 µF
4
CAP CER 47 µF 10 V 20% X7R
1210
GRM32ER71A476ME15
Murata
Front-end LDO capacitors for
VIN and VPWR.
2.2 µF
1
CAP CER 2.2 µF 10 V 10% X7S
0402
GRM155C71A225KE11
Murata
VIN input capacitor when not
using front-end LDO
0.1 µF
5
CAP CER 0.1 µF 10 V 10% X7S
0201
GRM033C71A104KE14
Murata
VDDIO, VHALF, VPWR, VIN
input capacitors (optional)
N/A
1
TRAN PMOS 11. A 12 V 12 SOT1220
PMPB15XP
NXP
External MOSFET
100 k
2
RES MF 100k 1/16 W 1% 0402
RC0402FR-07100KL
Yageo America
Pull-up resistors
4.7 k
2
RES MF 4.70k 1/20 W 1% 0201
RC0201FR-074K7L
Yageo America
I²C pull-up resistors
Miscellaneous
PF3000
NXP Semiconductors
113
THERMAL INFORMATION
9
Thermal information
9.1
Rating data
The thermal rating data of the packages has been simulated with the results listed in Thermal ratings. Junction to ambient thermal
resistance nomenclature: the JEDEC specification reserves the symbol RθJA or θJA (Theta-JA) strictly for junction-to-ambient thermal
resistance on a 1s test board in natural convection environment. RθJMA or θJMA (Theta-JMA) is used for both junction-to-ambient on a
2s2p test board in natural convection and for junction-to-ambient with forced convection on both 1s and 2s2p test boards. It is anticipated
that the generic name, Theta-JA, continues to be commonly used. The JEDEC standards can be consulted at http://www.jedec.org.
9.2
Estimation of junction temperature
An estimation of the chip junction temperature TJ can be obtained from the equation:
TJ = TA + (RθJA x PD)
with:
TA = Ambient temperature for the package in °C
RθJA = Junction to ambient thermal resistance in °C/W
PD = Power dissipation in the package in W
The junction to ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal performance.
Unfortunately, there are two values in common usage: the value determined on a single layer board RθJA and the value obtained on a four
layer board RθJMA. Actual application PCBs show a performance close to the simulated four layer board value although this may be
somewhat degraded in case of significant power dissipated by other components placed close to the device.
At a known board temperature, the junction temperature TJ is estimated using the following equation
TJ = TB + (RθJB x PD) with
TB = Board temperature at the package perimeter in °C
RθJB = Junction to board thermal resistance in °C/W
PD = Power dissipation in the package in W
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made.
PF3000
114
NXP Semiconductors
PACKAGING
10
Packaging
10.1
Packaging dimensions
Package dimensions are provided in package drawings. To find the most current package outline drawing, go to www.nxp.com and
perform a keyword search for the drawing's document number. See the Thermal Characteristics section for specific thermal characteristics
for each package.
Table 200. Package drawing information
Package
Suffix
Package outline drawing number
48-pin QFN 7X7 mm - 0.5mm pitch
EP
98ASA00719D
48 QFN 7.0 mm x 7.0 mm WF-type (wettable flank)
ES
98ASA00933D
PF3000
NXP Semiconductors
115
PACKAGING
PF3000
116
NXP Semiconductors
PACKAGING
PF3000
NXP Semiconductors
117
PACKAGING
PF3000
118
NXP Semiconductors
PACKAGING
PF3000
NXP Semiconductors
119
PACKAGING
PF3000
120
NXP Semiconductors
REVISION HISTORY
11
Revision history
Revision
Date
1.0
11/2014
•
Initial release
2.0
2/2015
•
•
•
•
•
•
•
VREFDDR output accuracy spec re-formatted
Added typical performance waveforms
Corrected OTP option 1 set points
LDO current limit specifications updated
VPWR LDO output voltage accuracy specification updated
Updated register names of Extended Page 1 registers to maintain consistency throughout document
Added typical bill of materials
3.0
2/2015
•
•
Corrected Register INTSENSE0 - ADDR 0x07
Added orderable part numbers PC32PF3000A5EP and PC34PF3000A5EP
4.0
6/2015
•
•
•
•
•
•
•
•
•
•
Included i.MX Series processor
Redefined voltages for SW1A and SW1A/B
Corrected typographic errors
Improved bill of materials capacitors
Updated SW1A/B, SW1A, and SW1B Output Voltage Accuracy
Added note on LICELL for Operating Input Voltage
Improved temperature range to 105 °C
Updated ILIM max values for Linear regulators
VCOREDIG/VCOREREF tables updated
Updated LSL of ISW1BLIM to 2.4 A
5.0
6/2015
•
•
•
Replaced i.MX Series by i.MX 7
Added i.MX 6UL processor
Updated Bill of Materials Table 199
•
Added MC32PF3000A6EP, MC34PF3000A6EP, MC32PF3000A7EP, and MC34PF3000A7EP parts
to the Orderable Part Variations Table
Updated Table 42
Removed i.MX 6 DL note on Power Virus
Updated the definition of rated current for switchers and linear regulators
6.0
8/2015
Description of changes
•
•
•
•
•
7.0
3/2016
•
Added 98ASA00933D and the page 1 package image for wettable flank
Changed Table 2, pins 7, 10, 18, and 28, from Bypass with at least a 10 μF to Bypass with at least a
4.7 μF
Added PC33PF3000A0ES, PC33PF3000A3ES, PC33PF3000A4ES, PC33PF3000A5ES,
PC33PF3000A6ES, and PC33PF3000A7ES to Table 2
PF3000
NXP Semiconductors
121
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Home Page:
NXP.com
There are no expressed or implied copyright licenses granted hereunder to design or fabricate any integrated circuits
Web Support:
http://www.nxp.com/support
products herein.
based on the information in this document. NXP reserves the right to make changes without further notice to any
NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular
purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation, consequential or incidental damages. "Typical"
parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications,
and actual performance may vary over time. All operating parameters, including "typicals," must be validated for each
customer application by the customer's technical experts. NXP does not convey any license under its patent rights nor
the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the
following address:
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NXP, the NXP logo, Freescale, the Freescale logo, and SMARTMOS are trademarks of NXP B.V. All other product or
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© 2016 NXP B.V.
Document Number: PF3000
Rev. 7.0
3/2016
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