Data Sheet

Freescale Semiconductor
Technical Data
Document Number: SGTL5000
Rev. 6.0, 11/2013
Low Power Stereo Codec with
Headphone Amp
SGTL5000
The SGTL5000 is a Low Power Stereo Codec with Headphone Amp
from Freescale, and is designed to provide a complete audio solution
for products needing LINEIN, MIC_IN, LINEOUT, headphone-out, and
digital I/O. Deriving it’s architecture from best in class, Freescale
integrated products that are currently on the market. The SGTL5000 is
able to achieve ultra low power with very high performance and
functionality, all in one of the smallest footprints available. Target
markets include media players, navigation devices, smart phones,
tablets, medical equipment, exercise equipment, consumer audio
equipment, etc. Features such as capless headphone design and an
internal PLL help lower overall system cost.
AUDIO CODEC
Features
•
•
•
•
PB-FREE
98ARE10742D
20-PIN QFN
Analog Inputs
• Stereo LINEIN - Support for external analog input
• Stereo LINEIN - Codec bypass for low power
• MIC bias provided
• Programmable MIC gain
• ADC - 85 dB SNR (-60 dB input) and -73 dB THD+N
(VDDA = 1.8 V)
Analog Outputs
• HP Output - Capless design
• HP Output - 62.5 mW max, 1.02 kHz sine into 16  load at 3.3 V
• HP Output - 100 dB SNR (-60 dB input) and -80 dB THD+N
(VDDA = 1.8 V, 16  load, DAC to headphone)
• LINEOUT - 100 dB SNR (-60 dB input) and -85 dB THD+N
(VDDIO = 3.3 V)
Digital I/O
I2S port to allow routing to Application Processor
Integrated Digital Processing
Freescale surround, Freescale bass, tone control/ parametric
equalizer/graphic equalizer clocking/control
PLL allows input of an 8.0 MHz to 27 MHz system clock - standard
audio clocks are derived from PLL
Power Supplies
Designed to operate from 1.62 to 3.6 volts
MP3/FM Input
MIC IN/Speech
Recognition
LINEIN_R
LINEIN_L
MIC_IN
MIC_BIAS
Analog In
(Stereo
Line In,
MIC)
ADC
ORDERING INFORMATION
I2S_LRCLK
I2S_SCLK
I2S
Interface
SGTL5000XNLA3/R2
SGTL5000XNAA3/R2
DAC
SYS_MCLK
Headphone /
Line Out
w/ volume
Audio
Switch
I2S_DOUT
Temperature
Range (TA)
Device
I2S_DIN
Application
Processor
PB-FREE
98ARE10739D
32-PIN QFN
-40 to 85 °C
HP_R
HP_L
LINEOUT_R
LINEOUT_L
Audio
Processing
PLL
I2C/SPI Control
Note: SPI is not supported in the 3.0 mm x 3.0 mm 20-pin QFN package
Figure 1. SGTL5000 Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2008-2013. All rights reserved.
Package
20 QFN
32 QFN
Headphone
Speaker
Amp/Docking
Station/FMTX
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
Analog Gain
LINE_IN
MIC_IN
Analog
Gain
(0 to
22.5dB)
MIC GAIN
(0dB, 20dB,
30dB, 40dB )
Digital Gain
DAC Volume
Control
-90dB to 0dB
ADC
DAC
Headphone Volume Control
-52dB to +12dB
(CHIP_ANA_HP_CTRL)
HP_OUT
Audio
Switch
I2S_DIN
Line Out Volume Control
(CHIP_LINE_OUT_VOL)
I2S_DOUT
Mix
+6dB
AVC
+12dB
Surround
Bass Enhancement
+6dB
LINEOUT
Tone Control /GEQ/PEQ
+12dB
Only Gain is shown for the Digital Audio Processing blocks. For complete description
please see Digital Audio Processing section.
Figure 2. SGTL5000 Simplified Internal Block Diagram
SGTL5000
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
2
14
I2S_LRCLK
VDDA
3
13
SYS_MCLK
HP_L
4
12
VDDIO
VAG
5
11
MIC_BIAS
6
7
8
9
10
LINEOUT_R
LINEOUT_L
LINEIN_R
LINEIN_L
MIC
GND
CTRL_CLK
NC
CTRL_DATA
I2S_DIN
I2S_DOUT
28
27
26
25
GND
1
24 I2S_SCLK
HP_R
2
23 I2S_LRCLK
GND
3
22 NC
HP_VGND
4
VDDA
5
20 VDDIO
HP_L
6
19 NC
AGND
7
18 CPFILT
NC
8
17 NC
21 SYS_MCLK
GND
9
10
20 QFN
Transparent Top View
11
12
13
14
15
16
MIC_BIAS
HP_VGND
29
MIC
I2S_SCLK
30
LINEIN_L
15
31
LINEIN_R
1
32
LINEOUT_L
HP_R
VDDD
16
LINEOUT_R
I2S_DOUT
17
CTRL_ADR0_CS
I2S_DIN
18
VAG
CTRL_DATA
19
CTRL_MODE
CTRL_CLK
20
NC
VDDD
PIN CONNECTIONS
32 QFN
Transparent Top View
Figure 3. SGTL5000 Pin Connections
A functional description can be found in Functional Description, beginning on page 12.
Table 1. SGTL5000 Pin Definitions
20 Pin QFN 32 Pin QFN
Pin Name
Pin
Function
Formal Name
Right headphone output
1
2
HP_R
Analog
2
4
HP_VGND
Analog
3
5
VDDA
Power
Analog voltage
4
6
HP_L
Analog
Left headphone output
-
7
AGND
Analog
Ground
Ground
-
8, 9, 17, 19,
22, 28
NC
No Connect
5
10
VAG
Analog
DAC VAG filter
6
11
LINEOUT_R
Analog
Right LINEOUT
7
12
LINEOUT_L
Analog
Left LINEOUT
8
13
LINEIN_R
Analog
Right LINEIN
9
14
LINEIN_L
Analog
Left LINEIN
Definition
Headphone virtual ground Do not connect HP_VGND to system ground, even
when unused. This is a virtual ground (DC voltage) that
should never connect to an actual “0 Volt ground”. Use
the widest, shortest trace possible for the HP_VGND.
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
Table 1. SGTL5000 Pin Definitions (continued)
20 Pin QFN 32 Pin QFN
Pin Name
Pin
Function
Formal Name
10
15
MIC
Analog
Microphone input
11
16
MIC_BIAS
Analog
Mic bias
—
18
CPFILT
Analog
Charge Pump Filter
12
20
VDDIO
Power
Digital I/O voltage
13
21
SYS_MCLK
Digital
System master clock
14
23
I2S_LRCLK
Digital
I2S frame clock
15
24
I2S_SCLK
Digital
I2S bit clock
16
25
I2S_DOUT
Digital
I2S data output
17
26
I2S_DIN
Digital
I2S data input
18
27
CTRL_DATA
Digital
I2C Mode: Serial Data
(SDA); SPI Mode: Serial
Data Input (MOSI)
19
29
CTRL_CLK
Digital
I2C Mode: Serial Clock
(SCL); SPI Mode: Serial
Clock (SCK)
20
30
VDDD
Digital
-
31
CTRL_ADR0_CS
Digital
I2C Mode: I2C Address
Select 0; SPI Mode: SPI
Chip Select
-
32
CTRL_MODE
Digital
Mode select for I2C or
SPI; When pulled low the
Digital voltage
Definition
The CPFILT cap value is 0.1 F. If both VDDIO and
VDDA are  3.0 V, the CPFILT pin must be connected
to a 0.1 F cap to GND. If either is > 3.0 V, the CPFILT
cap MUST NOT be placed.
For new designs, connect VDDD to an external voltage
source and to a 0.1 F capacitor to GND.
control mode is I2C, when
pulled high the control
mode is SPI
PAD
1, 3, 4, PAD
GND
Ground
Ground
The PAD must be soldered to ground.
Star the ground pins of the chip, VAG ground, and all
analog inputs/outputs to a single point, then to the
ground plane.
SGTL5000
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
Exceeding the absolute maximum ratings shown in the following table could cause permanent damage to the part and is not
recommended. Normal operation is not guaranteed at the absolute maximum ratings, and extended exposure could affect long
term reliability.
Ratings
Symbol
Value
Unit
Maximum Digital Voltage
VDDD
1.98
V
Maximum Digital I/O Voltage
VDDIO
3.6
V
Maximum Analog Supply Voltage
VDDA
3.6
V
Maximum voltage on any digital input
GND-0.3 to VDDIO+0.3
V
Maximum voltage on any analog input
GND-0.3 to VDDA+0.3
V
- 55 to 125
C
ELECTRICAL RATINGS
THERMAL RATINGS
Storage Temperature
TSTG
C
Operating Temperature
Ambient
TA
- 40 to 85
Symbol
Value
Unit
Digital Voltage (If supplied externally). External VDDD connection required for
new designs.
VDDD
1.1 to 2.0
V
Digital I/O Voltage
VDDIO
1.62 to 3.6
V
Analog Supply Voltage
VDDA
1.62 to 3.6
V
Table 3. Recommended Operating Conditions
Ratings
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 4. Input/Output Electrical Characteristics
Test Conditions unless otherwise noted: VDDIO = 3.3 V, VDDA = 3.3 V, TA = 25 °C, Slave mode, fS = 48 kHz, MCLK = 256 fS, 
24 bit input, 1.02 kHz sine.
Characteristic
Symbol
Min
Typ
Max
Unit
LINEIN Input Level (3.3 V VDDA)
-
-
2.83
VPP
LINEIN Input Level (1.8 V VDDA)
-
-
1.60
VPP
MIC Input Level (3.3 V VDDA)
-
-
2.83
VPP
MIC Input Level (1.8 V VDDA)
-
-
1.60
VPP
1.46
1.52
1.68
2.53
2.61
3.11
LINEIN Input Impedance
-
29
-
k
MIC Input Impedance
-
2.9
-
k
LINEOUT Output Impedance
LINEOUT Output level
0 dBFS at 1.031 kHz 12S input, 1.8 V LINEOUT supply (normally
VDDIO), 10 k load
VPP
LINEOUT Output level
0 dBFS at 1.031 kHz 12S input, 3.3 V LINEOUT supply (normally
VDDIO), 10 k load
VPP
-
320
-

LINEOUT Load
10
-
-
k
HP (headphone) Load
16
-
-

SYS_MCLK Input Voltage swing
-0.3
VDDIO
VDDIO+0.3
V
SYS_MCLK Rise/Fall Time
0.5
-
10
ns
SGTL5000
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 5. Audio Performance 1
Test Conditions unless otherwise noted: VDDIO = 1.8 V, VDDA = 1.8 V, TA = 25 °C, Slave mode, fS = 48 kHz, MCLK = 256 fS, 
24 bit input
Characteristic
Symbol
Min
Typ
Max
Unit
LINEIN Input Level
-
0.57
-
VRMS
LINEIN Input Impedance (at 1.02 kHz)
-
29
-
k
SNR (-60 dB input)
-
85
-
dB
THD+N
-
-70
-
dB
Frequency Response
-
0.11
-
dB
Channel Separation
-
79
-
dB
SNR (-60 dB input)
-
98
-
dB
THD+N (10 k load)
-
-87
-
dB
THD+N (16  load)
-
-87
-
dB
Frequency Response
-
0.05
-
dB
AUDIO PERFORMANCE
2
LINEIN -> ADC -> I S OUT
LINEIN -> HEADPHONE_LINEOUT (CODEC BYPASS MODE)
Channel Separation (at 1.0 kHz)
82
dB
I2S IN -> DAC -> LINEOUT
Output Level
-
0.6
-
VRMS
SNR (-60 dB input)
-
95
-
dB
THD+N
-
-85
-
dB
Frequency Response
-
0.12
-
dB
Output Power
-
17
-
mW
SNR (-60 dB input)
-
100
-
dB
THD+N
-
-80
-
dB
Frequency Response
-
0.12
-
dB
Output Power
-
10
-
mW
SNR (-60 dB input)
-
95
-
dB
THD+N
-
-86
-
dB
Frequency Response
-
0.11
-
dB
SNR (-60 dB input)
-
96
-
dB
THD+N
-
-84
-
dB
Frequency Response
-
0.11
-
dB
PSRR (200 mVp-p at 1.0 kHz on VDDA)
-
85
-
dB
2
I S IN -> DAC -> HEADPHONE OUT - 16  LOAD
2
I S IN -> DAC -> HEADPHONE OUT - 32  LOAD
2
I S IN -> DAC -> HEADPHONE OUT - 10 K LOAD
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 6. Audio Performance 2
Test Conditions unless otherwise noted: VDDIO = 3.3 V, VDDA = 3.3 V, TA = 25°C, Slave mode, fS = 48 kHz, MCLK = 256 fS, 24
bit input. ADC tests were conducted with BIAS_CTRL = -37.5%, all other tests conducted with BIAS_CTRL = -50%.
Characteristic
Symbol
Min
Typ
Max
Unit
LINEIN Input Level
-
1.0
-
VRMS
LINEIN Input Impedance (at 1.02 kHz)
-
29
-
k
SNR (-60 dB input)
-
90
-
dB
THD+N
-
-72
-
dB
Frequency Response
-
0.11
-
dB
Channel Separation
-
80
-
dB
SNR (-60 dB input)
-
102
-
dB
THD+N (10 k load)
-
-89
-
dB
THD+N (16  load)
-
-87
-
dB
Frequency Response
-
0.05
-
dB
AUDIO PERFORMANCE
2
LINEIN -> ADC -> I S OUT
LINEIN -> HEADPHONE_LINEOUT (CODEC BYPASS MODE)
Channel Separation (at 1.0 kHz)
81
dB
I2S IN -> DAC -> LINEOUT
Output Level
-
1.0
-
VRMS
SNR (-60 dB input)
-
100
-
dB
THD+N
-
-85
-
dB
Frequency Response
-
0.12
-
dB
Output Power
-
58
-
mW
SNR (-60 dB input)
-
98
-
dB
THD+N
-
-86
-
dB
Frequency Response
-
0.12
-
dB
Output Power
-
30
-
mW
SNR (-60 dB input)
-
100
-
dB
THD+N
-
-88
-
dB
Frequency Response
-
0.11
-
dB
SNR (-60 dB input)
-
97
-
dB
THD+N
-
-85
-
dB
Frequency Response
-
0.11
-
dB
PSRR (200 mVp-p at 1.0 kHz on VDDA)
-
89
-
dB
2
I S IN -> DAC -> HEADPHONE OUT - 16  LOAD
2
I S IN -> DAC -> HEADPHONE OUT - 32  LOAD
2
I S IN -> DAC -> HEADPHONE OUT - 10 K LOAD
SGTL5000
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 7. Dynamic Electrical Characteristics
Characteristic
Symbol
Min
Typ
Max
Unit
tPC
1.0(2)
–
-
s
I2C Serial Clock Frequency
fI2C_CLK
-
-
400
kHz
I2C Start condition hold time
tI2CSH
150
-
-
ns
I2C Stop condition setup time
tI2CSTSU
150
-
-
ns
I2C Data input setup time to rising edge of CTRL_CLK
tI2CDSU
125
-
-
ns
I2C Data input hold time from falling edge of CTRL_CLK (receiving data)
tI2CDH
5.0
-
-
ns
2
tI2CDH
360
-
-
ns
I2 C
CTRL_CLK low time
tI2CCLKL
300
-
-
ns
CTRL_CLK high time
tI2CCLKH
100
-
-
ns
SPI Serial Clock Frequency
fSPI_CLK
-
-
TBD
MHz
SPI data input setup time
tSPIDSU
10
-
-
ns
SPI data input hold time
tSPIDH
10
-
-
ns
SPI CTRL_CLK low time
tSPICLKL
TBD
-
-
ns
SPI CTRL_CLK high time
tSPICLKH
TBD
-
-
ns
SPI clock to chip select
tCCS
60
-
-
ns
SPI chip select to clock
tCSC
20
-
-
ns
SPI chip select low
tCSL
20
-
-
ns
tCSH
20
fLRCLK
8.0
-
96
kHz
fSCLK
-
32*fLRCLK
-
kHz
POWER UP TIMING
Time from all supplies powered up and SYS_MCLK present to initial
communication. See Figure 4.
I2C BUS TIMING(3) See Figure 5.
I C Data input hold time from falling edge of CTRL_CLK (driving data)
I2 C
SPI BUS TIMING
(4)
See Figure 6.
SPI chip select high
SPECIFICATIONS AND TIMING FOR THE
2
Frequency of I S_LRCLK
Frequency of
I2S_SCLK
I2S
PORT(5)
ns
See Figure 7.
64*fLRCLK
I2S delay
tI2S_D
-
-
10
ns
I2S setup time
tI2S_S
10
-
-
ns
I2S hold time
tI2S_H
10
-
-
ns
Notes
1. The SGTL5000 has an internal reset that is deasserted 8 SYS_MCLK cycles after all power rails have been brought up. After this time,
communication can start.
2. 1.0s represents 8 SYS_MCLK cycles at the minimum 8.0 MHz SYS_MCLK.
3.
4.
This section provides timing for the SGTL5000 while in I2C mode (CTRL_MODE = 0).
This section provides timing for the SGTL5000 while in SPI mode (CTRL_MODE = 1)
5.
The following are the specifications and timing for I2S port. The timing applies to all formats.
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
Tpc
VDDA
VDDIO
VDDD (if used)
SYS_MCLK
CTRL_DATA
CTRL_CLK
CTRL_ADR0_CS
Initial
Communication
Figure 4. Power Up Timing
1/Fi2c_clk
Ti2cdsu
Ti2cclkh
Ti2cclkl
CTRL_CLK
Ti2cstsu
Ti2cdh
Ti2csh
CTRL_DATA
Figure 5. I2C Timing (CTRL_MODE == 0)
Tcsl
Tcsh
CTRL_ADR0_CS
CTRL_AD0_CS
1/Fspi_clk
Tspiclkh Tspiclkl
Tccs
Tcsc
CTRL_CLK
Tspidsu
Tspidh
CTRL_DATA
Figure 6. SPI Timing
SGTL5000
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
.
Ti2s_s
1/Fsclk
I2S_SCLK
I2S_LRCLK
In slave mode
Ti2s_d
I2S_LRCLK
In master mode
Ti2s_s
Ti2s_h
I2S_SCLK
I2S_DIN
Ti2s_d
I2S_DOUT
1/Flrclk
I2S_LRCLK
Figure 7. I2S Interface Timing
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The SGTL5000 is a low power stereo codec with
integrated headphone amplifier. It is designed to provide a
complete audio solution for portable products needing
LINEIN, mic-in, LINEOUT, headphone-out, and digital I/O.
Deriving it’s architecture from best in class Freescale
integrated products that are currently on the market, the
SGTL5000 is able to achieve ultra low power with very high
performance and functionality, all in one of the smallest
footprints available. Target markets include portable media
players, GPS units and smart phones. Features such as
capless headphone design and USB clocking mode (12 MHz
SYS_MCLK input) help lower overall system cost.
In summary, the SGTL5000 accepts the following inputs:
• Line input
• Microphone input, with mic bias
• Digital I2S input
In addition, the SGTL5000 supports the following outputs:
• Line output
• Headphone output
• Digital I2S output
The following digital audio processing is included to allow
for product differentiation:
• Digital mixer
• Freescale Surround
• Freescale Bass Enhancement
• Tone Control, parametric equalizer, or graphic equalizer
The SGTL5000 can accept an external standard master
clock at a multiple of the sampling frequency (i.e. 256*Fs,
385*Fs, 512*Fs). In addition it can take non-standard
frequencies and use the internal PLL to derive the audio
clocks. The device supports 8.0 kHz, 11.025 kHz, 12 kHz,
16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1kHz, 48 kHz, 96 kHz
sampling frequencies.
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
SYSTEM BLOCK DIAGRAM W/ SIGNAL FLOW AND
GAIN MAP
Figure 8 shows a block diagram that highlights the signal
flow and gain map for the SGTL5000.
Analog Gain
LINE_IN
MIC_IN
Analog
Gain
(0 to
22.5dB)
MIC GAIN
(0dB, 20dB,
30dB, 40dB )
To guarantee against clipping, it is important that the gain
in a signal path in addition to the signal level does not exceed
0 dB at any point.
Digital Gain
DAC Volume
Control
-90dB to 0dB
ADC
DAC
Headphone Volume Control
-52dB to +12dB
(CHIP_ANA_HP_CTRL)
HP_OUT
Audio
Switch
I2S_DIN
Line Out Volume Control
(CHIP_LINE_OUT_VOL)
I2S_DOUT
Mix
+6dB
AVC
+12dB
Surround
Bass Enhancement
+6dB
LINEOUT
Tone Control /GEQ/PEQ
+12dB
Only Gain is shown for the Digital Audio Processing blocks. For complete description
please see Digital Audio Processing section.
Figure 8. System Block Diagram, Signal Flow and Gain
SGTL5000
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
POWER
The SGTL5000 has a flexible power architecture to allow
the system designer to minimize power consumption and
maximize performance at the lowest cost.
External Power Supplies
The SGTL5000 requires 2 external power supplies: VDDA
and VDDIO. An optional third external power supply VDDD
may be provided externally to achieve lower power. This
external VDDD power supply is required for new designs. A
description for the different power supplies is as follows:
• VDDA: This external power supply is used for the internal
analog circuitry including ADC, DAC, LINE inputs, MIC
inputs, headphone outputs and reference voltages. VDDA
supply ranges are shown in Maximum Ratings. A
decoupling cap should be used on VDDA, as shown in the
typical application diagrams in Typical Applications.
• VDDIO: This external power supply controls the digital I/O
levels as well as the output level of LINE outputs. VDDIO
supply ranges are shown in Maximum Ratings. A
decoupling cap should be used on VDDIO as shown in the
typical application diagrams in Typical Applications.
Note that if VDDA and VDDIO are derived from the same
voltage, a single decoupling capacitor can be used to
minimize cost. This capacitor should be placed closest to
VDDA.
• VDDD: This is a digital power supply that is used for
internal digital circuitry. An external VDDD power supply is
required for new designs. For lowest power, this supply
can be driven at the lowest specified voltage given in
Maximum Ratings. If an external supply is used for VDDD,
a decoupling capacitor is recommended, as shown in the
typical applications diagram. VDDD supply ranges are
shown in Maximum Ratings for when externally driven. If
the system drives VDDD externally, an efficient switching
supply should be used or no system power savings is
realized.
Internal Power Supplies
The SGTL5000 has two exposed internal power supplies,
VAG and charge pump.
• VAG is the internal voltage reference for the ADC and
DAC. After startup the voltage of VAG should be set to
VDDA/2 by writing CHIP_REF_CTRL->VAG_VAL. Refer
to programming Chip Powerup and Supply Configurations.
The VAG pin should have an external filter capacitor as
shown in the typical application diagram.
• Chargepump: This power supply is used for internal
analog switches. If VDDA or VDDIO is greater than 2.7 V,
this supply is automatically driven from the highest of
VDDIO and VDDA. If both VDDIO and VDDA are less than
3.1 V, then the user should turn on the charge pump
function to create the charge pump rail from VDDIO by
writing CHIP_ANA_POWER->
VDDC_CHRGPMP_POWERUP register. Refer to
programming Chip Powerup and Supply Configurations.
• LINE_OUT_VAG is the line output voltage reference. It
should be set to VDDIO/2 by writing
CHIP_LINE_OUT_CTRL->LO_VAGCNTRL.
Power Schemes
The SGTL5000 supports a flexible architecture and allows
the system designer to minimize power or maximize BOM
savings.
• For maximum cost savings, all supplies can be run at the
same voltage.
• Alternatively for minimum power, the analog and digital
supplies can be run at minimum voltage while driving the
digital I/O voltage at the voltage needed by the system.
• To save power, independent supplies are provided for line
outputs and headphone outputs. This allows for 1VRMS
line outputs while using minimal headphone power.
• For best power, VDDA should be run at the lowest
possible voltage required for the maximum headphone
output level. For highest performance, VDDA should be
run at 3.3 V. For most applications a lower voltage can be
used for the best performance/power combination.
RESET
The SGTL5000 has an internal reset that is deasserted 8
SYS_MCLKs after all power rails have been brought up. After
this time communication can start. See Dynamic Electrical
Characteristics.
CLOCKING
Clocking for the SGTL5000 is provided by a system
master clock input (SYS_MCLK). SYS_MCLK should be
synchronous to the sampling rate (Fs) of the I2S port.
Alternatively any clock between 8.0 and 27 MHz can be
provided on SYS_MCLK and the SGTL5000 can use an
internal PLL to derive all internal and I2S clocks. This allows
the system to use an available clock such as 12 MHz
(common USB clock) for SYS_MCLK to reduce overall
system costs.
Synchronous SYS_MCLK input
The SGTL5000 supports various combinations of
SYS_MCLK frequency and sampling frequency as shown in
Table 8. Using a synchronous SYS_MCLK allows for lower
power as the internal PLL is not used.
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
Table 8. Synchronous MCLK Rates and Sampling Frequencies
CLOCK
SUPPORTED RATES
System Master Clock (SYS_MCLK)
UNITS
256, 384, 512
Sampling Frequency (Fs)
Fs
8, 11.025, 12, 16, 22.05, 24, 32, 44.1, 48, 96
(6)
kHz
Notes
6. For a sampling frequency of 96 kHz, only 256 Fs SYS_MCLK is supported
Using the PLL - Asynchronous SYS_MCLK input
An integrated PLL is provided in the SGTL5000 that allows
any clock from 8.0 to 27 MHz to be connected to SYS_MCLK.
This can help save system costs, as a clock available
elsewhere in the system can be used to derive all audio
clocks using the internal PLL. In this case, the clock input to
SYS_MCLK can be asynchronous with the sampling
frequency needed in the system. For example, a 12 MHz
Yes
clock from the system processor could be used as the clock
input to the SGTL5000.
Three register fields need to be configured to properly use
the PLL. They are CHIP_PLL_CTRL->INT_DIVISOR,
CHIP_PLL_CTRL->FRAC_DIVISOR and
CHIP_CLK_TOP_CTRL->INPUT_FREQ_DIV2. Figure 9
shows a flowchart that shows how to determine the values to
program in the register fields.
SYS_MCLK>17MHz?
No
CHIP_CLK_TOP _CTRL->INPUT_FREQ_DIV2 = 1
CHIP_CLK_TOP_CTRL->INPUT_FREQ_DIV2 = 0
PLL_INPUT_FREQ = SYS_MCLK/2
PLL_INPUT_FREQ = SYS_MCLK
Yes
Sampling
Frequency =
44.1kHz?
PLL_OUTPUT_FREQ=180 .6336 MHz
No
PLL_OUTPUT_FREQ=196 .608 MHz
CHIP_PLL_CTRL->INT_DIVISOR = FLOOR (PLL_OUTPUT_FREQ/INPUT_FREQ
CHIP_PLL_CTRL->FRAC_DIVISOR = ((PLL_OUTPUT_FREQ/INPUT_FREQ) - INT_DIVISOR) * 2048
Figure 9. PLL Programming Flowchart
For example, when a 12 MHz digital signal is placed on
MCLK, for a 48 kHz frame clock
CHIP_CLK_TOP_CTRL->INPUT_FREQ_DIV2 = 0 //
SYS_MCLK < 17 MHz
CHIP_PLL_CTRL->INT_DIVISOR = FLOOR
(196.608 MHz/12 MHz) = 16 (decimal)
CHIP_PLL_CTRL->FRAC_DIVISOR = ((196.608 MHz/
12 MHz) - 16) * 2048 = 786 (decimal)
Refer to PLL programming PLL Configuration.
AUDIO SWITCH (SOURCE SELECT SWITCH)
The audio switch is the central routing block that controls
the signal flow from input to output. Any single input can be
routed to any single or multiple outputs.
Any signal can be routed to the Digital Audio Processor
(DAP). The output of the DAP (an input to the audio switch)
can in turn be routed to any physical output. The output of the
DAP can not be routed into itself. Refer to Digital Audio
Processing, for DAP information and configuration.
It should be noted that the analog bypass from Line input
to headphone output does not go through the audio switch.
SGTL5000
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
To configure a route, the CHIP_SSS_CTRL register is
used. Each output from the source select switch has its own
register field that is used to select what input is routed to that
output.
For example, to route the I2S digital input through the DAP
and then out to the DAC (headphone) outputs write
SSS_CTRL->DAP_SELECT to 0x1 (selects I2S_IN) and
SSS_CTRL->DAC_SELECT to 0x3 (selects DAP output).
ANALOG INPUT BLOCK
The analog input block contains a stereo line input and a
microphone input with mic bias. Either input can be routed to
the ADC. The line input can also be configured to bypass the
CODEC and be routed directly to the headphone output.
Line Inputs
+16.5 dB of gain. The ADC gain is controlled in the
CHIP_ANA_ADC_CTRL register.
The ADC has an available zero cross detect (ZCD) that
prevents any volume change until a zero-volt crossing of the
audio signal is detected. This helps in eliminating pop or other
audio anomalies. If the ADC is to be used, the chip reference
bias current should not be set to -50% when in 3.0 V mode.
ANALOG OUTPUTS
The SGTL5000 contains a single stereo DAC that can be
used to drive a headphone output and a line output. The DAC
receives its input from the audio switch. The headphone
output and the line output can be driven at the same time
from the DAC.
The headphone output can also be driven directly by the
line input bypassing the ADC and DAC for a very low power
mode of operation.
The headphone output is powered by VDDA while the line
output is powered by VDDIO. This allows the headphone
output to be run at the lowest possible voltage while the line
output can still meet line output level requirements.
One stereo line input is provided for connection to line
sources such as an FM radio or MP3 input.
The source should be connected to the left and right line
inputs through series coupling capacitors. The suggested
value is shown in the typical application diagram in Typical
Applications.
As detailed in ADC, the line input can be routed to the
ADC.
The line input can also be routed to the headphone output
by writing CHIP_ANA_CTRL->SELECT_HP. This selection
bypasses the ADC and audio switch and routes the line input
directly to the headphone output to enable a very low power
pass through.
The DAC output is routed to the headphone and the
dedicated line output.
The DAC output has a digital volume control from -90 dB
to 0 dB in ~0.5 dB step sizes. This volume is shared among
headphone output and line output. The register
CHIP_DAC_VOL controls the DAC volume.
Microphone Input
Headphone
One mono microphone input is provided for uses such as
voice recording.
Mic bias is provided. The mic bias is programmed with the
CHIP_MIC_CTRL->BIAS_VOLT register field. Values from
1.25 V to 3.00 V are supported in 0.25 V steps. Mic bias
should be set less than 200 mV from VDDA, e.g. with VDDA
at 1.70 V, Mic bias should be set no greater than 1.50 V.
The microphone should be connected through a series
coupling capacitor. The suggested value is shown in the
typical connection diagram.
The microphone has programmable gain through the
CHIP_MIC_CTRL->GAIN register field. Values of 0 dB,
+20 dB, +30 dB and +40 dB are available.
Stereo headphone outputs are provided which can be
used to drive a headphone load or a line level output. The
headphone output has its own independent analog volume
control with a volume range of -52 dB to +12 dB in 0.5 dB
step sizes. This volume control can be used in addition to the
DAC volume control. For best performance the DAC volume
control should be left at 0 dB until the headphone is brought
to its lowest setting of -52 dB. The register
CHIP_ANA_HP_CTRL is used to control the headphone
volume.
The headphone output has an independent mute that is
controlled by the register field CHIP_ANA_CTRL>MUTE_HP.
The line input is routed to the headphone output by writing
CHIP_ANA_CTRL->SELECT_HP. This selection bypasses
the ADC and audio switch and routes the line input directly to
the headphone output to enable a very low power pass
through. When the line input is routed to the headphone
output, only the headphone analog volume and mute affects
the headphone output.
The headphone has an available zero cross detect (ZCD)
which, as previously described, prevents any volume change
until a zero-volt crossing of the audio signal is detected. This
helps in eliminating pop or other audio anomalies.
ADC
The SGTL5000 contains an ADC, which takes its input
from either the line input or a microphone. The register field
CHIP_ANA_CTRL->SELECT_ADC controls this selection.
The output of the ADC feeds the audio switch.
The ADC has its own analog gain stage that provides 0 to
+22.5 dB of gain in 1.5 dB steps. A bit is available that shifts
this range down by 6.0 dB to effectively provide -6.0 dB to
DAC
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
Line Outputs
The SGTL5000 contains a stereo line output. The line
output has a dedicated gain stage that can be used to adjust
the output level. The CHIP_LINE_OUT_VOL controls the line
level output gain.
The line outputs also have a dedicated mute that is
controlled by the register field CHIP_ANA_CTRL>MUTE_LO.
The line out volume is intended as maximum output level
adjustment. It is intended to be used to set the maximum
output swing. It does not have the range of a typical volume
control and does not have a zero cross detect (ZCD).
However the DAC digital volume could be used if volume
control is desired.
SGTL5000
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
FUNCTIONAL DEVICE OPERATION
POWER CONSUMPTION
Table 9. Power Consumption: VDDA=1.8 V, VDDIO=1.8 V
CURRENT CONSUMPTION (MA)
MODE
POWER (MW)
VDDD
VDDA
VDDIO
Playback (I2S->DAC->Headphone)
-
2.54
0.9
6.19
Playback with DAP ((I2S->DAP->DAC->Headphone)
-
3.59
0.9
8.08
Playback/Record (I2S->DAC->Headphone, ADC->I2S)
-
3.71
1.10
8.67
Record (ADC->I2S)
-
2.29
1.06
6.02
Analog playback, CODEC bypassed (LINEIN->HP)
-
1.48
0.89
4.27
Standby, all analog power off
-
0.019
0.002
0.038
Playback with PLL (I2S->DAC->HP)
-
3.01
2.17
9.31
input, slave mode unless otherwise noted, paths tested as
indicated, unused paths turned off.
VDDD derived internally at 1.2 V, slave mode except for
PLL case, 32  load on HP, Conditions: -100 dBFs signal
Table 10. Power Consumption: VDDA=3.3 V, VDDIO=3.3 V
CURRENT CONSUMPTION (MA)
MODE
POWER(MW)
VDDD
VDDA
VDDIO
Playback (I2S->DAC->Headphone)
-
3.45
0.067
11.60
Playback with DAP ((I2S->DAP->DAC->Headphone)
-
4.49
0.067
15.03
Playback/Record (I2S->DAC->Headphone, ADC->I2S)
-
4.67
0.343
16.53
Record (ADC->I2S)
-
2.90
0.296
10.56
Analog playback, CODEC bypassed (LINEIN->HP)
-
1.91
0.039
6.43
Standby, all analog power off
-
0.04
0.002
0.139
Playback with PLL (I2S->DAC->HP)
-
3.92
2.76
22.05
DIGITAL INPUT & OUTPUT
One I2S (Digital Audio) Port is provided which supports the
following formats: I2S, Left Justified, Right Justified, and PCM
mode.
I2S, Left Justified, and Right Justified Modes
I2S, Left Justified and Right Justified modes are stereo
interface formats. The I2S_SCLK frequency, I2S_SCLK
polarity, I2S_DIN/DOUT data length, and I2S_LRCLK
polarity can all be changed through the CHIP_I2S_CTRL
register. For I2S, Left Justified and Right Justified formats,
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
the left subframe should always be presented first regardless
of the CHIP_I2S_CTRL->LRPOL setting.
The I2S_LRCLK and I2S_SCLK can be programmed as
master (driven to an external target) or slave (driven from an
external source). When the clocks are in slave mode, they
must be synchronous to SYS_MCLK. For this reason the
SGTL5000 can only operate in synchronous mode (see
Clocking) while in I2S slave mode.
In master mode, the clocks are synchronous to
SYS_MCLK or the output of the PLL when the part is running
in asynchronous mode.
Figure 10 shows functional examples of different common
digital interface formats and their associated register
settings.
I2S Format (n = bit length)
CHIP_I2S0_CTRL field values:
(SCLKFREQ = 0; SCLK_INV = 0; DLEN = 1; I2S_MODE = 0; LRALIGN = 0; LRPOL = 0)
I2S_LRCLK
I2S_SCLK
I2S_DIN, DOUT
Ln
L (n-1)
L01
L00
Rn
R(n-1)
R01
R00
Ln
Left Justified Format (n = bit length)
CHIP_I2S0_CTRL field values:
(SCLKFREQ = 0; SCLK_INV = 0; DLEN = 1; I2S_MODE = 0; LRALIGN = 1; LRPOL = 0)
I2S_LRCLK
I2S_SCLK
I2S_DIN, DOUT
Ln
L(n-1)
L1
L0
Rn
R(n-1)
R1
R0
Ln
L(n-1)
Right Justified Format (n = bit length)
CHIP_I2S0_CTRL field values:
SCLKFREQ = 0; SCLK_INV = 0; DLEN = 1; I2S_MODE = 1; LRALIGN = 1; LRPOL = 0)
I2S_LRCLK
I2S_SCLK
I2S_DIN, DOUT
Ln
L (n-1)
L0
Rn
R(n-1)
R0
Figure 10. I2S Port Supported Formats
SGTL5000
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
PCM Mode
frame clock may be configured to clock in on the rising or
falling edge of Bit Clock.
PCM Format A is a format in which the data word begins
one SCLK bit following the I2S_LRCLK transition, as in I2S
Mode. PCM Format B is a format in which the data word
begins after the I2S_LRCLK transition, as in Left Justified.
In slave mode, the pulse width of the I2S_LRCLK does not
matter. The pulse can range from one cycle high to all but one
cycle high. In master mode, it is driven one cycle high.
Figures 11 shows a functional drawing of the different
formats in master mode.
2
The I S port can also be configured in PCM mode (also
known as DSP mode). This mode is provided to allow
connectivity to external devices such as Bluetooth modules.
PCM mode differs from other interface formats presented in
I2S, Left Justified, and Right Justified Modes, in that the
frame clock (I2S_LRCLK) does not represent a different
channel when high or low. Instead, it is a bit-wide pulse that
marks the start of a frame. Data is aligned such that the left
channel data is immediately followed by right channel data.
Zero padding is filled in for the remaining bits. The data and
PCM Format A
CHIP_I2S0_CTRL = 0x01F4
(SCLKFREQ = 1; MS = 1; SCLK_INV = 1; DLEN = 3; I2S_MODE = 2; LRALIGN = 0)
I2S_LRCLK
I2S_SCLK
Ln
I2S_DIN, DOUT
L (n-1)
L0
Rn
R( n-1)
R1
R0
Ln
L (n-1)
L0
Rn
R(n-1)
R1
R0
PCM Format B
CHIP_I2S0_CTRL = 0x01F6
(SCLKFREQ = 1; MS = 1; SCLK_INV = 1; DLEN = 3; I2S_MODE = 2; LRALIGN = 1)
I2S_LRCLK
I2S_SCLK
I2S_DIN, DOUT
Ln
L(n-1)
L0
Rn
R(n-1)
R0
Ln
L( n-1)
L0
Rn
R(n-1)
R0
Figure 11. PCM Formats
DIGITAL AUDIO PROCESSING
The SGTL5000 contains a digital audio processing block
(DAP) connected to the source select switch. The digitized
signal from the source select switch can be routed into the
DAP block for audio processing. The DAP has the following
5 sub blocks:
• Dual Input Mixer
• Freescale Surround
• Freescale Bass Enhancement
• 7-Band Parameter EQ / 5-Band Graphic EQ / Tone Control
(only one can be used at a time)
• Automatic Volume Control (AVC)
The block diagram in Figure 12 shows the sequence in
which the signal passes through these blocks.
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
Set DAP_CONTROL->DAP_EN to enable DAP block
7-Band
Parametric
EQ
From
Source
Select
Swtich
Main Input
Mix Input
Automatic
Automatic
Volume
Volume
Control
Control
(AVC)
(AVC)
Dual
Dual
Input
Input
Mixer
Mixer
Freescale
SigmaTel
Bass
Bass
Enhance
Enhance
SigmaTel
Freescale
Surround
Surround
5-Band
Graphic
EQ
To
Source
Select
Swtich
Tone
Control
Each DAP sub-block can be configured in a pass-through mode
Only one of PEQ/GEQ/TC
can be used at a time
Figure 12. Digital Audio Processing Block Diagram
When the DAP block is added in the route, it must be
enabled separately to get audio through. It is recommended
to mute the outputs before enabling/disabling the DAP block
to avoid any pops or clicks due to discontinuities in the output.
Refer to Digital Audio Processor Configuration for
programming examples on how to enable/disable the DAP
block.
Each sub-block of the DAP can be individually disabled if
its processing is not required. The following sections describe
the DAP sub-blocks and how to configure them.
Dual Input Mixer
The dual input digital mixer allows for two incoming
streams from the source select switch as shown in DAP Dual Input Mixer.
Main Channel Volume
DAP_MAIN_CHAN->VOL
Main Channel
From Source Select Switch
Sum
Mixer Output
To Freescale
To SGTL Surround
Surround Block
Block
Mix Channel
From Source Select Switch
Mix Channel Volume
DAP_MIX_CHAN->VOL
Figure 13. DAP - Dual Input Mixer
The Dual Input Mixer can be enabled or configured in a
pass-through mode (Main channel is passed through without
any mixing). When enabled, the volume of the main and mix
channels can be independently controlled before they are
mixed together.
The volume range allowed on each channel is 0% to 200%
of the incoming signal level. The default is 100% (same as
input signal level) volume on the main input and 0% (muted)
on the mix input.
Refer to Dual Input Mixer for programming examples on
how to enable/disable the mixer and also to set the main and
mix channel volume.
Freescale Surround
Freescale Surround is a royalty free virtual surround
algorithm for stereo or mono inputs. It widens and deepens
the sound stage of the music input.
SGTL5000
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
Input
Output
SigmaTel
Freescale
Surround
Surround
From Dual Mixer
To Freescale
BassEnhance
Enhance
To
SGTL Bass
DAP_SGTL_SURROUND
-> WIDTH_CONTROL
->SELECT
The Freescale Surround can be enabled or configured in
pass-through mode (input is passed through without any
processing). When enabling the Surround, mono or stereo
input type must be selected based on the input signal.
Surround width may be adjusted for the size of the sound
stage.
Refer to Freescale Surround and Freescale Surround On/
Off for a programming example on how to configure Surround
width and how to enable/disable Surround.
Freescale Bass Enhance
Freescale Bass Enhance is a royalty-free algorithm that
enhances natural bass response of the audio. Bass Enhance
extracts bass content from right and left channels, adds bass
and mixes this back up with the original signal. An optional
complementary high pass filter is provided after the mixer.
DAP_BASS_ENHANCE_CTRL
->LR_LEVEL
Input
Input
(from Freescale
Surround)
(From
SGTL Surround)
DAP_BASS_ENHANCE_CTRL
->CUTOFF_HPF
->BYPASS_HPF
High Pass
Filter
Low Pass
Filter
DAP_BASS_ENHANCE
->CUT_OFF
Output
(To PEQ/GEQ/TC)
Bass
Enhance
DAP_BASS_ENHANCE_CTRL
->BASS_LEVEL
Figure 14. DAP- Freescale Bass Enhance
The Freescale Bass Enhance can be enabled or
configured in pass-through mode (input is passed through
without any processing).
The cutoff frequency of the low-pass filter (LPF) can be
selected based on the speakers frequency response. The
cutoff frequency of the low-pass and high-pass filters are
selectable between 80 to 225 Hz. Also, the input signal and
bass enhanced signal can be individually adjusted for level
before the two signals are mixed.
Refer to Freescale Bass Enhance and Bass Enhance On/
Off for a programming example on how to configure Bass
Enhance and how to enable/disable this feature.
7-Band Parametric EQ / 5-Band Graphic EQ / Tone
Control
One 7-band parametric equalizer (PEQ), one 5-band
graphic equalizer (GEQ), and Tone Control (Bass and Treble
control) blocks are implemented as mutually exclusive
blocks. Only one block can be used at a given time.
Refer to 7-Band Parametric EQ / 5-Band Graphic EQ /
Tone Control for a programming example that shows how to
select the desired EQ mode.
7-Band Parametric EQ
The 7-band PEQ allows the designer to compensate for
speaker response and to provide the ability to filter out
resonant frequencies caused by the physical system design.
The system designer can create custom EQ presets such as
Rock, Speech, Classical, etc, which allows users the
flexibility to customize their audio.
The 7-band PEQ is implemented using 7 cascaded
second order IIR filters. All filters are implemented using
programmable bi-quad filters. Figure 15 shows the transfer
function and Direct Form 1 of the five coefficient biquadratic
filter.
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
H ( z) 
b0  b1 z 1  b2 z 2
1  a1 z 1  a2 z 2
Direct Form 1

X(z)
H(z)X(z)
b0
z 1
z 1
b1
-a1
z 1
z 1
b2
-a2
Figure 15. 5-Coefficient Biquad Filter and Transfer Function
If a band is enabled but is not being used (flat response),
then a value of 0.5 should be put in b0 and all other
coefficients should be set to 0.0. Note that the coefficients
must be converted to hex values before writing to the
registers. By default, all the filters are loaded with coefficients
to give a flat response.
In order to create EQ presets such as Rock, Speech,
Classical, etc, the coefficients must be calculated, converted
to 20-bit hex values and written to the registers. Note that
coefficients are sample-rate dependent and separate
coefficients must be generated for different sample rates.
Please contact Freescale for assistance with generating the
coefficients.
Refer to 7-Band PEQ Preset Selection for a programming
example that shows how load the filter coefficients when the
end-user changes the preset.
PEQ can be disabled (pass-through mode) by writing 0 to
DAP_AUDIO_EQ->EN bits.
5-Band Graphic EQ
The 5-band graphic equalizer is implemented using 5
parallel second order IIR filters. All filters are implemented
using biquad filters whose coefficients are programmed to set
the bands at a specific frequency. The GEQ bands are fixed
at 115 Hz, 330 Hz, 990 Hz, 3000 Hz, and 9900 Hz. The
volume on each band is independently adjustable in the
range of +12 dB to -11.75 dB in 0.25 dB steps.
Refer to 5-Band GEQ Volume Change for a programming
example that shows how to change the GEQ volume.
Tone Control
Tone control comprises treble and bass controls. The tone
control is implemented as one 2nd order low pass filter (bass)
and one 2nd order high pass filter (treble).
Refer to Tone Control - Bass and Treble Change for a
programming example that shows how to change Bass and
Treble values.
Automatic Volume Control (AVC)
An Automatic Volume Control (AVC) block is provided to
reduce loud signals and amplify low level signals for easier
listening. The AVC is designed to compress audio when the
measured level is above the programmed threshold or to
expand the audio to the programmed threshold when the
measured audio is below the threshold. The threshold level is
programmable with an allowed range of 0 to -96 dB.
Figure 16 shows the AVC block diagram and controls.
SGTL5000
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
DAP_AVC_THRESHOLD
Input from
Dual Input Mixer
If < Threshold
Decay (0.05dB/s to ~200dB/s)
DAP_AVC_DECAY
DAP_AVC_THRESHOLD -> MAX_GAIN
Threshold
Level
Compare
Volume
Control
Output To
to
Output
Freescale
Surround
SGTL Surround
If > Threshold
Attack (0.8dB/s to ~3200dB/s)
DAP_AVC_ATTACK
Figure 16. DAP AVC Block Diagram
When the measured audio level is below threshold, the
AVC can apply a maximum gain of up to 12 dB. The
maximum gain can be selected, either 0, 6, or 12 dB. When
the maximum gain is set to 0 dB the AVC acts as a limiter. In
this case the AVC only takes effect when the signal level is
above the threshold.
The rate at which the incoming signal is attenuated down
to the threshold is called the attack rate. Too high of an attack
causes an unnatural sound as the input signal may be
distorted. Too low of an attack may cause saturation of the
output as the incoming signal is not compressed quickly
enough. The attack rate is programmable with allowed range
of 0.05 dB/s to 200 dB/s.
When the signal is below the threshold, AVC adjusts the
volume up until either the threshold or the maximum gain is
reached. The rate at which this volume is changed is called
the decay rate. The decay rate is programmable with allowed
range of 0.8 dB/s to 3200 dB/s. It is desirable to use very slow
decay rate to avoid any distortion in the signal and prevent
the AVC from entering a continuous attack-decay loop.
Refer to Automatic Volume Control (AVC) and Automatic
Volume Control (AVC) On/Off for a programming example
that shows how to configure AVC and how to enable/disable
AVC respectively.
CONTROL
The SGTL5000 supports both I2C and SPI control modes
(note that SPI is not supported in the 20 QFN part). The
CTRL_MODE pin chooses which mode is used. When
CTRL_MODE is tied to ground, the control mode is I2C.
When CTRL_MODE is tied to VDDIO, the control mode is
SPI.
Regardless of the mode, the control interface is used for all
communication with the SGTL5000 including startup
configuration, routing, volume, etc.
I2C
The I2C port is implemented according to the I2C
specification v2.0. The I2C interface is used to read and write
all registers.
For the 32 QFN version of the SGTL5000, the I2C device
address is 0n01010(R/W) where n is determined by
CTRL_ADR0_CS and R/W is the read/write bit from the I2C
protocol.
For the 20 QFN version of the SGTL5000 the I2C address
is always 0001010(R/W).
The SGTL5000 is always the slave on all transactions,
which means that an external master always drives
CTRL_CLK.
In general, an I2C transaction looks like the following.
All locations are accessed with a 16 bit address. Each
location is 16 bits wide.
Example I2C write
• Start condition
• Device address with the R/W bit cleared to indicate write
• Send two bytes for the 16 bit register address (most
significant byte first)
• Send two bytes for the 16 bits of data to be written to the
register (most significant byte first)
• Stop condition
Example I2C read
• Start condition
• Device address with the R/W bit cleared to indicate write
• Send two bytes for the 16 bit register address (most
significant byte first)
• Stop Condition followed by start condition (or a single
restart condition)
• Device address with the R/W bit set to indicate read
• Read two bytes from the addressed register (most
significant byte first)
• Stop condition
Figure 17 shows the functional I2C timing diagram.
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
I2C Address
R/W ACK
A15
A8
ACK
A7
A0
ACK D15
D8
ACK
Start Condition
D7
D0
ACK
Stop Condition
Figure 17. Functional I2C Diagram
The protocol has an auto increment feature. Instead of
sending the stop condition after two bytes of data, the master
may continue to send data byte pairs for writing, or it may
send extra clocks for reading data byte pairs. In either case,
the access address is incremented after every two bytes of
data. A start or stop condition from the I2C master interrupts
the current command. For reads, unless a new address is
written, a new start condition with R/W=0 reads from the
current address and continues to auto increment.
The following diagrams describe the different access
formats. The gray fields are from the I2C master, and the
white fields are the SGTL5000 responses. Data [n]
corresponds to the data read from the address sent,
data[n+1] is the data from the next register, and so on.
S = Start Condition
Sr = Restart Condition
A = Ack
N = Nack
P = Stop Condition
Table 11. Write Single Location
S
Device
Address
W
(0)
A
ADDR
byte 1
A
ADDR
byte 0
A
DATA
byte 1
A
DATA
byte 0
A
P
Table 12. Write Auto increment
S
Device
Address
W
(0)
A
A
start
ADDR
byte 1
A
start
ADDR
byte 0
A
DATA
[n]
byte 1
DATA
[n]
byte 0
A
DATA
[n+1]
byte 1
A
DATA
[n+1]
byte 0
A
P
A
DATA
byte 1
A
DATA
byte 0
N
P
Table 13. Read Single Location
S
Device
Address
W
(0)
A
ADDR
byte 1
A
ADDR
byte 0
A
Sr
Device
Address
Sr
Device
Address
R
(1)
Table 14. Read Auto increment
S
Device
Address
W
(0)
A
start
ADDR
byte 1
A
start
ADDR
byte 0
A
R
(1)
A
DATA
[n]
byte 1
A
DATA
[n]
byte 0
A
DATA
[n+3]
byte 1
A
DATA
[n+1]
byte 1
A
DATA
[n+1]
byte 0
DATA
[n+3]
byte 0
N
N
P
Table 15. Read Continuing Auto increment
S
Device
Address
R
A
DATA
[n+2]
byte 1
A
SPI
Serial Peripheral Interface (SPI) is a communications
protocol supported by the SGTL5000 (not supported in the 20
QFN package). The SGTL5000 is always a slave. The
CTRL_ADR0_CS is used as the slave select (SS) when the
master wants to select the SGTL5000 for communication.
CTRL_CLK is connected to master’s SCLK and CTRL_DATA
DATA
[n+2]
byte 0
A
P
is connected to master’s MOSI line. The part only supports
SPI write operations and does not support read operations.
Figure 18 shows the functional timing diagram of the SPI
communication protocol as supported by the SGTL5000 chip.
Note that on the rising edge of the SS, the chip latches to the
previous 32 bits of data. It interprets the latest 16-bits as
register value and the 16-bits preceding it as register
address.
SGTL5000
24
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
On rising edge of SS, latch
the last 32 bits of data
16-bits Register Value
16-bits Register Address
SS
23
31
7
15
0
SCK
MOSI
Addr
15
Addr
14
Addr
8
Addr
7
Addr
6
Addr
0
Val
15
Val
14
Val
8
Val
7
Val
6
Val
0
Figure 18. Functional Timing Diagram of SPI Protocol
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
25
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
PROGRAMMING EXAMPLES
This section provides programming examples showing
how to configure the chip. The registers can be written/read
by using I2C communication protocol. The chip also supports
SPI communication protocol (not supported in the 20 QFN
package), but only register write operation is supported.
PROTOTYPE FOR READING AND WRITING A REGISTER
The generic register read write prototype is used
throughout this section, as shown by the following. The I2C or
SPI implementation is specific to the I2C/SPI hardware used
in the system.
used and desired configuration. The initialization sequence
below assumes VDDIO = 3.3 V and VDDA = 1.8 V.
//--------------- Power Supply Configuration---------------// NOTE: This next 2 Write calls is needed ONLY if VDDD is
// This prototype writes a value to the entire register. All
// internally driven by the chip
// bit-fields of the register will be written.
// Configure VDDD level to 1.2V (bits 3:0)
Write REGISTER REGISTERVALUE
Write CHIP_LINREG_CTRL
// This prototype writes a value only to the bit-field specified.
// Power up internal linear regulator (Set bit 9)
// In the actual implementation, the other bit-fields should be
Write CHIP_ANA_POWER
// masked to prevent them from being written. Also, the
// NOTE: This next Write call is needed ONLY if VDDD is
// actual implementation should left-shift the BITFIELDVALUE
// externally driven
// by appropriate number to match the starting bit location of
// Turn off startup power supplies to save power (Clear bit 12 and
13)
// the BITFIELD.
0x0008
0x7260
Modify REGISTER -> BITFIELD, BITFIELDVALUE //Bitfield
Location
Write CHIP_ANA_POWER
// Example implementation
// VDDIO power supplies are less than 3.1V.
// Modify DAP_EN (bit 0) bit to value 1 to enable DAP block
// Enable the internal oscillator for the charge pump (Set bit 11)
Modify(DAP_CONTROL_REG, 0xFFFE, 1 <<
DAP_EN_STARTBIT);
Write CHIP_CLK_TOP_CTRL 0x0800
// Example Implementation of Modify
Write CHIP_ANA_POWER
void Modify(unsigned short usRegister,
unsigned short usClearMask,
unsigned short usSetValue)
0x4260
// NOTE: The next Write calls is needed only if both VDDA and
// Enable charge pump (Set bit 11)
0x4A60
// NOTE: The next modify call is only needed if both VDDA and
// VDDIO are greater than 3.1 V
{
// Configure the charge pump to use the VDDIO rail (set bit 5 and
bit 6)
unsigned short usData;
Write CHIP_LINREG_CTRL
// 1) Read current value
//---- Reference Voltage and Bias Current Configuration----
ReadRegister(usRegister, &usData);
// NOTE: The value written in the next 2 Write calls is dependent
// 2) Clear out old bits
// on the VDDA voltage value.
usData = usData & usClearMask;
// Set ground, ADC, DAC reference voltage (bits 8:4). The value
should
// 3) set new bit values
usData = usData | usSetValue;
// 4) Write out new value created
WriteRegister(usRegister, usData);
}
CHIP CONFIGURATION
All outputs (LINEOUT, HP_OUT, I2S_OUT) are muted by
default on power up. To avoid any pops/clicks, the outputs
should remain muted during these chip configuration steps.
Refer to Volume Control for volume and mute control.
0x006C
// be set to VDDA/2. This example assumes VDDA = 1.8 V.
VDDA/2 = 0.9 V.
// The bias current should be set to 50% of the nominal value (bits
3:1)
Write CHIP_REF_CTRL 0x004E
// Set LINEOUT reference voltage to VDDIO/2 (1.65 V) (bits 5:0)
and bias current (bits 11:8) to the recommended value of 0.36 mA
for 10 kOhm load with 1.0 nF capacitance
Write CHIP_LINE_OUT_CTRL 0x0322
//------------Other Analog Block Configurations-------------// Configure slow ramp up rate to minimize pop (bit 0)
Initialization
Write CHIP_REF_CTRL
Chip Powerup and Supply Configurations
// and center channel and set short detect current trip level
After the power supplies for the chip are turned on, the
following initialization sequence should be followed. Please
note that certain steps may be optional or different values
may need to be written based on the power supply voltage
0x004F
// Enable short detect mode for headphone left/right
// to 75 mA
Write CHIP_SHORT_CTRL
0x1106
// Enable Zero-cross detect if needed for HP_OUT (bit 5) and ADC
(bit 1)
SGTL5000
26
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Write CHIP_ANA_CTRL
0x0133
//------------Power up Inputs/Outputs/Digital Blocks--------// Power up LINEOUT, HP, ADC, DAC
Write CHIP_ANA_POWER 0x6AFF
// Power up desired digital blocks
// I2S_IN (bit 0), I2S_OUT (bit 1), DAP (bit 4), DAC (bit 5),
// ADC (bit 6) are powered on
Write CHIP_DIG_POWER
0x0073
Modify CHIP_PLL_CTRL->FRAC_DIVISOR Frac_Divisor // bits
10:0
Input/Output Routing
To avoid any pops/clicks, the outputs should be muted
during these chip configuration steps. Refer to Volume
Control for volume and mute control.
A few example routes are shown below:
//----------------Set LINEOUT Volume Level-------------------
// Example 1: I2S_IN -> DAP -> DAC -> LINEOUT, HP_OUT
// Set the LINEOUT volume level based on voltage reference
(VAG)
// Route I2S_IN to DAP
// values using this formula
// Route DAP to DAC
// Value = (int)(40*log(VAG_VAL/LO_VAGCNTRL) + 15)
Modify CHIP_SSS_CTRL->DAC_SELECT 0x0003 // bits 5:4
// Assuming VAG_VAL and LO_VAGCNTRL is set to 0.9 V and
1.65 V respectively, the // left LO vol (bits 12:8) and right LO
volume (bits 4:0) value should be set // to 5
// Select DAC as the input to HP_OUT
Write CHIP_LINE_OUT_VOL 0x0505
System MCLK and Sample Clock
// Configure SYS_FS clock to 48 kHz
// Configure MCLK_FREQ to 256*Fs
Modify CHIP_CLK_CTRL->SYS_FS 0x0002 // bits 3:2
Modify CHIP_CLK_CTRL->MCLK_FREQ 0x0000 // bits 1:0
// Configure the I2S clocks in master mode
// NOTE: I2S LRCLK is same as the system sample clock
Modify CHIP_I2S_CTRL->MS 0x0001 // bit 7
PLL Configuration
These programming steps are needed only when the PLL
is used. Refer to Using the PLL - Asynchronous SYS_MCLK
input for details on when to use the PLL.
To avoid any pops/clicks, the outputs should be muted
during these chip configuration steps. Refer to Volume
Control for volume and mute control.
// Power up the PLL
Modify CHIP_ANA_POWER->PLL_POWERUP 0x0001 // bit 10
Modify CHIP_ANA_POWER->VCOAMP_POWERUP 0x0001 //
bit 8
// NOTE: This step is required only when the external SYS_MCLK
// is above 17 MHz. In this case the external SYS_MCLK clock
Modify CHIP_SSS_CTRL->DAP_SELECT 0x0001 // bits 7:6
Modify CHIP_ANA_CTRL->SELECT_HP 0x0000 // bit 6
// Example 2: MIC_IN -> ADC -> I2S_OUT
// Set ADC input to MIC_IN
Modify CHIP_ANA_CTRL->SELECT_ADC 0x0000 // bit 2
// Route ADC to I2S_OUT
Modify CHIP_SSS_CTRL->I2S_SELECT 0x0000 // bits 1:0
// Example 3: LINEIN -> HP_OUT
// Select LINEIN as the input to HP_OUT
Modify CHIP_ANA_CTRL->SELECT_HP 0x0001 // bit 6
DIGITAL AUDIO PROCESSOR CONFIGURATION
To avoid any pops/clicks, the outputs should be muted
during these chip configuration steps. Refer to Volume
Control for volume and mute control.
// Enable DAP block
// NOTE: DAP will be in a pass-through mode if none of DAP
// sub-blocks are enabled.
Modify DAP_CONTROL->DAP_EN 0x0001 // bit 0
Dual Input Mixer
These programming steps are needed only if dual input
mixer feature is used.
// Enable Dual Input Mixer
Modify DAP_CONTROL->MIX_EN 0x0001 // bit 4
// NOTE: This example assumes mix level of main and mix
// must be divided by 2
// channels as 100% and 50% respectively
Modify CHIP_CLK_TOP_CTRL->INPUT_FREQ_DIV2 0x0001 //
bit 3
// Configure main channel volume to 100% (No change from input
// level)
Sys_MCLK_Input_Freq = Sys_MCLK_Input_Freq/2;
Write DAP_MAIN_CHAN 0x4000
// PLL output frequency is different based on the sample clock
// Configure mix channel volume to 50% (attenuate the mix
// rate used.
// input level by half)
if (Sys_Fs_Rate == 44.1 kHz)
Write DAP_MIX_CHAN 0x4000
PLL_Output_Freq = 180.6336 MHz
else
PLL_Output_Freq = 196.608 MHz
// Set the PLL dividers
Int_Divisor = floor(PLL_Output_Freq/Sys_MCLK_Input_Freq)
Frac_Divisor = ((PLL_Output_Freq/Sys_MCLK_Input_Freq) Int_Divisor)*2048
Modify CHIP_PLL_CTRL->INT_DIVISOR Int_Divisor // bits 15:11
Freescale Surround
The Freescale Surround on/off function is typically
controlled by the end-user. End-user driven programming
steps are shown in End-user Driven Chip Configuration.
The default WIDTH_CONTROL of 4 should be appropriate
for most applications. This optional programming step shows
how to configure a different width value.
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
27
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
// Configure the surround width
// (0x0 = Least width, 0x7 = Most width). This example shows
// a width setting of 5
Modify DAP_SGTL_SURROUND->WIDTH_CONTROL 0x0005
// bits 6:4
Freescale Bass Enhance
The Freescale Bass Enhance on/off function is typically
controlled by the end-user. End-user driven programming
steps are shown in End-user Driven Chip Configuration.
The default LR_LEVEL value of 0x0005 results in no
change in the input signal level and BASS_LEVEL value of
0x001F adds some harmonic boost to the main signal. The
default settings should work for most applications. This
optional programming step shows how to configure a
different value.
// Gain up the input signal level
Modify DAP_BASS_ENHANCE_CTRL->LR_LEVEL 0x0002
// bits 7:4
// Add harmonic boost
Modify DAP_BASS_ENHANCE_CTRL->BASS_LEVEL 0x003F);
// bits 6:0
7-Band Parametric EQ / 5-Band Graphic EQ / Tone
Control
Only one audio EQ block can be used at a given time. The
pseudocode in this section shows how to select each block.
Some parameters of the audio EQ are typically controlled
by the end-user. End-user driven programming steps are
shown in End-user Driven Chip Configuration.
// 7-Band PEQ Mode
// Select 7-Band PEQ mode and enable 7 PEQ filters
Write DAP_AUDIO_EQ 0x0001
Write DAP_PEQ 0x0007
Write DAP_AVC_DECAY 0x0028
I2S CONFIGURATION
By default the I2S port on the chip is configured for 24-bits
of data in I2S format with SCLK set for 64*Fs. This can be
modified by setting various bit-fields in the CHIP_I2S_CTRL
register.
VOLUME CONTROL
The outputs should be unmuted after all the configuration
is complete.
//---------------- Input Volume Control--------------------// Configure ADC left and right analog volume to desired default.
// Example shows volume of 0dB
Write CHIP_ANA_ADC_CTRL 0x0000
// Configure MIC gain if needed. Example shows gain of 20dB
Modify CHIP_MIC_CTRL->GAIN 0x0001
// bits 1:0
//---------------- Volume and Mute Control--------------------// Configure HP_OUT left and right volume to minimum, unmute
// HP_OUT and ramp the volume up to desired volume.
Write CHIP_ANA_HP_CTRL 0x7F7F
Modify CHIP_ANA_CTRL->MUTE_HP 0x0000
// bit 4
// Code assumes that left and right volumes are set to same value
// So it only uses the left volume for the calculations
usCurrentVolLeft = 0x7F;
usNewVolLeft = usNewVol & 0xFF;
usNumSteps = usNewVolLeft - usCurrentVolLeft;
if (usNumSteps == 0) return;
// Ramp up
for (int i = 0; i < usNumSteps; i++)
{
++usCurrentVolLeft;
// Tone Control mode
usCurrentVol = (usCurrentVolLeft << 8) | (usCurrentVolLeft);
Write DAP_AUDIO_EQ 0x0002
// 5-Band GEQ Mode
Write DAP_AUDIO_EQ 0x0003
Automatic Volume Control (AVC)
The AVC on/off function is typically controlled by the enduser. End-user driven programming steps are shown in Enduser Driven Chip Configuration.
The default configuration of the AVC should work for most
applications. However, the following example shows how to
change the configuration if needed.
// Configure threshold to -18dB
Write DAP_AVC_THRESHOLD 0x0A40
// Configure attack rate to 16dB/s
Write DAP_AVC_ATTACK 0x0014
// Configure decay rate to 2dB/s
Write CHIP_ANA_HP_CTRL usCurrentVol;
}
// LINEOUT and DAC volume control
Modify CHIP_ANA_CTRL->MUTE_LO 0x0000
// bit 8
// Configure DAC left and right digital volume. Example shows
// volume of 0dB
Write CHIP_DAC_VOL 0x3C3C
Modify CHIP_ADCDAC_CTRL->DAC_MUTE_LEFT 0x0000
// bit 2
Modify CHIP_ADCDAC_CTRL->DAC_MUTE_RIGHT 0x0000
// bit 3
// Unmute ADC
Modify CHIP_ANA_CTRL->MUTE_ADC 0x0000
// bit 0
SGTL5000
28
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
END-USER DRIVEN CHIP CONFIGURATION
End-users control features like volume up/down, and
audio EQ parameters such as Bass and Treble. This requires
programming the chip without introducing any pops/clicks or
any other disturbance to the output. This section shows
examples on how to program these features.
VOLUME AND MUTE CONTROL
Refer to Volume Control for examples on how to program
volume when end-user changes the volume or mutes/
unmutes the output. Note that the DAC volume ramp is
automatically handled by the chip.
7-BAND PEQ PRESET SELECTION
This programming example shows how to load the filter
coefficients when the end-user changes PEQ presets such
as Rock, Speech, Classical etc.
// Load the 5 coefficients for each band and write them to
// appropriate filter address. Repeat this for all enabled
// filters (this example shows 7 filters)
usNumSteps = abs(usNewVol - usCurrentVol);
if (usNumSteps == 0) return;
for (int i = 0; i++; usNumSteps)
{
if (usNewVol > usCurrentVol)
++usCurrentVol;
else
--usCurrentVol;
Write DAP_AUDIO_EQ_BASS_BAND0 usCurrentVol;
}
TONE CONTROL - BASS AND TREBLE CHANGE
This programming example shows how to program the
Tone Control Bass and Treble when end-user changes it on
the fly.
Tone Control Bass and Treble volume should be ramped
in 0.5 dB steps in order to avoid any pops. The example
assumes that Treble is changed to a new value. Bass can be
programmed similarly.
for (i = 0; i < 7; i++)
// Read current Treble value
{
usCurrentVal = Read DAP_AUDIO_EQ_TREBLE_BAND4
// Note that each 20-bit coefficient is broken into 16-bit MSB
// Convert the new Treble value to hex value
// (unsigned short usXXMSB) and 4-bit LSB (unsigned short
usNewVol = 4*dNewValDb + 47;
// usXXLSB)
// Calculate the number of steps
Write DAP_COEF_WR_B0_LSB usB0MSB[i]
usNumSteps = abs(usNewVal - usCurrentVal);
Write DAP_COEF_WR_B0_MSB usB0LSB[i]
if (usNumSteps == 0) return;
Write DAP_COEF_WR_B1_LSB usB1MSB[i]
for (int i = 0; i++; usNumSteps)
Write DAP_COEF_WR_B1_MSB usB1LSB[i]
{
Write DAP_COEF_WR_B2_LSB usB2MSB[i]
if (usNewVal > usCurrentVal)
Write DAP_COEF_WR_B2_MSB usB2LSB[i]
++usCurrentVal;
Write DAP_COEF_WR_A1_LSB usA1MSB[i]
else
Write DAP_COEF_WR_A1_MSB usA1LSB[i]
--usCurrentVal;
Write DAP_COEF_WR_A2_LSB usA2MSB[i]
Write DAP_AUDIO_EQ_TREBLE_BAND4 usCurrentVal;
Write DAP_COEF_WR_A2_MSB usA2LSB[i]
}
// Set the index of the filter (bits 7:0) and load the
// coefficients
FREESCALE SURROUND ON/OFF
Modify DAP_FILTER_COEF_ACCESS->INDEX (0x0101 + i)
This programming example shows how to program the
Surround when end-user turns it on/off on their device.
The Surround width should be ramped up to highest value
before enabling/disabling the Surround to avoid any pops.
// bit 8
}
5-BAND GEQ VOLUME CHANGE
This programming example shows how to program the
GEQ volume when end-user changes the volume on any of
the 5 bands.
GEQ volume should be ramped in 0.5 dB steps in order to
avoid any pops. The example assumes that volume is
ramped on Band 0. Other bands can be programmed
similarly.
// Read current volume set on Band 0
usCurrentVol = Read DAP_AUDIO_EQ_BASS_BAND0
// Read current Surround width value
// WIDTH_CONTROL bits 6:4
usOriginalVal = (Read DAP_SGTL_SURROUND >> 4) &&
0x0003;
usNextVal = usOriginalVal;
// Ramp up the width to maximum value of 7
for (int i = 0; i++; (7 - usOriginalVal)
{
++usNextVal;
// Convert the new volume to hex value
Modify DAP_SGTL_SURROUND->WIDTH_CONTROL
usNextVal;
usNewVol = 4*dNewVolDb + 47;
}
// Calculate the number of steps
// Enable (To disable, write 0x0000) Surround
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
29
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
// SELECT bits 1:0
{
Modify DAP_SGTL_SURROUND->SELECT 0x0003;
++usNextVal;
// Ramp down the width to original value
for (int i = 0; i++; (7 - usOriginalVal)
Modify DAP_BASS_ENHANCE_CTRL->BASS_LEVEL
usNextVal;
{
}
--usNextVal;
// Enable (To disable, write 0x0000) Bass Enhance
Modify DAP_SGTL_SURROUND->WIDTH_CONTROL
usNextVal;
// EN bit 0
}
// Ramp Bass level back to original value
Modify DAP_BASS_ENHANCE->EN 0x0001;
for (int i = 0; i++; usNumSteps)
BASS ENHANCE ON/OFF
{
This programming example shows how to program the
Bass Enhance on/off when end-user turns it on/off on their
device.
The Bass level should be ramped down to the lowest Bass
before Bass Enhance feature is turned on/off.
--usNextVal;
Modify DAP_BASS_ENHANCE_CTRL->BASS_LEVEL
usNextVal;
}
// Read current Bass level value
AUTOMATIC VOLUME CONTROL (AVC) ON/OFF
// BASS_LEVEL bits 6:0
This programming example shows how to program the
AVC on/off when end-user turns it on/off on their device.
usOriginalVal = Read DAP_BASS_ENHANCE_CTRL &&
0x007F;
// Enable AVC (To disable, write 0x0000)
usNextVal = usOriginalVal;
Modify DAP_AVC_CTRL->EN 0x0001
// Ramp Bass level to lowest bass (lowest bass = 0x007F)
// bit 0
usNumSteps = abs(0x007F - usOriginalVal);
Register description
for (int i = 0; i++; usNumSteps)
CHIP_ID
0x0000
Table 16. CHIP_ID 0x0000
15
14
13
12
11
10
9
8
7
6
5
4
PARTID
3
2
1
0
REVID
BITS
FIELD
RW
RESET
15:8
PARTID
RO
0xA0
DEFINITION
SGTL5000 Part ID
0xA0 - 8 bit identifier for SGTL5000
7:0
REVID
RO
0x00
SGTL5000 Revision ID
0xHH - revision number for SGTL5000.
Table 17. CHIP_DIG_POWER 0x0002
11
10
9
8
6
ADC_POWERUP
RSVD
7
5
4
BITS
FIELD
RW
RESET
15:7
RSVD
RO
0x0
Reserved
6
ADC_POWERUP
RW
0x0
Enable/disable the ADC block, both digital and analog
3
2
RSVD
1
0
I2S_IN_POWERUP
12
I2S_OUT_POWERUP
13
DAP_POWERUP
14
DAC_POWERUP
15
DEFINITION
0x0 = Disable
0x1 = Enable
SGTL5000
30
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
BITS
FIELD
RW
RESET
5
DAC_POWERUP
RW
0x0
DEFINITION
Enable/disable the DAC block, both analog and digital
0x0 = Disable
0x1 = Enable
4
DAP_POWERUP
RW
0x0
Enable/disable the DAP block
0x0 = Disable
0x1 = Enable
3:2
RSVD
RW
0x0
Reserved
1
I2S_OUT_POWERUP
RW
0x0
Enable/disable the I2S data output
0x0 = Disable
0x1 = Enable
0
I2S_IN_POWERUP
RW
0x0
Enable/disable the I2S data input
0x0 = Disable
0x1 = Enable
Table 18. CHIP_CLK_CTRL 0x0004
15
14
13
12
11
10
9
8
7
6
RSVD
5
4
RATE_MODE
3
2
SYS_FS
1
0
MCLK_FREQ
BITS
FIELD
RW
RESET
DEFINITION
15:6
RSVD
RO
0x0
Reserved
5:4
RATE_MODE
RW
0x0
Sets the sample rate mode. MCLK_FREQ is still specified relative to the rate in SYS_FS
0x0 = SYS_FS specifies the rate
0x1 = Rate is 1/2 of the SYS_FS rate
0x2 = Rate is 1/4 of the SYS_FS rate
0x3 = Rate is 1/6 of the SYS_FS rate
3:2
SYS_FS
RW
0x2
Sets the internal system sample rate
0x0 = 32 kHz
0x1 = 44.1 kHz
0x2 = 48 kHz
0x3 = 96 kHz
1:0
MCLK_FREQ
RW
0x0
Identifies incoming SYS_MCLK frequency and if the PLL should be used
0x0 = 256*Fs
0x1 = 384*Fs
0x2 = 512*Fs
0x3 = Use PLL
The 0x3 (Use PLL) setting must be used if the SYS_MCLK is not a standard multiple of Fs
(256, 384, or 512). This setting can also be used if SYS_MCLK is a standard multiple of Fs.
Before this field is set to 0x3 (Use PLL), the PLL must be powered up by setting
CHIP_ANA_POWER->PLL_POWERUP and CHIP_ANA_POWER>VCOAMP_POWERUP. Also, the PLL dividers must be calculated based on the external
MCLK rate and CHIP_PLL_CTRL register must be set (see CHIP_PLL_CTRL register
description details on how to calculate the divisors).
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
31
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 19. CHIP_I2S_CTRL 0x0006
12
11
10
9
8
RSVD
7
MS
6
5
4
DLEN
3
2
I2S_MODE
1
LRALIGN
13
SCLK_INV
14
SCLKFREQ
15
0
LRPOL
BITS
FIELD
RW
RESET
DEFINITION
15:9
RSVD
RO
0x0
Reserved
8
SCLKFREQ
RW
0x0
Sets frequency of I2S_SCLK when in master mode (MS=1). When in slave mode (MS=0),
this field must be set appropriately to match SCLK input rate.
0x0 = 64Fs
0x1 = 32Fs - Not supported for RJ mode (I2S_MODE = 1)
7
MS
RW
0x0
Configures master or slave of I2S_LRCLK and I2S_SCLK. 0x0 = Slave: I2S_LRCLK and
I2S_SCLK are inputs
0x1 = Master: I2S_LRCLK and I2S_SCLK are outputs
NOTE: If the PLL is used (CHIP_CLK_CTRL->MCLK_FREQ==0x3), the SGTL5000 must
be a master of the I2S port (MS==1)
6
SCLK_INV
RW
0x0
Sets the edge that data (input and output) is clocked in on for I2S_SCLK
0x0 = data is valid on rising edge of I2S_SCLK
0x1 = data is valid on falling edge of I2S_SCLK
5:4
DLEN
RW
0x1
I2S data length
0x0 = 32 bits (only valid when SCLKFREQ=0), not valid for Right Justified Mode
0x1 = 24 bits (only valid when SCLKFREQ=0)
0x2 = 20 bits
0x3 = 16 bits
3:2
I2S_MODE
RW
0x0
Sets the mode for the I2S port
0x0 = I2S mode or Left Justified (Use LRALIGN to select)
0x1 = Right Justified Mode
0x2 = PCM Format A/B
0x3 = RESERVED
1
LRALIGN
RW
0x0
I2S_LRCLK Alignment to data word. Not used for Right Justified mode
0x0 = Data word starts 1 I2S_SCLK delay after I2S_LRCLK transition (I2S format, PCM
format A)
0x1 = Data word starts after I2S_LRCLK transition (left justified format, PCM format B)
0
LRPOL
RW
0x0
I2S_LRCLK Polarity when data is presented.
0x0 = I2S_LRCLK = 0 - Left, 1 - Right
1x0 = I2S_LRCLK = 0 - Right, 1 - Left
The left subframe should be presented first regardless of the setting of LRPOL.
SGTL5000
32
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 20. CHIP_SSS_CTRL 0x000A
10
RSVD
9
8
DAP_MIX_SELECT
11
I2S_LRSWAP
12
DAC_LRSWAP
13
DAP_LRSWAP
RSVD
14
DAP_MIX_LRSWAP
15
7
6
DAP_SELECT
BITS
FIELD
RW
RESET
15
RSVD
RW
0x0
Reserved
14
DAP_MIX_LRSWAP
RW
0x0
DAP Mixer Input Swap
5
4
3
DAC_SELECT
2
RSVD
1
0
I2S_SELECT
DEFINITION
0x0 = Normal Operation
0x1 = Left and Right channels for the DAP MIXER Input are swapped.
13
DAP_LRSWAP
RW
0x0
DAP Input Swap
0x0 = Normal Operation
0x1 = Left and Right channels for the DAP Input are swapped
12
DAC_LRSWAP
RW
0x0
DAC Input Swap
0x0 = Normal Operation
0x1 = Left and Right channels for the DAC are swapped
11
RSVD
RW
0x0
Reserved
10
I2S_LRSWAP
RW
0x0
I2S_DOUT Swap
0x0 = Normal Operation
0x1 = Left and Right channels for the I2S_DOUT are swapped
9:8
DAP_MIX_SELECT
RW
0x0
Select data source for DAP mixer
0x0 = ADC
0x1 = I2S_IN
0x2 = Reserved
0x3 = Reserved
7:6
DAP_SELECT
RW
0x0
Select data source for DAP
0x0 = ADC
0x1 = I2S_IN
0x2 = Reserved
0x3 = Reserved
5:4
DAC_SELECT
RW
0x1
Select data source for DAC
0x0 = ADC
0x1 = I2S_IN
0x2 = Reserved
0x3 = DAP
3:2
RSVD
RW
0x0
Reserved
1:0
I2S_SELECT
WO
0x0
Select data source for I2S_DOUT
0x0 = ADC
0x1 = I2S_IN
0x2 = Reserved
0x3 = DAP
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
33
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 21. CHIP_ADCDAC_CTRL 0x000E
7
6
RSVD
5
4
RSVD
BITS
FIELD
RW
RESET
15:14
RSVD
RO
0x0
Reserved
13
VOL_BUSY_DAC_RIG
HT
RO
0x0
Volume Busy DAC Right
3
2
1
0
ADC_HPF_BYPASS
8
ADC_HPF_FREEZE
9
DAC_MUTE_LEFT
10
DAC_MUTE_RIGHT
11
VOL_EXPO_RAMP
12
VOL_RAMP_EN
RSVD
13
VOL_BUSY_DAC_LEFT
14
VOL_BUSY_DAC_RIGHT
15
DEFINITION
0x0 = Ready
0x1 = Busy - This indicates the channel has not reached its programmed volume/mute
level
12
VOL_BUSY_DAC_LEF
T
RO
0x0
Volume Busy DAC Left
0x0 = Ready
0x1 = Busy - This indicates the channel has not reached its programmed volume/mute
level
11:10
RSVD
RO
0x0
Reserved
9
VOL_RAMP_EN
RW
0x1
Volume Ramp Enable
0x0 = Disables volume ramp. New volume settings take immediate effect without a
ramp
0x1 = Enables volume ramp
This field affects DAC_VOL. The volume ramp effects both volume settings and mute.
When set to 1 a soft mute is enabled.
8
VOL_EXPO_RAMP
RW
0x0
Exponential Volume Ramp Enable
0x0 = Linear ramp over top 4 volume octaves
0x1 = Exponential ramp over full volume range
This bit only takes effect if VOL_RAMP_EN is 1.
7:4
RSVD
RW
0x0
Reserved
3
DAC_MUTE_RIGHT
RW
0x1
DAC Right Mute
0x0 = Unmute
0x1 = Muted
If VOL_RAMP_EN = 1, this is a soft mute.
2
DAC_MUTE_LEFT
RW
0x1
DAC Left Mute
0x0 = Unmute
0x1 = Muted
If VOL_RAMP_EN = 1, this is a soft mute.
1
ADC_HPF_FREEZE
RW
0x0
ADC High Pass Filter Freeze
0x0 = Normal operation
0x1 = Freeze the ADC high-pass filter offset register. The offset continues to be
subtracted from the ADC data stream.
0
ADC_HPF_BYPASS
RW
0x0
ADC High Pass Filter Bypass
0x0 = Normal operation
0x1 = Bypassed and offset not updated
SGTL5000
34
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 22. CHIP_DAC_VOL 0x0010
15
14
13
12
11
10
9
8
7
6
5
DAC_VOL_RIGHT
4
3
2
1
0
DAC_VOL_LEFT
BITS
FIELD
RW
RESET
15:8
DAC_VOL_RIGHT
RW
0x3C
DEFINITION
DAC Right Channel Volume
Set the Right channel DAC volume with 0.5017 dB steps from 0 to -90 dB
0x3B and less = Reserved
0x3C = 0 dB
0x3D = -0.5 dB
0xF0 = -90 dB
0xFC and greater = Muted
If VOL_RAMP_EN = 1, there is an automatic ramp to the new volume setting.
7:0
DAC_VOL_LEFT
RW
0x3C
DAC Left Channel Volume
Set the Left channel DAC volume with 0.5017 dB steps from 0 to -90 dB
0x3B and less = Reserved
0x3C = 0 dB
0x3D = -0.5 dB
0xF0 = -90 dB
0xFC and greater = Muted
If VOL_RAMP_EN = 1, there is an automatic ramp to the new volume setting.
Table 23. CHIP_PAD_STRENGTH 0x0014
15
14
13
12
11
10
RSVD
9
8
I2S_LRCLK
7
6
5
I2S_SCLK
4
I2S_DOUT
BITS
FIELD
RW
RESET
15:14
RSVD
RW
0x0
Reserved
9:8
I2S_LRCLK
RW
0x1
I2S LRCLK Pad Drive Strength
3
2
CTRL_DATA
1
0
CTRL_CLK
DEFINITION
Sets drive strength for output pads per the table below.
VDDIO
1.8 V
2.5 V
3.3 V
0x0 = Disable
7:6
I2S_SCLK
RW
0x1
0x1 =
1.66 mA
2.87 mA
4.02 mA
0x2 =
3.33 mA
5.74 mA
8.03 mA
0x3 =
4.99 mA
8.61 mA
12.05 mA
I2S SCLK Pad Drive Strength
Sets drive strength for output pads per the table below.
VDDIO
1.8 V
2.5 V
3.3 V
0x0 = Disable
0x1 =
1.66 mA
2.87 mA
4.02 mA
0x2 =
3.33 mA
5.74 mA
8.03 mA
0x3 =
4.99 mA
8.61 mA
12.05 mA
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
35
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
BITS
FIELD
5:4
RW
I2S_DOUT
RW
RESET
0x1
DEFINITION
2
I S DOUT Pad Drive Strength
Sets drive strength for output pads per the table below.
VDDIO
1.8 V
2.5 V
3.3 V
0x0 = Disable
3:2
CTRL_DATA
RW
0x3
0x1 =
1.66 mA
2.87 mA
4.02 mA
0x2 =
3.33 mA
5.74 mA
8.03 mA
0x3 =
4.99 mA
8.61 mA
12.05 mA
I2C DATA Pad Drive Strength
Sets drive strength for output pads per the table below.
VDDIO
1.8 V
2.5 V
3.3 V
0x0 = Disable
1:0
CTRL_CLK
RW
0x3
0x1 =
1.66 mA
2.87 mA
4.02 mA
0x2 =
3.33 mA
5.74 mA
8.03 mA
0x3 =
4.99 mA
8.61 mA
12.05 mA
I2 C
CLK Pad Drive Strength
Sets drive strength for output pads per the table below.
VDDIO
1.8 V
2.5 V
3.3 V
0x0 = Disable
0x1 =
1.66 mA
2.87 mA
4.02 mA
0x2 =
3.33 mA
5.74 mA
8.03 mA
0x3 =
4.99 mA
8.61 mA
12.05 mA
Table 24. CHIP_ANA_ADC_CTRL 0x0020
14
13
12
11
10
9
8
ADC_VOL_M6DB
15
RSVD
7
6
5
4
ADC_VOL_RIGHT
BITS
FIELD
RW
RESET
15:9
RSVD
RO
0x0
Reserved
8
ADC_VOL_M6DB
RW
0x0
ADC Volume Range Reduction
3
2
1
0
ADC_VOL_LEFT
DEFINITION
This bit shifts both right and left analog ADC volume range down by 6.0 dB.
0x0 = No change in ADC range
0x1 = ADC range reduced by 6.0 dB
SGTL5000
36
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
BITS
FIELD
RW
RESET
7:4
ADC_VOL_RIGHT
RW
0x0
DEFINITION
ADC Right Channel Volume
Right channel analog ADC volume control in 1.5.0 dB steps.
0x0 = 0 dB
0x1 = +1.5 dB
...
0xF = +22.5 dB
This range is -6.0 dB to +16.5 dB if ADC_VOL_M6DB is set to 1.
3:0
ADC_VOL_LEFT
RW
0x0
ADC Left Channel Volume
Left channel analog ADC volume control in 1.5 dB steps.
0x0 = 0 dB
0x1 = +1.5 dB
...
0xF = +22.5 dB
This range is -6.0 dB to +16.5 dB if ADC_VOL_M6DB is set to 1.
Table 25. CHIP_ANA_HP_CTRL 0x0022
15
14
13
12
RSVD
BITS
11
10
9
8
HP_VOL_RIGHT
FIELD
RW
RESET
7
6
RSVD
5
4
3
2
1
0
HP_VOL_LEFT
DEFINITION
15
RSVD
RO
0x0
Reserved
14:8
HP_VOL_RIGHT
RW
0x18
Headphone Right Channel Volume
Right channel headphone volume control with 0.5 dB steps.
0x00 = +12 dB
0x01 = +11.5 dB
0x18 = 0 dB
...
0x7F = -51.5 dB
7
RSVD
RO
0x0
Reserved
6:0
HP_VOL_LEFT
RW
0x18
Headphone Left Channel Volume
Left channel headphone volume control with 0.5 dB steps.
0x00 = +12 dB
0x01 = +11.5 dB
0x18 = 0 dB
...
0x7F = -51.5 dB
Table 26 is an analog control register that includes mutes,
input selects, and zero-cross-detectors for the ADC,
headphone, and LINEOUT.
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
37
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 26. 7.0.0.11. CHIP_ANA_CTRL 0x0024
8
MUTE_LO
RSVD
9
BITS
FIELD
RW
RESET
15:9
RSVD
RO
0x0
Reserved
8
MUTE_LO
RW
0x1
LINEOUT Mute
7
RSVD
6
5
4
3
RSVD
2
1
0
MUTE_ADC
10
EN_ZCD_ADC
11
SELECT_ADC
12
MUTE_HP
13
EN_ZCD_HP
14
SELECT_HP
15
DEFINITION
0x0 = Unmute
0x1 = Mute
7
RSVD
RO
0x0
Reserved
6
SELECT_HP
RW
0x0
Select the headphone input.
0x0 = DAC
0x1 = LINEIN
5
EN_ZCD_HP
RW
0x0
Enable the headphone zero cross detector (ZCD)
0x0 = HP ZCD disabled
0x1 = HP ZCD enabled
4
MUTE_HP
RW
0x1
Mute the headphone outputs
0x0 = Unmute
0x1 = Mute
3
RSVD
RO
0x0
Reserved
2
SELECT_ADC
RW
0x0
Select the ADC input.
0x0 = Microphone
0x1 = LINEIN
1
EN_ZCD_ADC
RW
0x0
Enable the ADC analog zero cross detector (ZCD)
0x0 = ADC ZCD disabled
0x1 = ADC ZCD enabled
0
MUTE_ADC
RW
0x1
Mute the ADC analog volume
0x0 = Unmute
0x1 = Mute
The Table 27, CHIP_LINREG_CTRL 0x0026 register
controls the VDDD linear regulator and the charge pump.
SGTL5000
38
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 27. CHIP_LINREG_CTRL 0x0026
14
13
12
11
10
9
8
7
VDDC_MAN_ASSN
RSVD
6
5
VDDC_ASSN_OVRD
15
4
3
RSVD
2
1
0
D_PROGRAMMING
BITS
FIELD
RW
RESET
DEFINITION
15:7
RSVD
RO
0x0
Reserved
6
VDDC_MAN_ASSN
RW
0x0
Determines chargepump source when VDDC_ASSN_OVRD is set.
0x0 = VDDA
0x1 = VDDIO
5
VDDC_ASSN_OVRD
RW
0x0
Charge pump Source Assignment Override
0x0 = Charge pump source is automatically assigned based on higher of VDDA and
VDDIO
0x1 = the source of charge pump is manually assigned by VDDC_MAN_ASSN
If VDDIO and VDDA are both the same and greater than 3.1 V, VDDC_ASSN_OVRD
and VDDC_MAN_ASSN should be used to manually assign VDDIO as the source for
charge pump.
4
RSVD
RW
0x0
Reserved
3:0
D_PROGRAMMING
RW
0x0
Sets the VDDD linear regulator output voltage in 50 mV steps. Must clear the
LINREG_SIMPLE_POWERUP and STARTUP_POWERUP bits in the 0x0030 register
after power-up, for this setting to produce the proper VDDD voltage.
0x0 = 1.60
0xF = 0.85
The Table 28, CHIP_REF_CTRL 0x0028 register controls
the bandgap reference bias voltage and currents.
Table 28. CHIP_REF_CTRL 0x0028
14
13
12
11
10
9
8
RSVD
7
6
5
4
VAG_VAL
BITS
FIELD
RW
RESET
15:9
RSVD
RO
0x0
Reserved
8:4
VAG_VAL
RW
0x0
Analog Ground Voltage Control
3
2
BIAS_CTRL
1
0
SMALL_POP
15
DEFINITION
These bits control the analog ground voltage in 25 mV steps. This should usually be
set to VDDA/2 or lower for best performance (maximum output swing at minimum
THD). This VAG reference is also used for the DAC and ADC voltage reference. So
changing this voltage scales the output swing of the DAC and the output signal of the
ADC.
0x00 = 0.800 V
0x1F = 1.575 V
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
39
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
BITS
FIELD
RW
RESET
3:1
BIAS_CTRL
RW
0x0
DEFINITION
Bias control
These bits adjust the bias currents for all of the analog blocks. By lowering the bias
current a lower quiescent power is achieved. It should be noted that this mode can
affect performance by 3-4 dB.
0x0 = Nominal
0x1-0x3=+12.5%
0x4=-12.5%
0x5=-25%
0x6=-37.5%
0x7=-50%
0
SMALL_POP
RW
0x0
VAG Ramp Control
Setting this bit slows down the VAG ramp from ~200 to ~400 ms to reduce the startup
pop, but increases the turn on/off time.
0x0 = Normal VAG ramp
0x1 = Slow down VAG ramp
The Table 29, CHIP_MIC_CTRL 0x002A register controls
the microphone gain and the internal microphone biasing
circuitry.
Table 29. CHIP_MIC_CTRL 0x002A
15
14
13
12
11
10
RSVD
9
8
7
6
BIAS_RESISTOR RSVD
5
4
BIAS_VOLT
BITS
FIELD
RW
RESET
15:10
RSVD
RO
0x0
Reserved
9:8
BIAS_RESISTOR
RW
0x0
MIC Bias Output Impedance Adjustment
3
2
RSVD
1
0
GAIN
DEFINITION
Controls an adjustable output impedance for the microphone bias. If this is set to zero
the micbias block is powered off and the output is highZ.
0x0 = Powered off
0x1 = 2.0 k
0x2 = 4.0 k
0x3 = 8.0 k
7
RSVD
RO
0x0
Reserved
6:4
BIAS_VOLT
RW
0x0
MIC Bias Voltage Adjustment
Controls an adjustable bias voltage for the microphone bias amp in 250 mV steps. This
bias voltage setting should be no more than VDDA-200 mV for adequate power supply
rejection.
0x0 = 1.25 V
...
0x7 = 3.00 V
3:2
RSVD
RO
0x0
Reserved
1:0
GAIN
RW
0x0
MIC Amplifier Gain
Sets the microphone amplifier gain. At 0 dB setting the THD can be slightly higher than
other paths- typically around ~65 dB. At other gain settings the THD are better.
0x0 = 0 dB
0x1 = +20 dB
0x2 = +30 dB
0x3 = +40 dB
SGTL5000
40
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 30. CHIP_LINE_OUT_CTRL 0x002C
15
14
13
12
11
RSVD
10
9
8
7
OUT_CURRENT
6
5
4
RSVD
3
2
1
0
LO_VAGCNTRL
BITS
FIELD
RW
RESET
DEFINITION
15:12
RSVD
RO
0x0
Reserved
11:8
OUT_CURRENT
RW
0x0
Controls the output bias current for the LINEOUT amplifiers. The nominal
recommended setting for a 10 k load with 1.0 nF load cap is 0x3. There are only 5
valid settings.
0x0=0.18 mA, 0x1=0.27 mA, 0x3=0.36 mA, 0x7=0.45 mA, 0xF=0.54 mA
7:6
RSVD
RO
0x0
Reserved
5:0
LO_VAGCNTRL
RW
0x0
LINEOUT Amplifier Analog Ground Voltage
Controls the analog ground voltage for the LINEOUT amplifiers in 25 mV steps. This
should usually be set to VDDIO/2.
0x00 = 0.800 V
...
0x1F = 1.575 V
...
0x23 = 1.675 V
0x24-0x3F are invalid
Table 31. CHIP_LINE_OUT_VOL 0x002E
15
14
13
12
RSVD
11
10
9
8
7
LO_VOL_RIGHT
6
5
4
RSVD
BITS
FIELD
RW
RESET
15:13
RSVD
RO
0x0
Reserved
12:8
LO_VOL_RIGHT
RW
0x4
LINEOUT Right Channel Volume
3
2
1
0
LO_VOL_LEFT
DEFINITION
Controls the right channel LINEOUT volume in 0.5 dB steps. Higher codes have more
attenuation. See programming information for Left channel.
7:5
RSVD
RO
0x0
Reserved
4:0
LO_VOL_LEFT
RW
0x4
LINEOUT Left Channel Output Level
The LO_VOL_LEFT is used to normalize the output level of the left line output to full
scale based on the values used to set LINE_OUT_CTRL -> LO_VAGCNTRL and
CHIP_REF_CTRL -> VAG_VAL. In general this field should be set to:
40*log((VAG_VAL)/(LO_VAGCNTRL)) + 15
Table 32 shows suggested values based on typical VDDIO and VDDA voltages.
After setting to the nominal voltage, this field can be used to adjust the output level in
+/-0.5 dB increments by using values higher or lower than the nominal setting.
Table 32. LINEOUT Output Level Values
VDDA
VAG_VAL
VDDIO
LO_VAGCNTRL
LO_VOL_*
1.8 V
0.9
3.3 V
1.55
0x06
1.8 V
0.9
1.8 V
0.9
0x0F
3.3 V
1.55
1.8 V
0.9
0x19
3.3 V
1.55
3.3 V
1.55
0x0F
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
41
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
The Table 33, CHIP_ANA_POWER 0x0030 register
contains all of the power down controls for the analog blocks.
The only other power-down controls are BIAS_RESISTOR in
the MIC_CTRL register and the EN_ZCD control bits in
ANA_CTRL.
Table 33. CHIP_ANA_POWER 0x0030
0
LINEOUT_POWERUP
1
ADC_POWERUP
2
CAPLESS_HEADPHONE_POWERUP
3
DAC_POWERUP
4
HEADPHONE_POWERUP
5
REFTOP_POWERUP
6
ADC_MONO
7
VAG_POWERUP
8
VCOAMP_POWERUP
9
LINREG_D_POWERUP
10
PLL_POWERUP
11
VDDC_CHRGPMP_POWERUP
12
STARTUP_POWERUP
RSVD
13
LINREG_SIMPLE_POWERUP
14
DAC_MONO
15
BITS
FIELD
RW
RESET
DEFINITION
15
RSVD
RW
0x0
Reserved
14
DAC_MONO
RW
0x1
While DAC_POWERUP is set, this allows the DAC to be put into left only mono
operation for power savings.
0x0 = Mono (left only)
0x1 = Stereo
13
LINREG_SIMPLE_PO
WERUP
RW
0x1
Power up the simple (low power) digital supply regulator. After reset, this bit can be
cleared IF VDDD is driven externally OR the primary digital linreg is enabled with
LINREG_D_POWERUP
0x0 = Power down
0x1 = Power up
12
STARTUP_POWERUP
RW
0x1
Power up the circuitry needed during the power up ramp and reset. After reset this bit
can be cleared if VDDD is coming from an external source.
0x0 = Power down
0x1 = Power up
11
VDDC_CHRGPMP_PO
WERUP
RW
0x0
Power up the VDDC charge pump block. If neither VDDA or VDDIO is 3.0 V or larger
this bit should be cleared before analog blocks are powered up.
0x0 = Power down
0x1 = Power up
Note that for charge pump to function, either the PLL must be powered on and
programmed correctly (refer to CHIP_CLK_CTRL->MCLK_FREQ description) or the
internal oscillator (set CLK_TOP_CTRL->ENABLE_INT_OSC) must be enabled
10
PLL_POWERUP
RW
0x0
PLL Power Up
0x0 = Power down
0x1 = Power up
When cleared, the PLL is turned off. This must be set before CHIP_CLK_CTRL ->
MCLK_FREQ is programmed to 0x3. The CHIP_PLL_CTRL register must be
configured correctly before setting this bit.
9
LINREG_D_POWERUP
RW
0x0
Power up the primary VDDD linear regulator.
0x0 = Power down
0x1 = Power up
SGTL5000
42
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
BITS
FIELD
RW
RESET
8
VCOAMP_POWERUP
RW
0x0
DEFINITION
Power up the PLL VCO amplifier.
0x0 = Power down
0x1 = Power up
7
VAG_POWERUP
RW
0x0
Power up the VAG reference buffer. Setting this bit starts the power up ramp for the
headphone and LINEOUT. The headphone (and/or LINEOUT) powerup should be set
BEFORE clearing this bit. When this bit is cleared the power-down ramp is started. The
headphone (and/or LINEOUT) powerup should stay set until the VAG is fully ramped
down (200 to 400 ms after clearing this bit).
0x0 = Power down
0x1 = Power up
6
ADC_MONO
RW
0x1
While ADC_POWERUP is set, this allows the ADC to be put into left only mono
operation for power savings. This mode is useful when only using the microphone
input.
0x0 = Mono (left only)
0x1 = Stereo
5
REFTOP_POWERUP
RW
0x1
Power up the reference bias currents
0x0 = Power down
0x1 = Power up
This bit can be cleared when the part is a sleep state to minimize analog power.
4
HEADPHONE_POWER
UP
RW
0x0
Power up the headphone amplifiers
0x0 = Power down
0x1 = Power up
3
DAC_POWERUP
RW
0x0
Power up the DACs
0x0 = Power down
0x1 = Power up
2
CAPLESS_HEADPHO
NE_POWERUP
RW
0x0
Power up the capless headphone mode
0x0 = Power down
0x1 = Power up
1
ADC_POWERUP
RW
0x0
Power up the ADCs
0x0 = Power down
0x1 = Power up
0
LINEOUT_POWERUP
RW
0x0
Power up the LINEOUT amplifiers
0x0 = Power down
0x1 = Power up
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
43
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
The Table 34, CHIP_PLL_CTRL 0x0032 register may only
be changed after reset, and before PLL_POWERUP is set.
Table 34. CHIP_PLL_CTRL 0x0032
15
14
13
12
11
10
9
8
7
INT_DIVISOR
6
5
4
3
2
1
0
FRAC_DIVISOR
BITS
FIELD
RW
RESET
DEFINITION
15:11
INT_DIVISOR
RW
0xA
This is the integer portion of the PLL divisor. To determine the value of this field, use
the following calculation:
INT_DIVISOR = FLOOR(PLL_OUTPUT_FREQ/INPUT_FREQ)
PLL_OUTPUT_FREQ = 180.6336 MHz if System sample rate = 44.1 kHz
else
PLL_OUTPUT_FREQ = 196.608 MHz if System sample rate!= 44.1 kHz
INPUT_FREQ = Frequency of the external MCLK provided if CHIP_CLK_TOP_CTRL>INPUT_FREQ_DIV2 = 0x0
else
INPUT_FREQ = (Frequency of the external MCLK provided/2) If
CHIP_CLK_TOP_CTRL->INPUT_FREQ_DIV2 = 0x1
10:0
FRAC_DIVISOR
RW
0x0
This is the fractional portion of the PLL divisor. To determine the value of this field, use
the following calculation:
FRAC_DIVISOR = ((PLL_OUTPUT_FREQ/INPUT_FREQ) - INT_DIVISOR)*2048
PLL_OUTPUT_FREQ = 180.6336 MHz if System sample rate = 44.1 kHz
else
PLL_OUTPUT_FREQ = 196.608 MHz if System sample rate!= 44.1 kHz
INPUT_FREQ = Frequency of the external MCLK provided if CHIP_CLK_TOP_CTRL>INPUT_FREQ_DIV2 = 0x0
else
INPUT_FREQ = (Frequency of the external MCLK provided/2) If
CHIP_CLK_TOP_CTRL->INPUT_FREQ_DIV2 = 0x1
Table 35, CHIP_CLK_TOP_CTRL 0x0034 has the
miscellaneous controls for the clock block.
Table 35. CHIP_CLK_TOP_CTRL 0x0034
13
12
RSVD
11
10
9
8
7
6
5
4
3
INPUT_FREQ_DIV2
14
RSVD
ENABLE_INT_OSC
15
2
1
0
RSVD
BITS
FIELD
RW
RESET
DEFINITION
15:12
RESERVED
RO
0x0
Reserved
11
ENABLE_INT_OSC
RW
0x0
Setting this bit enables an internal oscillator to be used for the zero cross detectors,
the short detect recovery, and the charge pump. This allows the I2S clock to be shut
off while still operating an analog signal path. This bit can be kept on when the I2S
clock is enabled, but the I2S clock is more accurate so it is preferred to clear this bit
when I2S is present.
10:4
RSVD
RW
0x0
Reserved
SGTL5000
44
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
BITS
FIELD
RW
RESET
3
INPUT_FREQ_DIV2
RW
0x0
DEFINITION
SYS_MCLK divider before PLL input
0x0 = pass through
0x1 = SYS_MCLK is divided by 2 before entering PLL
This must be set when the input clock is above 17 MHz. This has no effect when the
PLL is powered down.
2:0
RSVD
RW
Reserved
0x0
Status bits for analog blocks are found in Table 36,
CHIP_ANA_STATUS 0x0036
Table 36. CHIP_ANA_STATUS 0x0036
13
12
11
10
LRSHORT_STS
RSVD
9
8
7
6
5
4
3
2
PLL_IS_LOCKED
14
RSVD
CSHORT_STS
15
1
0
RSVD
BITS
FIELD
RW
RESET
DEFINITION
15:10
RSVD
RO
0x0
Reserved
9
LRSHORT_STS
RO
0x0
This bit is high whenever a short is detected on the left or right channel headphone
drivers.
0x0 = Normal
0x1 = Short detected
8
CSHORT_STS
RO
0x0
This bit is high whenever a short is detected on the capless headphone common/
center channel driver.
0x0 = Normal
0x1 = Short detected
7:5
RSVD
RO
0x0
Reserved
4
PLL_IS_LOCKED
RO
0x0
This bit goes high after the PLL is locked.
0x0 = PLL is not locked
0x1 = PLL is locked
3:0
RSVD
RO
0x0
Reserved
Table 37, CHIP_ANA_TEST1 0x0038 and Table 38,
CHIP_ANA_TEST2 0x003A register controls are intended
only for debug.
Table 37. CHIP_ANA_TEST1 0x0038
6
5
4
3
2
1
0
TESTMODE
HP_ANTIPOP
7
TM_SELECT_MIC
8
TM_HPCOMMON
9
TM_ADCIN_TOHP
10
VAG_CLASSA
HP_I1_ADJ
11
VAG_DOUB_CURRENT
12
HP_CLASSAB
HP_IALL_ADJ
13
HP_HOLD_GND
14
HP_HOLD_GND_CENTER
15
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
45
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
BITS
FIELD
RW
15:14
HP_IALL_ADJ
RW
RESET
DEFINITION
0x0
These bits control the overall bias current of the headphone amplifier (all stages
including first and output stage).
0x0=nominal, 0x1=-50%, 0x2=+50%, 0x3=-40%
13:12
HP_I1_ADJ
RW
0x0
These bits control the bias current for the first stage of the headphone amplifier.
0x0=nominal, 0x1=-50%, 0x2=+100%, 0x3=+50%
11:9
HP_ANTIPOP
RW
0x0
These bits control the headphone output current in classA mode and also the pull-down
strength while powering off. These bits normally are not needed.
8
HP_CLASSAB
RW
0x1
This defaults high. When this bit is high the headphone is in classAB mode. ClassA
mode would normally not be used.
7
HP_HOLD_GND_CE
NTER
RW
0x1
This defaults high. When this bit is high and the capless headphone center channel is
powered off, the output is tied to ground. This is the preferred mode of operation for
best antipop performance.
6
HP_HOLD_GND
RW
0x1
This defaults high. When this bit is high and the headphone is powered off, the output
is tied to ground. This is the preferred mode of operation for best antipop performance.
5
VAG_DOUB_CURRE
NT
RW
0x0
Double the VAG output current when in classA mode.
4
VAG_CLASSA
RW
0x0
Turn off the classAB output current for the VAG buffer. The classA current is limited so
this may cause clipping in some modes.
3
TM_ADCIN_TOHP
RW
0x0
Put ADCmux output onto the headphone output pin. Must remove headphone load and
any external headphone compensation for this mode.
2
TM_HPCOMMON
RW
0x0
Enable headphone common to be used in ADCmux for testing
1
TM_SELECT_MIC
RW
0x0
Enable the mic-adc-dac-HP path
0
TESTMODE
RW
0x0
Enable the analog test mode paths
Table 38. CHIP_ANA_TEST2 0x003A
9
8
7
6
5
4
3
2
INVERT_ADC_DATA_TIMING
10
INVERT_ADC_SAMPLE_CLOCK
11
INVERT_DAC_DATA_TIMING
12
INVERT_DAC_SAMPLE_CLOCK
13
1
0
Reserved
14
LINEOUT_TO_VDDA
RW
0x0
Changes the LINEOUT amplifier power supply from VDDIO to VDDA. Typically
LINEOUT should be on the higher power supply. This bit is useful when VDDA is
~3.3 V and VDDIO is ~1.8 V.
13
SPARE
RW
0x0
Spare registers to analog.
12
MONOMODE_DAC
RW
0x0
Copy the left channel DAC data to the right channel. This allows both left and right to
play from MONO dac data.
11
VCO_TUNE_AGAIN
RW
0x0
When toggled high then low forces the PLL VCO to retune the number of inverters in
the ring oscillator loop.
RSVD
ADC_DITHEROFF
0x0
ADC_LESSI
RO
DAC_CLASSA
RSVD
DAC_DIS_RTZ
15
DAC_DOUBLE_I
RESET
DAC_EXTEND_RTZ
RW
MONOMODE_DAC
FIELD
SPARE
BITS
LINEOUT_TO_VDDA
LO_PASS_MASTERVAG
14
VCO_TUNE_AGAIN
15
DEFINITION
SGTL5000
46
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
BITS
FIELD
RW
RESET
DEFINITION
10
LO_PASS_MASTERV
AG
RW
0x0
Tie the main analog VAG to the LINEOUT VAG. This can improve SNR for the
LINEOUT when both are the same voltage.
9
INVERT_DAC_SAMPL
E_CLOCK
RW
0x0
Change the clock edge used for the DAC output sampling.
8
INVERT_DAC_DATA_
TIMING
RW
0x0
Change the clock edge used for the digital to analog DAC data crossing.
7
DAC_EXTEND_RTZ
RW
0x0
Extend the return-to-zero time for the DAC.
6
DAC_DOUBLE_I
RW
0x0
Double the output current of the DAC amplifier when it is in classA mode.
5
DAC_DIS_RTZ
RW
0x0
Turn off the return-to-zero in the DAC. In mode cases, this hurts the SNDR of the DAC.
4
DAC_CLASSA
RW
0x0
Turn off the classAB mode in the DAC amplifier. This mode should normally not be
used. The output current is not high enough to support a full scale signal in this mode.
3
INVERT_ADC_SAMPL
E_CLOCK
RW
0x0
Change the clock edge used for the ADC sampling.
2
INVERT_ADC_DATA_
TIMING
RW
0x0
Change the clock edge used for the analog to digital ADC data crossing
1
ADC_LESSI
RW
0x0
Drops ADC bias currents by 20%
0
ADC_DITHEROFF
RW
0x0
Turns off the ADC dithering.
The Table 39, CHIP_SHORT_CTRL 0x003C register
contains controls for the headphone short detectors.
Table 39. CHIP_SHORT_CTRL 0x003C
15
14
13
12
11
10
RSVD
9
8
LVLADJL
7
RSVD
6
5
4
LVLADJC
3
2
MODE_LR
1
0
RSVD
LVLADJR
MODE_CM
BITS
FIELD
RW
RESET
15
RSVD
RO
0x0
Reserved
14:12
LVLADJR
RW
0x0
These bits adjust the sensitivity of the right channel headphone short detector in 25 mA
steps.This trip point can vary by ~30% over process so leave plenty of guard band to
avoid false trips. This short detect trip point is also effected by the bias current
adjustments made by CHIP_REF_CTRL -> BIAS_CTRL and by CHIP_ANA_TEST1 > HP_IALL_ADJ.
DEFINITION
0x3=25 mA
0x2=50 mA
0x1=75 mA
0x0=100 mA
0x4=125 mA
0x5=150 mA
0x6=175 mA
0x7=200 mA
11
RSVD
RO
0x0
Reserved
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
47
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
BITS
FIELD
RW
RESET
DEFINITION
10:8
LVLADJL
RW
0x0
These bits adjust the sensitivity of the left channel headphone short detector in 25 mA
steps.This trip point can vary by ~30% over process so leave plenty of guard band to
avoid false trips. This short detect trip point is also effected by the bias current
adjustments made by CHIP_REF_CTRL -> BIAS_CTRL and by CHIP_ANA_TEST1 > HP_IALL_ADJ.
0x3=25 mA
0x2=50 mA
0x1=75 mA
0x0=100 mA
0x4=125 mA
0x5=150 mA
0x6=175 mA
0x7=200 mA
7
RSVD
RO
0x0
Reserved
6:4
LVLADJC
RW
0x0
These bits adjust the sensitivity of the capless headphone center channel short
detector in 50 mA steps. This trip point can vary by ~30% over process so leave plenty
of guard band to avoid false trips. This short detect trip point is also effected by the bias
current adjustments CHIP_REF_CTRL -> BIAS_CTRL and by CHIP_ANA_TEST1 ->
HP_IALL_ADJ.
0x3=50 mA
0x2=100 mA
0x1=150 mA
0x0=200 mA
0x4=250 mA
0x5=300 mA
0x6=350 mA
0x7=400 mA
3:2
MODE_LR
RW
0x0
These bits control the behavior of the short detector for the capless headphone central
channel driver. This mode should be set prior to powering up the headphone amplifier.
When a short is detected the amplifier output switches to classA mode internally to
avoid excessive currents.
0x0 = Disable short detector, reset short detect latch, software view non-latched short
signal
0x1 = Enable short detector and reset the latch at timeout (every ~50 ms)
0x2 = This mode is not used/invalid
0x3 = Enable short detector with only manual reset (have to return to 0x0 to reset the
latch)
1:0
MODE_CM
RW
0x0
These bits control the behavior of the short detector for the capless headphone central
channel driver. This mode should be set prior to powering up the headphone amplifier.
When a short is detected the amplifier output switches to classA mode interally to avoid
excessive currents.
0x0 = Disable short detector, reset short detect latch, software view non-latched short
signal
0x1 = Enable short detector and reset the latch at timeout (every ~50 ms)
0x2 = Enable short detector and auto reset when output voltage rises (preferred mode)
0x3 = Enable short detector with only manual reset (have to return to 0x0 to reset the
latch)
SGTL5000
48
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 40. DAP_CONTROL 0x0100
15
14
13
12
11
10
9
8
7
6
5
4
RSVD
3
2
MIX_EN
BITS
FIELD
RW
RESET
15:5
RSVD
RO
0x0
Reserved
4
MIX_EN
RW
0x0
Enable/Disable the DAP mixer path
1
0
RSVD
DAP_EN
DEFINITION
0x0 = Disable
0x1 = Enable
When enabled, DAP_EN must also be enabled to use the mixer.
3:1
RSVD
RO
0x0
Reserved
0
DAP_EN
RW
0x0
Enable/Disable digital audio processing (DAP)
0x0 = Disable. When disabled, no audio passes through.
0x1 = Enable. When enabled, audio can pass through DAP even if none of the DAP
functions are enabled.
Table 41. DAP_PEQ 0x0102
15
14
13
12
11
10
9
8
7
6
5
4
3
2
RSVD
1
0
EN
BITS
FIELD
RW
RESET
DEFINITION
15:3
RSVD
RO
0x0
Reserved
2:0
EN
RW
0x0
Set to Enable the PEQ filters
0x0 = Disabled
0x1 = 1 Filter Enabled
0x2 = 2 Filters Enabled
.....
0x7 = Cascaded 7 Filters
DAP_AUDIO_EQ->EN bit must be set to 1 in order to enable the PEQ
Table 42. DAP_BASS_ENHANCE 0x0104
14
13
12
11
10
9
8
BYPASS_HPF
15
RSVD
7
6
RSVD
BITS
FIELD
RW
RESET
15:9
RSVD
RO
0x0
Reserved
8
BYPASS_HPF
RW
0x0
Bypass high pass filter
5
4
CUTOFF
3
2
RSVD
1
0
EN
DEFINITION
0x0 = Enable high pass filter
0x1 = Bypass high pass filter
7
RSVD
RO
0x0
Reserved
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
49
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
BITS
FIELD
RW
RESET
6:4
CUTOFF
RW
0x4
DEFINITION
Set cut-off frequency
0x0 = 80 Hz
0x1 = 100 Hz
0x2 = 125 Hz
0x3 = 150 Hz
0x4 = 175 Hz
0x5 = 200 Hz
0x6 = 225 Hz
3:1
RSVD
RO
0x0
Reserved
0
EN
RW
0x0
Enable/Disable Bass Enhance
0x0 = Disable
0x1 = Enable
Table 43. DAP_BASS_ENHANCE_CTRL 0x0106
15
14
RSVD
13
12
11
10
9
8
LR_LEVEL
7
RSVD
6
5
4
3
2
1
0
3
2
1
0
BASS_LEVEL
BITS
FIELD
RW
RESET
DEFINITION
15:14
RSVD
RO
0x0
Reserved
13:8
LR_LEVEL
RW
0x5
Left/Right Mix Level Control
0x00= +6.0 dB for Main Channel
......
0x3F= Least L/R Channel Level
7
RSVD
RO
0x0
6:0
BASS_LEVEL
RW
0x1f
Bass Harmonic Level Control
0x00= Most Harmonic Boost
......
0x7F=Least Harmonic Boost
Table 44. DAP_AUDIO_EQ 0x0108
15
14
13
12
11
10
9
8
7
6
5
4
RSVD
EN
BITS
FIELD
RW
RESET
DEFINITION
15:2
RSVD
RO
0x0
Reserved
1:0
EN
RW
0x0
Selects between PEQ/GEQ/Tone Control and Enables it.
0x0 = Disabled.
0x1 = Enable PEQ. NOTE: DAP_PEQ->EN bit must also be set to the desired number
of filters (bands) in order for the PEQ to be enabled.
0x2 = Enable Tone Control
0x3 = Enable 5 Band GEQ
SGTL5000
50
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 45. DAP_SGTL_SURROUND 0x010A
15
14
13
12
11
10
9
8
7
RSVD
6
5
4
3
WIDTH_CONTROL
2
RSVD
1
0
SELECT
BITS
FIELD
RW
RESET
DEFINITION
15:7
RSVD
RO
0x0
Reserved
6:4
WIDTH_CONTROL
RW
0x4
Freescale Surround Width Control - The width control changes the perceived width of
the sound field.
0x0 = Least Width
......
0x7 = Most Width
3:2
RSVD
RO
0x0
Reserved
1:0
SELECT
RW
0x0
Freescale Surround Selection
0x0 = Disabled
0x1 = Disabled
0x2 = Mono input Enable
0x3 = Stereo input Enable
Table 46. DAP_FILTER_COEF_ACCESS 0x010C
15
14
13
12
11
10
9
RSVD
8
7
6
5
WR
4
3
2
1
0
INDEX
BITS
FIELD
RW
RESET
DEFINITION
15:9
RSVD
RO
0x0
Reserved
8
WR
WO
0x0
When set, the coefficients written in the ten coefficient data registers are loaded into
the filter specified by INDEX
7:0
INDEX
RW
0x0
Specifies the index for each of the seven bands of the filter coefficient that needs to be
written to. Each filter has 5 coefficients that need to be loaded into the 10 coefficient
registers (MSB, LSB) before setting the index and WR bit.
Steps to write coefficients:
1. Write the five 20-bit coefficient values to DAP_COEF_WR_XX_MSB and
DAP_COEF_WR_XX_LSB registers (XX= B0,B1,B2,A1,A2)
2. Set INDEX of the coefficient from the table below.
3. Set the WR bit to load the coefficient.
NOTE: Steps 2 and 3 can be performed with a single write to
DAP_FILTER_COEF_ACCESS register.
Coefficient address:
Band 0 = 0x00
Band 1 = 0x01
Band 2 = 0x02
Band 3 = 0x03
Band 4 = 0x04
...
Band 7 = 0x06
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
51
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 47. DAP_COEF_WR_B0_MSB 0x010E
15
14
13
12
11
10
9
8
7
6
5
BIT_19 BIT_18 BIT_17 BIT_16 BIT_15 BIT_14 BIT_13 BIT_12 BIT_11 BIT_10 BIT_9
BITS
FIELD
RW
RESET
15
BIT_19
WO
0x0
14
BIT_18
WO
0x0
13
BIT_17
WO
0x0
12
BIT_16
WO
0x0
11
BIT_15
WO
0x0
10
BIT_14
WO
0x0
9
BIT_13
WO
0x0
8
BIT_12
WO
0x0
7
BIT_11
WO
0x0
6
BIT_10
WO
0x0
5
BIT_9
WO
0x0
4
BIT_8
WO
0x0
3
BIT_7
WO
0x0
2
BIT_6
WO
0x0
1
BIT_5
WO
0x0
0
BIT_4
WO
0x0
4
3
2
1
0
BIT_8
BIT_7
BIT_6
BIT_5
BIT_4
DEFINITION
Most significant 16-bits of the 20-bit filter coefficient that needs to be written
Table 48. DAP_COEF_WR_B0_LSB 0x0110
15
14
13
12
11
10
9
8
7
6
5
4
RSVD
BITS
FIELD
RW
RESET
15:4
RSVD
RO
0x0
3
BIT_3
WO
0x0
2
BIT_2
WO
0x0
1
BIT_1
WO
0x0
0
BIT_0
WO
0x0
3
2
1
0
BIT_3
BIT_2
BIT_1
BIT_0
DEFINITION
Least significant 4 bits of the 20-bit filter coefficient that needs to be written.
SGTL5000
52
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 49. DAP_AUDIO_EQ_BASS_BAND0 0x0116 115 Hz
15
14
13
12
11
10
9
8
7
6
5
4
RSVD
3
2
1
0
2
1
0
2
1
0
VOLUME
BITS
FIELD
RW
RESET
15:7
RSVD
RO
0x0
6:0
VOLUME
RW
0x2F
DEFINITION
Reserved
Sets Tone Control Bass/GEQ Band0
0x5F = sets to 12 dB
0x2F = sets to 0 dB
0x00 = sets to -11.75 dB
Each LSB is 0.25 dB
Table 50. DAP_AUDIO_EQ_BAND1 0x0118 330 Hz
15
14
13
12
11
10
9
8
7
6
5
4
RSVD
3
VOLUME
BITS
FIELD
RW
RESET
15:7
RSVD
RO
0x0
6:0
VOLUME
RW
0x2F
DEFINITION
Reserved
Sets GEQ Band1
0x5F = sets to 12 dB
0x2F = sets to 0 dB
0x00 = sets to -11.75 dB
Each LSB is 0.25 dB
Table 51. DAP_AUDIO_EQ_BAND2 0x011A 990 Hz
15
14
13
12
11
10
9
8
7
6
5
4
RSVD
3
VOLUME
BITS
FIELD
RW
RESET
15:7
RSVD
RO
0x0
6:0
VOLUME
RW
0x2F
DEFINITION
Reserved
Sets GEQ Band2
0x5F = sets to 12 dB
0x2F = sets to 0 dB
0x00 = sets to -11.75 dB
Each LSB is 0.25 dB
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
53
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 52. DAP_AUDIO_EQ_BAND3 0x011C 3000 Hz
15
14
13
12
11
10
9
8
7
6
5
4
3
RSVD
2
1
0
VOLUME
BITS
FIELD
RW
RESET
15:7
RSVD
RO
0x0
6:0
VOLUME
RW
0x2F
DEFINITION
Reserved
Sets GEQ Band3
0x5F = sets to 12 dB
0x2F = sets to 0 dB
0x00 = sets to -11.75 dB
Each LSB is 0.25 dB
Table 53. DAP_AUDIO_EQ_TREBLE_BAND4 0x011E 9900 Hz
15
14
13
12
11
10
9
8
7
6
5
4
RSVD
BITS
FIELD
RW
3
2
1
0
2
1
0
VOLUME
RESET
15:7
RSVD
RO
0x0
6:0
VOLUME
RW
0x2F
DEFINITION
Reserved
Sets Tone Control Treble/GEQ Band4
0x5F = sets to 12 dB
0x2F = sets to 0 dB
0x00 = sets to -11.75 dB
Each LSB is 0.25 dB
Table 54, DAP_MAIN_CHAN 0x0120 sets the main channel volume level
.
Table 54. DAP_MAIN_CHAN 0x0120
15
14
13
12
11
10
9
8
7
6
5
4
3
VOL
BITS
FIELD
RW
RESET
15:0
VOL
RW
0x8000
DEFINITION
DAP Main Channel Volume
0xFFFF
= 200%
0x8000 (default) = 100%
0x0000
= 0%
Table 55, DAP_MIX_CHAN 0x0122 sets the mix channel volume level
.
Table 55. DAP_MIX_CHAN 0x0122
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
VOL
BITS
FIELD
RW
RESET
15:0
VOL
RW
0x0000
DEFINITION
DAP Mix Channel Volume
0xFFFF
= 200%
0x8000
= 100%
0x0000 (default) = 0%
SGTL5000
54
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 56. DAP_AVC_CTRL 0x0124
14
RSVD
RSVD
13
12
11
MAX_GAIN
10
RSVD
9
8
7
LBI_RESPONSE
6
RSVD
5
4
3
HARD_LIMIT_EN
15
2
1
0
RSVD
EN
BITS
FIELD
RW
RESET
DEFINITION
15
RSVD
RO
0x0
Reserved
14
RSVD
RW
0x1
Reserved.
13:12
MAX_GAIN
RW
0x1
Maximum gain that can be applied by the AVC in expander mode.
0x0 = 0 dB gain
0x1 = 6.0 dB of gain
0x2 = 12 dB of gain
11:10
RSVD
RO
0x0
Reserved
9:8
LBI_RESPONSE
RW
0x1
Integrator Response
0x0 = 0 mS LBI
0x1 = 25 mS LBI
0x2 = 50 mS LBI
0x3 = 100 mS LBI
7:6
RSVD
RO
0x0
Reserved
5
HARD_LIMIT_EN
RW
0x0
Enable Hard Limiter Mode
0x0 = Hard limit disabled. AVC Compressor/Expander is enabled.
0x1 = Hard limit enabled. The signal is limited to the programmed threshold. (Signal
saturates at the threshold)
4:1
RSVD
RO
0x0
Reserved
0
EN
RW
0x0
Enable/disable AVC
0x0 = Disable
0x1 = Enable
Table 57. DAP_AVC_THRESHOLD 0x0126
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
THRESH
BITS
FIELD
RW
RESET
15:0
THRESH
RW
0x1473
DEFINITION
AVC Threshold Value
Threshold is programmable. Use the following formula to calculate hex value:
Hex Value = ((10^(THRESHOLD_dB/20))*0.636)*2^15
Threshold can be set in the range of 0 dB to -96 dB
Example Values:
0x1473 = Set Threshold to -12 dB
0x0A40 = Set Threshold to -18 dB
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
55
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 58. DAP_AVC_ATTACK 0x0128
15
14
13
12
11
10
9
8
7
6
RSVD
5
4
3
2
1
0
RATE
BITS
FIELD
RW
RESET
DEFINITION
15:12
RSVD
RO
0x0
Reserved
11:0
RATE
RW
0x28
AVC Attack Rate
This is the rate at which the AVC applies attenuation to the signal to bring it to the
threshold level. AVC Attack Rate is programmable. To use a custom rate, use the
formula below to convert from dB/S to hex value:
Hex Value = (1 - (10^(-(Rate_dBs/(20*SYS_FS)))) * 2^19
where, SYS_FS is the system sample rate configured in CHIP_CLK_CTRL register.
Example values:
0x28 = 32 dB/s
0x10 = 8.0 dB/s
0x05 = 4.0 dB/s
0x03 = 2.0 dB/s
Table 59. DAP_AVC_DECAY 0x012A
15
14
13
12
11
10
9
8
7
6
RSVD
5
4
3
2
1
0
RATE
BITS
FIELD
RW
RESET
DEFINITION
15:12
RSVD
RO
0x0
Reserved
11:0
RATE
RW
0x50
AVC Decay Rate
This is the rate at which the AVC releases the attenuation previously applied to the
signal during attack. AVC Decay Rate is programmable. To use a custom rate, use the
formula below to convert from dB/S to hex value:
Hex Value = (1 - (10^(-(Rate_dBs/(20*SYS_FS)))) * 2^23
where, SYS_FS is the system sample rate configured in CHIP_CLK_CTRL register.
Example values:
0x284 = 32 dB/s
0xA0 = 8.0 dB/s
0x50 = 4.0 dB/s
0x28 = 2.0 dB/s
Table 60. DAP_COEF_WR_B1_MSB 0x012C
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MSB
BITS
FIELD
RW
RESET
15:0
MSB
RW
0x0
DEFINITION
Most significant 16-bits of the 20-bit filter coefficient that needs to be written
SGTL5000
56
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 61. DAP_COEF_WR_B1_LSB 0x012E
15
14
13
12
11
10
9
8
7
6
5
4
3
2
RSVD
1
0
LSB
BITS
FIELD
RW
RESET
DEFINITION
15:4
RSVD
RO
0x0
Reserved
3:0
LSB
RW
0x0
Least significant 4 bits of the 20-bit filter coefficient that needs to be written.
Table 62. DAP_COEF_WR_B2_MSB 0x0130
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MSB
BITS
FIELD
RW
RESET
15:0
MSB
RW
0x0
DEFINITION
Most significant 16-bits of the 20-bit filter coefficient that needs to be written
Table 63. DAP_COEF_WR_B2_LSB 0x0132
15
14
13
12
11
10
9
8
7
6
5
4
3
2
RSVD
1
0
LSB
BITS
FIELD
RW
RESET
DEFINITION
15:4
RSVD
RO
0x0
Reserved
3:0
LSB
RW
0x0
Least significant 4 bits of the 20-bit filter coefficient that needs to be written.
Table 64. DAP_COEF_WR_A1_MSB 0x0134
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MSB
BITS
FIELD
RW
RESET
15:0
MSB
RW
0x0
DEFINITION
Most significant 16-bits of the 20-bit filter coefficient that needs to be written
Table 65. DAP_COEF_WR_A1_LSB 0x0136
15
14
13
12
11
10
9
8
7
6
5
4
3
2
RSVD
1
0
LSB
BITS
FIELD
RW
RESET
DEFINITION
15:4
RSVD
RO
0x0
Reserved
3:0
LSB
RW
0x0
Least significant 4 bits of the 20-bit filter coefficient that needs to be written.
Table 66. DAP_COEF_WR_A2_MSB 0x0138
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MSB
BITS
FIELD
RW
RESET
15:0
MSB
RW
0x0
DEFINITION
Most significant 16-bits of the 20-bit filter coefficient that needs to be written
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
57
FUNCTIONAL DEVICE OPERATION
PROGRAMMING EXAMPLES
Table 67. DAP_COEF_WR_A2_LSB 0x013A
15
14
13
12
11
10
9
8
7
6
5
4
RSVD
3
2
1
0
LSB
BITS
FIELD
RW
RESET
DEFINITION
15:4
RSVD
RO
0x0
Reserved
3:0
LSB
RW
0x0
Least significant 4 bits of the 20-bit filter coefficient that needs to be written.
SGTL5000
58
Analog Integrated Circuit Device Data
Freescale Semiconductor
TYPICAL APPLICATIONS
INTRODUCTION
TYPICAL APPLICATIONS
INTRODUCTION
connected to a 0.1 F cap to GND. If either is > 3.0 V, the
CPFILT cap MUST NOT be placed.
HP_VGND Note: Do not connect HP_VGND to system
ground, even when unused. This is a virtual ground (DC
voltage) that should never connect to an actual “0 Volt
ground”. Use the widest, shortest trace possible for the
HP_VGND.
Typical connections are shown in the following application
diagrams. For new designs, and for either the 20 QFN or 32
QFN part, an external VDDD power supply connection is
required along with a 0.1 F cap connection from VDDD to
ground.
CPFILT Note: The CPFILT cap value is 0.1 F. If both
VDDIO and VDDA are  3.0 V, the CPFILT pin must be
VDDD (1.1V - 2.0V, 11mA Min)
32QFN Typical Application Schematic
Note: External VDDD
required for new designs.
C1
0.1uF
CTRL_MODE
CTRL_ADR0_CS
VDDD
CTRL_CLK
NC
CTRL_DATA
I2S_DIN
I2S_DOUT
Note: Capless headphone design shown here.
For cap-coupled design, see 20QFN Typical
Application Schematic.
1
2
3
4
5
6
7
8
2
3
4
5
1
J1
Audio Jack
GND
HP_R
GND
HP_VGND
VDDA
HP_L
AGND
NC
C3
9
10
11
12
13
14
15
16
0.1uF
SGTL5000_32QFN
Notes:
C5
1. This 32QFN schematic shows VDDD (pin 30) being derived
externally. An external VDDD is required for new designs. For
lowest power operation, VDDD can be driven from an
external 1.2V switching supply with a 0.1uF capacitor to ground.
2. If both VDDIO and VDDA are equal to or below 3V, the CPFILT pin (pin
17) must be connected to a 0.1uF capacitor to ground. If either is above
3V, this capacitor must not be placed.
3. The above shows I2C implementation as CTRL_MODE (pin 32) is tied
to ground. In addition, address 0 of the I2C address is 0 as
CTRL_ADR0_CS (pin 31) is tied to ground.
I2S_SCLK
I2S_LRCLK
NC
SYS_MCLK
VDDIO
NC
CPFILT
NC
NC
VAG
LINEOUT_R
LINEOUT_L
LINEIN_R
LINEIN_L
MIC
MIC_BIAS
VDDA
I2S_DIN
I2S_DOUT
I2S_SCLK
I2S_LRCLK
32
31
30
29
28
27
26
25
U1
CTRL_CLK
CTRL_DATA
GND
SYS_MCLK
24
23
22
21
20
19
18
17
VDDIO
C2
0.1uF
PAD
Solder Pad to GND
C4
0.1uF
X1
1
2
0.1uF
MIC
C6
1uF
LINE_OUT_R
C7
R1
1uF
Note: R1 only needed if
internal BIAS_RESISTOR
settings are not suitable.
LINE_OUT_L
C8
2.2k
1uF
C9
1uF
LINE_IN_L
LINE_IN_R
C10
1uF
4. AGND (pin 7) should be "star" connected to the jack grounds for
LINEIN and LINEOUT, and to the VAG capacitor ground. This node
should via to the ground plane (or connected to ground) at a single point.
Figure 19. 32 QFN Typical Application Schematic
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
59
TYPICAL APPLICATIONS
INTRODUCTION
VDDD (1.1V - 2.0V, 11mA Min)
Note: External VDDD
required for new designs.
I2C_CLK
I2C_DATA
C1
I2S_DIN
I2SDOUT
I2S_SCLK
I2S_LRCLK
0.1uF
20
19
18
17
16
U1
J1
2
3
4
5
1
C2
220uF
C3
220uF
VDDD
CTRL_CLK
CTRL_DATA
I2S_DIN
I2S_DOUT
Note: Cap-coupled headphone design shown
here. For capless design, see 32QFN Typical
Application Schematic.
1
2
3
4
5
VDDA
HP_R
HP_VGND
VDDA
HP_L
VAG
I2S_SCLK
I2S_LRCLK
SYS_MCLK
VDDIO
MIC_BIAS
LINEOUT_R
LINEOUT_L
LINEIN_R
LINEIN_L
MIC
Audio Jack
C5
0.1uF
SGTL5000_20QFN
15
14
13
12
11
VDDIO
C4
0.1uF
GND
PAD
R1
Solder Pad to GND
6
7
8
9
10
C6
0.1uF
SYS_MCLK
C7
2.2k
C8
1uF
Note: R1 only needed if
internal BIAS_RESISTOR
settings are not suitable.
0.1uF
X1
C9
1uF
C10
LINE_OUT_RIGHT
1
2
1uF
LINE_IN_LEFT
LINE_OUT_LEFT
MIC
LINE_IN_RIGHT
C11
1uF
C12
1uF
Note: Bottom PAD/FLAG/Paddle MUST be connected to ground.
Figure 20. 20 QFN Typical Application Schematic
SGTL5000
60
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the 98Axxxxxxxxx listed
on the following pages.
EP SUFFIX
20-PIN
98ARE10742D
REVISION 0
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
61
PACKAGING
PACKAGE DIMENSIONS
EP SUFFIX
20-PIN
98ARE10742D
REVISION 0
SGTL5000
62
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
EP SUFFIX
20-PIN
98ARE10742D
REVISION 0
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
63
PACKAGING
PACKAGE DIMENSIONS
FC SUFFIX
32-PIN
98ARE10739D
REVISION 0
SGTL5000
64
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
FC SUFFIX
32-PIN
98ARE10739D
REVISION 0
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
65
PACKAGING
PACKAGE DIMENSIONS
FC SUFFIX
32-PIN
98ARE10739D
REVISION 0
SGTL5000
66
Analog Integrated Circuit Device Data
Freescale Semiconductor
REVISION HISTORY
REVISION HISTORY
REVISION DATE
DESCRIPTION
3.0
6/2010
•
4.0
9/2010
•
Corrected Pin 4 explanation (32-pin package) and added Pin 3 (32-Pin package) to Table 1.
5/2013
•
•
•
•
•
•
Corrected LINEOUT - 100 dB SNR (-60 dB input) and -85 dB THD+N (VDDIO = 3.3 V) in features
Added note for HP_VGND and CPFILT in pin definition table
Moved Recommended Operating Conditions to separate table
Added Input/Output Electrical Characteristics
Corrected LINEIN Input Level from 0.75 to 0.57
Corrected Table 7 Test Conditions unless otherwise noted: VDDIO = 1.8 V, VDDA = 1.8 V, TA = 25 °C, Slave
mode, fS = 48 kHz, MCLK = 256 fS, 24 bit input
Added note for HP_VGND and CPFILT to Typical Applications introduction
Corrected pin nomenclature as required for consistency
Clarified Bits 3:0 in Figure 27
Corrected pin name in Figure 3 and Table 1
Corrected address name in Figure 6, I2C, SPI
Changed limits on LINEOUT Output level
Changed 0x00 = sets to 12 dB to 11.75 dB, and deleted “To convert dB to hex value, use Hex Value = 4* dB value
+ 47” on tables 49, 50, 51, 52 and 53.
Revised back page. Updated document properties. Added SMARTMOS sentence to first paragraph.
Added comment for “new designs” where applicable
Corrected pin designations in the Pin Connections section
Changed limits and conditions for LINEOUT Output level and LINEOUT Output level
Added two new application diagrams in Typical Applications section
5.0
•
•
•
•
•
•
•
•
•
•
•
•
6.0
11/2013
•
•
•
•
•
•
Conversion from the old Freescale form and style to the current version. No existing content has been added,
altered, or removed.
Modified front page intro text to include more target markets and to remove type of IC technology
Increased HP max output power from 45 mW to 62.5 mW at 1.02 kHz based on bench measurements
Changed TYP LINEIN input impedance from 100kohm to 29 kohm at 1.02 kHz based on bench measurements
Added MIC input impedance based on bench measurements
Removed 10 kohm MIN LINEIN input impedance, and added 29 kohm as TYP in Table 5 and Table 6
Added 12 kHz sample rate to Functional Description Introduction, and added 12 kHz and 24 kHz sample rates to
Table 8
SGTL5000
Analog Integrated Circuit Device Data
Freescale Semiconductor
67
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© 2013 Freescale Semiconductor, Inc.
Document Number: SGTL5000
Rev. 6.0
11/2013
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