Data Sheet

DISCRETE SEMICONDUCTORS
DATA SHEET
BF1211; BF1211R; BF1211WR
N-channel dual-gate MOS-FETs
Product specification
2003 Dec 16
NXP Semiconductors
Product specification
BF1211; BF1211R;
BF1211WR
N-channel dual-gate MOS-FETs
FEATURES
PINNING
 Short channel transistor with high forward transfer
admittance to input capacitance ratio
PIN
 Low noise gain controlled amplifier
 Excellent low frequency noise performance
 Partly internal self-biasing circuit to ensure good
cross-modulation performance during AGC and good
DC stabilization.
DESCRIPTION
1
source
2
drain
3
gate 2
4
gate 1
handbook, 2 columns
4
3
APPLICATIONS
 Gain controlled low noise VHF and UHF amplifiers for
5 V digital and analog television tuner applications.
1
2
Top view
DESCRIPTION
BF1211 marking code: LFp
Enhancement type N-channel field-effect transistor with
source and substrate interconnected. Integrated diodes
between gates and source protect against excessive input
voltage surges. The BF1211, BF1211R and BF1211WR
are encapsulated in the SOT143B, SOT143R and
SOT343R plastic packages respectively.
handbook, 2 columns
3
Fig.1
4
2
MSB014
Simplified outline (SOT143B).
handbook, halfpage
3
4
2
1
1
Top view
Top view
MSB035
BF1211R marking code: LHp
BF1211WR marking code: MK
Fig.2
Fig.3
Simplified outline (SOT143R).
MSB842
Simplified outline (SOT343R).
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDS
drain-source voltage


6
ID
drain current


30
mA
Ptot
total power dissipation


180
mW
yfs
forward transfer admittance
25
30
40
mS
Cig1-ss
input capacitance at gate 1

2.1
2.6
pF
V
Crss
reverse transfer capacitance
f = 1 MHz

15
30
fF
F
noise figure
f = 400 MHz

0.9
1.6
dB
Xmod
cross-modulation
input level for k = 1% at
40 dB AGC
100
105

dBV
Tj
junction temperature


150
C
2003 Dec 16
2
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
BF1211

plastic surface mounted package; 4 leads
SOT143B
BF1211R

plastic surface mounted package; reverse pinning; 4 leads
SOT143R
BF1211WR

plastic surface mounted package; reverse pinning; 4 leads
SOT343R
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
VDS
drain-source voltage

ID
drain current (DC)
IG1
gate 1 current
IG2
gate 2 current
Ptot
total power dissipation
MAX.
UNIT
6
V

30
mA

10
mA

10
mA
BF1211; BF1211R
Ts  116 C; note 1

180
mW
BF1211WR
Ts  122 C; note 1

180
mW
Tstg
storage temperature
65
+150
C
Tj
junction temperature

150
C
Note
1. Ts is the temperature of the soldering point of the source lead.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-s)
2003 Dec 16
PARAMETER
VALUE
UNIT
thermal resistance from junction to soldering point
BF1211; BF1211R
185
K/W
BF1211WR
155
K/W
3
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
MDB828
250
handbook, halfpage
Ptot
(mW)
200
(2)
150
(1)
100
50
0
0
50
100
150
Ts (°C)
200
(1) BF1211WR.
(2) BF1211; BF1211R.
Fig.4 Power derating curve.
STATIC CHARACTERISTICS
Tj = 25 C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VG1-S = VG2-S = 0 V; ID = 10 A
6

V
V(BR)G1-SS gate 1-source breakdown voltage
VG2-S = VDS = 0 V; IG1-S = 10 mA
6
10
V
V(BR)G2-SS gate 2-source breakdown voltage
VG1-S = VDS = 0 V; IG2-S = 10 mA
6
10
V
V(BR)DSS
drain-source breakdown voltage
V(F)S-G1
forward source-gate 1 voltage
VG2-S = VDS = 0 V; IS-G1 = 10 mA
0.5
1.5
V
V(F)S-G2
forward source-gate 2 voltage
VG1-S = VDS = 0 V; IS-G2 = 10 mA
0.5
1.5
V
VG1-S(th)
gate 1-source threshold voltage
VG2-S = 4 V; VDS = 5 V; ID = 100 A
0.3
1
V
VG2-S(th)
gate 2-source threshold voltage
VG1-S = 5 V; VDS = 5 V; ID = 100 A
0.35
1
V
IDSX
drain-source current
VG2-S = 4 V; VDS = 5 V; RG1 = 75 k;
note 1
11
19
mA
IG1-S
gate 1 cut-off current
VG2-S = VDS = 0 V; VG1-S = 5 V

50
nA
IG2-S
gate 2 cut-off current
VG1-S = VDS = 0 V; VG2-S = 4 V

20
nA
Note
1. RG1 connects G1 to VGG = 5 V.
2003 Dec 16
4
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
DYNAMIC CHARACTERISTICS
Common source; Tamb = 25 C; VG2-S = 4 V; VDS = 5 V; ID = 15 mA; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
yfs
forward transfer admittance
pulsed; Tj = 25 C
25
30
40
mS
Cig1-ss
input capacitance at gate 1
f = 1 MHz

2.1
2.6
pF
Cig2-ss
input capacitance at gate 2
f = 1 MHz

1.1

pF
Coss
output capacitance
f = 1 MHz

0.9

pF
Crss
reverse transfer capacitance f = 1 MHz

15
30
fF
F
noise figure
f = 11 MHz; GS = 20 mS; BS = 0

3.5

dB
f = 400 MHz; YS = YS (opt)

0.9
1.6
dB
f = 800 MHz; YS = YS (opt)

1.3
2
dB
f = 200 MHz; GS = 2 mS; BS = BS (opt);
GL = 0.5 mS; BL = BL (opt)

34

dB
f = 400 MHz; GS = 2 mS; BS = BS (opt);
GL = 1 mS; BL = BL (opt)

29

dB
f = 800 MHz; GS = 3.3 mS; BS = BS (opt);
GL = 1 mS; BL = BL (opt)

24

dB
at 0 dB AGC
90


dBV
at 10 dB AGC

92

dBV
at 40 dB AGC
100
105

dBV
Gtr
Xmod
power gain
cross-modulation
input level for k = 1%; fw = 50 MHz;
funw = 60 MHz; note 1
Note
1. Measured in test circuit Fig.21.
2003 Dec 16
5
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
MDB829
25
ID
(1)
(2)
(3)
(4)
(mA)
20
MDB830
24
handbook, halfpage
handbook, halfpage
(1)
ID
(mA)
(2)
(5)
(3)
16
15
(4)
(6)
(5)
10
(6)
8
(7)
5
(7)
(8)
0
0.5
0
1
1.5
0
2
2.5
VG1-S (V)
0
VDS = 5 V; Tj = 25 C.
(1) VG2-S = 4 V.
4
VDS (V)
6
VG2-S = 4 V; Tj = 25 C.
(4) VG2-S = 2.5 V.
(5) VG2-S = 2 V.
(6) VG2-S = 1.5 V.
(2) VG2-S = 3.5 V.
(3) VG2-S = 3 V.
2
(7) VG2-S = 1 V.
(1) VG1-S = 1.5 V.
(2) VG1-S = 1.4 V.
(3) VG1-S = 1.3 V.
Fig.5 Transfer characteristics; typical values.
MDB832
40
handbook, halfpage
(1)
(2)
(3)
IG1
(μA)
(7) VG1-S = 0.9 V.
(8) VG1-S = 0.8 V.
Fig.6 Output characteristics; typical values.
MDB831
100
handbook, halfpage
(4) VG1-S = 1.2 V.
(5) VG1-S = 1.1 V.
(6) VG1-S = 1 V.
80
(4)
yfs
(mS)
(1)
30
(2)
(3)
60
20
(5)
40
(6)
(5)
(4)
10
(6)
20
(7)
0
0
0.5
0
1
1.5
0
2
6
12
18
VG1-S (V)
VDS = 5 V; Tj = 25 C.
(1) VG2-S = 4 V.
(2) VG2-S = 3.5 V.
(3) VG2-S = 3 V.
Fig.7
VDS = 5 V; Tj = 25 C.
(4) VG2-S = 2.5 V.
(5) VG2-S = 2 V.
(6) VG2-S = 1.5 V.
(7) VG2-S = 1 V.
(1) VG2-S = 4 V.
(2) VG2-S = 3.5 V.
Gate 1 current as a function of gate 1
voltage; typical values.
2003 Dec 16
24
30
ID (mA)
Fig.8
6
(3) VG2-S = 3 V.
(4) VG2-S = 2.5 V.
(5) VG2-S = 2 V.
(6) VG2-S = 1.5 V.
Forward transfer admittance as a function
of drain current; typical values.
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
MDB833
20
MDB834
16
handbook, halfpage
handbook, halfpage
ID
(mA)
16
ID
(mA)
12
12
8
8
4
4
0
0
10
0
20
30
40
0
50
IG1(μA)
1
2
3
4
5
VGG (V)
VDS = 5 V; VG2-S = 4 V.
Tj = 25 C.
VDS = 5 V; VG2-S = 4 V; Tj = 25 C.
RG1 = 75 k (connected to VGG); see Fig.21.
Fig.9
Fig.10 Drain current as a function of gate 1 supply
voltage (VGG); typical values.
Drain current as a function of gate 1 current;
typical values.
MDB835
20
MDB836
20
handbook, halfpage
handbook, halfpage
ID
(1)
(mA)
16
ID
(mA)
(2)
(3)
(4)
(5)
(1)
16
(2)
(3)
(6)
12
(4)
12
(7)
(5)
8
8
4
4
0
0
0
2
4
6
VGG = VDS (V)
0
2
4
VG2-S (V)
6
VG2-S = 4 V; Tj = 25 C; RG1 connected to VGG; see Fig.21.
VDS = 5 V; Tj = 25 C; RG1 = 75 k (connected to VGG); see Fig.21.
(1) RG1 = 47 k.
(1) VGG = 5 V.
(2) VGG = 4.5 V.
(3) VGG = 4 V.
(2) RG1 = 56 k.
(3) RG1 = 68 k.
(4) RG1 = 75 k.
(5) RG1 = 82 k.
(6) RG1 = 100 k.
(7) RG1 = 120 k.
Fig.11 Drain current as a function of gate 1 (VGG)
and drain supply voltage; typical values.
2003 Dec 16
(4) VGG = 3.5 V.
(5) VGG = 3 V.
Fig.12 Drain current as a function of gate 2
voltage; typical values.
7
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
MDB837
50
MDB838
0
gain halfpage
handbook,
handbook, halfpage
IG1
(μA)
reduction
(dB)
−10
(1)
40
(2)
−20
(3)
30
(4)
−30
(5)
20
−40
10
−50
−60
0
0
2
4
VG2-S (V)
6
(3) VGG = 4 V.
(4) VGG = 3.5 V.
1
2
4
VDS = 5 V; VGG = 5 V; RG1 = 75 k (connected to VGG);
see Fig.21; f = 50 MHz; Tamb = 25 C.
(5) VGG = 3 V.
Fig.13 Gate 1 current as a function of gate 2
voltage; typical values.
Fig.14 Typical gain reduction as a function of AGC
voltage.
MDB839
120
3
VAGC (V)
VDS = 5 V; Tj = 25 C; RG1 = 75 k (connected to VGG); see Fig.21.
(1) VGG = 5 V.
(2) VGG = 4.5 V.
0
MDB840
20
handbook, halfpage
handbook, halfpage
ID
(mA)
Vunw
(dBμV)
16
110
12
100
8
90
4
80
0
10
20
30
40
0
50
0
gain reduction (dB)
10
20
30
40
50
gain reduction (dB)
VDS = 5 V; VGG = 5 V; RG1 = 75 k (connected to VGG);
see Fig.21; f = 50 MHz; funw = 60 MHz; Tamb = 25 C.
VDS = 5 V; VGG = 5 V; RG1 = 75 k (connected to VGG);
see Fig.21; f = 50 MHz; Tamb = 25 C.
Fig.15 Unwanted voltage for 1% cross-modulation
as a function of gain reduction; typical
values.
Fig.16 Drain current as a function of gain
reduction; typical values.
2003 Dec 16
8
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
MDB841
102
handbook, halfpage
MDB842
103
handbook, halfpage
−103
|yrs|
(μS)
yis
(mS)
ϕrs
(deg)
ϕrs
102
10
−102
bis
1
|yrs|
10
−10
gis
10−1
10
102
f (MHz)
1
10
103
102
103
f (MHz)
−1
VDS = 5 V; VG2 = 4 V.
ID = 15 mA; Tamb = 25 C.
VDS = 5 V; VG2 = 4 V.
ID = 15 mA; Tamb = 25 C.
Fig.17 Input admittance as a function of frequency;
typical values.
Fig.18 Reverse transfer admittance and phase as
a function of frequency; typical values.
MDB843
102
handbook, halfpage
−102
|yfs|
(mS)
ϕfs
(deg)
yos
(mS)
|yfs|
bos
1
−10
10
ϕfs
1
10
MDB844
10
handbook, halfpage
102
f (MHz)
gos
10−1
103
−1
10−2
10
102
f (MHz)
VDS = 5 V; VG2 = 4 V.
ID = 15 mA; Tamb = 25 C.
VDS = 5 V; VG2 = 4 V.
ID = 15 mA; Tamb = 25 C.
Fig.19 Forward transfer admittance and phase as
functions of frequency; typical values.
Fig.20 Output admittance as a function of
frequency; typical values.
2003 Dec 16
9
103
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
VAGC
handbook, full pagewidth
R1
10 kΩ
C1
4.7 nF
C3
4.7 nF
RGEN
50 Ω
R2
50 Ω
RL
50 Ω
L1
C2
≈ 2.2 μH
DUT
C4
4.7 nF
RG1
4.7 nF
VGG
VI
VDS
MGS315
Fig.21 Cross-modulation test set-up.
Table 1
f
(MHz)
Scattering parameters: VDS = 5 V; VG2-S = 4 V; ID = 15 mA; Tamb = 25 C
s11
s21
s12
s22
MAGNITUDE
(ratio)
ANGLE
(deg)
MAGNITUDE
(ratio)
ANGLE
(deg)
MAGNITUDE
(ratio)
ANGLE
(deg)
MAGNITUDE
(ratio)
ANGLE
(deg)
50
0.987
3.86
2.928
175.8
0.0005
89.3
0.993
1.58
100
0.985
7.73
2.921
171.6
0.0010
86.9
0.993
3.14
200
0.979
15.25
2.807
163.2
0.0015
91.1
0.993
6.31
300
0.965
22.84
2.846
155.0
0.0028
77.4
0.988
9.41
400
0.949
30.15
2.784
146.7
0.0034
74.0
0.985
12.48
500
0.929
30.25
2.704
138.9
0.0037
71.4
0.981
15.54
600
0.904
44.24
2.639
130.9
0.0040
69.6
0.976
18.59
700
0.876
51.16
2.558
123.0
0.0039
69.0
0.971
21.65
800
0.846
58.16
2.486
115.1
0.0037
70.0
0.965
24.27
900
0.816
65.15
2.402
107.2
0.0032
74.5
0.960
27.79
1000
0.791
72.22
2.315
99.9
0.0028
87.1
0.956
30.94
Table 2
Noise data: VDS = 5 V; VG2-S = 4 V; ID = 15 mA; Tamb = 25 C
opt
f
(MHz)
Fmin
(dB)
(ratio)
(deg)
Rn
()
400
0.9
0.693
16.75
29.85
800
1.3
0.707
37.33
29.90
2003 Dec 16
10
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
PACKAGE OUTLINES
Plastic surface-mounted package; 4 leads
SOT143B
D
B
E
A
X
y
HE
v M A
e
bp
w M B
4
3
Q
A
A1
c
1
2
Lp
b1
e1
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
b1
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.1
0.48
0.38
0.88
0.78
0.15
0.09
3.0
2.8
1.4
1.2
1.9
1.7
2.5
2.1
0.45
0.15
0.55
0.45
0.2
0.1
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
04-11-16
06-03-16
SOT143B
2003 Dec 16
EUROPEAN
PROJECTION
11
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
Plastic surface-mounted package; reverse pinning; 4 leads
D
SOT143R
B
E
A
X
y
HE
v M A
e
bp
w M B
3
4
Q
A
A1
c
2
1
Lp
b1
e1
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
b1
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.1
0.48
0.38
0.88
0.78
0.15
0.09
3.0
2.8
1.4
1.2
1.9
1.7
2.5
2.1
0.55
0.25
0.45
0.25
0.2
0.1
0.1
OUTLINE
VERSION
SOT143R
2003 Dec 16
REFERENCES
IEC
JEDEC
JEITA
SC-61AA
12
EUROPEAN
PROJECTION
ISSUE DATE
04-11-16
06-03-16
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
Plastic surface-mounted package; reverse pinning; 4 leads
D
SOT343R
E
B
A
X
HE
y
v M A
e
3
4
Q
A
A1
c
2
w M B
1
bp
Lp
b1
e1
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
b1
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.4
0.3
0.7
0.5
0.25
0.10
2.2
1.8
1.35
1.15
1.3
1.15
2.2
2.0
0.45
0.15
0.23
0.13
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
97-05-21
06-03-16
SOT343R
2003 Dec 16
EUROPEAN
PROJECTION
13
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
Right to make changes  NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
DEFINITIONS
Product specification  The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
Suitability for use  NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
DISCLAIMERS
Limited warranty and liability  Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications  Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
2003 Dec 16
14
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FETs
BF1211; BF1211R; BF1211WR
Export control  This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Quick reference data  The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products  Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Limiting values  Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
Terms and conditions of commercial sale  NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license  Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
2003 Dec 16
15
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R77/01/pp16
Date of release: 2003 Dec 16
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