Data Sheet

DISCRETE SEMICONDUCTORS
DATA SHEET
M3D124
BFG480W
NPN wideband transistor
Product specification
Supersedes data of 1998 Jul 09
1998 Oct 21
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
FEATURES
PINNING
 High power gain
PIN
DESCRIPTION
 High efficiency
1
emitter
 Low noise figure
2
base
 High transition frequency
3
emitter
 Emitter is thermal lead
4
collector
 Low feedback capacitance
 Linear and non-linear operation.
handbook, halfpage
3
4
2
1
APPLICATIONS
 RF front end with high linearity system demands
(CDMA)
 Common emitter class AB driver.
Top view
DESCRIPTION
MSB842
Marking code: P6.
NPN double polysilicon wideband transistor with buried
layer for low voltage applications in a 4-pin dual-emitter
SOT343R plastic package.
Fig.1 Simplified outline SOT343R.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
VCEO
collector-emitter voltage open base

4.5
V
IC
collector current (DC)
80
250
mA

Ptot
total power dissipation
Ts  60 C
360
mW
fT
transition frequency
IC = 80 mA; VCE = 2 V; f = 2 GHz; Tamb = 25 C 21

GHz
Gmax
maximum gain
IC = 80 mA; VCE = 2 V; f = 2 GHz; Tamb = 25 C 16

dB
F
noise figure
IC = 8 mA; VCE = 2 V; f = 2 GHz; S = opt
1.8

dB
Gp
power gain
Pulsed; class-AB;  < 1 : 2; tp = 5 ms;
VCE = 3.6 V; f = 2 GHz; PL = 100 mW
13.5

dB
C
collector efficiency
Pulsed; class-AB;  < 1 : 2; tp = 5 ms;
VCE = 3.6 V; f = 2 GHz; PL = 100 mW
45

%
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling.
1998 Oct 21
2
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCBO
collector-base voltage
open emitter

14.5
V
VCEO
collector-emitter voltage
open base

4.5
V
VEBO
emitter-base voltage
open collector

1
V
IC
collector current (DC)

250
mA
Ptot
total power dissipation

360
mW
Tstg
storage temperature
65
+150
C
Tj
operating junction temperature

150
C
Ts  60 C; note 1; see Fig.2
Note
1. Ts is the temperature at the soldering point of the emitter pins.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-s
PARAMETER
thermal resistance from junction to soldering point
MGR623
500
Ptot
handbook, halfpage
(mW)
400
300
200
100
0
0
40
80
120
160
Ts (°C)
Fig.2 Power derating curve.
1998 Oct 21
3
VALUE
UNIT
250
K/W
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
CHARACTERISTICS
Tj = 25 C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
IC = 50 A; IE = 0
V(BR)CBO
collector-base breakdown voltage
V(BR)CEO
collector-emitter breakdown voltage IC = 5 mA; IB = 0
V(BR)EBO
emitter-base breakdown voltage
IE = 100 A; IC = 0
MIN.
TYP.
MAX.
UNIT
14.5


V
4.5


V
1


V
nA
ICBO
collector-base leakage current
VCE = 5 V; VBE = 0


70
hFE
DC current gain
IC = 80 mA; VCE = 2 V; see Fig.3
40
60
100
Cc
collector capacitance
IE = ie = 0; VCB = 2 V; f = 1 MHz

1.4

Ce
emitter capacitance
IC = ic = 0; VEB = 0.5 V; f = 1 MHz

2.2

pF
Cre
feedback capacitance
IC = 0; VCB = 2 V; f = 1 MHz;
see Fig.4

340

fF
fT
transition frequency
IC = 80 mA; VCE = 2 V; f = 2 GHz;
Tamb = 25 C; see Fig.5

21

GHz
Gmax
maximum power gain; note 1
IC = 80 mA; VCE = 2 V; f = 2 GHz;
Tamb = 25 C; see Figs 7 and 8

16

dB
insertion power gain
IC = 80 mA; VCE = 2 V; f = 2 GHz;
Tamb = 25 C; see Fig.8

12

dB
noise figure
IC = 8 mA; VCE = 2 V; f = 900 MHz;
S = opt; see Fig.13

1.2

dB
IC = 8 mA; VCE = 2 V; f = 2 GHz;
S = opt; see Fig.13

1.8

dB
S 21
2
F
pF
PL1
output power at 1 dB gain
compression
Class-AB;  < 1 : 2; tp = 5 ms;
VCE = 3.6 V; ICQ = 1 mA; f = 2 GHz

20

dBm
ITO
third order intercept point
IC = 80 mA; VCE = 2 V; f = 2 GHz;
ZS = ZS opt; ZL = ZL opt; note 2

28

dBm
Notes
1. Gmax is the maximum power gain, if K > 1. If K < 1 then Gmax = MSG; see Figs 6, 7 and 8.
2. ZS is optimized for noise; ZL is optimized for gain.
1998 Oct 21
4
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
MGR624
MGR625
800
100
handbook, halfpage
handbook, halfpage
Cre
hFE
(fF)
80
600
60
400
40
200
20
0
0
0
50
100
IC (mA)
0
150
2
3
4
5
VCB (V)
VCE = 2 V.
Fig.3
1
IC = 0; f = 1 MHz.
DC current gain as a function of collector
current; typical values.
Fig.4
MGR627
MGR626
30
30
handbook, halfpage
handbook, halfpage
fT
(GHz)
20
10
10
102
IC (mA)
1998 Oct 21
Gmax
S21
0
103
0
40
80
120
160
IC (mA)
f = 2 GHz; VCE = 2 V; Tamb = 25 C.
Fig.5
MSG
gain
(dB)
20
0
10
Feedback capacitance as a function of
collector-base voltage; typical values.
f = 900 MHz; VCE = 2 V.
Transition frequency as a function of
collector current; typical values.
Fig.6
5
Gain as a function of collector current;
typical values.
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
MGR629
MGR628
50
20
handbook, halfpage
handbook, halfpage
gain
(dB)
gain
(dB)
Gmax
16
40
S21
12
MSG
30
S21
Gmax
8
20
4
10
0
0
0
40
80
120
160
102
10
IC (mA)
VCE = 2 V; f = 2 GHz.
Fig.7
1998 Oct 21
103
f (MHz)
104
IC = 80 mA; VCE = 2 V.
Gain as a function of collector current;
typical values.
Fig.8
6
Gain as a function of frequency;
typical values.
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
90°
handbook, full pagewidth
1.0
1
135°
0.8
45°
2
0.5
0.6
3 GHz
0.2
0.4
5
0.2
180°
0.2
0
0.5
1
2
5
0°
0
40 MHz
5
0.2
0.5
2
−135°
−45°
1
1.0
MGR630
−90°
IC = 80 mA; VCE = 2 V; Zo = 50 
Fig.9 Common emitter input reflection coefficient (S11); typical values.
90°
handbook, full pagewidth
135°
45°
40 MHz
25
20
15
10
5
3 GHz
180°
−135°
0°
−45°
−90°
MGR631
IC = 80 mA; VCE = 2 V.
Fig.10 Common emitter forward transmission coefficient (S21); typical values.
1998 Oct 21
7
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
90°
handbook, full pagewidth
135°
45°
3 GHz
0.5
0.4
0.3
0.2
0.1
180°
0°
40 MHz
−135°
−45°
−90°
MGR632
IC = 80 mA; VCE = 2 V.
Fig.11 Common emitter reverse transmission coefficient (S12); typical values.
90°
handbook, full pagewidth
1.0
1
135°
0.8
45°
2
0.5
0.6
0.2
0.4
5
0.2
3 GHz
180°
0.2
0
0.5
1
2
5
0°
0
40 MHz
5
0.2
0.5
2
−135°
−45°
1
1.0
−90°
MGR633
IC = 80 mA; VCE = 2 V; Zo = 50 
Fig.12 Common emitter output reflection coefficient (S22); typical values.
1998 Oct 21
8
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
Noise data
VCE = 2 V; typical values.
f
(MHz)
900
2000
IC
(mA)
Fmin
(dB)
mag
angle
rn
()
2
1.1
0.41
96.1
0.21
4
1.1
0.31
106.6
0.14
Fmin
6
1.2
0.27
118.4
0.12
(dB)
8
1.2
0.26
131.7
0.10
10
1.3
0.28
143.2
0.10
20
1.6
0.39
166.2
0.07
40
2.0
0.49
176.0
0.07
60
2.3
0.57
179.5
0.07
80
2.9
0.45
177.3
0.18
2
2.4
0.57
171.9
0.09
4
2.0
0.49
178.9
0.08
6
1.8
0.46
175.7
0.09
8
1.8
0.44
171.7
0.09
10
1.8
0.43
168.4
0.09
12
1.8
0.44
165.3
0.10
14
1.8
0.44
163.7
0.10
20
1.9
0.46
158.3
0.11
40
2.3
0.52
150.2
0.14
60
2.6
0.56
147.7
0.18
80
2.8
0.60
146.1
0.22
MGR634
4
handbook, halfpage
3
2 GHz
2
900 MHz
1
0
0
20
40
60
IC (mA)
80
VCE = 2 V.
Fig.13 Minimum noise figure as a function of
collector current; typical values.
APPLICATION INFORMATION
RF performance at Ts  60 C in a common emitter test circuit (see Figs 18 and 19).
MODE OF OPERATION
f
(GHz)
VCE
(V)
ICQ
(mA)
PL
(mW)
Gp
(dB)
C
(%)
Pulsed; class-AB;  < 1 : 2; tp = 5 ms
2
3.6
1
100
typ. 13.5
typ. 45
1998 Oct 21
9
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
MGR635
MGR636
80
16
handbook, halfpage
ηC
(%)
Gp
(dB)
Gp
80
16
handbook, halfpage
ηC
(%)
Gp
(dB)
Gp
60
12
8
40
8
40
4
20
4
20
0
0
12
ηC
ηC
0
10
14
18
22
PL (dBm)
0
10
26
Pulsed, class-AB operation;  < 1 ; 2; tp = 5 ms.
f = 2 GHz; VCE = 2.4 V; ICQ = 1 mA; tuned at PL = 100 mW.
14
18
22
PL (dBm)
26
Pulsed, class-AB operation;  < 1 ; 2; tp = 5 ms.
f = 2 GHz; VCE = 3.6 V; ICQ = 1 mA; tuned at PL = 100 mW.
Fig.14 Power gain and collector efficiency as a
function of load power; typical values.
Fig.15 Power gain and collector efficiency as a
function of load power; typical values.
MGR637
10
Zi
60
MGR638
30
handbook, halfpage
handbook, halfpage
ri
(Ω)
RL
ZL
(Ω)
8
20
6
4
10
2
xi
XL
0
1.8
1.85
1.9
1.95
f (GHz)
0
1.8
2
1.9
1.95
f (GHz)
2
VCE = 3.6 V; ICQ = 1 mA; PL = 100 mW; Ts  60 C.
VCE = 3.6 V; ICQ = 1 mA; PL = 100 mW; Ts  60 C.
Fig.16 Input impedance as function of frequency
(series components); typical values.
1998 Oct 21
1.85
Fig.17 Load impedance as a function of frequency
(series components); typical values.
10
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
VC
handbook, full pagewidth
VS
R1
L5
R2
R3
C7
C6
TR1
C3
L4
L1
RF input
50 Ω
L3
C5
L2
C1
RF output
50 Ω
DUT
C4
C2
MGM221
Fig.18 Common emitter test circuit for class-AB operation at 2 GHz.
List of components used in test circuit (see Figs 18 and 19)
COMPONENT
DESCRIPTION
VALUE
DIMENSIONS
C1, C5
multilayer ceramic chip capacitor; note 1
C2, C4
multilayer ceramic chip capacitor; note 1
2 pF
C3, C6
multilayer ceramic chip capacitor, note 1
15 pF
C7
multilayer ceramic chip capacitor; note 1
1 nF
L1, L4
stripline; note 2
100 
18 x 0.2 mm
L2
stripline; note 2
50 
5 x 0.8 mm
L3
stripline; note 2
50 
6 x 0.8 mm
L5
Grade 4S2 Ferroxcube chip bead
R1
metal film resistor
220 ; 0.4 W
R2, R3
metal film resistor
10 ; 0.4 W
TR1
NPN transistor
BC817
CATALOGUE No.
24 pF
4330 030 36300
9335 895 20215
Notes
1. American Technical Ceramics type 100A or capacitor of same quality.
2. The striplines are on a double copper-clad printed-circuit board with PTFE fibre-glass dielectric (r = 6.15,
tan  = 0.0019); thickness 0.64 mm, copper cladding = 35 m.
1998 Oct 21
11
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
45
handbook, full pagewidth
35
VS
VC
R1
TR1
L5
R2
R3
C3
C7
C6
L1
C1
L4
C5
L2
L3
input
C2
DUT
C4
output
MBK827
Dimensions in mm.
The components are situated on one side of the copper-clad PTFE fibre-glass board, the other side is unetched and serves as a ground plane.
Earth connections from the component side to the ground plane are made by through metallization.
Fig.19 Printed-circuit board and component layout for 2 GHz class-AB test circuit in Fig.18.
1998 Oct 21
12
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
PACKAGE OUTLINE
Plastic surface-mounted package; reverse pinning; 4 leads
D
SOT343R
E
B
A
X
HE
y
v M A
e
3
4
Q
A
A1
c
2
w M B
1
bp
Lp
b1
e1
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
b1
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.4
0.3
0.7
0.5
0.25
0.10
2.2
1.8
1.35
1.15
1.3
1.15
2.2
2.0
0.45
0.15
0.23
0.13
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
97-05-21
06-03-16
SOT343R
1998 Oct 21
EUROPEAN
PROJECTION
13
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
Right to make changes  NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
DEFINITIONS
Product specification  The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
Suitability for use  NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
DISCLAIMERS
Limited warranty and liability  Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications  Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
1998 Oct 21
14
NXP Semiconductors
Product specification
NPN wideband transistor
BFG480W
Export control  This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Quick reference data  The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products  Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Limiting values  Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
Terms and conditions of commercial sale  NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license  Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
1998 Oct 21
15
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R77/03/pp16
Date of release: 1998 Oct 21
Similar pages