Data Sheet

SO
T8
9
BFQ540
NPN wideband transistor
Rev. 05 — 21 March 2013
Product data sheet
1. Product profile
1.1 General description
NPN wideband transistor in a SOT89 plastic package.
1.2 Features and benefits
 High gain
 Gold metallization ensures excellent
reliability
 Low thermal resistance.
 High output voltage
 Low noise
1.3 Applications
 VHF, UHF and CATV amplifiers.
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
VCBO
collector-base voltage
open emitter
Min
Typ
Max
Unit
20
V
VCES
collector-emitter voltage
RBE = 0
15
V
VEBO
emitter-base voltage
open collector
2.5
V
IC
collector current (DC)
120
mA
1.2
W
Ptot
total power dissipation
Ts  60 C
hFE
DC current gain
IC = 40 mA; VCE = 8 V;
Tj = 25 C
fT
transition frequency
IC = 40 mA; VCE = 8 V;
f = 1 GHz; Tamb = 25 C
s212
insertion power gain
IC = 40 mA; VCE = 8 V;
f = 900 MHz; Tamb = 25 C
F
noise figure
IC = 40 mA; VCE = 8 V;
f = 900 MHz; S = opt
[1]
Ts is the temperature at the soldering point of the collector pin.
[1]
100
12
120
250
9
GHz
13
dB
1.9
2.4
dB
BFQ540
NXP Semiconductors
NPN wideband transistor
2. Pinning information
Table 2.
Pinning
Pin
Description
1
emitter
2
collector
3
base
Simplified outline
Graphic symbol
2
3
3
2
1
1
sym042
3. Ordering information
Table 3.
Ordering information
Type number
BFQ540
Package
Name
Description
Version
-
plastic surface-mounted package; collector pad for
good heat transfer; 3 leads
SOT89
4. Marking
Table 4.
Marking codes
Type number
Marking code
BFQ540
N4
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VCBO
collector-base voltage
VCES
collector-emitter voltage
VEBO
emitter-base voltage
open collector
IC
collector current (DC)
Ptot
total power dissipation
Tstg
storage temperature
Tj
operating junction
temperature
Min
Max
Unit
open emitter
20
V
RBE = 0
15
V
2.5
V
120
mA
Ts  60 C
65
1.2
W
+150
C
175
C
6. Thermal characteristics
Table 6.
BFQ540_5
Product data sheet
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth j-s
thermal resistance from junction
to soldering point
Ts  60 C; Ptot = 1.2 W
95
K/W
All information provided in this document is subject to legal disclaimers.
Rev. 05 — 21 March 2013
© NXP B.V. 2013. All rights reserved.
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BFQ540
NXP Semiconductors
NPN wideband transistor
Ptot
(W)
mbg241
1.4
mbg244
103
1.2
IC
(mA)
1.0
0.8
102
0.6
0.4
0.2
10
0
0
50
100
150
Tj (°C)
1
200
10
VCE (V)
102
VCE  9 V.
Fig 1.
Power derating curve.
Fig 2.
SOAR.
7. Characteristics
Table 7.
Characteristics
Tj = 25 C unless otherwise specified.
BFQ540_5
Product data sheet
Symbol
Parameter
Conditions
V(BR)CBO
collector-base breakdown open emitter; IC = 10 A;
voltage
IE = 0
V(BR)CES
collector-emitter
breakdown voltage
V(BR)EBO
Min
Typ
Max Unit
20
V
RBE = 0; IC = 40 A
15
V
emitter-base breakdown
voltage
IE = 100 A; IC = 0
2
V
ICBO
collector-base leakage
current
VCB = 8 V; IE = 0
50
nA
IEBO
emitter-base leakage
current
VCB = 1 V; IC = 0
200
nA
hFE
DC current gain
IC = 40 mA; VCE = 8 V
fT
transition frequency
IC = 40 mA; VCE = 8 V;
fm = 1 GHz
9
GHz
Ce
emitter capacitance
IC = ie = 0; VEB = 0.5 V;
f = 1 MHz
2
pF
Cre
feedback capacitance
IC = 0; VCE = 8 V; f = 1 MHz
0.9
pF
s212
insertion power gain
IC = 40 mA; VCE = 8 V;
f = 900 MHz; Tamb = 25 C
13
dB
Vo
output voltage
[1]
500
mV
[2]
350
mV
d2
second order
intermodulation distortion
F
noise figure
100
12
120
[3]
IC = 40 mA; VCE = 8 V;
f = 900 MHz; S = opt
All information provided in this document is subject to legal disclaimers.
Rev. 05 — 21 March 2013
1.9
250
-53
dB
2.4
dB
© NXP B.V. 2013. All rights reserved.
3 of 9
BFQ540
NXP Semiconductors
NPN wideband transistor
[1]
dim = 60 dB (DIN45004B); VCE = 8 V; IC = 40 mA; RL = 50 ; Vp = Vo; Vq = Vo 6 dB; Vr = Vo 6 dB;
fp = 795.25 MHz; fq = 803.25 MHz; fr = 805.5 MHz; measured at fp + fq - fr = 793.25 MHz.
[2]
dim = 60 dB (DIN 45004B); IC = 40 mA; VCE = 8 V; RL = 50 ; Vp = Vq = Vo; fp = 806 MHz; fq = 810 MHz;
measured at 2fp  fq = 802 MHz.
[3]
IC = 40 mA; VCE = 8 V; RL = 50 ; Vp = Vq = 225 mV; fp = 250 MHz; fq = 560 MHz; measured
at fp + fq = 810 MHz.
mra688
1
Cre
(pF)
0.8
mra689
12
fT
(GHz)
VCE = 8 V
8
4V
0.6
0.4
4
0.2
0
0
4
8
0
10−1
12
1
IC (mA)
IC = 0; f = 1 MHz.
Fig 3.
f = 1 GHz; Tamb = 25 °C.
Feedback capacitance as a function of
collector-base voltage; typical values.
Fig 4.
Transition frequency as a function of collector
current; typical values.
mbg242
-20
mbg243
-20
d2
(dB)
dim
(dB)
-30
-30
-40
-40
-50
-50
-60
-60
-70
10
20
30
40
50
-70
60
IC (mA)
10
VCE = 8 V; Vo = 475 mV; RL = 50 . fp + fq  fr = 793.25
MHz; Tamb = 25 C.
Fig 5.
102
10
VCB (V)
Intermodulation distortion as a function of
collector current; typical values.
BFQ540_5
Product data sheet
20
30
40
50
60
IC (mA)
VCE = 8 V; Vo = 225 mV; RL = 50 ; fp + fq = 810 MHz;
Tamb = 25 C.
Fig 6.
Second order intermodulation distortion as a
function of collector current; typical values.
All information provided in this document is subject to legal disclaimers.
Rev. 05 — 21 March 2013
© NXP B.V. 2013. All rights reserved.
4 of 9
BFQ540
NXP Semiconductors
NPN wideband transistor
8. Package outline
Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads
SOT89
B
D
A
bp3
E
HE
Lp
1
2
3
c
bp2
w M B
bp1
e1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
bp1
bp2
bp3
c
D
E
mm
1.6
1.4
0.48
0.35
0.53
0.40
1.8
1.4
0.44
0.23
4.6
4.4
2.6
2.4
OUTLINE
VERSION
SOT89
Fig 7.
e
3.0
e1
HE
Lp
w
1.5
4.25
3.75
1.2
0.8
0.13
REFERENCES
IEC
JEDEC
JEITA
TO-243
SC-62
EUROPEAN
PROJECTION
ISSUE DATE
06-03-16
06-08-29
Package outline SOT89 (TO-243).
BFQ540_5
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 05 — 21 March 2013
© NXP B.V. 2013. All rights reserved.
5 of 9
BFQ540
NXP Semiconductors
NPN wideband transistor
9. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BFQ540 v.5
20130321
Product data sheet
-
BFQ540_N_4
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Package outline drawings have been updated to the latest version.
VEBO value updated.
BFQ540_N_4
20070925
Product data sheet
BFQ540_3
(9397 750 07064)
20000523
Product specification
BFQ540_2
BFQ540_2
(9397 750 04296)
19980827
Product specification
BFQ540_1
BFQ540_1
19950904
Product specification
-
BFQ540_5
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 05 — 21 March 2013
BFQ540_3
© NXP B.V. 2013. All rights reserved.
6 of 9
BFQ540
NXP Semiconductors
NPN wideband transistor
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
10.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BFQ540_5
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 05 — 21 March 2013
© NXP B.V. 2013. All rights reserved.
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BFQ540
NXP Semiconductors
NPN wideband transistor
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BFQ540_5
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 05 — 21 March 2013
© NXP B.V. 2013. All rights reserved.
8 of 9
BFQ540
NXP Semiconductors
NPN wideband transistor
12. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description . . . . . . . . . . . . . . . . . . . . .
Features and benefits . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
2
2
3
5
6
7
7
7
7
8
8
9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 21 March 2013
Document identifier: BFQ540_5