LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Parts LG-192-8HY-CT-A01 DATA SHEET DOC. NO : QW0905-LG-192-8HY-CT-A01 REV. : A DATE : 18 - Aug. - 2014 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/11 PART NO. LG-192-8HY-CT-A01 Features: 1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with reflow solder process. Descriptions: 1. The LG-192 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: PART NO MATERIAL LG-192-8HY-CT-A01 AlGaInP COLOR Emitted Lens Yellow Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/11 PART NO. LG-192-8HY-CT-A01 Package Dimensions Cathode Mark 0.4 0.2 0.8 Resin Cathode Mark 0.3 LED DIE 1.6 1.0 Soldering Terminal 1.0 0.6 0.3 PCB Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 0.8 0.8 0.7 0.8 Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/11 PART NO. LG-192-8HY-CT-A01 Absolute Maximum Ratings at Ta=25 ℃ Symbol Ratings UNIT Power Dissipation PD 65 mW Peak Forward Current Duty 1/10@10KHz IFP 60 mA Forward Current IF 25 mA Reverse Current @5V Ir 10 μA Electrostatic Discharge ESD 2000 V Operating Temperature Topr -40 ~ + 85 ℃ Storage Temperature Tstg -40 ~ + 100 ℃ Parameter Typical Electrical & Optical Characteristics (Ta=25 ℃) Items Symbol Min. Typ. Max. UNIT CONDITION Luminous Intensity Iv 80 ---- 180 mcd IF=20mA Dominant Wavelength λD 587 ---- 598 nm IF=20mA △λ ---- 15 ---- nm IF=20mA VF 1.7 ---- 2.6 V IF=20mA 2θ 1/2 ---- 130 ---- deg IF=20mA Spectral Line Half-Width Forward Voltage Viewing Angle Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 3.The dominant wavelength data did not including ±1nm testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/11 PART NO. LG-192-8HY-CT-A01 Luminous Intensity Classification BIN CODE Iv(mcd) at 20mA Min. Max. Q 80 125 R 125 180 Dominant Wavelength Classification BIN CODE λD(nm) at 20mA Min. Max. 16 587 589 17 589 592 18 592 595 19 595 598 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/11 PART NO. LG-192-8HY-CT-A01 Typical Electro-Optical Characteristics Curve 8HY CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.0 1.0 0 2.0 1.0 3.0 1.0 5.0 4.0 10 Fig.4 Relative Intensity vs. Temperature 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Relative Intensity @20mA Fig.5 Relative Intensity vs. Wavelength 0.5 0 600 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 Fig.6 Directive Radiation 1.0 550 3.0 80 Ambient Temperature( ℃) Ambient Temperature( ℃) 500 Relative Intensity @20mA Normalize @25℃ Forward Voltage@20mA Normaliz @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/11 PART NO. LG-192-8HY-CT-A01 Carrier Type Dimensions 2.0 1.5 4.0±0.2 0.25 1.75 3.5±0.2 8.0±0.3 5.3 1.75 Polarity 0.6 4.0±0.2 0.9 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. ‧ Packing Specifications Label Aluminum Moist-Proff bag Label Part No. Description Quantity/Reel LG-192-8HY-CT-A01 8.0mm tape,7"reel 4000 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/11 PART NO. LG-192-8HY-CT-A01 Label Explanation LIGITEK ELECTRONICS CO., LTD. Pb PART : LG-192-8HY-CT-A01 BIN : Luminous Intensity LOT : GS11470168 HUE : Dominant Wavelength QTY(PCS): 4000 BIN/HUE : Q/17 VF:1.8-2.0 VF : Forward Voltage Reel Dimensions 0.2 0.4 0.8 0.8 0.6 0.2 0.4 0.6 2.0±0.5 178±1.5 6.0±1.0 9.0±1.0 ψ13.5±1.0 12.0±1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/11 PART NO. LG-192-8HY-CT-A01 Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm L W H Date：2013.9.6 Profile Feature Preheat/Soak Temperature Min (Tsmin) Temperature Max (Tsmax) Time (ts) from (Tsmin to Tsmax) Ramp‐up rate (TL to Tp) Liquidous temperature (TL) Time (tL) maintained above TL Peak package body temperature (Tp) Time (tp)* within 5 °C of the specified classification temperature (Tc), see Figure 1‐1 . Ramp‐down rate (Tp to TL) Time 25 °C to peak temperature SMD Pb‐Free Assembly DIP Pb‐Free Assembly 150 °C 200 °C 120 seconds 80 °C 135 °C 120 seconds 3 °C/second max. 217 °C 90 seconds 260 °C 3 °C/second max. NA 270 °C 10* seconds 6* seconds 6 °C/second max. 8 minutes max. 6 °C/second max. 8 minutes max. SMT Component Vendor Spec DIP Component Vendor Spec 135 °C need endure 120 seconds For LED need endure 80 seconds need endure 3 °C/second max. need endure3 °C/second max. 217 °C NA need endure 90 seconds 260 °C 270 °C 150 °C 200 °C need endure 120 seconds need endure 10* seconds need endure 6* seconds need endure 6 °C/second max need endure 6 °C/second max. 8 minutes max. 8 minutes max. Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live‐bug). If parts are reflowed in other than the normal live‐bug assembly reflow orientation (i.e., dead‐bug), Tp shall be within ± 2 °C of the live‐bug Tp and still meet the Tc requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body temperatures refer to JEP140 for recommended thermocouple use. 2. DIP Plastic heat resistance capability : (1) Direct contact 270℃, 6 seconds (2) In‐direct contact 230℃, 5 seconds (3) no contact 130℃, 5 seconds Figure 1‐1 2. DIP零件 耐溫性要求 最高溫度 270°C =6 s 藍色線條：代表錫面溫度, 紅色：代表零件面溫度. 耐溫 135 °C > 120 s For LED 135°C =80s 3. DIP 零件塑膠部分耐溫要求 (1) 直接接觸需承受270度6秒 / Direct contact 270℃, 6 sec (2) 間接接觸需承受230度5秒 / In-direct contact 230℃, 5 sec (3) 完全不接觸需承受130度5秒 / no contact 130℃, 5 sec LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 10/11 PART NO. LG-192-8HY-CT-A01 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year at ＜30℃ and ＜90% relative humidity(RH) (from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃±5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forward current should not be allowed to change by more than 40% of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 11/11 PART NO. LG-192-8HY-CT-A01 Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=1000hrs¡Ó2hrs Endurance Test Thermal Shock Test Solderability Test Environmental Test Temperature Cycling IR Reflow 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface 1.105 ℃ ~ 25℃ ~ -55℃ ~ 25℃ 30mins 5mins 30mins 5mins 2.10 Cyeles 1.T=260°C Max. 10sec.Max. 2. 6 Min MIL-STD-202F:103B JIS C 7021: B-11 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 MIL-STD-750D:2031.2 J-STD-020