LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT LED TAPE AND REEL Pb Lead-Free Parts L2URFSDBK9Q53/TR1 DATA SHEET DOC. NO : QW0905-L2URFSDBK9Q53/TR1 REV. : A DATE : 24 - Nov. - 2011 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/12 PART NO. L2URFSDBK9Q53/TR1 Features: 1. Top view white LED. 2. white SMT package. 3. Leadframe package with individual 6 pin. 4.Wide viewing angle. 5.Soldering methods:IR reflow soldering. 6.Feature of the device:more light due to higher optical efficiency;extremely wide viewing angle;ideal for backlighting and coupling in light guide. Descriptions: The L2URFSDBK9Q53 SMD has wide viewing angle and optimized light coupling by inter reflector,The low current requirement makes this device ideal for portable equipment or any other application where power is at a premium. Applications: 1. LCD back light. 2. Mobile phones. 3. Indicators. 4. Switch lights. 5. Lighting. Device Selection Guide: PART NO L2URFSDBK9Q53/TR1 MATERIAL COLOR Emitted AlGaInP Red InGaN/GaN Blue Lens Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L2URFSDBK9Q53/TR1 Page 2/12 Package Dimensions 5.4 1.0 1 6 2 5 3 4 5.0 1.0 0.9 0.9 0.9 0.9 0.9 0.9 Andoe Mark Soldering Terminal 5.0 R 1 6 B 2 1.6 5 R 3 1.0 4.1 4 1.0 Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 6.8 2.0 2.0 1.2 0.4 0.4 Note : The tolerances unless mentioned is ±0.1mm Unit=mm. 1.2 1.2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L2URFSDBK9Q53/TR1 Page 3/12 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol UNIT URFS DBK Forward Current IF 50 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 100 mA Power Dissipation PD 120 120 mW Reverse Current @5V Ir 10 50 μA Electrostatic Discharge ESD 2000 500 V Operating Temperature Topr - 20 ~ + 80 ℃ Storage Temperature Tstg - 30 ~ + 100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) Items Luminous Intensity Dominant Wavelength Spectral Line Half-Width Forward Voltage Viewing Angle Min. Typ. 80 200 ---- DBK 500 800 ---- ---- 625 ---- DBK ---- 450 ---- URFS ---- 20 ---- DBK ---- 36 ---- URFS 1.7 ---- 2.6 DBK 2.8 ---- 3.6 URFS ---- 120 ---- DBK ---- 120 ---- Symbol URFS Iv URFS λD △λ VF 2θ 1/2 Max. UNIT mcd Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2.The luminous intensity data did not including ±15% testing tolerance. nm nm V deg CONDITION IF=20mA X 2 IF=20mA IF=20mA X 2 IF=20mA IF=20mA X 2 IF=20mA IF=20mA X 2 IF=20mA IF=20mA X 2 IF=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L2URFSDBK9Q53/TR1 Page 4/12 Luminous Intensity Classification BIN CODE URFS Q R S T BIN CODE DBK U V-1 V-2 W-1 Iv(mcd) at 20mA Min. Max. 80 125 200 320 125 200 320 500 Iv(mcd) at 20mA Min. Max. 500 800 1000 1250 800 1000 1250 1600 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L2URFSDBK9Q53/TR1 Page 5/12 Typical Electro-Optical Characteristics Curve URFS CHIP Fig.2 Luminous Intensity vs. Forward Current 6.0 150 Luminous Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 100 50 0 0 0.5 1.0 1.5 2.0 2.5 5.0 4.0 3.0 2.0 1.0 0.0 0 3.0 50 1.06 1.04 1.02 1.00 0.98 0.96 0.94 0 20 40 60 80 100 Fig.4 Luminous Intensity vs. Temperature Luminous Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 0 20 40 60 80 100 Fig.6 Directive Radiation Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA -20 Ambient Temperature(℃) Ambient Temperature(℃) 0° 1.0 -30° 30° -60° 0.5 0 150 Forward Current(mA) Forward Voltage(V) -40 100 100% 75% 50% 550 600 650 Wavelength (nm) 700 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L2URFSDBK9Q53/TR1 Page 6/12 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.2 Luminous Intensity vs. Forward Current Relative Intensity Normalize @120mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 100 10 1 1.0 2.0 3.0 4.0 0.8 0.6 0.4 0.2 0.0 5.0 1 3.4 3.3 3.2 3.1 3.0 2.9 2.8 40 60 120 150 80 100 120 100 80 60 40 20 0 20 40 60 80 100 Ambient Temperature(℃) Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 90 Fig.4 Relative Intensity vs. Temperature Relative Intensity@120mA Normalize @25℃ Forward Voltage@120mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 20 60 Forward Current(mA) Forward Voltage(V) 0 30 Fig.6 Directive Radiation 1.0 0° -30° 30° -60° 0.5 0.0 100% 75% 50% 400 450 500 Wavelength (nm) 550 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L2URFSDBK9Q53/TR1 Page 7/12 Carrier Type Dimensions 4.0 2.0 8.0 1.95 ψ1.5 1.75 5.5 9.3 12.0 ±0.3 5.4 Polarity Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. ‧ Packing Specifications 0.2 0.8 0.6 Aluminum Moist-Proof bag Label 0.8 0.6 0.2 0.4 0.4 Label Part No. Description Quantity/Reel L2URFSDBK9Q53/TR1 12.0mm tape,7"reel 1000 PCS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L2URFSDBK9Q53/TR1 Page 8/12 Label Explanation LIGITEK ELECTRONICS CO., LTD. Pb PART : L2URFSDBK9Q53/TR1/A LOT : GS1-080168 QTY(PCS): 1000 VF:2.8-3.6 BIN/HUE : R-U-R VF:1.7-2.6 BIN : Luminous Intensity VF : Forward Voltage VF:1.7-2.6 Reel Dimensions 0.2 0.4 0.8 0.8 0.6 0.4 0.2 0.6 2.0±0.5 ψ13.5±1.0 178±1.5 60.0±1.0 13.0±1.0 16.0±1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L2URFSDBK9Q53/TR1 Page 9/12 Box Explanation 1. 4 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L2URFSDBK9Q53/TR1 Page 10/12 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 320℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260℃ 245±5℃ within 5 sec 120 ~ 150℃ Preheat 120 ~ 180 sec 3 PB-Free Reflow Solder 1~5°C/sec 1~5°C/sec Preheat 180~200°C 260°C MaX. 10sec.Max 6°C/sec Above 220°C 60 sec.Max. 120 sec.Max. Note: 1.Reflow soldering should not be done more than two times. 2.When soldering,do not put stress on the LEDs during heating. 3.After soldering,do not warp the circuit board. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L2URFSDBK9Q53/TR1 Page 11/12 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5℃ ~ 35℃,RH60%, they should be treated at 60℃±5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40% of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 12/12 PART NO. L2URFSDBK9Q53/TR1 Reliability Test: (1)Test items and results Classification Test Item Test Condition Sample Size Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=60mA 3.t=1000 hrs 22 High Temperature Storage Test 1.Ta=105℃± 5℃ 2.t=500 hrs 22 Low Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs 22 High Temperature High Humidity Storage Test 1.IR-Reflow In-Board, 2 Times 2.Ta=85℃± 5℃ 3.RH=90%~95% 4.t=500hrs±2hrs 22 1.IR-Reflow In-Board,2 times 2.Ta=105℃±5℃& -40℃± 5℃ (30min) ( 30min) 3.total 100 cycles 22 1.T.Sol=260 ℃±5℃ 2.Dwell Time= 10Max. 22 1.105℃ ~ 25℃ ~ - 40℃ 30mins 15mins 30mins 2.100 Cyeles 22 Endurance Test Thermal Shock Test Environmental Test Reflow Soldering Test Temperature Cycling (2)Criteria for judging the damage Item Symbol Test Conditions Criteria for Judgement Min. Max. Forward Voltage Vf If=60mA - U.S.L x1.2 Reverse Current Ir Vr=5V - U.S.L x2.0 Luminous Intensity Iv If=60mA L.S.L x 0.5 - Note: 1.U.S.L.:Upper Standard Level. 2.L.S.L.:Lower Standard Level.