Pressure Freescale Semiconductor + MPX4200A Rev 4, 1/2009 Integrated Silicon Pressure Sensor for Manifold Absolute Pressure, Applications, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The Freescale MPX4200A series Manifold Absolute Pressure (MAP) sensor for turbo boost engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The MPX4200A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high level analog output signal and temperature compensation. The small form factor and reliability of on-chip integration make the Freescale MAP sensor a logical and economical choice for automotive system designers. MPX4200A Series 20 to 200 kPa (2.9 to 29 psi) 0.3 to 4.9 V Output Application Examples • Manifold Sensing for Automotive Systems • Ideally suited for Microprocessor or Microcontroller-Based Systems • Also ideal for Non-Automotive Applications Features • Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems • Patented Silicon Shear Stress Strain Gauge • Temperature Compensated Over –40° to +125°C • Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules • Durable Epoxy Unibody Element ORDERING INFORMATION Device Name MPX4200A Package Options Case No. None Tray 867 • # of Ports Single Dual Gauge Pressure Type Differential Absolute • UNIBODY PACKAGE MPX4200A CASE 867-08 © Freescale Semiconductor, Inc., 2006-2009. All rights reserved. Device Marking MPX4200A Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 20 — 200 kPa Supply Voltage(2) VS 4.85 5.1 5.35 Vdc Io — 7.0 10 mAdc (1) Supply Current (3) Minimum Pressure Offset @ VS = 5.1 Volts (0 to 85°C) Voff 0.199 0.306 0.413 Vdc Full Scale Output @ VS = 5.1 Volts(4) (0 to 85°C) VFSO 4.725 4.896 4.978 Vdc Full Scale Span @ VS = 5.1 Volts(5) (0 to 85°C) VFSS — 4.590 — Vdc (0 to 85°C) — — — ±1.5 %VFSS V/P — 25.5 —- mV/kPa tR — 1.0 —- ms Io+ — 0.1 —- mAdc — — 20 —- ms — — ±0.5 —- %VFSS (6) Accuracy Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Time (8) (9) Offset Stability 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: TcSpan: TcOffset: Variation from Nominal: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. Output deviation over the temperature range of 0 to 85°C, relative to 25°C. Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX4200A 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 800 kPa Storage Temperature TSTG –40 to +125 °C TA –40 to +125 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Table 3. Mechanical Characteristics Characteristics Weight, Basic Element (Case 867) Typ Unit 4.0 grams Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND 3 Gain Stage #2 and Ground Reference Shift Circuitry Vout 1 Pins 4, 5, and 6 are NO CONNECTS for unibody devices. 2 Figure 1. Fully Integrated Pressure Sensor Schematic MPX4200A Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4200A series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Silicone Die Coat Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over temperature range of 0° to 85°C. The output will saturate outside of the specified pressure range. Stainless Steel Metal Cover Die P1 Wire Bond Epoxy Case RTV Die Bond Lead Frame P2 Sealed Vacuum Reference Figure 2. Cross Sectional Diagram (not to scale) +5.1 V Vout Output Vs IPS 1.0 μF 0.01 μF GND 470 pF Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) 5.0 Transfer Function: Vout = Vs* (0.005 x P-0.04) ± Error VS = 5.1 Vdc Temperature = 0 to 85°C 4.5 4.0 Output (Volts) 3.5 TYP 3.0 2.5 2.0 MAX 1.5 MIN 1.0 0.5 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 0 Figure 4. Output versus Absolute Pressure MPX4200A 4 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS C R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30˚ NOM 30˚ NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867-08 ISSUE N UNIBODY PACKAGE MPX4200A Sensors Freescale Semiconductor 5 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 firstname.lastname@example.org Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 010 5879 8000 email@example.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. 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