Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXC2011DT1 Rev. 11, 09/2015 MPXC2011DT1, 0 to 10 kPa, Differential, Compensated Pressure Sensor MPXC2011DT1 Freescale Semiconductor has developed a high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor's unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration. Chip Pak package Back view Features • Integrated temperature compensation and calibration • Ratiometric to supply voltage • Polysulfone case material (ISO 10993) • Provided in easy-to-use tape and reel MPXC2011DT1 Case 98ASB13355C Front view Typical applications • Respiratory diagnostics • Air movement control • Controllers • Pressure switching 1 2 3 4 GND +VOUT +VS –VOUT NOTE The die and wire bonds are exposed on the front side of the chip pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes. Pinout Ordering Information Pressure Type Device Name Shipping Package Device Marking Gauge MPXC2011DTI Tape and Reel Differential 98ASB13355C • Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2010, 2012, 2014, 2015 Freescale Semiconductor, Inc. All rights reserved. Absolute XXXX = Device code XXX = Trace code Contents 1 2 3 4 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Package description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 4 4 4 5 5 6 Related Documentation The MPXC2011DT1 device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. 3. In the Keyword search box at the top of the page, enter the device number MPXC2011DT1. In the Refine Your Result pane on the left, click on the Documentation link. MPXC2011DT1 2 Sensors Freescale Semiconductor, Inc. 1 General Description Freescale Semiconductor's MPXC2011DT1 Pressure Sensor has been designed for medical usage by combining the performance of Freescale Semiconductor's shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: ISO 10993-5:1999, ISO 10993-10:2002, and ISO 10993-11:1993. The MPXC2011DT1 contains a silicone dielectric gel which covers the silicon piezoresistive sensing element. The gel is a nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing, as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the performance of the sensor. 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 3 Thin Film Temperature Compensation and Calibration Circuitry Sensing Element 2 4 +VOUT –VOUT 1 GND Figure 1. Block diagram 1.2 Pinout GND +VOUT +VS –VOUT 1 2 3 4 Figure 2. Device pinout (front view) Table 1. Pin functions Pin Name 1 GND Function 2 +VOUT Output voltage 3 +VS Voltage supply 4 –VOUT Output voltage Ground MPXC2011DT1 Sensors Freescale Semiconductor, Inc. 3 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings(1) Rating Symbol Value Unit Maximum pressure (backside) Pmax 75 kPa Storage temperature Tstg -25 to +85 °C Operating temperature TA +15 to +40 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.2 Operating characteristics Table 3. Operating characteristics (VS = 10 VDC, TA = 25 °C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure range(1) POP 0 — 10 kPa Supply voltage(2) VS — 3 10 VDC Supply current IO — 6.0 — mAdc Full-scale span(3) VFSS 24 25 26 mV Offset(4) VOFF -1.0 — 1.0 mV Sensitivity ΔV/ΔP — 2.5 — mV/kPa Linearity(5) — -1.0 — 1.0 %VFSS Pressure hysteresis(5) (0 to 10 kPa) — — ±0.1 — %VFSS Temperature hysteresis(5) (+15 °C to +40 °C) — — ±0.1 — %VFSS Temperature effect on full-scale span(5) TCVFSS -1.0 — 1.0 %VFSS Temperature effect on offset(5) TCVOFF -1.0 — 1.0 mV ZIN 1300 — 2550 Ω ZOUT 1400 — 3000 Ω Response time(6) (10% to 90%) tR — 1.0 — ms Warm-up — — 20 — ms Offset stability(7) — — ±0.5 — %VFSS Input impedance Output impedance 1. 1.0 kPa (kilo Pascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 °C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85 °C, relative to 25 °C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 °C, relative to 25 °C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXC2011DT1 4 Sensors Freescale Semiconductor, Inc. 3 Package Dimensions 3.1 Package description This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB13355C.pdf. A M C L F N B 1 2 3 V 4 K DETAIL A –T– D1 G J H FRONT VIEW E END VIEW AC NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 3. Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4. F AA AB AD D2 DETAIL A BACK VIEW DIM A B C D1 D2 E F G H J K L M N V AA AB AC AD INCHES MIN MAX 0.240 0.260 0.350 0.370 0.140 0.150 0.012 0.020 0.014 0.022 0.088 0.102 0.123 0.128 0.045 0.055 0.037 0.047 0.007 0.011 0.120 0.140 0.095 0.105 0.165 0.175 0.223 0.239 0.105 0.115 0.095 0.107 0.015 0.035 0.120 0.175 0.100 0.115 MILLIMETERS MIN MAX 6.10 6.60 8.89 9.40 3.56 3.81 0.30 0.51 0.36 0.56 2.24 2.59 3.12 3.25 1.14 1.40 0.94 1.19 0.18 0.28 3.05 3.56 2.41 2.67 4.19 4.45 5.66 6.07 2.67 2.92 2.41 2.72 0.38 0.89 3.05 4.45 2.54 2.92 Case 98ASB1335C, Chip Pak package MPXC2011DT1 Sensors Freescale Semiconductor, Inc. 5 4 Revision History Table 4. Revision history Revision number Revision date 9 10/2012 • Deleted references to device number MPXC2012DT (a no-gel option) throughout the document. 10 08/2014 • Added pin descriptions and pin numbers. 11 09/2015 • Corrected Block Diagram. • Updated format. Description MPXC2011DT1 6 Sensors Freescale Semiconductor, Inc. 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All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logos are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2010, 2012, 2014, 2015 Freescale Semiconductor, Inc. Document Number: MPXC2011DT1 Rev. 11 09/2015