Data Sheet

Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPXH6300A
Rev. 6.0, 09/2015
MPXH6300A, 20 to 300 kPa, Absolute,
Integrated, Pressure Sensor
MPXH6300A
Freescale's MPXH6300A series sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The small form factor and high reliability of on-chip
integration make the Freescale pressure sensor a logical and economical choice
for the system designer.
The MPXH6300A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
Features
•
Improved accuracy at high temperature
•
Available in super small outline package
•
1.5% maximum error over 0 °C to 85 °C
•
Fully calibrated and compensated
•
Ideally suited for microprocessor or microcontroller-based systems
•
Temperature compensated from -40 °C to +125 °C
•
Durable thermoplastic surface mount package
•
Package porting and mounting options enable tube attachment for liquefied
natural gas (LPG) or remote sensing applications
Super small outline package
MPXH6300A6U/6T1 MPXH6300AC6U/6T1
Case 98ARH99066A Case 98ARH99089A
Top view
DNC 5
4 VOUT
DNC 6
3 GND
DNC 7
DNC 8
2 VS
1 DNC
Typical applications
Pin 1 identification,
chamfered corner.
•
Fuel injected car engines
•
Vehicles powered by green gases (for example LPG and CNG)
•
Small engines
•
Industrial controls
Pinout
Ordering information
# of Ports
Part number
Pressure type
Absolute
Device
marking
•
MPXH6300A
Shipping
Package
MPXH6300A6U
Rail
98ARH99066A
•
MPXH6300A6T1
Tape and Reel
98ARH99066A
•
•
MPXH6300A
MPXH6300AC6U
Rail
98ARH99089A
•
•
MPXH6300A
MPXH6300AC6T1
Tape and Reel
98ARH99089A
•
•
MPXH6300A
None
Single
Dual
Gauge
Differential
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© 2007, 2010, 2012, 2015 Freescale Semiconductor, Inc. All rights reserved.
Contents
1
2
3
4
5
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Pressure (P1)/Vacuum (P2) Side Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Related Documentation
The MPXH6300A device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1.
Go to the Freescale homepage at:
http://www.freescale.com/
2.
3.
In the Keyword search box at the top of the page, enter the device number MPXH6300A.
In the Refine Your Result pane on the left, click on the Documentation link.
MPXH6300A
2
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Freescale Semiconductor, Inc.
1
General Description
1.1
Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
VOUT
Pins 1, 5, 6, 7, and 8 are internal device connections.
Do not connect to external circuitry or ground.
Figure 1. Integrated pressure sensor block diagram
1.2
Pinout
DNC 5
4 VOUT
DNC 6
3 GND
DNC 7
DNC 8
2 VS
1 DNC
Pin 1 identification,
chamfered corner.
Figure 2. Device pinout (top view)
Table 1. Pin functions
Pin
Name
1
DNC
Function
Do not connect to external circuitry or ground. Pin 1 is notated by chamfered corner.
2
VS
3
GND
Ground
4
VOUT
Output voltage
5
DNC
Do not connect to external circuitry or ground.
6
DNC
Do not connect to external circuitry or ground.
7
DNC
Do not connect to external circuitry or ground.
8
DNC
Do not connect to external circuitry or ground.
Voltage supply
MPXH6300A
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2
Mechanical and Electrical Specifications
2.1
Maximum ratings
Table 2. Maximum ratings(1)
Parametrics
Symbol
Value
Units
Maximum pressure (P1 > P2)
Pmax
1200
kPa
Storage temperature
Tstg
-40 to +125
°C
Operating temperature
TA
-40 to +125
°C
Io+
0.5
mAdc
Io -
-0.5
mAdc
Output source current @ full-scale output(2)
Output sink current @ minimum pressure offset
(2)
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit.
2.2
Operating characteristics
Table 3. Operating characteristics (VS = 5.1 VDC, TA = 25 °C unless otherwise noted, P1 > P2.)
Characteristic
Pressure range
(1)
Supply voltage
Symbol
Min
Typ
Max
Unit
POP
20
—
304
kPa
VS
4.74
5.1
5.46
VDC
IO
—
6.0
10
mAdc
VOFF
0.241
0.306
0.371
VDC
Full-scale output(3) (0 to 85 °C) @ VS = 5.1 Volts
VFSO
4.847
4.912
4.977
VDC
Full-scale span(4) (0 to 85 °C) @ VS = 5.1 Volts
VFSS
4.476
4.606
4.736
VDC
—
—
—
±1.5
%VFSS
V/P
—
16.2
—
mV/kPa
Response time(6)
tR
—
1.0
—
ms
Warm-up time(7)
—
—
20
—
ms
Offset stability(8)
—
—
±0.25
—
%VFSS
Supply current
Minimum pressure offset
(2) (0
to 85 °C) @ VS = 5.1 Volts
Accuracy(5) (0 to 85 °C)
Sensitivity
1.Device is ratiometric within this specified excitation range.
2.Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure.
4.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum rated pressures
5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at
25 °C due to all sources of error including the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25 °C
TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25 °C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 °C, relative to 25 °C.
Variation from Nominal: The variation from nominal values, for offset or full-scale span, as a percent of VFSS, at 25 °C.
6.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test.
MPXH6300A
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On-chip Temperature Compensation and Calibration
Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A).
Figure 4 shows a typical application circuit (output source current operation).
Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for
operation over 0 to 85 °C temperature range. The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm. The MPXH6300A pressure sensor operating characteristics, internal reliability and
qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor
performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Fluorosilicone
Gel Die Coat
Die
P1
Stainless Steel
Cap
Thermoplastic
Case
Wire Bond
Lead frame
Absolute Element
Die Bond
Sealed
Vacuum Reference
Figure 3. Cross-sectional diagram (not-to-scale)
+5.1 V
VS
VOUT
100 nF
To ADC
1 μF
GND
47 pF
51 K
Figure 4. Recommended power supply decoupling and output filtering
MPXH6300A
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Freescale Semiconductor, Inc.
5
5.0
4.5
4.0
Output (Volts)
3.5
Transfer Function:
VOUT = VS*(.00318*P-.00353) ± Error
VS = 5.1 Vdc
Temperature = 0 to 85 °C
3.0
2.5
MAX
TYP
2.0
1.5
1.0
MIN
0.5
20
35
50
65
80
95
110
125
140
155
170
185
200
215
230
245
260
275
290
304
0
Pressure (Reference to Sealed Vacuum) in kPa
Figure 5. Output vs. absolute pressure
Nominal Transfer Value: Vout = VS x (0.00318 x P - 0.00353)
± (Pressure Error x Temp Factor x 0.00318 x VS)
VS = 5.1 ± 0.36 Vdc
Figure 6. Transfer function
Temperature Error Factor
4.0
Break Points
3.0
2.0
Temp
Multiplier
-40
0 to 85
125
3
1
3
1.0
0.0
-40
-20
0
20
40
80
60
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0 °C to -40 °C and from 85 °C to 125 °C.
Figure 7. Temperature error band
Error Limits for Pressure
4.0
Pressure Error (kPa)
3.0
2.0
1.0
0.0
-1.0
20
60
100
140
180
220
260
300
Pressure (in kPa)
-2.0
-3.0
Pressure
Error (Max)
-4.0
20 to 304 (kPa)
±4.0 (kPa)
Figure 8. Pressure error band
MPXH6300A
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Package Information
4.1
Minimum recommended footprint for surface mounted applications
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder
mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 9. SSOP footprint
MPXH6300A
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4.2
Package Dimensions
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf.
Case 98ARH99066A, super small outline package, surface mount
MPXH6300A
8
Sensors
Freescale Semiconductor, Inc.
Case 98ARH99066A, super small outline package, surface mount
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
9
Case 98ARH99066A, super small outline package, surface mount
MPXH6300A
10
Sensors
Freescale Semiconductor, Inc.
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99089A.pdf.
Case 98ARH99089A, super small outline package, surface mount
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
11
Case 98ARH99089A, super small outline package, surface mount
MPXH6300A
12
Sensors
Freescale Semiconductor, Inc.
5
Revision History
Table 4. Revision history
Revision
number
Revision
date
5.1
05/2012
• Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H.
6.0
09/2015
• Corrected figure 4.
• Updated format.
Description
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
13
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© 2007, 2010, 2012, 2015 Freescale Semiconductor, Inc.
Document Number: MPXH6300A
Rev. 6.0
09/2015
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