Data Sheet

Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPXHZ6130A
Rev. 1.2, 06/2015
MPXHZ6130A, 15 to 130 kPa,
Absolute, Integrated Pressure Sensor
MPXHZ6130A
The MPXHZ6130A series sensor integrates on-chip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature
compensation. The sensor's packaging has been designed to provide resistance
to high humidity conditions as well as common automotive media. The small form
factor and high reliability of on-chip integration make this pressure sensor a logical
choice for the system designer.
The MPXHZ6130A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
Super small outline packages
MPXHZ6130A6U
Case 98ARH99066A
MPXHZ6130AC6U
Case 98ARH99089A
Features
Top view
•
1.5% maximum error over 0 °C to 85 °C
•
Resistant to high humidity and common automotive media
•
Improved accuracy at high temperature
DNC
5
4
VOUT
•
Ideally suited for microprocessor or microcontroller-based systems
DNC
6
3
GND
•
Temperature compensated from -40 °C to +125 °C
DNC
7
2
VS
•
Durable thermoplastic (PPS) surface mount package
DNC
8
1
DNC
Typical applications
•
Aviation altimeters
•
Industrial controls
•
Engine control/manifold absolute pressure (MAP)
•
Weather stations and weather reporting devices
Pin 1 identification,
chamfered corner
Pinout
Ordering information
# of Ports
Part number
Shipping
Pressure type
Package
None
Single
Dual
Gauge
Differential
Absolute
Device
marking
Small Outline Package (MPXHZ6130A series)
MPXHZ6130A6U
Rail
98ARH99066A
MPXHZ6130AC6U
Rail
98ARH99089A
•
•
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© 2006-2010, 2012, 2015 Freescale Semiconductor, Inc. All rights reserved.
•
MPXHZ6130A
•
MPXHZ6130A
Contents
1
2
3
4
5
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Minimum recommended footprint for super small packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Related Documentation
The MPXHZ6130A device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1.
Go to the Freescale homepage at:
http://www.freescale.com/
2.
3.
In the Keyword search box at the top of the page, enter the device number MPXHZ6130A.
In the Refine Your Result pane on the left, click on the Documentation link.
MPXHZ6130A
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1
General Description
1.1
Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
Gain Stage #2
and
Ground
Reference
Shift Circuitry
VOUT
Pins 1, 5, 6, 7, and 8 are internal device connections.
Do
. not connect to external circuitry or ground.
GND
Figure 1. Fully integrated pressure sensor schematic
1.2
Pinout
DNC
5
4
VOUT
DNC
6
3
GND
DNC
7
2
VS
DNC
8
1
DNC
Pin 1 identification, chamfered corner
Figure 2. Device pinout (top view)
Table 1. Pin functions
Pin
Name
1
DNC
Function
Do not connect to external circuitry or ground. Pin 1 is denoted by chamfered corner.
2
VS
3
GND
4
VOUT
Output voltage
5
DNC
Do not connect to external circuitry or ground.
6
DNC
Do not connect to external circuitry or ground.
7
DNC
Do not connect to external circuitry or ground.
8
DNC
Do not connect to external circuitry or ground.
Voltage supply
Ground
MPXHZ6130A
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Freescale Semiconductor, Inc.
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2
Mechanical and Electrical Specifications
2.1
Maximum ratings
Table 2. Maximum ratings(1)
Rating
Symbol
Value
Units
Maximum pressure (P1 > P2)
Pmax
400
kPa
Storage temperature
Tstg
-40 to +125
°C
TA
-40 to +125
°C
Io +
0.5
mAdc
Io -
-0.5
mAdc
Operating temperature
Output source current @ full-scale output
(2)
Output sink current @ minimum pressure offset
(2)
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2.Maximum output current is controlled by effective impedance from VOUT to Gnd or VOUT to VS in the application circuit.
2.2
Operating characteristics
Table 3. Operating characteristics (VS = 5.0 Vdc, TA = 25 °C unless otherwise noted, P1 > P2).
Characteristic
Pressure range
Supply voltage(1)
Symbol
Minimum pressure offset
Full-scale output
(3)
VS = 5.0 Volts (0 °C to 85 °C)
@ VS = 5.0 Volts (0 °C to 85 °C)
Full-scale span(4) @ VS = 5.0 Volts (0 °C to 85 °C)
(5)
Accuracy
@ VS = 5.0 Volts (0 °C to 85 °C)
Sensitivity
(6)
Typ
Max
Unit
POP
15
—
130
kPa
VS
4.75
5.0
5.25
Vdc
Io
—
6.0
10
mAdc
Voff
0.132
0.200
0.268
Vdc
VFSO
4.632
4.700
4.768
Vdc
VFSS
4.365
4.500
4.635
Vdc
—
—
—
±1.5
%VFSS
V/P
—
39.2
—
mV/kPa
Supply current
(2) @
Min
Response time
tR
—
1.0
—
ms
Warm-up time(7)
—
—
20
—
ms
Offset stability(8)
—
—
±0.25
—
%VFSS
1.Device is ratiometric within this specified excitation range.
2.Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum rated pressure.
5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at
25°C due to all sources of error including the following:
Linearity:
Temperature Hysteresis:
Pressure Hysteresis:
TcSpan:
TcOffset:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25 °C.
Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C.
Output deviation with minimum pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C.
6.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to at
specified step change in pressure.
7. Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8.Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXHZ6130A
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3
On-chip Temperature Compensation and Calibration
Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for
operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range.
A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted
to the sensor diaphragm. The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor
to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory
for more information regarding media compatibility in your specific application.
Fluorosilicone
Gel Die Coat
Stainless
Steel Cap
Die
P1
Wire Bond
Thermoplastic
Case
Lead
Frame
Die Bond
Absolute Element
Sealed Vacuum Reference
Figure 3. Cross-sectional diagram SSOP (not to scale)
+5 V
VS
MPXHZ6130A
to ADC
VOUT
100 nF
47 pF
GND
51 K
Figure 4. Recommended power supply decoupling and output filtering
5.0
Transfer Function:
4.5
Vout = VS x (0.007826 x P (kPa) - 0.07739)
4.0 ±(PE x TM x V x 0.007826)
MAX
Output (Volts)
S
3.5 PE = ±1.725 kPa
3.0 TM = 1 @ 0 to 85 °C
2.5 VS = 5.0 Vdc
MIN
2.0
TYP
1.5
1.0
140
130
120
110
100
90
80
70
60
50
40
30
20
0
10
0.5
Pressure (ref: to sealed vacuum) in kPa
Figure 5. Output vs. absolute pressure
MPXHZ6130A
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Nominal Transfer Value:
VOUT = VS x (0.007826 x P (kPa) - 0.07739)
± (Pressure Error x Temp. factor x 0.007826 x VS)
VS = 5.0 ± 0.25 Vdc
Figure 6. Transfer function
Temperature Error Factor
4.0
Break Points
Temp
3.0
Multiplier
-40
0 to 85
125
2.0
3
1
1.75
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The temperature multiplier is a linear response from 0 °C to -40 °C and from 85 °C to 125 °C
Figure 7. Temperature error band
Error Limits for Pressure
3.0
Pressure Error (kPa)
2.0
1.0
0.0
20
40
60
80
100
120
Pressure (in kPa)
-1.0
Pressure
15 to 130 (kPa)
-2.0
Error (Max)
±1.725 (kPa)
-3.0
Figure 8. Pressure error band
MPXHZ6130A
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4
Package Information
4.1
Minimum recommended footprint for super small packages
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder
mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 9. SSOP footprint
MPXHZ6130A
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Freescale Semiconductor, Inc.
7
4.2
Package dimensions
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf.
Case 98ARH99066A, 8-lead super small outline package
MPXHZ6130A
8
Sensors
Freescale Semiconductor, Inc.
Case 98ARH99066A, 8-lead super small outline package
MPXHZ6130A
Sensors
Freescale Semiconductor, Inc.
9
Case 98ARH99066A, 8-lead super small outline package
MPXHZ6130A
10
Sensors
Freescale Semiconductor, Inc.
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99089A.pdf.
Case 98ARH99089A, 8-lead ported super small outline package
MPXHZ6130A
Sensors
Freescale Semiconductor, Inc.
11
Case 98ARH99089A, 8-lead ported super small outline package
MPXHZ6130A
12
Sensors
Freescale Semiconductor, Inc.
5
Revision History
Table 4. Revision history
Revision
number
Revision
date
1.1
05/2012
• Updated package drawing 98ARH99066A was Rev. F, updated to Rev. H.
1.2
06/2015
• Updated format.
• Updated package drawing 98ARH99089A was Rev D, updated to Rev G.
Description
MPXHZ6130A
Sensors
Freescale Semiconductor, Inc.
13
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© 2006-2010, 2012, 2015 Freescale Semiconductor, Inc.
Document Number: MPXHZ6130A
Rev. 1.2
06/2015
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