Data Sheet

Pressure
Freescale Semiconductor
MPVZ5150
Rev 1, 05/2010
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MPVZ5150
Series
0 to 150 kPa (0 to 21.75 psi)
0.2 to 4.7 V Output
The MPVZ5150 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Typical Applications
•
•
•
•
Features
•
•
•
•
•
Level Indicators
Process Control
Pump/Motor Control
Pressure Switching
2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Patented Silicon Shear Stress Strain Gauge
Available in Gauge Surface Mount (SMT) or Through Hole (DIP) Configurations
Increased media compatibility
ORDERING INFORMATION
# of Ports
Package
Case
Device Name
Options
No.
None
Single
Small Outline Package (Media Resistant Gel) (MPVZ5150 Series)
MPVZ5150GC6T1
MPVZ5150GC7U
Tape & Reel
Rail
482A
482C
Dual
•
•
Gauge
Pressure Type
Differential
Absolute
•
•
SMALL OUTLINE PACKAGES
MPVZ5150GC6T1
CASE 482A
© Freescale Semiconductor, Inc., 2006, 2010. All rights reserved.
MPVZ5150GC7U
CASE 482C
Device
Marking
MPVZ5150G
MPVZ5150G
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 3 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
—
150
kPa
Supply Voltage(2)
VS
4.75
5.0
5.25
VDC
Supply Current
IO
—
7.0
10
mAdc
0.088
0.200
0.313
4.588
4.700
4.813
—
4.500
—
(0 to 85°C)
VOFF
Full Scale Output(4)
@ VS = 5.0 V
Differential and Absolute (0 to 85°C)
VFSO
Full Scale Span(5)
@ VS = 5.0 V
Differential and Absolute (0 to 85°C)
VFSS
Minimum Pressure Offset(3)
@ VS = 5.0 V
VDC
VDC
VDC
Accuracy(6)
—
Sensitivity
V/P
—
30
—
mV/kPa
tR
—
1.0
—
ms
Output Source Current at Full Scale Output
IO+
—
0.1
—
mAdc
Warm-Up Time(8)
—
—
20
—
ms
Offset Stability(9)
—
—
±0.5
—
%VFSS
Response
1.
2.
3.
4.
5.
6.
7.
8.
9.
Time(7)
1 kPa (kiloPascal) equals 0.145 PSI.
Device is ratiometric within this specified excitation range.
Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25°C.
TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal:
The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPVZ5150
2
Sensors
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
400
kPa
Storage Temperature
TSTG
-40° to +125°C
°C
TA
-40° to +125°C
°C
Operating Temperature
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
2
Thin Film
Temperature
Compensation
and Gain
Stage # 1
Sensing
Element
3
Gain Stage # 2
and Ground
Reference
Shift Circuitry
4
VOUT
Pins 1 and 5 through 8 are NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
MPVZ5150
Sensors
Freescale Semiconductor
3
Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPVZ5150 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Stainless
Steel Cap
Die
Gel Die Coat
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
+5 V
P1
Thermoplastic
Case
Wire Bond
Vout
OUTPUT
Vs
Lead Frame
IPS
1.0 μF
P2
GND
0.01 μF
470 pF
Die Bond
Differential Sensing
Element
Figure 2. Cross-Sectional Diagram (not to scale)
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to Application
Note AN1646)
150
75
60
45
30
15
0
135
TYP
1
0
Span Range (Typ)
MIN
MAX
120
2
105
3
90
Output Voltabe (V)
4
Vout = VS*(0.006*P(kPa)+0.04)
± (PE * TM * 0.006 * Vs)
VS = 5.0 V ± 0.25 Vdc
PE = 3.75 kPa
TM = 1 @ 0 to 85°C
TM = 3 @ +125°C
TM = 3 @ -40°C
Vs = 5.0 V +/- 0.25 Vdc
Output Range (Typ)
5
Pressure (kPa)
(Typ)
Offset
Figure 4. Output vs. Pressure Differential
MPVZ5150
4
Sensors
Freescale Semiconductor
Pressure
Transfer Function (MPVZ5150 Series)
Nominal Transfer Value: VOUT = VS x (0.006 x P (kPa) + 0.04)
± (Pressure Error x Temp. Mult. x 0.006 x VS)
VS = 5.0 V ± 0.25 Vdc
Temperature Error Multiplier
MPVZ5150 Series
Break Points
Temp
4.0
Multiplier
- 40
0 to 85°C
+125°
3.0
3
1
3
2.0
1.0
0.0
-40
-20
0
20
40
60
Temperature in °C
80
100
120
140
Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.
Pressure Error Band
MPVZ5150 Series
Error Limits for Pressure
4.0
3.0
Error (kPa)
2.0
1.0
0.0
0
25
50
75
100
125
150
Pressure in kPa
-1.0
-2.0
-3.0
Pressure
Error (max)
-4.0
0 to 150 kPa
± 3.75 kPa
MPVZ5150
Sensors
Freescale Semiconductor
5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The MPX pressure
Part Number
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Case Type
Pressure (P1) Side Identifier
MPVZ5150GC6T1
482A
Side with Port Attached
MPVZ5150GC7U
482C
Side with Port Attached
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder.
Figure 5. Small Outline Package Footprint
MPVZ5150
6
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
–A–
D 8 PL
0.25 (0.010)
4
5
M
T B
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
S
N –B–
G
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
W
V
C
H
J
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.038
0.042
0.100 BSC
0.002
0.010
0.009
0.011
0.061
0.071
0
7
0.444
0.448
0.709
0.725
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0
7
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
–T–
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–A–
4
5
N –B–
G
8
0.25 (0.010)
1
M
T B
D 8 PL
S A
S
DIM
A
B
C
D
G
J
K
M
N
S
V
W
DETAIL X
S
W
V
PIN 1
IDENTIFIER
C
–T–
K
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.026
0.034
0.100 BSC
0.009
0.011
0.100
0.120
0
15
0.444
0.448
0.540
0.560
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.66
0.864
2.54 BSC
0.23
0.28
2.54
3.05
0
15
11.28
11.38
13.72
14.22
6.22
6.48
2.92
3.17
SEATING
PLANE
M
J
DETAIL X
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPVZ5150
Sensors
Freescale Semiconductor
7
How to Reach Us:
Home Page:
www.freescale.com
Web Support:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor, Inc.
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
1-800-521-6274 or +1-480-768-2130
www.freescale.com/support
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
www.freescale.com/support
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
[email protected]
Asia/Pacific:
Freescale Semiconductor China Ltd.
Exchange Building 23F
No. 118 Jianguo Road
Chaoyang District
Beijing 100022
China
+86 10 5879 8000
[email protected]
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
1-800-441-2447 or +1-303-675-2140
Fax: +1-303-675-2150
[email protected]
MPVZ5150
Rev. 1
05/2010
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.,
Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their
respective owners.
© Freescale Semiconductor, Inc. 2010. All rights reserved.
Similar pages