Pressure Freescale Semiconductor MPVZ5150 Rev 1, 05/2010 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPVZ5150 Series 0 to 150 kPa (0 to 21.75 psi) 0.2 to 4.7 V Output The MPVZ5150 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Typical Applications • • • • Features • • • • • Level Indicators Process Control Pump/Motor Control Pressure Switching 2.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Available in Gauge Surface Mount (SMT) or Through Hole (DIP) Configurations Increased media compatibility ORDERING INFORMATION # of Ports Package Case Device Name Options No. None Single Small Outline Package (Media Resistant Gel) (MPVZ5150 Series) MPVZ5150GC6T1 MPVZ5150GC7U Tape & Reel Rail 482A 482C Dual • • Gauge Pressure Type Differential Absolute • • SMALL OUTLINE PACKAGES MPVZ5150GC6T1 CASE 482A © Freescale Semiconductor, Inc., 2006, 2010. All rights reserved. MPVZ5150GC7U CASE 482C Device Marking MPVZ5150G MPVZ5150G Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 150 kPa Supply Voltage(2) VS 4.75 5.0 5.25 VDC Supply Current IO — 7.0 10 mAdc 0.088 0.200 0.313 4.588 4.700 4.813 — 4.500 — (0 to 85°C) VOFF Full Scale Output(4) @ VS = 5.0 V Differential and Absolute (0 to 85°C) VFSO Full Scale Span(5) @ VS = 5.0 V Differential and Absolute (0 to 85°C) VFSS Minimum Pressure Offset(3) @ VS = 5.0 V VDC VDC VDC Accuracy(6) — Sensitivity V/P — 30 — mV/kPa tR — 1.0 — ms Output Source Current at Full Scale Output IO+ — 0.1 — mAdc Warm-Up Time(8) — — 20 — ms Offset Stability(9) — — ±0.5 — %VFSS Response 1. 2. 3. 4. 5. 6. 7. 8. 9. Time(7) 1 kPa (kiloPascal) equals 0.145 PSI. Device is ratiometric within this specified excitation range. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPVZ5150 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 400 kPa Storage Temperature TSTG -40° to +125°C °C TA -40° to +125°C °C Operating Temperature 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation and Gain Stage # 1 Sensing Element 3 Gain Stage # 2 and Ground Reference Shift Circuitry 4 VOUT Pins 1 and 5 through 8 are NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic MPVZ5150 Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPVZ5150 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Stainless Steel Cap Die Gel Die Coat Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. +5 V P1 Thermoplastic Case Wire Bond Vout OUTPUT Vs Lead Frame IPS 1.0 μF P2 GND 0.01 μF 470 pF Die Bond Differential Sensing Element Figure 2. Cross-Sectional Diagram (not to scale) Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) 150 75 60 45 30 15 0 135 TYP 1 0 Span Range (Typ) MIN MAX 120 2 105 3 90 Output Voltabe (V) 4 Vout = VS*(0.006*P(kPa)+0.04) ± (PE * TM * 0.006 * Vs) VS = 5.0 V ± 0.25 Vdc PE = 3.75 kPa TM = 1 @ 0 to 85°C TM = 3 @ +125°C TM = 3 @ -40°C Vs = 5.0 V +/- 0.25 Vdc Output Range (Typ) 5 Pressure (kPa) (Typ) Offset Figure 4. Output vs. Pressure Differential MPVZ5150 4 Sensors Freescale Semiconductor Pressure Transfer Function (MPVZ5150 Series) Nominal Transfer Value: VOUT = VS x (0.006 x P (kPa) + 0.04) ± (Pressure Error x Temp. Mult. x 0.006 x VS) VS = 5.0 V ± 0.25 Vdc Temperature Error Multiplier MPVZ5150 Series Break Points Temp 4.0 Multiplier - 40 0 to 85°C +125° 3.0 3 1 3 2.0 1.0 0.0 -40 -20 0 20 40 60 Temperature in °C 80 100 120 140 Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Pressure Error Band MPVZ5150 Series Error Limits for Pressure 4.0 3.0 Error (kPa) 2.0 1.0 0.0 0 25 50 75 100 125 150 Pressure in kPa -1.0 -2.0 -3.0 Pressure Error (max) -4.0 0 to 150 kPa ± 3.75 kPa MPVZ5150 Sensors Freescale Semiconductor 5 Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX pressure Part Number sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type Pressure (P1) Side Identifier MPVZ5150GC6T1 482A Side with Port Attached MPVZ5150GC7U 482C Side with Port Attached MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder. Figure 5. Small Outline Package Footprint MPVZ5150 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS –A– D 8 PL 0.25 (0.010) 4 5 M T B A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S N –B– G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 –T– SEATING PLANE PIN 1 IDENTIFIER M K CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. –A– 4 5 N –B– G 8 0.25 (0.010) 1 M T B D 8 PL S A S DIM A B C D G J K M N S V W DETAIL X S W V PIN 1 IDENTIFIER C –T– K INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0 15 0.444 0.448 0.540 0.560 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0 15 11.28 11.38 13.72 14.22 6.22 6.48 2.92 3.17 SEATING PLANE M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPVZ5150 Sensors Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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