Data Sheet

Pressure
Freescale Semiconductor
MPX10
Rev 14, 10/2008
+
10 kPa Uncompensated
Silicon Pressure Sensors
The MPX10 series silicon piezoresistive pressure sensors provide a very
accurate and linear voltage output, directly proportional to the applied
pressure. These standard, low cost, uncompensated sensors permit
manufacturers to design and add their own external temperature
compensation and signal conditioning networks. Compensation techniques
are simplified because of the predictability of Freescale's single element
strain gauge design.
Features
•
•
•
•
•
Low Cost
Patented Silicon Shear Stress Strain Gauge Design
Ratiometric to Supply Voltage
Differential and Gauge Options
Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount
Package
MPX10
Series
0 to 10 kPa (0 to 1.45 psi)
35 mV Full Scale Span
(Typical)
Application Examples
•
•
•
•
•
•
•
•
Air Movement Control
Environmental Control Systems
Level Indicators
Leak Detection
Medical Instrumentation
Industrial Controls
Pneumatic Control Systems
Robotics
ORDERING INFORMATION
Package
Case
Device Name
Options
No.
None
Unibody Package (MPX10 Series)
MPX10D
Tray
344
•
MPX10DP
Tray
344C
MPX10GP
Tray
344B
Small Outline Package (MPXV10G Series)
MPXV10GC6U
Rail
482A
MPXV10GC7U
Rail
482C
# of Ports
Single
Dual
Gauge
MPXV10GC7U
CASE 482C-03
Absolute
Device
Marking
•
•
MPX10D
MPX10DP
MPX10GP
•
•
•
•
MPXV10G
MPXV10G
•
•
•
UNIBODY PACKAGE
SMALL OUTLINE PACKAGE
MPXV10GC6U
CASE 482A-01
Pressure Type
Differential
MPX10D
CASE 344-15
© Freescale Semiconductor, Inc., 2007-2008. All rights reserved.
MPX10GP
CASE 344B-01
MPX10DP
CASE 344C-01
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
POP
0
—
10
kPa
VS
—
3.0
6.0
VDC
IO
—
6.0
—
mAdc
Full Scale Span(3)
VFSS
20
35
50
mV
Offset(4)
VOFF
0
20
35
mV
Sensitivity
ΔV/ΔΡ
—
3.5
—
mV/kPa
Linearity
—
–1.0
—
1.0
%VFSS
Pressure Hysteresis (0 to 10 kPa)
—
—
±0.1
—
%VFSS
Temperature Hysteresis
—
—
±0.5
—
%VFSS
Temperature Coefficient of Full Scale Span
TCVFSS
–0.22
—
–0.16
%VFSS/°C
Temperature Coefficient of Offset
TCVOFF
—
±15
—
µV/°C
TCR
0.21
—
0.27
%ZIN/°C
ZIN
400
—
550
Ω
ZOUT
750
—
1250
Ω
Response Time(5) (10% to 90%)
tR
—
1.0
—
ms
Warm-Up Time(6)
—
—
20
—
ms
—
—
±0.5
—
%VFSS
Differential Pressure Range
Supply
(1)
Voltage(2)
Supply Current
Temperature Coefficient of Resistance
Input Impedance
Output Impedance
Offset
Stability(7)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX10
2
Sensors
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Maximum Pressure (P1 > P2)
Burst Pressure (P1 > P2)
Storage Temperature
Operating Temperature
Symbol
Value
Unit
PMAX
75
kPa
PBURST
100
kPa
TSTG
–40 to +125
°C
TA
–40 to +125
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip.
3
+VS
2
Sensing
Element
4
+VOUT
–VOUT
1
GND
Figure 1. Uncompensated Pressure Sensor Schematic
Voltage Output versus Applied Differential Pressure
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum side (P2) relative to the pressure side (P1).
MPX10
Sensors
Freescale Semiconductor
3
Pressure
Temperature Compensation
Figure 2 shows the typical output characteristics of the
MPX10 series over temperature.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
or by designing your system using the MPX2010D series
sensor.
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX10 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your
application.Refer to application note AN3728, for more
information regarding media compatibility.
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: 1) end point straight line fit or 2) a
least squares best line fit. While a least squares fit gives the
80
70
Output (mVdc)
60
MPX10
VS = 3 VDC
P1 > P2
+25°C
-40°C
50
Span
Range
(Typ)
40
30
+125°C
20
Offset
(Typ)
10
0
PSI 0
kPa
0.3
2.0
0.6
0.9
4.0
6.0
1.2
8.0
1.5
10
Pressure Differential
Figure 2. Output vs. Pressure Differential
70
Linearity
60
Output (mVdc)
50
Actual
Span
(VFSS)
40
30
Silicone
Die Coat
Stainless Steel
Metal Cover
Die
P1
Wire Bond
Epoxy
Case
Theoretical
20
Offset
(VOFF)
10
0
0
Pressure (kPa)
Max
Figure 3. Linearity Specification Comparison
Lead Frame
P2
RTV Die
Bond
POP
Figure 4. Unibody Package — Cross-Sectional Diagram
(Not to Scale)
MPX10
4
Sensors
Freescale Semiconductor
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The pressure sensor is
designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Part Number
MPX10D
Case Type
344
Pressure (P1) Side Identifier
Stainless Steel Cap
MPX10DP
344C
Side with Part Marking
MPX10GP
344B
Side with Port Attached
MPXV10GC6U
482A
Side with Port Attached
MPXV10GC7U
482C
Side with Port Attached
MPX10
Sensors
Freescale Semiconductor
5
Pressure
PACKAGE DIMENSIONS
C
R
M
1
B
2
-A-
Z
4
3
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
D 4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
Y
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
- SUPPLY
+ SUPPLY
GROUND
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
GND
-VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX10
6
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
N
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
-T-
0.25 (0.010)
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX10
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPX10
8
Sensors
Freescale Semiconductor
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MPX10
Rev. 14
10/2008
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