Data Sheet

Pressure
Freescale Semiconductor
Data Sheet: Technical Data
MPX2053
Rev 9, 10/2012
50 kPa On-Chip Temperature
Compensated and Calibrated
Silicon Pressure Sensors
MPX2053
Series
0 to 50 kPa (0 to 7.25 psi)
40 mV Full Scale
(Typical)
The MPX2053 series devices are silicon piezoresistive pressure sensors
that provide a highly accurate and linear voltage output directly proportional to the
applied pressure. A single, monolithic silicon diaphragm with the strain gauge and
an integrated thin-film resistor network. Precise span and offset calibration with
temperature compensation are achieved by laser trimming.
Application Examples
Features
•
•
•
•
•
•
•
•
•
•
•
•
Temperature Compensated Over 0C to +85C
Easy-to-Use Chip Carrier Package Options
Ratiometric to Supply Voltage
Gauge Ported and Non Ported Options
Available in Easy-to-Use Tape & Reel
Differential and Gauge Pressure Options
Pump/Motor Control
Robotics
Level Detectors
Medical Diagnostics
Pressure Switching
Blood Pressure Measurement
ORDERING INFORMATION
Device Name
Case No.
None
# of Ports
Single
Small Outline Package (MPXV2053G Series)
MPXV2053GP
1369
MPXV2053DP
1351
Unibody Package (MPX2053 Series)
MPX2053D
344
•
MPX2053DP
344C
MPX2053GP
344B
MPAK Package (MPXM2053 Series)
MPXM2053D
1320
•
MPXM2053DT1
1320
•
MPXM2053GS
1320A
MPXM2053GST1
1320A
Dual
•
Gauge
Pressure Type
Differential
•
Absolute
Device Marking
MPXV2053GP
MPXV2053DP
•
•
•
•
•
MPX2053D
MPX2053DP
MPX2053GP
•
•
MPXM2053D
MPXM2053D
MPXM2053GS
MPXM2053GS
•
•
•
© 2005-2009, 2012 Freescale Semiconductor Inc. All rights reserved.
•
•
•
Pressure
UNIBODY PACKAGES
MPX2053D
CASE 344-15
MPX2053GP
CASE 344B-01
MPX2053DP
CASE 344C-01
SMALL OUTLINE PACKAGES
MPXV2053GP
CASE 1369-01
MPXV2053DP
CASE 1351-01
MPAK PACKAGES
MPXM2053D/DT1
CASE 1320-02
MPXM2053GS/GST1
CASE 1320A-02
MPX2053
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Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
POP
0
—
50
kPa
VS
—
10
16
VDC
IO
—
6.0
—
mAdc
VFS
38.5
40
41.5
mV
Offset(4)
—
–1.0
—
1.0
mV
Sensitivity
—
V/P
—
0.8
—
Non-Linearity
—
–0.6
—
0.4
%VFS
Pressure Hysteresis (0 to 50 kPa)
—
—
0.1
—
%VFS
Temperature Hysteresis (-40° to 125°C)
—
—
0.5
—
%VFS
Temperature Coefficient of Full Scale
TCVFS
–2.0
—
2.0
%VFS
Temperature Coefficient of Offset
TCVOFF
–1.0
—
1.0
mV
ZIN
1000
—
2500

ZOUT
1400
—
3000

Response Time(5) (10% to 90%)
tR
—
1.0
—
ms
Warm-Up Time
—
—
20
—
ms
Offset Stability(6)
—
—
0.5
—
%VFS
Pressure Range(1)
(2)
Supply Voltage
Supply Current
Full Scale Span
(3)
Input Impedance
Output Impedance
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
6. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Max Value
Unit
Supply Voltage
16
V
Pressure (P1 > P2)
200
kPa
Storage Temperature
–40 to +125
C
Operating Temperature Range
–40 to +125
C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX2053
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Freescale Semiconductor, Inc.
Pressure
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
3
Thin Film
Temperature
Compensation
and
Calibration
X-ducer
Sensing
Element
2
4
Vout+
Vout-
1
GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
Voltage Output versus Applied Differential Pressure
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side relative to the vacuum side. Similarly, output voltage
increases as increasing vacuum is applied to the vacuum
side relative to the pressure side.
On-Chip Temperature Compensation and Calibration
Figure 2 shows the minimum, maximum and typical output
characteristics of the MPX2053 series at 25C. The output is
directly proportional to the differential pressure and is
essentially a straight line.
40
VS = 10 Vdc
TA = 25C
35
Output (mVdc)
A silicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
TYP
30
25
20
SPAN
RANGE
(TYP)
MAX
15
10
MIN
5
kPa
PSI
0
-5
0
12.5
1.8
25
3.6
37.5
5.4
50
7.25
OFFSET
(TYP)
Figure 2. Output vs. Pressure Differential
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Pressure
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 3) or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. The
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
Least
Square
Deviation
Least Squares Fit
Exaggerated
Performance
Relative Voltage Output
Straight Line
End Point
Straight Line Fit
OFFSET
0
50
100
Pressure (% Full scale)
Figure 3. Linearity Specification Comparison
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX2053 series pressure sensor operating
characteristics and internal reliability and qualification tests
Silicone
Die Coat
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Refer to application note AN3728, for more information
regarding media compatibility.
Stainless Steel
Metal Cover
Die
P1
Wire Bond
Lead Frame
P2
Epoxy
Case
RTV Die
Bond
Figure 4. Unibody Package — Cross-Sectional Diagram (Not to Scale)
MPX2053
5
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PACKAGE DIMENSIONS
C
R
M
1
B
2
-A-
3
Z
4
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
D 4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
Y
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
- SUPPLY
+ SUPPLY
GROUND
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
GND
-VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2053
6
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Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
N
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
-T-
0.25 (0.010)
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
MPX2053
Sensors
Freescale Semiconductor, Inc.
7
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2053
Sensors
Freescale Semiconductor, Inc.
8
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2053
9
Sensors
Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE D
SMALL OUTLINE PACKAGE
MPX2053
Sensors
Freescale Semiconductor, Inc.
10
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE D
SMALL OUTLINE PACKAGE
MPX2053
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Freescale Semiconductor, Inc.
11
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1320-02
ISSUE B
MPX2053
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12
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1320-02
ISSUE B
MPX2053
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13
Pressure
PACKAGE DIMENSIONS
PIN 4
PIN 1
PAGE 1 OF 2
CASE 1320A-02
ISSUE A
MPX2053
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14
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1320A-02
ISSUE A
MPX2053
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Pressure
Table 3. Revision History
Revision
number
Revision
date
9
10/2012
Description of changes
• Deleted references to device number MPXV2053GVP throughout the document
MPX2053
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16
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MPX2053
Rev. 9
10/2012
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