Data Sheet

Pressure
Freescale Semiconductor
Document Number: MPX2102
Rev 9, 01/2012
100 kPa On-Chip Temperature
Compensated Silicon
Pressure Sensors
MPX2102
Series
0 to 100 kPa (0 to 14.5 psi)
40 mV Full Scale
(Typical)
The MPX2102 series devices are silicon piezoresistive pressure sensors
providing a highly accurate and linear voltage output directly proportional to the
applied pressure. The sensor is a single, monolithic silicon diaphragm with the
strain gauge and a thin-film resistor network integrated on chip. The chip is laser
trimmed for precise span and offset calibration and temperature compensation.
Application Examples
•
•
•
•
•
•
•
Features
•
•
•
•
Temperature Compensated Over 0°C to +85°C
Easy-to-Use Chip Carrier Package Options
Available in Absolute, Differential and Gauge Configurations
Absolute, Differential and Gauge Options
Pump/Motor Control
Robotics
Level Detectors
Medical Diagnostics
Pressure Switching
Barometers
Altimeters
ORDERING INFORMATION
Package
Device Name
Options
Unibody Package (MPX2102 Series)
MPX2102A
Tray
MPX2102AP
Tray
Case
No.
None
344
•
Tray
344F
MPX2102DP
Tray
344C
MPX2102GP
Tray
344B
MPXM2102AS
Rail
1320A
Tape and Reel
1320A
Rail
1320
MPXM2102DT1
Tape and Reel
1320
MPXM2102GS
Rail
1320A
Tape and Reel
1320A
MPXM2102AST1
MPXM2102D
MPXM2102GST1
Gauge
Pressure Type
Differential Absolute
•
•
•
•
MPX2102GVP
Tray
344D
Small Outline Package (MPXV2102G Series)
MPXV2102GP
Tray
1369
MPAK Package (MPXM2102 Series)
MPXM2102A
Rail
1320
MPXM2102AT1
Tape and Reel
1320
Dual
•
•
344B
MPX2102ASX
# of Ports
Single
•
Device Marking
MPX2102A
MPX2102AP
MPX2102A
MPX2102DP
•
•
•
•
MPX2102GVP
•
•
MPXV2102GP
MPX2102GP
•
•
•
•
•
•
•
•
•
•
•
•
•
•
© 2005-2008, 2010, 2012 Freescale Semiconductor, Inc. All rights reserved.
•
•
MPXM2102A
MPXM2102A
MPXM2102AS
MPXM2102AS
MPXM2102D
MPXM2102D
MPXM2102GS
MPXM2102GS
Pressure
UNIBODY PACKAGES
MPX2102A
CASE 344
MPX2102AP/GP
CASE 344B
SMALL OUTLINE PACKAGE
MPXV2102GP
CASE 1369
MPX2102DP
CASE 344C
MPX2102GVP
CASE 344D
MPX2102ASX
CASE 344F
MPAK
MPXM2102A/ATI
MPXM2102D/DT1
CASE 1320
MPXM2102AS/AST1
MPXM2102GS/AS
CASE 1320A
MPX2102
2
Sensors
Freescale Semiconductor, Inc.
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
POP
POP
20
0
—
—
100
100
kPa
kPa
Supply Voltage(2)
VS
—
10
16
VDC
Supply Current
IO
—
6.0
—
mAdc
VFSS
38.5
40
41.5
mV
VOFF
-1.0
-2.0
-1.0
-2.0
—
—
—
—
1.0
2.0
1.0
2.0
mV
ΔV/ΔΡ
—
0.4
—
mV/kPa
—
—
—
—
-0.6
-1.0
-0.6
-1.0
—
—
—
—
0.4
1.0
0.4
1.0
%VFSS
Pressure Hysteresis(5) (0 to 100 kPa)
—
—
±0.1
—
%VFSS
Temperature Hysteresis(5)(-40°C to +125°C)
—
—
±0.5
—
%VFSS
Temperature Coefficient of Full Scale Span(5)
TCVFSS
-2.0
—
2.0
%VFSS
Temperature Coefficient of Offset(5)
TCVOFF
-1.0
—
1.0
mV
ZIN
1000
—
2500
W
ZOUT
1400
—
3000
W
Response Time(6) (10% to 90%)
tR
—
1.0
—
ms
Warm-Up Time
—
—
20
—
ms
Offset Stability(7)
—
—
±0.5
—
%VFSS
Pressure Range(1)
Absolute Pressure Range MPX2102A
Differential Pressure Range MPX2102D
Full Scale Span(3)
Offset(4)
MPX2102D Series
MPX2102A Series
MPXM2102D/G Series
MPXM2102A Series
Sensitivity
VOFF
mV
Linearity(5)
MPX2102D Series
MPX2102A Series
MPXM2102D/G Series
MPXM2102A Series
Input Impedance
Output Impedance
%VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
6. Response Time is defined as the time from the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2102
Sensors
Freescale Semiconductor, Inc.
3
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
400
kPa
Storage Temperature
TSTG
-40 to +125
°C
TA
-40 to +125
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Voltage Output vs. Applied Differential
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The absolute sensor has a built-in reference vacuum. The
output voltage will decrease as vacuum, relative to ambient,
is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
(P1) side relative to the vacuum (P2) side. Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a block diagram of the internal circuitry
on the stand-alone pressure sensor chip.
VS
3
Thin Film
Temperature
Compensation
and
Calibration
Circuitry
X-ducer
Sensing
Element
2 +V
OUT
4 -V
OUT
1
GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
MPX2102
4
Sensors
Freescale Semiconductor, Inc.
Pressure
On-Chip Temperature Compensation and Calibration
Figure 2 shows the output characteristics of the MPX2102
series at 25°C. The output is directly proportional to the
differential pressure and is essentially a straight line.
VS = 10 VDC
TA = 25°C
MPX2102
P1 > P2
40
35
30
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating
Characteristics.
TYP
Output (mVDC)
25
20
Span
Range
(TYP)
MAX
15
MIN
10
5
0
kPa
PSI
-5
0
25
3.62
50
7.25
100
75
10.88
14.5
Offset
(TYP)
Figure 2. Output vs. Pressure Differential
Silicone Gel
Die Coat
Differential/Gauge
Die
P1
Epoxy
Case
Wire Bond
Lead Frame
Silicone Gel
Die Coat
Stainless Steel
Metal Cover
Differential/GaugeElement
P2
Bond
Die
Absolute
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Wire Bond
Lead Frame
Die
Bond
Absolute Element
P2
Figure 3. Cross Sectional Diagrams (Not to Scale)
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: VOUT = VOFF + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 4) or (2)
a least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Least Squares Fit
Least
Square
Deviation
Exaggerated
Performance
Curve
Relative Voltage Output
Figure 3 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2102 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Straight Line
Deviation
End Point Straight
Line Fit
Offset
0
50
Pressure (% Full scale)
100
Figure 4. Linearity Specification Comparison
MPX2102
Sensors
Freescale Semiconductor, Inc.
5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die. The differential or gauge sensor is
designed to operate with positive differential pressure
applied, P1 > P2. The absolute sensor is designed for
vacuum applied to P1 side.
The Pressure (P1) side may be identified by using Table 3.
Table 3. Pressure (P1) Side Delineation
Part Number
MPX2102A
Case
Type
344
Pressure (P1) Side
Identifier
Stainless Steel Cap
MPX2102DP
344C
Side with Part Marking
MPX2102AP,
MPX2102GP
344B
Side with Port Attached
MPX2102GVP
344D
Stainless Steel Cap
MPX2102ASX
344F
Side with Port Marking
MPXV2102GP
1369
Side with Port Attached
MPXM2102A,
MPX2102ATI,
MPXM2102D,
MPXM2102DT1
1320
Stainless Steel Cap
MPXM2102AS,
MPXM2102GS,
MPXM2102ASTI,
MPXM2102GSTI
1320A
Side with Port Attached
MPX2102
6
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
C
R
M
1
B
2
-A-
3
Z
4
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
D 4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
Y
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
- SUPPLY
+ SUPPLY
GROUND
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
GND
-VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2102
7
Sensors
Freescale Semiconductor, Inc.
Pressure
16
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
N
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
0.25 (0.010)
-T-
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
T S
M
S
Q
S
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
-AU
SEATING
PLANE
-T-
L
H
PORT #2
VACUUM
(P2)
R
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
POSITIVE
PRESSURE
(P1)
N
-Q-
B
1 2 3 4
K
PIN 1
S
C
J
F
-P0.25 (0.010)
M
T Q
S
G
D
4 PL
0.13 (0.005)
M
T S
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
1.145
1.175 29.08
29.85
0.685
0.715 17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725 17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440 10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.158
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344D-01
ISSUE B
UNIBODY PACKAGE
MPX2102
Sensors
Freescale Semiconductor, Inc.
8
Pressure
PACKAGE DIMENSIONS
-TC
A
E
-Q-
U
N
V
B
R
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
-P0.25 (0.010)
M
T Q
M
4
3
2
1
S
K
J
F
D 4 PL
0.13 (0.005)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
1.080
1.120 27.43
28.45
0.740
0.760 18.80
19.30
0.630
0.650 16.00
16.51
0.016
0.020
0.41
0.51
0.160
0.180
4.06
4.57
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.41
0.220
0.240
5.59
6.10
0.070
0.080
1.78
2.03
0.150
0.160
3.81
4.06
0.150
0.160
3.81
4.06
0.440
0.460 11.18
11.68
0.695
0.725 17.65
18.42
0.840
0.860 21.34
21.84
0.182
0.194
4.62
4.92
G
M
T P
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
V (+) OUT
V SUPPLY
V (-) OUT
CASE 344F-01
ISSUE B
UNIBODY PACKAGE
MPX2102
9
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2102
Sensors
Freescale Semiconductor, Inc.
10
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2102
11
Sensors
Freescale Semiconductor, Inc.
Pressure
CASE 1320-02
ISSUE B
MPAK
MPX2102
12
Sensors
Freescale Semiconductor, Inc.
Pressure
CASE 1320-02
ISSUE B
MPAK
MPX2102
Sensors
Freescale Semiconductor, Inc.
13
Pressure
PIN 4
PIN 1
CASE 1320A-02
ISSUE A
MPAK
MPX2102
14
Sensors
Freescale Semiconductor, Inc.
Pressure
CASE 1320A-02
ISSUE A
MPAK
MPX2102
Sensors
Freescale Semiconductor, Inc.
15
Pressure
REVISION HISTORY
Revision
number
Revision
date
9
01/2012
Description of changes
• In Table 1. Operating Characteristics, in the Characteristic column under Pressure Range, added
rows for Absolute Pressure Range MPX2102A and Differential Pressure Range MPX2102D
devices
MPX2102
Sensors
Freescale Semiconductor, Inc.
16
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MPX2102
Rev. 9
01/2012
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