LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA08B/5G-PF DATA SHEET DOC. NO : QW0905-LA08B/5G-PF REV. : A DATE : 16 - Jul. - 2015 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/6 PART NO. LA08B/5G-PF Package Dimensions G G G G G 5.3 5.0 1.8 4.4 7.2 6.8X4=27.2 35.75±0.5 2.0 5.9 7.9 12.5MIN □0.5 TYP 2.3TYP -+ 1.0MIN LG5520-PF 3.8 5.3 1.8 6.0 8.0 2.0 1.5MAX 12.5MIN □0.5 TYP 1.0MIN 2.3TYP Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 PART NO. LA08B/5G-PF Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol UNIT G Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 120 mA Power Dissipation PD 100 mW Reverse Current @5V Ir 10 μA Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted LA08B/5G-PF GaP Green Forward Peak Spectral voltage wave halfwidth length △λnm @20mA(V) λPnm Viewing angle @10mA(mcd) 2θ 1/2 (deg) Min. Max. Min. Typ. Lens Green Diffused Luminous intensity 565 30 1.7 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 2.6 1.8 4.5 142 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA08B/5G-PF Page 3/6 Brightness Code For Standard LED Lamps G CHIP Group Luminous Intensity(mcd) at 10 mA Min. Max. A6 1.8 3.0 A7 3.0 4.5 A8 4.5 8.0 A9 8.0 12 A10 12 20 Color Code G CHIP Group Wave length(nm) at 20 mA Min. Max. 6 566 568 7 568 570 8 570 572 9 572 574 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/6 PART NO. LA08B/5G-PF Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 5.0 1.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA08B/5G-PF Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 120seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp(°C) 260°C3sec Max 260° 5°/sec max 120° 25° 0° 0 2°/sec max Preheat 120 Seconds Max 100 200 250 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/6 PART NO. LA08B/5G-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃± 5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃± 5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃± 5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃ &-40 ℃± 5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11