CP2,15,06,L1,W4.5

CP Series CP2,15,06,L1,W4.5
Thermoelectric Modules
The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered
‘the standard’ in the thermoelectric industry.
This broad product line of high-performance and highly reliable TEMs is available
in numerous heat pumping capacities, geometric shapes, and input power ranges.
Assembled with Bismuth Telluride semiconductor material and thermally conductive
Aluminum Oxide ceramics, the CP Series is designed for higher current and large
heat-pumping applications.
APPLICATIONS
FEATURES
• Precise Temperature Control
• Compact Geometric Sizes
• Reliable Solid State Operation
• No Sound or Vibration
• Environmentally Friendly
• DC Operation
• RoHS Compliant
• Medical Lasers
• Lab Science Instrumentation
• Clinical Diagnostic Systems
• Photonics Laser Systems
• Electronic Enclosure Cooling
• Food & Beverage Cooling
• Chillers (Liquid Cooling)
PERFORMANCE SPECIFICATIONS
Hot Side Temperature (°C)
25
50
Qmax (Watts)
14.4
15.8
Delta Tmax (°C)
67
75
Imax (Amps)
14.0
14.0
Vmax (Volts)
1.7
1.9
Module Resistance (Ohms)
0.11
0.13
SUFFIX THICKNESS
(PRIOR TO TINNING)
FLATNESS &
PARALLELISM
HOT
FACE
COLD
FACE
LEAD
LENGTH
L1
0.180” ± 0.001”
0.001” / 0.001”
Lapped
Lapped
4.5”
L2
0.180” ± 0.0005”
0.0005” / 0.0005”
Lapped
Lapped
4.5”
ML
0.186 ± 0.010”
0.002” / 0.002”
Metallized
Lapped
4.5”
LM
0.186 ± 0.010”
0.002” / 0.002”
Lapped
Metallized
4.5”
SEALING OPTION
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
[email protected]
www.lairdtech.com
SUFFIX
SEALANT COLOR
TEMP RANGE
DESCRIPTION
RT
RTV
White
-60 to 204 °C
Non-corrosive, silicone adhesive sealant
EP
Epoxy
Black
-55 to 150 °C
Low density syntactic foam epoxy encapsulant
CP Series CP2,15,06,L1,W4.5
Thermoelectric Modules
Performance Curves at Th = 25°C
Qc (W)
Voltage (V)
ELECTRIC
THERMO
Delta T (°C)
OPERATING TIPS
• Max Operating Temperature: 80°C
• Do not exceed Imax or Vmax when
operating module
• Reference assembly guidelines for
recommended installation
• Solder tinning also available on
metallized ceramics
THR-DS-CP2,15,06,L1,W4.5 0913
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility
for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies
makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be
liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from
time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo,
and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third
parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.