eTEC Series HV37,48,F2,0202,GG Thin Film Thermoelectric Module The eTEC Series is a thin film thermoelectric module (TEM) with high heat flux density. Due to its size, input power requirements and heat pumping capacity this device is suited for use in applications to stabilize the temperature of sensitive optical components in telecom and photonics industries. The eTEC HV37 can produce 3.7 Watts of cooling capacity at 25°C ambient in a 9 mm2 footprint. Assembled with thin film semiconductor material and thermally conductive Aluminum Nitride ceramics, the eTEC Series is designed for lower current applications with tight geometric space constraints. Custom designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies. FEATURES APPLICATIONS • • • • • • • • • • • • Micro Footprint High Heat Pumping Density Precise Temperature Control Reliable Solid State Operation <2 ms Response Time RoHS Compliant Laser Diodes Photodiodes Infrared (IR) Sensors Pump Lasers Crystal Oscillators Optical Transceivers PERFORMANCE SPECIFICATIONS Hot Side Temperature (°C) 25°C 50°C Qmax (Watts) 3.7 3.7 Delta Tmax (°C) 45 45 Imax (Amps) 1.1 1.0 6.0 6.4 Qmax / area (W/cm ) 66 66 Electrical Resistance (Ohms) 4.8 5.5 Thermal Resistance (K/W) 16.5 15.5 Vmax (Volts) 2 PACKAGE ASSEMBLY CONDITIONS Max Time Exposure > 290°C 60 sec Peak Assembly Temperature 325°C TEMPERATURE CONDITIONS Max Operating Temperature 150°C OPERATING CONDITIONS Max rate of change of current Americas: +1 888.246.9050 Europe: +46.31.420530 Asia: +86.755.2714.1166 [email protected] www.lairdtech.com 1.75 Amps/sec eTEC Series HV37,48,F2,0202,GG Thin Film Thermoelectric Module PERFORMANCE CURVES COEFFICIENT OF PERFORMANCE 0.04 1.26 0.04 0.75 1.10 0.75 0.03 3.39 2.07 2 2.05 0.06 0.06 0.25 ISOMETRIC DRAWING 0.62 0.27 1 1 0.06 0.75 0.25 0.01 Standard 3.77 Au metallization on exterior ceramic substrate surfaces Au wire bondable pads on hot side ceramic for lead attachment DIMENSIONS ARE IN INCHES TOLERANCES: FRACTIONAL ANGULAR: MACH BEND TWO PLACE DECIMAL THREE PLACE DECIMAL PROPRIETARY AND CONFIDENTIAL THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF <INSERT COMPANY NAME HERE>. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF <INSERT COMPANY NAME HERE> IS PROHIBITED. OPERATING TIPS MATERIAL NAME 0.01 2.36 DATE DRAWN CHECKED ENG APPR. MFG APPR. Q.A. COMMENTS: NEXT ASSY USED ON APPLICATION FINISH SIZE DWG. NO. A HV37_01_DraftSource DO NOT SCALE DRAWING SCALE:20:1 WEIGHT: 2.36 2.38 REV. SHEET 1 OF 1 UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN MM TOLERANCES: TWO PLACE DECIMAL 0.02 THREE PLACE DECIMAL 0.02 • Maintain good surface contact on heat dissipation mechanism prior to operation NAME DRAWN DATE Paul Crocco 10/4/2013 TITLE: CHECKED ENG APPR. A604 Paul Crocco 10/4/2013 MFG APPR. • Do not exceed Vmax or Imax values to maintain peak performance INTERPRET GEOMETRIC TOLERANCING PER: PROPRIETARY AND CONFIDENTIAL THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF LAIRD ENGINEERED THERMAL SYSTEMS. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF LAIRD ENGINEERED THERMAL SYSTEMS IS PROHIBITED. MATERIAL USED ON NEXT ASSY Laird Engineered Thermal Systems 5 4 Q.A. COMMENTS: SIZE DWG. NO. A FINISH SCALE: 30:1 WEIGHT DO NOT SCALE DRAWING 3 THR-DS-eTEC-HV37 1113 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. 2