UltraTECTM Series UT8,24,F1,5555 Thermoelectric Module Innovative Technology for a Connected World The UltraTECTM Series is a high heat pumping density thermoelectric module (TEM). The module is assembled with a large number of semiconductor couples to achieve a higher heat pumping capacity than standard single stage TEMs. This product line is available in multiple configurations and is ideal for applications that require higher cooling capacities with limited surface area. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the UltraTECTM Series is designed for higher current and larger heat-pumping applications. FEATURES APPLICATIONS • High heat pump density • Analytical instrumentation • Precise temperature control • Clinical diagnostics • Reliable solid state operation • Photonics laser systems • No sound or vibration • Electronic enclosure cooling • DC operation • Food and beverage cooling • RoHS compliant • Chillers (liquid cooling) PERFORMANCE SPECIFICATIONS Hot side temperature (°C) 25 Qmax (watts) 153 Delta Tmax (°C) 72 Imax (amps) 8.5 Vmax (volts) 29.8 SUFFIX TA THICKNESS FLATNESS & PARALLELISM HOT FACE COLD FACE LEAD LENGTH 0.150” +/- 0.001” 0.0008” / 0.0016” Lapped Lapped 6.0” 3.80 +/- 0.02 mm 0.02 mm / 0.04 mm Lapped Lapped 152.4 mm SEALING OPTION global solutions: local support Americas: +1 888.246.9050 Europe: +46.31.704.67.57 Asia: +86.755.2714.1166 [email protected] www.lairdtech.com TM SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION RT RTV White -60 to 204 °C Non-corrosive, silicone adhesive sealant EP Epoxy Black -55 to 150 °C Low density syntactic foam epoxy encapsulant UltraTECTM Series UT8,24,F1,5555 Thermoelectric Module Innovative Technology for a Connected World PERFORMANCE CURVES THERMO ELECTRIC MECHANICAL DRAWING Ceramic Material 96% Alumina Ceramics Solder Construction: 138°C BiSn OPERATING TIPS • Max operating temperature: 80°C • Do not exceed Imax or Vmax when operating module • Reference assembly guidelines for recommended installation THR-DS-UT8,24,F1,5555 1011 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2011 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.