IDT 813252CKI

ICS813252I-02
VCXO JITTER ATTENUATOR &
FEMTOCLOCK™ MULTIPLIER
GENERAL DESCRIPTION
FEATURES
The ICS813252I-02 is a member of the
ICS
HiperClockS™ family of high performance clock
HiPerClockS™
solutions from IDT. The ICS813252I-02 is a PLL
based synchronous multiplier that is optimized for
PDH or SONET to Ethernet clock jitter attenuation
and frequency translation. The device contains two internal
frequency multiplication stages that are cascaded in series.
The first stage is a VCXO PLL that is optimized to provide
reference clock jitter attenuation. The second stage is a
FemtoClock™ frequency multiplier that provides the low jitter,
high frequency Ethernet output clock that easily meets Gigabit
and 10 Gigabit Ethernet jitter requirements. Pre-divider and
output divider multiplication ratios are selected using device
selection control pins. The multiplication ratios are optimized
to support most common clock rates used in PDH, SONET
and Ethernet applications. The VCXO requires the use of an
external, inexpensive pullable crystal. The VCXO uses external
passive loop filter components which allows configuration of
the PLL loop bandwidth and damping characteristics. The
device is packaged in a space-saving 32-VFQFN package and
supports industrial temperature range.
• Two LVPECL outputs
Each output supports independent frequency selection at
25MHz, 125MHz, 156.25MHz and 312.5MHz
• Two differential inputs support the following input types:
LVPECL, LVDS, LVHSTL, SSTL, HCSL
• Accepts input frequencies from 8kHz to 155.52MHz including
8kHz, 1.544MHz, 2.048MHz, 19.44MHz, 25MHz, 77.76MHz,
125MHz and 155.52MHz
• Attenuates the phase jitter of the input clock by using a lowcost pullable fundamental mode VCXO crystal
• VCXO PLL bandwidth can be optimized for jitter attenuation
and reference tracking using external loop filter connection
• FemtoClock frequency multiplier provides low jitter, high
frequency output
• Absolute pull range: 50ppm
• FemtoClock VCO frequency: 625MHz
• RMS phase jitter @ 125MHz, using a 25MHz crystal
(10kHz – 20MHz): 1.3ps (maximum)
• 3.3V supply voltage
• -40°C to 85°C ambient operating temperature
PIN ASSIGNMENT
• Available in both standard (RoHS 5) and lead-free (RoHS 6)
packages
nCLK1
VCC
CLK1
CLK0
nCLK0
XTAL_OUT
VCCX
XTAL_IN
32 31 30 29 28 27 26 25
LF1
1
24
VEE
LF0
2
23
nQB
ISET
3
22
QB
VEE
4
21
VCCO
CLK_SEL
5
20
nQA
VCC
6
19
QA
RESERVED
7
18
VEE
VEE
8
17
ODASEL_0
ICS813252I-02
ODASEL_1
ODBSEL_0
ODBSEL_1
VCC
VCCA
PDSEL_0
PDSEL_1
PDSEL_2
9 10 11 12 13 14 15 16
32-Lead VFQFN
5mm x 5mm x 0.925 package body
K Package
Top View
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
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CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
XTAL_IN
LF1
LF0
ISET
Loop
Filter
XTAL_OUT
BLOCK DIAGRAM
25MHz
Output Divider
PDSEL_[2:0]
Pullup
CLK0
0
nCLK0
CLK1
1
nCLK1
CLK_SEL
Pulldown
VCXO Input
Pre-Divider
000 = 1
001 = 193
010 = 256
011 = 2430
100 = 3125
101 = 9720
110 = 15625
111 = 19440
(default)
00 = 25 (default)
01 = 5
10 = 4
11 = 2
Phase
Detector
2
VCXO
Charge
Pump
VCXO Feedback Divider
÷3125
VCXO Jitter Attenuation PLL
FemtoClock PLL
625MHz
Output Divider
00 = 25 (default)
01 = 5
10 = 4
11 = 2
2
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
2
QA
nQA
ODASEL_[1:0]
QB
nQB
ODBSEL_[1:0]
CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
TABLE 1. PIN DESCRIPTIONS
Number
Name
Type
Analog
Input/Output
Analog
Input/Output
Power
1, 2
LF1, LF0
3
ISET
4 , 8, 1 8 , 2 4
VEE
5
CLK_SEL
Input
6, 12, 27
VCC
Power
7
9,
10,
11
13
14,
15
16,
17
19, 20
RESERVED
PDSEL_2,
PDSEL_1,
PDSEL_0
VCCA
ODBSEL_1,
ODBSEL_0
ODASEL_1,
ODASEL_0
QA, nQA
Reserved
21
VCCO
Power
22, 23
QB, nQB
Output
Input
Power
Input
Input
Output
25
nCLK1
Input
26
CLK1
Input
28
nCLK0
Input
29
30,
31
CLK0
XTAL_OUT,
XTAL_IN
Input
32
VCCX
Power
Description
Loop filter connection node pins.
LF0 is the output. LF1 is the input.
Charge pump current setting pin.
Negative supply pins.
Input clock select. When HIGH selects CLK1/nCLK1.
Pulldown
When LOW, selects CLK0/nCLK0. LVCMOS/LVTTL interface levels.
Core power supply pins.
Reserved pin. Do not connect.
Pullup
Pre-divider select pins. LVCMOS/LVTTL interface levels.
See Table 3A.
Analog supply pin.
Frequency select pins for Bank B output. See Table 3B.
Pulldown
LVCMOS/LVTTL interface levels.
Frequency select pins for Bank A output. See Table 3B.
Pulldown
LVCMOS/LVTTL interface levels.
Differential Bank A clock outputs. LVPECL interface levels.
Output power supply pin.
Differential Bank B clock outputs. LVPECL interface levels.
Pullup/
Pulldown
Pulldown
Pullup/
Pulldown
Pulldown
Input
Inver ting differential clock input. VCC/2 bias voltage when left floating.
Non-inver ting differential clock input.
Inver ting differential clock input. VCC/2 bias voltage when left floating.
Non-inver ting differential clock input.
Crystal oscillator interface. XTAL_IN is the input.
XTAL_OUT is the output.
Power supply pin for VCXO charge pump.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
kΩ
RPULLDOWN
Input Pulldown Resistor
51
kΩ
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
Test Conditions
3
Minimum Typical
Maximum
Units
CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
TABLE 3A. PRE-DIVIDER FUNCTION TABLE
Inputs
PDSEL_2
PDSEL_1
PDSEL_0
0
0
0
0
0
1
TABLE 3B. OUTPUT DIVIDER FUNCTION TABLE
Inputs
Pre-Divider Value
Output Divider Value
ODxSEL_1
ODxSEL_0
1
0
0
25 (default)
193
0
1
5
0
1
0
256
1
0
4
0
1
1
2430
1
1
2
1
0
0
3125
1
0
1
9720
1
1
0
15625
1
1
1
19440 (default)
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
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ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
TABLE 3C. FREQUENCY FUNCTION TABLE
Input
Frequency
(MHz)
Pre-Divider
Value
VCXO
Frequency
(MHz)
FemtoClock
Feedback Divider
Value
Femtoclock
VCO Frequency
(MHz)
Output Divider
Value
Output Frequency
(MHz)
0.008
1
25
25
625
25
25
0.008
1
25
25
625
5
125
0.008
1
25
25
625
4
156.25
0.008
1
25
25
625
2
312.5
1.544
193
25
25
625
25
25
1.544
193
25
25
625
5
125
1.544
193
25
25
625
4
156.25
1.544
193
25
25
625
2
312.5
2.048
256
25
25
625
25
25
2.048
256
25
25
625
5
125
2.048
256
25
25
625
4
156.25
2.048
256
25
25
625
2
312.5
19.44
2430
25
25
625
25
25
19.44
2430
25
25
625
5
125
19.44
2430
25
25
625
4
156.25
19.44
2430
25
25
625
2
312.5
25
3125
25
25
625
25
25
25
3125
25
25
625
5
125
25
3125
25
25
625
4
156.25
25
3125
25
25
625
2
312.5
77.76
9720
25
25
625
25
25
77.76
9720
25
25
625
5
125
77.76
9720
25
25
625
4
156.25
77.76
9720
25
25
625
2
312.5
125
15625
25
25
625
25
25
125
15625
25
25
625
5
125
125
15625
25
25
625
4
156.25
125
15625
25
25
625
2
312.5
155.52
19440
25
25
625
25
25
155.52
19440
25
25
625
5
125
155.52
19440
25
25
625
4
156.25
155.52
19440
25
25
625
2
312.5
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
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CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC + 0.5V
Outputs, IO
Continuous Current
Surge Current
50mA
100mA
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause per manent damage to the
device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
Package Thermal Impedance, θJA 37°C/W (0 mps)
Storage Temperature, TSTG
-65°C to 150°C
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VCC = VCCO = VCCX = 3.3V±5%, VEE = 0V, TA = -40°C TO 85°C
Symbol
Parameter
Test Conditions
VCC
Core Supply Voltage
VCCA
Analog Supply Voltage
VCCO
Output Supply Voltage
Minimum
Typical
Maximum
Units
3.135
3. 3
3.465
V
VCC – 0.15
3.3
VCC
V
3.135
3. 3
3.465
V
3.135
3. 3
VCCX
Charge Pump Supply Voltage
3.465
V
IEE
Power Supply Current
235
mA
ICCA
Analog Supply Current
15
mA
TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VCC = VCCO = VCCX = 3.3V±5%, VEE = 0V, TA = -40°C
Symbol
Parameter
Test Conditions
VIH
Input High Voltage
VIL
Input Low Voltage
CLK_SEL,
ODASEL_[0:1],
Input
High Current ODBSEL_[0:1]
PDSEL[0:2]
CLK_SEL,
ODASEL_[0:1],
Input
Low Current ODBSEL_[0:1]
IIH
IIL
PDSEL[0:2]
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
Minimum
Typical
TO
85°C
Maximum
Units
2
VCC + 0.3
V
-0.3
0.8
V
VCC = VIN = 3.465V
150
µA
VCC = VIN = 3.465V
5
µA
VCC = 3.465V, VIN = 0V
-5
µA
VCC = 3.465V, VIN = 0V
-150
µA
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CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
TABLE 4C. DIFFERENTIAL DC CHARACTERISTICS, VCC = VCCO = VCCX = 3.3V±5%, VEE = 0V, TA = -40°C TO 85°C
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
150
µA
CLK0/nCLK0,
CLK1/nCLK1
CLK0, CLK1
VIN = 0V, VCC = 3.465V
-5
µA
nCLK0, nCLK1
VIN = 0V, VCC = 3.465V
-150
µA
IIH
Input High Current
IIL
Input Low Current
VPP
Peak-to-Peak Input Voltage; NOTE 1
VIN = VCC = 3.465V
VCMR
Common Mode Input Voltage; NOTE 1, 2
NOTE 1: VIL should not be less than -0.3V.
NOTE 2: Common mode voltage is defined as VIH.
0.15
1.3
V
VEE + 0.5
VCC - 0.85
V
TABLE 4D. LVPECL DC CHARACTERISTICS, VCC = VCCO = VCCX = 3.3V±5%, VEE = 0V, TA = -40°C TO 85°C
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VOH
Output High Voltage; NOTE 1
VCCO - 1.4
VCCO - 0.9
V
VOL
Output Low Voltage; NOTE 1
VCCO - 2.0
VCCO - 1.7
V
VSWING
Peak-to-Peak Output Voltage Swing
0.6
1. 0
V
NOTE 1: Outputs terminated with 50Ω to VCCO - 2V.
TABLE 5. AC CHARACTERISTICS, VCC = VCCO = VCCX = 3.3V±5%, VEE = 0V, TA = -40°C TO 85°C
Symbol
Parameter
fIN
Input Frequency
fOUT
Output Frequency
tjit(Ø)
RMS Phase Jitter (Random);
NOTE 1
tjit(acc)
Accumulated Jitter, RMS;
NOTE 2
tjit(pk-pk)
Peak-to-Peak Jitter
tsk(o)
Output Skew; NOTE 2, 3
odc
Output Duty Cycle
t R / tF
Output Rise/Fall Time
Test Conditions
Minimum
Maximum
Units
0.008
155.52
MHz
25
312.5
MHz
1.3
ps
10
ps
35
ps
75
ps
125MHz fOUT, 25MHz cr ystal
Integration Range:
10kHz – 20MHz
125MHz fOUT, 25MHz cr ystal,
20K Cycles
100K Random Cycles
Typical
45
55
%
200
700
ps
PLL Lock Time
175
tLOCK
Characterized with outputs at the same frequency using the loop filter components for the mid loop bandwidth.
Refer to VCXO-PLL Loop Bandwidth Selection Table.
NOTE 1: Please refer to the Phase Noise Plot.
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load condtions.
Measured at the output differential cross points.
ms
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
20% to 80%
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CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
TYPICAL PHASE NOISE @ 125MHZ
125MHz
Z
(dBc
H )
PHASE NOISE
RMS Phase Jitter (Random)
10kHz to 20MHz = 0.98ps (typical)
OFFSET FREQUENCY (HZ)
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
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CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
PARAMETER MEASUREMENT INFORMATION
2V
2V
VCC
VCC,
VCCO,
VCCX VCCA
Qx
SCOPE
nCLK0,
nCLK1
V
V
Cross Points
PP
CMR
CLK0,
CLK1
LVPECL
nQx
VEE
VEE
-1.3V ± 0.165V
DIFFERENTIAL INPUT LEVEL
3.3V OUTPUT LOAD AC TEST CIRCUIT
Phase Noise Plot
Noise Power
nFOUTx
FOUTx
Phase Noise Mask
nFOUTy
FOUTy
f1
Offset Frequency
tsk(o)
f2
RMS Jitter = Area Under the Masked Phase Noise Plot
OUTPUT SKEW
PHASE JITTER
nQA, nQB
nQA, nQB
80%
80%
QA, QB
VSW I N G
QA, QB
t PW
t
20%
20%
tR
tF
odc =
PERIOD
t PW
x 100%
t PERIOD
OUTPUT DUTY CYCLE/PULSE WIDTH/tPERIOD
OUTPUT RISE/FALL TIME
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
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CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
APPLICATION INFORMATION
POWER SUPPLY FILTERING TECHNIQUES
3.3V
As in any high speed analog circuitry, the power supply pins are
vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The ICS813252I-02
provides separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. VCC, VCCX, VCCA, and
VCCO should be individually connected to the power supply
plane through vias, and 0.01µF bypass capacitors should be used
for each pin. Figure 1 illustrates this for a generic VCC pin and
also shows that VCCA requires that an additional 10Ω resistor
along with a 10µF bypass capacitor be connected to the VCCA pin.
VDD
.01µF
10Ω
VDDX
10Ω
.01µF
10µF
VDDA
.01µF
10µF
FIGURE 1. POWER SUPPLY FILTERING
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS
of R1 and R2 might need to be adjusted to position the V_REF in
the center of the input voltage swing. For example, if the input
clock swing is only 2.5V and VCC = 3.3V, V_REF should be 1.25V
and R2/R1 = 0.609.
Figure 2 shows how the differential input can be wired to accept
single ended levels. The reference voltage V_REF ~ VCC/2 is
generated by the bias resistors R1, R2 and C1. This bias circuit
should be located as close as possible to the input pin. The ratio
VCC
R1
1K
Single Ended Clock Input
CLKx
V_REF
nCLKx
C1
0.1u
R2
1K
FIGURE 2. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
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CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
DIFFERENTIAL CLOCK INPUT INTERFACE
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL
and other differential signals. VSWING and VOH must meet the VPP and
VCMR input requirements. Figures 3A to 3F show interface examples
for the HiPerClockS CLK/nCLK input driven by the most common
driver types. The input interfaces suggested here are examples
only. Please consult with the vendor of the driver component to
confirm the driver termination requirements. For example in Figure
3A, the input termination applies for IDT HiPerClockS open emitter
LVHSTL drivers. If you are using an LVHSTL driver from another
vendor, use their termination recommendation.
3.3V
3.3V
3.3V
1.8V
Zo = 50 Ohm
CLK
Zo = 50 Ohm
CLK
Zo = 50 Ohm
nCLK
Zo = 50 Ohm
LVPECL
nCLK
HiPerClockS
Input
LVHSTL
ICS
HiPerClockS
LVHSTL Driver
R1
50
R1
50
HiPerClockS
Input
R2
50
R2
50
R3
50
FIGURE 3A. HIPERCLOCKS CLK/nCLK INPUT
DRIVEN BY AN IDT OPEN EMITTER
HIPERCLOCKS LVHSTL DRIVER
FIGURE 3B. HIPERCLOCKS CLK/nCLK INPUT
DRIVEN BY A 3.3V LVPECL DRIVER
3.3V
3.3V
3.3V
3.3V
3.3V
R3
125
R4
125
Zo = 50 Ohm
LVDS_Driv er
Zo = 50 Ohm
CLK
CLK
R1
100
Zo = 50 Ohm
nCLK
LVPECL
R1
84
HiPerClockS
Input
nCLK
Receiv er
Zo = 50 Ohm
R2
84
FIGURE 3C. HIPERCLOCKS CLK/nCLK INPUT
DRIVEN BY A 3.3V LVPECL DRIVER
2.5V
FIGURE 3D. HIPERCLOCKS CLK/nCLK INPUT
DRIVEN BY A 3.3V LVDS DRIVER
2.5V
3.3V
3.3V
2.5V
*R3
33
R3
120
Zo = 50Ω
R4
120
Zo = 60Ω
CLK
CLK
Zo = 50Ω
Zo = 60Ω
nCLK
HCSL
*R4
33
R1
50
R2
50
nCLK
HiPerClockS
Input
HiPerClockS
SSTL
R1
120
R2
120
*Optional – R3 and R4 can be 0Ω
FIGURE 3F. HIPERCLOCKS CLK/nCLK INPUT
DRIVEN BY A 2.5V SSTL DRIVER
FIGURE 3E. HIPERCLOCKS CLK/nCLK INPUT
DRIVEN BY A 3.3V HCSL DRIVER
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
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CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
VFQFN EPAD THERMAL RELEASE PATH
In order to maximize both the removal of heat from the package
and the electrical performance, a land patter n must be
incorporated on the Printed Circuit Board (PCB) within the footprint
of the package corresponding to the exposed metal pad or
exposed heat slug on the package, as shown in Figure 4. The
solderable area on the PCB, as defined by the solder mask, should
be at least the same size/shape as the exposed pad/slug area on
the package to maximize the thermal/electrical performance.
Sufficient clearance should be designed on the PCB between the
outer edges of the land pattern and the inner edges of pad pattern
for the leads to avoid any shorts.
are application specific and dependent upon the package power
dissipation as well as electrical conductivity requirements. Thus,
thermal and electrical analysis and/or testing are recommended
to determine the minimum number needed. Maximum thermal
and electrical performance is achieved when an array of vias is
incorporated in the land pattern. It is recommended to use as
many vias connected to ground as possible. It is also
recommended that the via diameter should be 12 to 13mils (0.30
to 0.33mm) with 1oz copper via barrel plating. This is desirable to
avoid any solder wicking inside the via during the soldering process
which may result in voids in solder between the exposed pad/
slug and the thermal land. Precautions should be taken to
eliminate any solder voids between the exposed heat slug and
the land pattern. Note: These recommendations are to be used
as a guideline only. For further information, refer to the Application
Note on the Surface Mount Assembly of Amkor’s Thermally/
Electrically Enhance Leadfame Base Package, Amkor Technology.
While the land pattern on the PCB provides a means of heat
transfer and electrical grounding from the package to the board
through a solder joint, thermal vias are necessary to effectively
conduct from the surface of the PCB to the ground plane(s). The
land pattern must be connected to ground through these vias.
The vias act as “heat pipes”. The number of vias (i.e. “heat pipes”)
PIN
PIN PAD
SOLDER
EXPOSED HEAT SLUG
GROUND PLANE
THERMAL VIA
SOLDER
LAND PATTERN
(GROUND PAD)
PIN
PIN PAD
FIGURE 4. P.C.ASSEMBLY FOR EXPOSED PAD THERMAL RELEASE PATH –SIDE VIEW (DRAWING NOT TO SCALE)
RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS
INPUTS:
OUTPUTS:
LVPECL OUTPUTS
All unused LVPECL outputs can be left floating. We recommend
that there is no trace attached. Both sides of the differential output
pair should either be left floating or terminated.
CLK/nCLK INPUTS
For applications not requiring the use of the differential input,
both CLK and nCLK can be left floating. Though not required, but
for additional protection, a 1kΩ resistor can be tied from CLK to
ground.
LVCMOS CONTROL PINS
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1kΩ resistor can be used.
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
12
CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
TERMINATION FOR 3.3V LVPECL OUTPUT
The clock layout topology shown below is a typical termination
for LVPECL outputs. The two different layouts mentioned are recommended only as guidelines.
transmission lines. Matched impedance techniques should be
used to maximize operating frequency and minimize signal distortion. Figures 5A and 5B show two different layouts which are
recommended only as guidelines. Other suitable clock layouts
may exist and it would be recommended that the board designers simulate to guarantee compatibility across all printed circuit
and clock component process variations.
FOUT and nFOUT are low impedance follower outputs that generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must be
used for functionality. These outputs are designed to drive 50Ω
3.3V
Zo = 50Ω
125Ω
FOUT
FIN
125Ω
Zo = 50Ω
Zo = 50Ω
FOUT
50Ω
1
RTT =
Z
((VOH + VOL) / (VCC – 2)) – 2 o
FIN
50Ω
Zo = 50Ω
VCC - 2V
RTT
84Ω
FIGURE 5A. LVPECL OUTPUT TERMINATION
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
84Ω
FIGURE 5B. LVPECL OUTPUT TERMINATION
13
CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
SCHEMATIC EXAMPLE
Figure 6 shows an example of the ICS813252I-02 application
schematic. In this example, the device is operated at VCC =
VCCX = VCCO = 3.3V. The decoupling capacitors should be
located as close as possible to the power pin. The input is
driven by a 3.3V LVPECL driver. An optional 3-pole filter
can also be used for additional spur reduction. It is
recommended that the loop filter components be laid out for
the 3-pole option. This will also allow the 2-pole filter to be
used.
FIGURE 6. ICS813252I-02 S CHEMATIC EXAMPLE
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
14
CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
VCXO-PLL EXTERNAL COMPONENTS
Choosing the correct external components and having a proper
printed circuit board (PCB) layout is a key task for quality
operation of the VCXO-PLL. In choosing a crystal, special
precaution must be taken with the package and load
capacitance (C L ). In addition, frequency, accuracy and
temperature range must also be considered. Since the pulling
range of a cr ystal also var ies with the package, it is
recommended that a metal-canned package like HC49 be used.
Generally, a metal-canned package has a larger pulling range
than a surface mounted device (SMD). For crystal selection
information, refer to the VCXO Crystal Selection Application
Note.
the crystal specification. In either case, the absolute tuning
range is reduced. The correct value of CL is dependent on the
characteristics of the VCXO. The recommended CL in the Crystal
Parameter Table balances the tuning range by centering the
tuning curve.
The VCXO-PLL Loop Bandwidth Selection Table shows RS, C S
and C P values for recommended high, mid and low loop
bandwidth configurations. The device has been characterized
using these parameters. For other configurations, refer to the
Loop Filter Component Selection for VCXO Based PLLs
Application Note.
The crystal and external loop
filter components should be
kept as close as possible to the
device. Loop filter and crystal
traces should be kept short and
separated from each other.
Other signal traces should be
kept separate and not r un
under neath the device, loop
filter or crystal components.
The crystal’s load capacitance CL characteristic determines its
resonating frequency and is closely related to the VCXO tuning
range. The total external capacitance seen by the crystal when
installed on a board is the sum of the stray board capacitance,
IC package lead capacitance, internal varactor capacitance and
any installed tuning capacitors (CTUNE).
If the crystal’s CL is greater than the total external capacitance,
the VCXO will oscillate at a higher frequency than the crystal
specification. If the crystal’s CL is lower than the total external
capacitance, the VCXO will oscillate at a lower frequency than
LF0
LF1
ISET
RS
CP
RSET
CS
XTAL_IN
CTUNE
25MHz
XTAL_OUT
CTUNE
VCXO CHARACTERISTICS TABLE
Symbol
Parameter
Typical
Unit
kVCXO
VCXO Gain
15,700
Hz/V
CV_LOW
Low Varactor Capacitance
9.9
pF
CV_HIGH
High Varactor Capacitance
22.2
pF
VCXO-PLL APPROXIMATE LOOP BANDWIDTH SELECTION TABLE
Bandwidth
Crystal Frequency (MHz)
RS (kΩ )
CS (µF)
CP (µF)
RSET (kΩ )
10Hz (Low)
25MHz
121
1.0
0.01
9.09
90Hz (Mid)
25MHz
22 1
0.1
0.001
2.21
300Hz (High)
25MHz
680
0.1
0.0001
2.21
CRYSTAL CHARACTERISTICS
Symbol
Parameter
fN
Frequency
fT
Frequency Tolerance
fS
Frequency Stability
Minimum
Mode of Operation
Operating Temperature Range
Typical
Maximum
Units
Fundamental
25
MHz
-40
±20
ppm
±20
ppm
85
°C
CL
Load Capacitance
10
pF
CO
Shunt Capacitance
4
pF
CO /C1
Pullability Ratio
ESR
Equivalent Series Resistance
22 0
24 0
20
Drive Level
Aging @ 25°C
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
1
mW
±3 per year
ppm
15
CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS813252I-02.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS813252I-02 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 235mA = 814.275mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 30mW = 60mW
Total Power_MAX (3.465V, with all outputs switching) = 814.275mW + 60mW = 874.275mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS TM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air
flow and a multi-layer board, the appropriate value is 37°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.874W * 37°C/W = 117.3°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE θJA FOR 32 LEAD VFQFN, FORCED CONVECTION
θ JA vs. 0 Air Flow (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
16
0
1
2.5
37.0°C/W
32.4°C/W
29.0°C/W
CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 7.
VCC
Q1
VOUT
RL
50
VCC - 2V
FIGURE 7. LVPECL DRIVER CIRCUIT
AND TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of V
– 2V.
CCO
•
For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.9V
(V
CCO_MAX
•
–V
OH_MAX
) = 0.9V
For logic low, VOUT = V
OL_MAX
=V
CC_MAX
– 1.7V
(VCCO_MAX – VOL_MAX) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(V
OH_MAX
– (V
CCO_MAX
– 2V))/R ] * (V
CCO_MAX
L
–V
OH_MAX
) = [(2V – (V
CCO_MAX
–V
OH_MAX
))/R ] * (V
CCO_MAX
L
–V
OH_MAX
)=
[(2V – 0.9V)/50Ω] * 0.9V = 19.8mW
Pd_L = [(V
OL_MAX
– (V
CCO_MAX
- 2V))/R ] * (V
L
CCO_MAX
–V
OL_MAX
) = [(2V – (V
CCO_MAX
–V
OL_MAX
))/R ] * (V
L
CCO_MAX
–V
OL_MAX
)=
[(2V – 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
17
CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
RELIABILITY INFORMATION
TABLE 7. θJAVS. AIR FLOW TABLE
FOR
32 LEAD VFQFN
θ JA vs. 0 Air Flow (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2.5
37.0°C/W
32.4°C/W
29.0°C/W
TRANSISTOR COUNT
The transistor count for ICS813252I-02 is: 6579
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
18
CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
PACKAGE OUTLINE AND DIMENSIONS - K SUFFIX FOR 32 LEAD VFQFN
NOTE: The above mechanical package drawing is a generic drawing that applies to any pin count VFQFN package. This drawing is not
intended to convey the actual pin count or pin layout of this device. The pin count and pinout are shown on the front page. The package
dimensions are in Table 8 below.
TABLE 8. PACKAGE DIMENSIONS
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS (VHHD -2/ -4)
SYMBOL
Minimum
Maximum
32
N
A
0.80
1.0
A1
0
0.05
0.25 Reference
A3
b
0.18
0.30
e
0.50 BASIC
ND
8
NE
8
D, E
5.0 BASIC
D2, E2
3.0
3.3
L
0.30
0.50
Reference Document: JEDEC Publication 95, MO-220
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
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CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
TABLE 9. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
813252CKI-02
ICS3252CI02
32 Lead VFQFN
tray
-40°C to 85°C
813252CKI-02T
ICS3252CI02
32 Lead VFQFN
2500 tape & reel
-40°C to 85°C
813252CKI-02LF
ICS352CI02L
32 Lead "Lead-Free" VFQFN
tray
-40°C to 85°C
813252CKI-02LFT
ICS352CI02L
32 Lead "Lead-Free" VFQFN
2500 tape & reel
-40°C to 85°C
NOTE: Par ts that are ordered with an "LF" suffix to the par t number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology, Incorporated (IDT) assumes no responsibility for either its use or for
infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial and
industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT
reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
20
CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
REVISION HISTORY SHEET
Rev
Table
Page
A
T9
20
Description of Change
Date
Ordering Information Table - added ICS prefix in the Par t/Order Number.
IDT ™ / ICS™ VCXO JITTER ATTENUATOR/MULTIPLIER
21
5/6/08
CS813252CKI-02 REV. A OCTOBER 22, 2008
ICS813252I-02
VCXO JITTER ATTENUATOR & FEMTOCLOCK™ MULTIPLIER
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