Tire Pressure
Monitoring System
User’s Guide
© 2006 Microchip Technology Inc.
DS51624B
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
DS51624B-page ii
© 2006 Microchip Technology Inc.
TIRE PRESSURE MONITORING
SYSTEM USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 1
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 1
Conventions Used in this Guide ............................................................................ 2
Recommended Reading........................................................................................ 3
The Microchip Web Site ........................................................................................ 3
Customer Support ................................................................................................. 4
Document Revision History ................................................................................... 4
Chapter 1. Quick Start Instructions ............................................................................. 5
1.1 Introduction ..................................................................................................... 5
Chapter 2. System Overview ........................................................................................ 9
2.1 System Technical Specifications .................................................................... 9
2.2 Operation Overview ........................................................................................ 9
2.3 Network Setup Overview .............................................................................. 10
Chapter 3. Hardware Overview .................................................................................. 11
3.1 Introduction ................................................................................................... 11
3.2 Base Station Module Overview .................................................................... 11
3.3 Low Frequency Initiator Module ................................................................... 13
3.4 Transponder Sensor Module ........................................................................ 14
3.5 Analog Sensor Calibration ............................................................................ 19
3.6 Sensor Calibration ........................................................................................ 19
Appendix A. Schematic and Layouts ........................................................................ 23
A.1 Introduction .................................................................................................. 23
A.2 Base Station Module Schematic (Page 1) ................................................ 24
A.3 Base Station Module Schematic (Page 2) ................................................. 25
A.4 Base Station Wiring Harness - Schematic
............................................... 26
A.5 Base Station Module - Top Layer and Silk Screen .................................... 27
A.6 Base Station Module - Bottom Layer ......................................................... 27
A.7 Low Frequency Initiator Module - Schematic
........................................... 28
A.8 Low Frequency Initiator Module - Top Layer and Silk Screen ..................... 29
A.9 Low Frequency Initiator Module - Bottom Layer ........................................ 29
A.10 Transponder Sensor Module - Schematic ................................................ 30
A.11 Transponder Sensor Module - Top Layer and Silk Screen ...................... 31
A.12 Transponder Sensor Module - Bottom Layer ........................................... 31
A.13 Circuit Block Figure .................................................................................. 32
© 2006 Microchip Technology Inc.
DS51624B-page iii
Tire Pressure Monitoring System User’s Guide
Appendix B. Bill Of Materials (BOM) ..........................................................................33
Worldwide Sales and Service .....................................................................................38
DS51624B-page iv
© 2006 Microchip Technology Inc.
TIRE PRESSURE MONITORING
SYSTEM USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
Tire Pressure Monitor System. Items discussed in this chapter include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the Tire Pressure Monitor System as a development tool. The manual layout is as follows:
• Chapter 1. “Quick Start Instructions” – includes instructions on how to connect
the system together.
• Chapter 2. “System Overview” – shows an overview of the Tire Pressure
Monitor System.
• Chapter 3. “Hardware Overview” – shows and overview of the hardware used in
the Tire Pressure Monitor System.
• Appendix A. “Schematic and Layouts” – shows the schematic and board layout diagrams for the Tire Pressure Monitor System.
• Appendix B. “Bill Of Materials (BOM)” – lists the parts used to build the Tire
Pressure Monitor System boards.
© 2006 Microchip Technology Inc.
DS51624B-page 1
Tire Pressure Monitoring System User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
Represents code supplied by
user
DS51624B-page 2
Examples
File>Save
Press <Enter>, <F1>
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
var_name [,
var_name...]
void main (void)
{ ...
}
© 2006 Microchip Technology Inc.
Preface
RECOMMENDED READING
This user's guide describes how to use Tire Pressure Monitor System. The following
Microchip documents are available and recommended as supplemental reference
resources.
MCP201 Data Sheet, “LIN Transceiver with Voltage Regulator” (DS21730)
MCP2030 Data Sheet, “Three-Channel Analog Front-End Device“ (DS21981)
HCS365 Data Sheet “KEELOQ® Code Hopping Encoder“ (DS41109)
MCP3550/1/3 Data Sheet, “Low-Power Single Channel 22-Bit Delta Sigma ADCs“
(DS21950)
TC4421/22 Data Sheet, “9A High-Speed Mosfet Drivers” (DS21420)
AN232, "Low Frequency Magnetic Transmitter Design" (DS00232)
AN617, “Fixed Point Routines“ (DS00617)
AN695, “Interfacing Pressure Sensors to Microchip's Analog Peripherals“
(DS00695)
AN990, “Analog Sensor Conditioning Circuits - An Overview“ (DS00990)
AN1009, “LIN 2.0 Compliant Driver Using the PIC18XXXX” (DS01009)
Passive Keyless Entry (PKE) Reference Design User’s Manual (21986)
LIN Specification Package, Revision 1.3 (http://www.lin-subbus.org)
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
© 2006 Microchip Technology Inc.
DS51624B-page 3
Tire Pressure Monitoring System User’s Guide
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers should contact their distributor, representative or field application engineer
for support. Local sales offices are also available to help customers. A listing of sales
offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
DOCUMENT REVISION HISTORY
Revision A (August 2006)
• Initial Release of this Document.
DS51624B-page 4
© 2006 Microchip Technology Inc.
TIRE PRESSURE MONITORING
SYSTEM USER’S GUIDE
Chapter 1. Quick Start Instructions
1.1
INTRODUCTION
This section provides the user a quick step-by-step instruction guide on how to get the
Tire Pressure Monitor System operational.
1. Connect the Base Station module (J2) with the Low Frequency (LF) Initiator module (J4) with the connector cable provided with the kit to establish the Local Interconnect Network (LIN) physical connections.
Note:
© 2006 Microchip Technology Inc.
This reference design provides only the typical calibration values used
during development. Therefore, the accuracy of the measurements is not
guaranteed. The user is responsible for performing the calibration routine
for their applications. Please contact sensor manufacturing for additional
information regarding this topic.
DS51624B-page 5
Tire Pressure Monitoring System User’s Guide
2. Apply power to the Sensor module by inserting a 3V NiHM (CR2320) battery. The
LED will light to indicate that the power is supplied.
DS51624B-page 6
© 2006 Microchip Technology Inc.
Quick Start Instructions
3. Supply power to either the Base Station module or the LF Initiator module with a
9V - 18V supply. Only one power source is needed if the power is shared on the
LIN network. The LEDs will light to indicate that the power is connected.
4. The LCD module should be powered at this time. The pressure and temperature
data is displayed on the LCD for each Sensor module connected to the LIN network. Check power and connection if no information is shown.
© 2006 Microchip Technology Inc.
DS51624B-page 7
Tire Pressure Monitoring System User’s Guide
NOTES:
DS51624B-page 8
© 2006 Microchip Technology Inc.
TIRE PRESSURE MONITORING
SYSTEM USER’S GUIDE
Chapter 2. System Overview
2.1
SYSTEM TECHNICAL SPECIFICATIONS
UHF Communication Frequency:
LF Communication Frequency:
Network Connectivity:
Modulation Format:
Encoding Method:
2.2
433.92 MHz
125 kHz
LIN or CAN, LIN is used in the design
ASK
PWM
OPERATION OVERVIEW
The Base Station wakes up the Sensor modules in each tire through the Low
Frequency Initiator to poll the pressure, temperature data and checks the battery level
in a sequential manner. The Base Station communicates to the LF initiator via the LIN
network. The LF initiator transmits a wake up challenge via a 125 kHz ASK modulated
signal to the Tire sensor module after a command has been received from the Base
Station. The 3-axis Analog Front End (MCP2030) of the Tire Sensor module validates
the incoming challenge and wakes up the microcontroller from sleep only if the preambles match. The Tire Sensor module will then measure the pressure and the temperature, check the battery level and transmits the data to the Base Station via a 433.9 MHz
signal. The Base Station will display the information on the LCD after receiving the data.
The Base Station module contains a PIC18F4680. It is also implemented with a
MCP201 LIN Transceiver and MCP2551 CAN Transceiver for communications via LIN
or CAN.
The LF Initiator module contains a PIC18F2680. The module also contains a MCP201
and MCP2551 for LIN or CAN communication.
The Tire Sensor module contains a PIC16F684 with a MCP2030, a three-axis Analog
Front-End (AFE). The analog pressure sensor used is the MS5407-AM from Intersema.
© 2006 Microchip Technology Inc.
DS51624B-page 9
Tire Pressure Monitoring System User’s Guide
FIGURE 2-1:
COMPLETE TIRE PRESSURE MONITORING SYSTEM
Front
Driver Side
Front
Passenger Side
Inside
Snr/TX
Tire
Inside
Wheel well
Snr/TX Inside
Tire
LF
Inside
Wheel well
LF
Optional for
Spare Tire
Inside
Wheel well
LF
Inside
Wheel well
Inside
Tire
Base
Station
LF
Snr/TX
LF
Inside
Snr/TX
Tire
Inside
Wheel well
Snr/TX Inside
Tire
Rear
Driver Side
2.3
Inside
Vehicle
Rear
Passenger Side
NETWORK SETUP OVERVIEW
The reference kit provides one wiring harness for LIN connectivity between the Base
Station Module and one Low Frequency Initiator Module. Refer to A.4 “Base Station
Wiring Harness - Schematic” in Appendix A. “Schematic and Layouts” for the wiring harness schematic. The user must provide or modify the wiring harness in order to
build a complete TPMS network via LIN. Refer to Figure 2-2 for more information.
FIGURE 2-2:
WIRING HARNESS FOR COMPLETE TPMS NETWORK
LF
Initiator
J4
Power
Source
Base Station
LF
Initiator
J4
+12V DC
LIN
GND
J2
J4
LF
Initiator
DS51624B-page 10
J4
LF
Initiator
© 2006 Microchip Technology Inc.
TIRE PRESSURE MONITORING
SYSTEM USER’S GUIDE
Chapter 3. Hardware Overview
3.1
INTRODUCTION
The following section provides and overview of the hardware used in the Tire Pressure
Monitoring System.
3.2
BASE STATION MODULE OVERVIEW
3.2.1
Technical Specifications
UHF Receiving Frequency:
433.92 MHz
Normal Operating Voltage:
9 - 18V
Normal Operating Current:
~ 64 mA
Communication Protocols:
CAN and LIN
Liquid Crystal Display (LCD):
2x16
3.2.2
Microcontroller
The microcontroller implemented is a PIC18F4680 for this module based on the
number of features offered by this device. The PIC18F4680 has both a CAN controller
and a LIN compatible EUSART to interface to in-vehicle networks.
3.2.3
UHF Receiver
The RF input is an AM super-regenerative compact hybrid module, that is used to
capture decoded data from an AM Transmitter. The receiver has very high frequency
stability over a wide operating temperature and tolerant of mechanical vibrations or
manual handling. A laser trimmed on board inductor, removes the need for any
adjustable components.
3.2.4
LCD
A standard 16 pin 2x16 monochromes LCD is used to display the tire pressure and
temperature data
3.2.5
Connectivity
A MCP201 LIN transceiver and a MCP2551 CAN transceiver are provided on board to
provide a way of connecting to LIN or CAN networks. This reference design uses the
LIN to communicate between the Base Station and the LF Initiator(s) that is/are
connected to the LIN network. The capacitor between the LIN bus pin and ground
should have its value adjusted for the particular network topology. A large pull-up
resistor on the nFault/SLPS pin ensures that the device resets to a standard slope
control profile. Refer to the MCP201 Data Sheet, “LIN Transceiver with Voltage
Regulator” (DS21730) for more information. Refer to Appendix A. “Schematic and
Layouts”.
© 2006 Microchip Technology Inc.
DS51624B-page 11
Tire Pressure Monitoring System User’s Guide
3.2.6
Operation Overview
The Base Station schedules when each tire is polled. The Base Station transmits the
command to wake up the Transponder Sensor module to each LF Initiators individually
on the LIN network. The command issued to LF Initiator contains a unique ID that was
pre-assigned to each Initiator. This command will be issued maximum of three times if
the previous attempt failed. The LF Initiator transmits a wake up command containing
the two bytes of data from the base station to the Transponder Sensor module. The
Base Station will then wait for an incoming RF data message stream from the
Transponder Sensor module which will also contain the LF Initiator ID to distinguish the
tire position.
FIGURE 3-1:
LIN MESSAGE COMMAND
Message Frame
Header
Synch
Break
Synch
Field
Data
Ident
Field
inter-frame
space
or BREAK
Position Mode Checksum
ID
ID
Field
in-frame
response space
When the Learn Button (S1) is pressed, the Base Station places a Learn Mode ID in
the second data byte of the message. The Base Station then issues the learn command
sequentially to each LF initiator which in turn, transmits the command to the Transponder Sensor module. The Base Station waits for the Transponder Sensor to transmit
back a message via UHF (the number of LF Initiators on the LIN network will determine
how many messages to be expected by the Base Station and this must be defined by
the user in the firmware). After a predetermined time has expired, an error message is
displayed on the LCD if all the expected messages are not received.
DS51624B-page 12
© 2006 Microchip Technology Inc.
Hardware Overview
3.3
LOW FREQUENCY INITIATOR MODULE
3.3.1
Technical Specifications
LF Transmitting Frequency:
Connectivity:
3.3.2
125 kHz
LIN or CAN, LIN is used for this design
System Overview
The LF Transmitter is derived from the design described in Application Note AN232,
"Low Frequency Magnetic Transmitter Design" (DS00232).
The hardware design of the LF Initiator module is identical to the LF module used in
Microchip PKE reference design (APGRD001). Refer to Chapter 2 of the “PKE
Reference Design User Guide” for more information on this module. Refer to
Appendix A. “Schematic and Layouts”.
3.3.3
Operation Overview
LF Initiator is connected to Base Station Module through the LIN network. Each LF
Initiator is assigned a unique ID which is also used by the system to distinguish the tire
location during normal operation. Once a command from the Base Station has been
received, the LF Initiator transmits a wake-up challenge to the Transponder Sensor
module via a 125 kHz modulated signal. The format of the signal is user configurable
and also depends on the configurations of the AFE output filter on the Transponder
Sensor module.
Refer to 3.4.3.3 “LF Message Overview” for detail description of the LF message
formatting.
3.3.4
Reference Material
Refer to Recommended Reading in the Preface section.
© 2006 Microchip Technology Inc.
DS51624B-page 13
Tire Pressure Monitoring System User’s Guide
3.4
TRANSPONDER SENSOR MODULE
3.4.1
Technical Specifications
Modulation Format:
Encoding Method:
Operating Voltage:
Low Voltage Alert Threshold:
Stand By Current With 3 LF Input
Channels Enabled (PIC & AFE):
UHF Transmitting Frequency:
UHF Transmission Baud Rate (TE):
UHF Range:
LF Frequency:
LF Input Sensitivity:
LF Range:
Pressure Sensor Type:
Pressure Sensor Range:
Pressure Sensor Temperature
Range:
3.4.2
Hardware Overview
3.4.2.1
MICROCONTROLLER
ASK
PWM
2.3 - 3.3V
2.3V
~12 μA
433.92 MHz
100, 200, 400, 800 μs selectable,
system default is 400 μs
~ 10 Meters
125 kHz
~3 mVPP
Up to 3 Meters
Analog
1-7 bars absolute
-40 - 125°C
The microcontroller used is the PIC16F684. The internal 10-bit ADC is used for
pressure, temperature and battery measurements. It also interfaces with the MCP2030
for configuration and LF communications. Other PICmicro MCUs can be selected
based on design requirement.
3.4.2.2
LF RECEIVER (125 kHZ)
The LF signal processing is handled with the Microchip's three-channel Analog Front
End (MCP2030). The MCP2030 has a user-configurable input filter to process the
incoming LF challenges.
3.4.2.3
HF TRANSMITTER (433.9 MHZ)
The HF transmitter is used for transmitting data to the base station module. A surface
mounted SAW resonator is used to generate the carrier frequency which is controlled
by the output pin of the microcontroller.
3.4.2.4
PRESSURE SENSOR
The sensor implemented in this design is an analog pressure sensor (MS5407-AM)
from Intersema. The two output of the sensor, V+ and V-, will output voltages levels that
correspond to the changes in pressure. The sensor is powered by RA1 pin of the
microcontroller and is in the off state when not taking measurement.
3.4.2.5
SENSOR SIGNAL AMPLIFICATION
The two outputs of the pressure sensors are connected to the differential gain circuitry
using the MCP6273. The output of the differential gain signal is amplified by 10 and
then passed into the 10-bit ADC module in the microcontroller for conversion. The gain
of the signal is controlled by the values of R9, R10, R11 and R12. Refer to
A.13 “Circuit Block Figure”.
DS51624B-page 14
© 2006 Microchip Technology Inc.
Hardware Overview
3.4.2.6
POWER
The module is powered by a standard Lithium 3V coin cell battery.
To reduce power consumption, the LED used for indication should be removed to
reduce the standby current consumption. The typical standby current without the LED
is about 25 μA (the sum of the power down current of the microcontroller and the active
current of three-channel analog front end).
In addition, the LF Receiver has all three channels enabled and powered on all the time
for incoming signal detection. One or two channels can be disabled or a periodic
detection method can be implemented to further reduce the overall standby current
usage. Refer to Appendix A. “Schematic and Layouts”.
3.4.3
Operation Overview
When the Transponder Sensor module receives a LF (125 kHz) wake up challenge
message, the Analog Front End validates the incoming challenge. Only after a valid
message has been received, the microcontroller is awakened from sleep mode. The
action taken by the module is determined by the received commands. Normal request
measures the tire pressure and temperature. Learn Mode request assigns a new ID to
the sensor module for future operations prior to the measurements. The Transponder
Sensor module then transmits the data to the base station via UHF (433.9 MHz) and
returns to Sleep mode if no other interrupts were detected.
To reduce power consumption, the pressure sensor and the op-amp for signal
amplifications are normally powered off. These two devices are powered on only during
measurements.
© 2006 Microchip Technology Inc.
DS51624B-page 15
Tire Pressure Monitoring System User’s Guide
FIGURE 3-2:
SENSOR MODULE FLOW CHART
Module Initialization
Any Incoming
LF Challenge
Command?
Yes
Valid Challenge
Command?
Yes
Wake Up PIC
From Sleep Mode
Read Incoming
Messages
Learn Mode
Command
Recv?
No
Yes
Save New ID
No
Measure Battery
Level
Battery Level
Okay?
Yes
No
No
LF INT
Clear Vlow Flag
Measure Pressure
Set Vlow Flag
Measure
Temperature
Perform
Compensation
Routine
Transmit Data to
BaseStation
Enter Sleep Mode
DS51624B-page 16
© 2006 Microchip Technology Inc.
Hardware Overview
3.4.3.1
LEARN MODE OVERVIEW
When a Learn Mode ID is received, the module will save the new Tire Location ID and
use it as its default ID for all future normal transmissions until another Learn Mode ID
is received. This feature can be used to "re-learn" the tires after tire rotations or if a new
Transponder Sensor module has been installed.
Note:
3.4.3.2
Due to the possibility that one LF Initiator can wake up multiple Transponder Sensor modules in a full system setup (4 LF Initiators with 4 Sensor
Modules) during development due to the close proximity, either the
transmitting power of the LF Initiators should be reduced or the distance
between the module sets (1 set = 1 LF Initiator + 1 Transponder Sensor)
should be kept at a maximum where they will not cause interference with
each other. Refer to Application Note AN232 for more details on the LF
Transmitter.
ANALOG FRONT END OVERVIEW
The user configurable output filter of the MCP2030 is utilized to prevent the
microcontroller from being awakened unnecessarily by either noise or LF signals from
other unknown sources. The data is outputted to the microcontroller only when the preamble of the incoming message matches the pre-configured filter settings. The
MCP2030 can be configured via SPI by writing to the seven configuration registers
through the microcontroller. The number of channels enabled can also be controlled
through these configuration registers. Refer to the MCP2030 data sheet (DS21981) for
more information.
3.4.3.3
LF MESSAGE OVERVIEW
The incoming LF message from the LF Initiator Module consists of the following in a
125 kHz modulated format:
•
•
•
•
•
A required minimum of 4 ms ON time for AGC stabilization
A 500 μs OFF delay
A 2 ms ON time for the output filter (user configurable in AFE)
A 2 ms OFF for the output filter time (user configurable in AFE)
Two bytes of data (maximum of 8 bytes)
- Tire Location ID (user defined)
- System Mode ID (user defined)
FIGURE 3-3:
LF MESSAGE FORMAT
LOGIC ‘0’
LOGIC ‘1’
Bit
Period
125 kHz Base Frequency
Mode ID (1 byte)
Tire Location ID
(1 byte
2 ms
2 ms
500 μs
Wake-Up 125 kHz Preamble
Data
4 ms
Transmission Direction LSb First
© 2006 Microchip Technology Inc.
DS51624B-page 17
Tire Pressure Monitoring System User’s Guide
3.4.3.4
RF MESSAGE OVERVIEW
The transmitted message follows the HCS365 PWM format via a 433 MHz carrier
signal, which consists of:
• A preamble (31 TE, 50% duty cycle) for baud rate calculation on the receive side
• A header (4 or 10 Te, user selectable)
• Data bytes:
- Tire Location ID (1 Byte, user defined)
- Sensor ID (2 Bytes, user defined)
- Pressure Data (2 Bytes)
- Temperature Data (2 Bytes)
- Battery Low Flag (1 Bit)
- Dummy Bits (7 Bits)
Refer to the HCS365 data sheet (DS41109) for more information.
FIGURE 3-4:
RF MESSAGE FORMAT
TE
TE
TE
LOGIC "0"
LOGIC "1"
Transmission Direction LSb First
1
TBP
16
31xTe 50% Preamble
4-10
xTE
Data Bytes
Header
Note:
3.4.3.5
For the next three sections, refer to A.13 Circuit Block Figure in
Appendix A. “Schematic and Layouts” for circuit block diagram.
PRESSURE MEASUREMENT
• Drive pin RC0 and RA1 high to power up the sensor and the Op-Amp (MCP6273)
that is used for signal amplification
• Enable the Op-Amp with pin RA5
• Pin RC2 is set up as the analog input to the internal ADC for pressure measurement
3.4.3.6
TEMPERATURE MEASUREMENT
• Drive pin RC0 pin high to power up the sensor and the op-amp used for signal
amplification. This also pulls the sensor bridge high through R5. The R5 and the
sensor bridge form a resistive divider which is monitored by the internal ADC
through pin RA1. Since the sensor internal bridge resistance is temperature
dependent, the voltage on the resistor divider will change accordingly.
• Pin RC0 is configured as the analog input of the internal ADC. Vref for the ADC is
selected as internal which is equal to the battery voltage minus the diode drop.
• The recommended serial resistor (R5) value should be 10 kOhm or greater to
minimize the influence of the parasitic of the microcontroller pins (about
200 Ohm).
DS51624B-page 18
© 2006 Microchip Technology Inc.
Hardware Overview
Note:
3.4.3.7
This method of the temperature measurement is not the most accurate way
to monitor the temperature. An external temperature sensor should be
used, if high accuracy is desired.
BATTERY MEASUREMENT
• The battery measurement is implemented by comparing the difference between
the constant forward voltage drop of a diode (D3) with the battery voltage level
using the internal ADC in the microcontroller. Pin RC1 is set up as the input to
ADC for battery measurement. A threshold value of 2.3V is selected to ensure the
proper operation of the internal ADC. The Battery Low flag will be set if the battery
falls below the threshold value.
Note:
3.5
The internal ADC minimum required Vref voltage is 2.2V. In order to
achieve the 1LSB accuracy, Vref voltage value of 2.7V or higher is required.
ANALOG SENSOR CALIBRATION
The calibration method recommended by Intersema for the optimal sensor
performance is the 4-point calibration routine using the simple linear sensor model
described in the Intersema application note (AN402). Total of four independent measurements performed at two different temperatures and pressures are used to calculate and compensate for the variations in the performance of the sensor due to process
variations. Refer to Application Note AN402 from Intersema for more details regarding
analog sensor calibration methods.
Note:
3.6
This reference design provides only the typical calibration values used
during development and the calibration values will vary from unit to unit.
Therefore, the accuracy of the measurements is not guaranteed. The user
is responsible for performing the calibration routine for their applications.
Please contact sensor manufacturing for additional information regarding
this topic.
SENSOR CALIBRATION
The multiplication and division subroutines used in the sensor calibration/compensation routine are derived from the math subroutines described in Microchip’s Application
Note AN617, “Fixed Point Routines”. Refer to this application note for more descriptions on the 16x16 bits multiplication and 32/16 bits division routines. The flow charts
for the addition routine (Figure 3-6) and subtraction routine (Figure 3-7) are included
for references.
© 2006 Microchip Technology Inc.
DS51624B-page 19
Tire Pressure Monitoring System User’s Guide
FIGURE 3-5:
4 POINTS SENSOR CALIBRATION ROUTINE (INTERSEMA)
At Temp 1
At Pressure 1
Measure Pressure
Measure Temperature
Data Saved:
Pressure = T1P1
Temperature = T1
Save Pressure and
Temperature Data to
EEPROM
At Temp 1
At Pressure 2
Measure Pressure
Measure Temperature
Data Saved:
Pressure = T1P2
Temperature = T1
Save Pressure and
Temperature Data to
EEPROM
Change
Temperature
at this point
Measure Pressure
At Temp 2
At Pressure 1
Measure Temperature
Save Pressure and
Temperature Data to
EEPROM
Measure Pressure
Data Saved:
Pressure = T2P1
Temperature = T2
At Temp 2
At Pressure 2
Measure Temperature
Save Pressure and
Temperature Data to
EEPROM
DS51624B-page 20
Data Saved:
Pressure = T2P2
Temperature = T2
© 2006 Microchip Technology Inc.
Hardware Overview
FIGURE 3-6:
SENSOR_TX ADD FLOWCHART
Sflag Set?
Yes
No
data1L + data2H
data1H >
data2H?
Is there a
Carry?
No
Yes
Set Aflag
Yes
No
data1H =data1H +1
Call Subtraction Routine
data1H =data1H + data2H
Aflag Set?
Yes
No
Clear Sflag
Clear Aflag
Return
© 2006 Microchip Technology Inc.
DS51624B-page 21
Tire Pressure Monitoring System User’s Guide
FIGURE 3-7:
SENSOR_TX SUB FLOWCHART
Byte1H – Byte2H
Result = 0?
Yes
No
Set Zflag
A borrow
ocurred?
No
Yes
Set Nflag
Byte1H = 2's compliment of Byte1H
+1
Byte1L – Byte2L
Nflag AND borrow
both = 0?
No
Nflag = 1?
No
Yes
Set Sflag
Zflag =1?
Borrow = 1?
No
No
Yes
Byte1H = Byte1H - 1
Yes
Yes
Byte1L = 2's compliment of Byte1L +
1
Return
3.6.1
Reference Documents
PROVIDE LATER
DS51624B-page 22
© 2006 Microchip Technology Inc.
TIRE PRESSURE MONITORING
SYSTEM USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the schematic and PCB layout for the Tire Pressure Monitoring
System. Diagrams included:
•
•
•
•
•
•
•
•
•
•
•
Base Station Module Schematic (Page 1)
Base Station Module Schematic (Page 2)
Base Station Wiring Harness Schematic
Base Station Module - Top Layer (with silk screen)
Base Station Module - Bottom Layer
Low Frequency Initiator Module Schematic
Low Frequency Initiator Module - Top Layer (with silk screen)
Low Frequency Initiator Module - Bottom Layer
Transponder Sensor Module Schematic
Transponder Sensor Module - Top Layer (with silk screen)
Transponder Sensor Module - Bottom Layer
© 2006 Microchip Technology Inc.
DS51624B-page 23
Tire Pressure Monitoring System User’s Guide
BASE STATION MODULE SCHEMATIC (PAGE 1)
A.2
DS51624B-page 24
© 2006 Microchip Technology Inc.
Schematic and Layouts
BASE STATION MODULE SCHEMATIC (PAGE 2)
A.3
© 2006 Microchip Technology Inc.
DS51624B-page 25
DS51624B-page 26
A
B
5
4
5
6
2
Thursday, July 06, 2006
1
1.0
A
1 of
1
Drawn by
Chuck Simmers
Size
Sheet
Rev
SCHEMATIC1
Gauge
TPMS RefDes LIN Wiring Harness
Microchip Technology, Inc.
AMAD
Automotive Products Group
2355 West Chandler Blvd.
Chandler, Arizona 85224
AMP 172168-1
APG000014
1
2
3
AMP 172168-1
3
APG
4
5
6
APG000001
1
2
3
4
+12VDC
LIN
GND
J1
1
A
B
C
J2
2
C
3
D
4
A.4
D
5
Tire Pressure Monitoring System User’s Guide
BASE STATION WIRING HARNESS - SCHEMATIC
© 2006 Microchip Technology Inc.
Schematic and Layouts
A.5
BASE STATION MODULE - TOP LAYER AND SILK SCREEN
A.6
BASE STATION MODULE - BOTTOM LAYER
© 2006 Microchip Technology Inc.
DS51624B-page 27
A
B
C
D
J1
VCC
J2
5
PWM
C7
0.1uF
R7
1
2
3
4
5
6
1
30K
IN
C4
C3
D6
TC4422
OUT
U4
IN
5
Y1
20.0MHz
+12VDC
20pF
20pF
1
C1
10uF
1N4148WX
VCC
10MQ100N
D1
6
+12VDC
3
VDD
GND
2
GND VDD
4
4
R5
3
DO5022P
L2
10-00189
L1
4
YEL
LED2
C2
10uF
LED1
TP1
10nF
400V
P3476-ND
C8
High Voltage
0.200LS
C9
RC0/T1OSO/T1CKI
RC1/T1OSI
RC2/CCP1
RC3/SCK/SCL
RC4/SDI/SDA
RC5/SDO
RC6/TX/CK
RC7/RX/DT
3
C10
3
0.200LS
11
12
13
14
15
16
17
18
21
22
23
24
25
26
27
28
GRN
VCC
R1 1K
RB0/INT0
RB1/INT1
RB2/CANTX
RB3/CANRX
RB4
RB5
PIC18F2680 RB6
RB7
RA0/AN0
RA1/AN1
RA2/AN2/VrefRA3/AN3/Vref+
RA4/T0CLI
RA5/AN4/SS/LVDIN
OSC2/CLKOUT
OSC1/CLKIN
MCLR/Vpp
U1
1K
OUT
Not populated
2
3
4
5
6
7
10
9
1
VCC
2
GND
VR1
LM2937ET-5.0
1
PWM
R6
REF
RS
C6
1.0uF
MCP201
2
Thursday, February 02, 2006
U3
CS/WAKE
TX
LIN
RX
FAULT/SLPS
GND
5
6
5
8
6
7
R3
R2
R4
CANL
CANH
VCC
VCC
MCP2551
GND
VCC
RXD
TXD
U2
15K
25K
15K
25K
APG
2
4
1
8
C5
1.0uF
VCC
2
3
4
1
D2-2
BAV99DW
D2-1
BAV99DW
1
1N4148WX
D8
D9
2
4
6
2
4
6
R10
1N4750
CON6A
1
3
5
J4
CON6A
1
3
5
J3
120
Sheet
1 of
Size
A
1
APG000001-01
LF Initiator
1
2.0
Drawn by
Chuck Simmers
Rev
03-01889 Low Frequency Magnetic Initiator
Microchip Technology, Inc.
Automotive Products Group
AMAD
2355 West Chandler Blvd.
Chandler, Arizona USA
1K
10MQ100N
D7
R9
4.7K
R8
+12VDC
To input a +5-to-0 signal,
Remove R3 or R6, Replace
R2 or R4 with 1K, and
put a 10K pull-up resistor
from RB0 or RB1 to VCC
These two input circuits are set-up for +12-to-GND signals.
2
3
VDD
DS51624B-page 28
PICkit 2
7
A
B
C
D
A.7
VBAT
5
Tire Pressure Monitoring System User’s Guide
LOW FREQUENCY INITIATOR MODULE - SCHEMATIC
© 2006 Microchip Technology Inc.
Schematic and Layouts
A.8
LOW FREQUENCY INITIATOR MODULE - TOP LAYER AND SILK SCREEN
A.9
LOW FREQUENCY INITIATOR MODULE - BOTTOM LAYER
© 2006 Microchip Technology Inc.
DS51624B-page 29
Tire Pressure Monitoring System User’s Guide
3
4
A.10 TRANSPONDER SENSOR MODULE - SCHEMATIC
6
1
5
2
DS51624B-page 30
© 2006 Microchip Technology Inc.
Schematic and Layouts
A.11 TRANSPONDER SENSOR MODULE - TOP LAYER AND SILK SCREEN
A.12 TRANSPONDER SENSOR MODULE - BOTTOM LAYER
© 2006 Microchip Technology Inc.
DS51624B-page 31
Tire Pressure Monitoring System User’s Guide
A.13 CIRCUIT BLOCK FIGURE
RC0 (Power)
R8
RC1 (Battery)
R5
RA1 (temperature)
D3
Pressure Sensor
R11
R9
R10
VDD
CS
PIC
RC2 (pressure)
RA5 (op_cs)
R12
DS51624B-page 32
© 2006 Microchip Technology Inc.
TIRE PRESSURE MONITORING
SYSTEM USER’S GUIDE
Appendix B. Bill Of Materials (BOM)
TABLE B-1:
Qty
BASE STATION MODULE BILL OF MATERIALS (BOM)
Reference
Description
Manufacturer
Part Number
1
J2
AMP770969
1
ANT1
ANT_WIRE
1-770969-0-ND
3
C1,C2,C3
CAP0805
0.1uF
PCC1828CT-ND
2
C4,C5
CAP0805
1uF
PCC1849CT-ND
2
C6,C7
CAP0805
18pF
311-1102-1-ND
2
C8,C9
CAP_VS_B
10uf
493-2099-1-ND
1
J5
CONN_PJ-007
1
Y1
CRY_CITIZEN_HCM49
20MHz
X1076-ND
0
J1
DB9M
DO NOT ASSEMBLE
1
D1
DIO-1N4148WS
1N4148WS-FDICT-ND
1
D7
DIODE-DO214
S2G
S2G-TPMSCT-ND
2
D5, D6
DIODE-DO214
SMB5819-TP
SK14-TPMSCT-ND
2
D2,D3
DIODE-SMA
10MQ100NTRPBF
10MQ100NPBFCT-ND
1
D4
DIODE_ZENER_SMA
1SMA5935BT3G
1SMA5935BT3GOSCT-ND
1
Q1
FET-BSS84-SOT23
NUD3112
1
J4
HDR2X4
CP-102B-ND
NUD3112LT1G
NUD3112LT1GOS-ND
HTSW-104-07-F-D
0
LCD2
LCD_CU16025ECPB
CU16025ECPB
DO NOT ASSEMBLE
1
LCD1
LCD_SO1602_16X2
LCM-SO1602DTR/M
67-1781-ND
1
xLCD1
16p Header
2
LED1, LED2 LED_0805
1
U6
LM2940T
1
U2
MCP201
1
U1
MCP2551-I_SN
1
U4
PIC18F4680-44TQFP
PIC18F4680
Microchip Supplied
1
R13
POT-3352E
3352T-1-103
3352T-1-103LF-ND
1
R6
RES0603
100KΩ
311-100KARCT-ND
HTSW-116-07-F-S
160-1179-1-ND
LM2937ET-5.0
LM2937ET-5.0-ND/NOPB
Microchip Supplied
Microchip Supplied
3
R5,R10,R11
RES0805
1KΩ
311-1.0KARCT-ND
2
R2,R7
RES0805
4.7KΩ
311-4.7KARCT-ND
1
R4
RES0805
14.9KΩ
311-15.0KCRCT-ND
1
R3
RES0805
24.9KΩ
28K1086
1
R12
RES0805
47KΩ
311-47KARCT-ND
1
R1
RES0805
120Ω
311-120ARCT-ND
1
R8
RES0805
470Ω
0
R9
RES0806
1
U3
RF-MODULE-RR3
1
J3
SIP_6
Note 1:
311-470ARCT-ND
DO NOT ASSEMBLE
AMRRQ3-433
PICKIT2
HTSW-106-07-G-S-RA
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
© 2006 Microchip Technology Inc.
DS51624B-page 33
Tire Pressure Monitoring System User’s Guide
TABLE B-1:
Qty
BASE STATION MODULE BILL OF MATERIALS (BOM) (CONTINUED)
Reference
Description
Manufacturer
Part Number
4
J6,J7,J8,J9
SIP_11_.05_PITCH
HMTMS-111-01-G-S-230
1
S1
SW-B3F1000
SW404-ND
1
Bag
10N298
1
PCB
REV 1
4
Feet
Note 1:
2
Anti static bag
3M
SJ-67A11
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
TABLE B-2:
Qty
Newark-In-One
BASE STATION WIRING HARNESS BILL OF MATERIALS (BOM)
Reference
J1,J2
Description
Manufacturer
Part Number
AMP 172168-1
6
A25573-ND
AMP 171639-1
1
18-gauge RED stranded wire 6" in Length
1
18-gauge BLK stranded wire 6" in Length
1
18-gauge BLU stranded wire 6" in Length
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
TABLE B-3:
Qty
LOW FREQUENCY INITIATOR MODULE BILL OF MATERIALS
Reference
Description
Manufacturer
Part Number
1
C1
100uF
P10323-ND
1
C2
10uF
P966-ND
2
C3,C4
20pF
311-1153-1-ND
2
C5,C6
1.0uF
495-1935-1-ND
1
C7
0.1uF
311-1179-1-ND
1
C8
10nF
495-1225-ND
2
C9,C10
.200LS
not assembled
2
D1,D7
10MQ100N
10MQ100NPBFCT-ND
1
D2
BAV99DW
BAV99DW-FDICT-ND
1
D6,D8
1N4148WX-TP
1N4148WXTPMSCT-ND
1
D9
1N4750 27V
1N4750ADICT-ND
1
J1
POWERPLUG
CP-102B-ND
1
J5
6pinCON Rt Angle
TSW-106-08-G-S-RA
2
J3,J4
CON6AP
1-770969-0-ND
1
LED1
Green LED
160-1179-1-ND
1
LED2
Yellow LED
160-1175-1-ND
1
L1 Primary
MCD-L160UH
MCD-L160UH
0
L1
10-00189
Ask for Lead Free
1
L2
DO5022P
not assembled
1
R11
3
R1, R5, R9
1K
28K0916
2
R2,R4
25K
28K1086
2
R3,R6
15K
28K0996
Note 1:
not assembled
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
DS51624B-page 34
© 2006 Microchip Technology Inc.
Bill Of Materials (BOM)
TABLE B-3:
Qty
LOW FREQUENCY INITIATOR MODULE BILL OF MATERIALS (CONTINUED)
Reference
Description
Manufacturer
Part Number
1
R7
30K
28K1124
1
R8
4.7K
28K1196
1
R10
120
28K0956
1
TP1
TEST POINT
not assembled
1
U1
PIC18F2680
1
U2
MCP2551
1
U3
MCP201
1
U4
TC4422
1
VR1
LM2937IMP-5.0
LM2937IMP-5.0CT-ND
1
Y1
20.0MHz
X1076-ND
1
Bag
10N298
Newark-In-One
1
PCB
REV 2.4
1
HV Shield
Drawing Supplied
4
Feet
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
TABLE B-4:
Qty
Bumpon™
TRANSPONDER SENSOR MODULE BILL OF MATERIALS (BOM)
Reference
Description
Manufacturer
Part Number
2
J7, J8
2phdr
SAMTEC
TSW-102-08-G-S
1
BT1
3003
Keystone
3003K-ND
1
xBT1
CR2032
Enerqizer
N189-ND
3
C7, C8, C10
0.1uF
Panasonic
PCC1762CT-ND
1
CCOM
1uF
Murata
490-1807-1-ND
2
C4,C5, C6
220pF
RHOM
511-1146-1-ND
1
C2
0.5pF
RHOM
511-1086-1-ND
1
C3
5pF
RHOM
511-1103-1-ND
1
C1
470pF
RHOM
511-1154-1-ND
2
D1, D3
1N4148WXTP
Micro Comercial Co
1N4148WXTPMSCT-ND
1
D2
MA2S784
Panasonic
MA2S78400LCT-ND
2
D4, D5
SD103CWS-TP
Micro Comercial Co
SD103CWSTPMSCT-ND
1
D6
UDZSTE-175.6B
RHOM
UDZSTE-175.6BCT-ND
2
LY, LZ
7.15mH
Coilcraft
5315TC-715XGLB
1
D7
Grn LED
Lite-ON
160-1183-1-ND
1
LX
7.6mH
Mc Davis
Custom Inductor
1
U3
MCP2030-I/ST
Microchip supplied
Microchip supplied
1
U8
MCP6273T-E/CH
Microchip supplied
Microchip supplied
1
U2
PIC16F684-I/ST
Microchip supplied
Microchip supplied
1
U5
Dip Socket
Assman
AR14-HZL-TT-R
1
U4
MS5407-AM
NTERSEMA
1
S1
EVQ-PJS04K
Panasonic
8048SCT-ND
2
J5, C11
NOT POPULATED
NOT POPULATED
NOT POPULATED
2
R4, R13
NOT POPULATED
NOT POPULATED
NOT POPULATED
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
© 2006 Microchip Technology Inc.
DS51624B-page 35
Tire Pressure Monitoring System User’s Guide
TABLE B-4:
Qty
TRANSPONDER SENSOR MODULE BILL OF MATERIALS (BOM) (CONTINUED)
Reference
Description
Manufacturer
Part Number
1
R14
1K
RHOM
RHM1.0KGCT-ND
1
R7
1M
RHOM
RHM1.0MGCT-ND
4
R5, R8, R9,
R10
10K
RHOM
RHM10.0KHCT-ND
3
R6, R11,
R12
100K
RHOM
RHM100KHCT-ND
1
RCOM
10M
YAGEO
311-10MERCT-ND
1
R1
47
YAGEO
311-47.0HRCT-ND
1
R2
47K
YAGEO
311-47.0KHRCT-ND
1
R3
220
YAGEO
311-220HRCT-ND
1
U1
433.92MHz
YAGEO
XC998CT-ND
1
J3
PICKIT2
SAMTEC
TSW-106-08-G-S
1
Q1
NE94433B
NEC
NE94433B-ACT-ND
1
Metal Out
bag
SPC
10N298
1
PCB
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
DS51624B-page 36
© 2006 Microchip Technology Inc.
Bill Of Materials (BOM)
NOTES:
© 2006 Microchip Technology Inc.
DS51624B-page 37
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-3910
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
08/29/06
DS51624B-page 38
© 2006 Microchip Technology Inc.