BGA Package 88-Lead (15mm × 11.25mm × 6.16mm) (Reference LTC DWG # 05-08-1526)

BGA Package
88-Lead (15mm × 11.25mm × 6.16mm)
(Reference LTC DWG # 05-08-1526 Rev Ø)
6.400
DETAIL A
Z
A
8
A2
aaa Z
7
6
5
4
3
2
1
A
A1
0.5
PIN “A1”
CORNER
B
ccc Z
4
5.9
PIN 1
C
b
D
b1
MOLD
CAP
D
E
F
SUBSTRATE
H3
G
Z
H2
// bbb Z
F
H1
H
DETAIL B
5.9
J
2.625
6.0
e
ddd M Z X Y
eee M Z
L
EPOXY/SOLDER
X
2.625
SEE NOTES
Y
E
aaa Z
K
Øb (88 PLACES)
0.5
DETAIL B
PACKAGE SIDE VIEW
DIMENSIONS
6.350
5.080
3.810
2.540
1.270
0.000
1.270
2.540
3.810
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
7
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS. DRAWING NOT TO SCALE
4.445
3.175
1.905
0.000
0.635
0.635
1.905
3.175
4.445
DETAIL A
SEE NOTES
G
3
PACKAGE TOP VIEW
0.630 ±0.025 Ø 88x
e
b
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
H3
aaa
bbb
ccc
ddd
eee
MIN
5.86
0.50
2.31
0.60
0.60
0.36
1.95
3.05
NOM
6.16
0.60
2.41
0.75
0.63
15.00
11.25
1.27
12.70
8.89
0.41
2.00
3.15
MAX
6.46
0.70
2.51
0.90
0.66
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
ball ht.
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
0.46
2.05
3.25
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 88
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
sub.
mold cap ht.
IND ht.
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 88 0216 REV Ø
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