Datasheet

XR3G
Shrink IC Sockets
IC Socket for Shrink ICs.
■ IC socket designed exclusively for shrink ICs with
1.778-mm contact pitch.
■ Round-pin types for long life and good for shock
and vibration durability.
■ No flux rise.
RoHS Compliant
■ Construction
■ Contact Dimensions (unit: mm)
DIP Terminals
Inner clip
Base
0.51 dia.
Outer sleeve
■ Ratings and Characteristics
■ Materials and Finish
Rated voltage
1A
Base
PET (UL94 V-0)/black
Rated current
150 VAC
Inner clips
Contact resistance
20 mΩ max. (at 20 mV, 100 mA max.)
Beryllium copper/nickel base, 0.75-μm gold
plating
Outer sleeves
Brass/nickel base, gold flash plating
Insulation resistance 1,000 MΩ min. (at 500 VDC)
Dielectric strength
500 VAC for 1 min (leakage current: 1 mA
max.)
Insertion force
3.92 N max. (with test gauge, 0.432 mm
dia.)
Removal force
0.64 N min. (with test gauge, 0.432 mm
dia.)
Insertion durability
100 times (with 0.75-μm gold plating)
50 times (with 0.25-μm gold plating)
Ambient operating
temperature
− 55 to 125°C (with no condensation or
icing)
■ Applicable IC Lead Dimensions
Lead
Depth × width (mm)
Flat leads
0.29 ±0.09 × 0.46 ±0.08 (See note 1.)
Round leads
0.53 dia. max.
Note:
0.41 dia. min.
1. Do not use wire where diagonal is more than 0.56 mm.
2. IC lead length of 3 mm or more (If the lead terminal is
too long, the IC may rise up.)
1
XR3G Shrink IC Sockets
■ Dimensions
(unit: mm)
[email protected]
(With DIP terminals)
3 max.
0.51 dia.
1.13 dia.
[email protected]
[email protected]
[email protected]
[email protected]
(With DIP terminals)
3 max.
0.51 dia.
1.13 dia.
0.7 +0.1
dia.
0
Mounting holes (bottom view)
Dimensions
No. of
contacts
■ Ordering Information
No. of
contacts
Sockets with
0.25-μm gold plating
Sockets with
0.75-μm gold plating
28
XR3G-2811
XR3G-2801
32
XR3G-3211
XR3G-3201
42
XR3G-4211
XR3G-4201
52
XR3G-5211
XR3G-5201
64
XR3G-6411
XR3G-6401
2
IC Sockets (Shrink Type) XR3G
Dimensions (mm)
A
D
E
28
10.16
12.7
B
23.114
C
25.7
5.6
32
10.16
12.7
26.670
29.2
5.6
42
15.24
17.8
35.560
38.1
10.7
52
15.24
17.8
44.450
47.0
10.7
64
19.05
21.6
55.118
57.7
14.5
■ Precautions
Correct Use
Soldering
• When soldering, make sure that the outer sleeve of the IC Socket
does not stick out of the circuit board through-holes.
• Make sure that no flux enters the IC Socket from the top.
Automated Soldering Conditions (Jet Flow)
1. Soldering temperature: 250 ±5°C
2. Continuous soldering time: Within 5±1 s
• Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product.
• Consult your OMRON representative before using the product under conditions which are not described in the manual or applying the product to nuclear control systems, railroad
systems, aviation systems, vehicles, combustion systems, medical equipment, amusement machines, safety equipment, and other systems or equipment that may have a serious
influence on lives and property if used improperly. Make sure that the ratings and performance characteristics of the product provide a margin of safety for the system or
equipment, and be sure to provide the system or equipment with double safety mechanisms.
Note: Do not use this document to operate the Unit.
OMRON Corporation
ELECTRONIC AND MECHANICAL COMPONENTS COMPANY
Contact: www.omron.com/ecb
IC Sockets (Shrink Type)
Cat. No. G064-E1-02
1014(0412)(O)
XR3G
3
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