XR3G Shrink IC Sockets IC Socket for Shrink ICs. ■ IC socket designed exclusively for shrink ICs with 1.778-mm contact pitch. ■ Round-pin types for long life and good for shock and vibration durability. ■ No flux rise. RoHS Compliant ■ Construction ■ Contact Dimensions (unit: mm) DIP Terminals Inner clip Base 0.51 dia. Outer sleeve ■ Ratings and Characteristics ■ Materials and Finish Rated voltage 1A Base PET (UL94 V-0)/black Rated current 150 VAC Inner clips Contact resistance 20 mΩ max. (at 20 mV, 100 mA max.) Beryllium copper/nickel base, 0.75-μm gold plating Outer sleeves Brass/nickel base, gold flash plating Insulation resistance 1,000 MΩ min. (at 500 VDC) Dielectric strength 500 VAC for 1 min (leakage current: 1 mA max.) Insertion force 3.92 N max. (with test gauge, 0.432 mm dia.) Removal force 0.64 N min. (with test gauge, 0.432 mm dia.) Insertion durability 100 times (with 0.75-μm gold plating) 50 times (with 0.25-μm gold plating) Ambient operating temperature − 55 to 125°C (with no condensation or icing) ■ Applicable IC Lead Dimensions Lead Depth × width (mm) Flat leads 0.29 ±0.09 × 0.46 ±0.08 (See note 1.) Round leads 0.53 dia. max. Note: 0.41 dia. min. 1. Do not use wire where diagonal is more than 0.56 mm. 2. IC lead length of 3 mm or more (If the lead terminal is too long, the IC may rise up.) 1 XR3G Shrink IC Sockets ■ Dimensions (unit: mm) XR3G-64@1 (With DIP terminals) 3 max. 0.51 dia. 1.13 dia. XR3G-28@1 XR3G-32@1 XR3G-42@1 XR3G-52@1 (With DIP terminals) 3 max. 0.51 dia. 1.13 dia. 0.7 +0.1 dia. 0 Mounting holes (bottom view) Dimensions No. of contacts ■ Ordering Information No. of contacts Sockets with 0.25-μm gold plating Sockets with 0.75-μm gold plating 28 XR3G-2811 XR3G-2801 32 XR3G-3211 XR3G-3201 42 XR3G-4211 XR3G-4201 52 XR3G-5211 XR3G-5201 64 XR3G-6411 XR3G-6401 2 IC Sockets (Shrink Type) XR3G Dimensions (mm) A D E 28 10.16 12.7 B 23.114 C 25.7 5.6 32 10.16 12.7 26.670 29.2 5.6 42 15.24 17.8 35.560 38.1 10.7 52 15.24 17.8 44.450 47.0 10.7 64 19.05 21.6 55.118 57.7 14.5 ■ Precautions Correct Use Soldering • When soldering, make sure that the outer sleeve of the IC Socket does not stick out of the circuit board through-holes. • Make sure that no flux enters the IC Socket from the top. Automated Soldering Conditions (Jet Flow) 1. Soldering temperature: 250 ±5°C 2. Continuous soldering time: Within 5±1 s • Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product. • Consult your OMRON representative before using the product under conditions which are not described in the manual or applying the product to nuclear control systems, railroad systems, aviation systems, vehicles, combustion systems, medical equipment, amusement machines, safety equipment, and other systems or equipment that may have a serious influence on lives and property if used improperly. Make sure that the ratings and performance characteristics of the product provide a margin of safety for the system or equipment, and be sure to provide the system or equipment with double safety mechanisms. Note: Do not use this document to operate the Unit. OMRON Corporation ELECTRONIC AND MECHANICAL COMPONENTS COMPANY Contact: www.omron.com/ecb IC Sockets (Shrink Type) Cat. No. G064-E1-02 1014(0412)(O) XR3G 3