LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL COLOR LED LAMPS Pb Lead-Free Parts LHYSSBKS2092/TBS-2 DATA SHEET DOC. NO : QW0905- LHYSSBKS2092/TBS-2 REV. : B DATE : 19 -Dec. - 2011 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LHYSSBKS2092/TBS-2 Page 1/9 Package Dimensions P2 H2 W2 H1 L W0 W3 W1 D - + - F F SBKS P1 P HYS 1 2 3 1.ANODE BLUE 2.COMMON CATHODE 3.ANODE YELLOW T LHYSSBKS2092 3.0 4.0 4.2 5.2 6.7±0.5 1.5 MAX SBKS □0.5 TYP 18.0MIN 1 2 3 HYS 1 2 3 1.ANODE BLUE 2.COMMON CATHODE 3.ANODE YELLOW 2.0MIN 2.0MIN 2.54TYP 2.54TYP Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHYSSBKS2092/TBS-2 Page 2/9 Absolute Maximum Ratings at Ta=25 ℃ Absolute Maximum Ratings Symbol Parameter UNIT HYS SBKS Forward Current IF 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 60 100 mA Power Dissipation PD 75 120 mW Ir 10 50 μA Electrostatic Discharge( * ) ESD 2000 500 V Operating Temperature Topr -40 ~ +85 -20 ~ +80 ℃ Storage Temperature Tstg -40 ~ +100 -30 ~ +100 ℃ Reverse Current @5V Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted AlGaInP Yellow InGaN/SiC Blue LHYSSBKS2092/TBS-2 Lens Peak wave length λDnm Spectral halfwidth △λnm Forward Luminous voltage intensity @20mA(V) @20mA(mcd) Viewing angle 2θ 1/2 (deg) Min. Max. Min. Max. Min. Max. 580 592 15 465 480 26 1.7 2.6 160 1500 50 White Diffused 3.0 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 4.2 65 700 50 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHYSSBKS2092/TBS-2 Page 3/9 •Dimensions Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 2.3 0.09 3.0 0.12 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 TBS-2 Feed Hole To Bottom Of Component 21.5 0.85 22.5 0.89 ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- H1 ------- Feed Hole To Overall Component Height ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- ------- 36 1.42 11.0 0.43 ------- H2 Lead Length After Component Height ------- L Feed Hole Pitch ------- P 12.4 0.49 13.0 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19.0 0.75 W0 REMARK:TBS=Tape And Box Straight Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum W mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50 1.97 60 2.4 Quantity/Box 2500PCS L H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page4/9 PART NO. LHYSSBKS2092/TBS-2 Typical Electro-Optical Characteristics Curve HYS CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 1.5 2.0 2.5 3.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 100 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA 100 650 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/9 PART NO. LHYSSBKS2092/TBS-2 Typical Electro-Optical Characteristics Curve SBK-S CHIP Fig.2 Relative Intensity vs. Forward Current 30 1.5 Relative Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 25 20 15 10 5 0 2 3 4 1.0 0.75 0.5 0.25 0 5 0 5 10 15 20 25 30 Forward Voltage(V) Forward Current(mA) Fig.3 Forward Current vs. Temperature Fig.4 Relative Intensity vs. Wavelength 40 Relative Intensity@20mA Forward Current@20mA 1 1.25 30 20 10 0 0 25 50 75 100 Ambient Temperature( ℃) 0° 30° -60 ° 100% 75% 50% 60° 25% 0 25% 0.5 0 380 430 480 530 580 Wavelength (nm) Directivity Radiation -30 ° 1.0 50% 75% 100% 630 680 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/9 PART NO. LHYSSBKS2092/TBS-2 Brightness Code For Standard LED Lamps HYS CHIP Group Luminous Intensity(mcd) at 20 mA Min. Max. A14 160 220 A15 220 300 A16 300 350 A17 350 450 A18 450 550 A19 550 700 A20 700 900 A21 900 1100 A22 1100 1500 Color Code HYS CHIP Group Dominant Wave length(nm) at 20 mA Min. Max. 13 580 583 14 583 585 15 585 587 16 587 589 17 589 592 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/9 PART NO. LHYSSBKS2092/TBS-2 Brightness Code For Standard LED Lamps SBKS CHIP Group Luminous Intensity(mcd) at 20 mA Max. A11 Min. 65 A12 90 120 A13 120 160 A14 160 220 A15 220 300 A16 300 350 A17 350 450 A18 450 550 550 700 A19 90 Color Code SBKS CHIP Group Dominant Wave length(nm) at 20 mA Min. Max. 5 6 465 468 468 471 7 471 474 8 474 477 9 477 480 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHYSSBKS2092/TBS-2 Page 7/9 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 50 100 60 Seconds Max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/9 PART NO. LHYSSBKS2092/TBS-2 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11