LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LDGM63233Z/S1-LTS/TRS-6N DATA SHEET DOC. NO : QW0905-LDGM63233Z/S1-LTS/TRS-6N REV. : A DATE : 10 - Aug. - 2012 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/6 PART NO. LDGM63233Z/S1-LTS/TRS-6N Package Dimensions P2 ΔH W2 H2 H1 L W0 W1 D P1 P W3 F T + - Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 4.8 5.8 R2.4 4.4 9.75 1.5MAX 0.6 1.3 25.0MIN Zener ∅0.5TYP 1.0MIN - + 2.54TYP + - DGM LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM63233Z/S1-LTS/TRS-6N Page 2/6 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT DGM Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 120 mW Ir 50 μA Electrostatic Discharge( * )` ESD 8000 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Reverse Current @5V Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted LDGM63233Z/S1-LTS/TRS-6N Peak Dominant Spectral Forward voltage wave halfwidth wave length length △λ nm @20mA(V) λPnm λDnm @20mA(mcd) Viewing angle 2θ 1/2 (deg) Typ. Max. Min. Typ. Lens InGaN/GaN Green Water Clear 518 Luminous intensity 525 36 3.5 Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 4.0 1500 2700 60 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM63233Z/S1-LTS/TRS-6N Page 3/6 •Dimension Symbol Information OPTION SYMBOL CODE SYMBOL ITEMS SPECIFICATIONS Maximum mm inch Minimum mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 2.3 0.09 3.0 0.12 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 TRS-6N H1 19.9 0.78 20.9 0.82 Feed Hole To Overall Component Height ------- H2 ------- 36 1.42 Lead Length After Component Height ------- L 11.0 0.43 Feed Hole Pitch ------- P 12.4 0.49 13.0 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19 0.75 Feed Hole To Bottom Of Component ------- W0 REMARK:TRS=Tape And Reel Straight Leads • Dimensions Symbol Information Description Symbol • Package Dimensions Specification minimum maxmum mm inch mm inch Reel Diameter D 78.2 3.08 380 14.96 Core Diameter D1 34.9 1.37 102 4.02 Hub Recess Inside Diameter D2 28.6 1.13 88.0 3.46 Arbor Hole Diameter D3 T2 13.8 0.54 38.1 1.5 Overall Reel Thickness 57.2 2.25 Iside Reel Flange Thickness T1 30.0 50.0 1.97 Package LDGM63233Z/S1-LTS/TRS-6N 1.18 Quantity/Reel 1000PCS D3 MARKING D2 D1 D T1 T2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/6 PART NO. LDGM63233Z/S1-LTS/TRS-6N Typical Electro-Optical Characteristics Curve DGM CHIP Fig.2 Relative Intensity vs. Forward Current Fig.1 Forward current vs. Forward Voltage 3.0 2.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 5.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 2.5 2.0 1.5 1.0 0.5 0.0 100 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.6 Directivity Radiation Fig.5 Relative Intensity vs. Wavelength 0° 1.0 Relative Intensity@20mA 100 -30° 30° -60° 0.5 100% 75% 50% 0.0 450 500 550 Wavelength (nm) 600 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/6 PART NO. LDGM63233Z/S1-LTS/TRS-6N Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM63233Z/S1-LTS/TRS-6N Page 6/6 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=240 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11