LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DURL COLOR LED LAMPS Pb Lead-Free Parts LHIRSBKS34493/R23 DATA SHEET DOC. NO : QW0905-LHIRSBKS34493/R23 REV. : DATE : A 13 - May - 2013 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/6 PART NO. LHIRSBKS34493/R23 Package Dimensions 5.0 4.3 5.8 SBKS HIR 5.3 7.3±0.5 1.5 MAX 1 ∅0.5 TYP 2 3 18.0MIN 1 2 3 2.0MIN 2.0MIN 2.54TYP 1.ANODE BLUE 2.COMMON CATHODE 3.ANODE INFRARED 2.54TYP + - + Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 PART NO. LHIRSBKS34493/R23 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SBKS HIR IF 30 50 mA IFP ---- 1 A IFP 100 ---- mA Power Dissipation PD 120 100 mW Reverse Voltage Vr 10 5 V Operating Temperature Topr -20 ~ +80 -40 ~ +85 ℃ Storage Temperature Tstg -30 ~ +100 -40 ~ +85 ℃ Forward Current Peak Forward Current (300PPS,10 μs Pulse) Peak Forward Current Duty 1/10@10KHz HIR Electrical Optical Characteristics (Aa=25℃) SYMBOL Min. Typ. Radiant Intensity Le 3 Aperture Radiant Incidence Ee 0.42 Peak Emission Wavelength Max. UNIT TEST CONDITION 5 mW/sr IF=20mA 0.7 mW/cm IF=20mA λpeak 850 nm IF=20mA △λ 50 nm IF=20mA Forward Voltage VF 1.2 1.6 V IF=20mA Reverse Current IR 100 μA VR=5V PARAMETER Spectral Line Half Width 2 SBK Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted InGaN/SiC LHIRSBKS34493 /R23 Forward Dominant Spectral voltage wave halfwidth length △λ nm @20mA(V) λDnm @20mA(mcd) Viewing angle 2θ 1/2 (deg) Min. Typ. Max. Min. Typ. Lens Blue Luminous intensity 475 26 ---- ---- ---- 3.5 4.2 50 90 120 Water Clear GaAIAs Infrared Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The radiant intensity data did not including ±15% testing tolerance. ---- ---- 120 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/6 PART NO.LHIRSBKS34493/R23 Typical Electro-Optical Characteristics Curve HIR CHIP Fig.2 Relative Radiant Power vs. Wavelength Fig.1 Forward Current vs. Rorward Voltage 1.0 Relative Radiant Power Normalize @20mA Forward Current[mA] 1000 100 10 1 0.1 0.0 1.0 2.0 3.0 4.0 0.5 0.0 800 850 Wavelength[nm] Forward Voltage[V] Fig.3 Relative Radiant Power vs. Forward DC Current Fig.4 Relative Radiant Power vs. Forward Peak Current 10.0 Relative Radiant Power Normalize @100 mA Relative Radiant Power Normalize @20mA 10.0 1.0 0.1 1 10 1.0 0.1 10 100 100 Fig.5 Forward DC Voltage vs. Temperature Fig.6 Relative Radiant Power vs. Temperature 1.1 1.0 0.9 -20 0 20 40 60 Ambient Temperature [℃] 80 100 Relative Radiant Power Normalize @ 20mA, 25 ℃ 1.2 0.8 -40 1000 IFPK[mA] IFDC[mA] Forward DC Voltage Normalize @20mA, 25 ℃ 950 900 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature[ ℃] 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/6 PART NO. LHIRSBKS34493/R23 Typical Electro-Optical Characteristics Curve SBK-S CHIP Fig.2 Relative Intensity vs. Forward Current 30 1.5 Relative Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 25 20 15 10 5 0 1.25 1.0 0.75 0.5 0.25 0 1 2 3 4 5 0 5 Relative Intensity@20mA Forward Current@20mA 40 30 20 10 0 25 50 75 Ambient Temperature( ℃) 15 20 25 30 Fig.4 Relative Intensity vs. Wavelength Fig.3 Forward Current vs. Temperature 0 10 Forward Current(mA) Forward Voltage(V) 100 1.0 0.5 0 380 430 480 530 580 Wavelength (nm) 630 680 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/6 PART NO. LHIRSBKS34493/R23 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260°C3sec Max 260° 5°/sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page6/6 PART NO. LHIRSBKS34493/R23 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃± 5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃± 5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃± 5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11