1.5 MB

The following document contains information on Cypress products.
FUJITSU MICROELECTRONICS
DATA SHEET
DS04–27266–2E
ASSP (for Mobile Terminals)
Power Management IC for Mobile Terminals
3ch DC/DC Converter + 4ch LDO
MB39C316
■ DESCRIPTION
The MB39C316 is equipped with the 3 ch DC/DC converter and the 4 ch linear regulator (LDO), and is the
power supply LSI for mobile terminals which operate in the range of power supply voltage with 1-cell Li-ion
power by 1ch high efficiency voltage step-up/down DC/DC.
The MB39C316 contains the 2ch synchronous rectification DC/DC converter with current mode system and
the 1ch voltage step-up/down DC/DC converter. Detecting load current by each DC/DC converter alternates
the Normal mode (PWM) with the ECO mode (PFM) automatically.
MB39C316 has the built-in 4ch LDO which is suitable to supply voltage to the system block and the built-in
1ch LDO which generates stable internal reference voltage.
It is possible to control a notice of internal condition, the power supply and reset in order to support the
communication interface which is compliant with the I2C bus standard.
■ FEATURES
•
•
•
•
•
•
•
•
•
Input voltage range
: 2.7 V to 5.5 V
Step-down regulators
: 2 channels
Step-up/down regulator
: 1 channel
Linear regulator (LDO)
: 4 channels
Possible to select output voltage : LDO3 1.2 V/1.3 V (register setting)
On/Off control of LDO and DC/DC converter by external signals and register settings
Compliant with I2C bus standard (Max 400 kbps)
Possible to output the 32.768 kHz clock by connecting crystal oscillator
Protection function:Over current protection (OCP), Output short circuit protection (SCP),
Under voltage lock out protection (UVLO), Over temperature protection (OTP)
• Package
: 49 pin, WL-CSP (3.14 mm × 3.11 mm × 0.8 mm)
■ APPLICATIONS
• Mobile WiMAX terminals
• Other mobile terminals etc.
Copyright©2009 FUJITSU MICROELECTRONICS LIMITED All rights reserved
2009.1
MB39C316
■ PIN ASSIGNMENT
(BOTTOM VIEW)
G
F
E
D
C
B
A
7
7
NC3
VDD31
SWOUT31
DGND31
SWIN31
DDOUT31
NC2
6
6
FB3
VDD32
SWOUT32
DGND32
SWIN32
DDOUT32
OSCIN
5
5
AGND
VCC_D
LDOCNT1
LDOCNT2
VIN_RTC
GND1
OSCOUT
4
4
SWOUT1
VDD1
FB1
SCL
V24IO
VFIL2
VFIL1
3
3
DGND1
DGND2
FB2
SDA
ONOFF
VCC1
LDOOUT2
2
2
SWOUT2
VDD2
XRST2
GND2
VCC4
VCC2
VCC3
1
2
1
NC4
RTC_CLK
XRST1
LDOOUT4
LDOOUT1
LDOOUT3
NC1
G
F
E
D
C
B
A
DS04–27266–2E
MB39C316
■ PIN DISCRIPTIONS
Block
External
power
supply
Constant
voltage
power
supply
I2C
interface
RTC
Start/Stop
Reference
voltage
Pin No.
Pin name
I/O
Descriptions
B3
VCC1
I
Power supply input, Power supply input pin for LDO2, LDO3
control
B2
VCC2
I
Power supply input pin for LDO2 power
A2
VCC3
I
Power supply input pin for LDO3 power
C2
VCC4
I
Power supply input pin for LDO1, LDO4 control/power
F5
VCC_D
I
Power supply input pin for DC/DC converter control
F4
VDD1
I
Power supply input pin for DC/DC1 converter power
F2
VDD2
I
Power supply input pin for DC/DC2 converter power
F7
VDD31
I
Power supply input pin 1 for DC/DC3 converter power
F6
VDD32
I
Power supply input pin 2 for DC/DC3 converter power
C5
VIN_RTC
I
Power supply input pin for RTC
E5
LDOCNT1
I
LDO output control input pin 1
D5
LDOCNT2
I
LDO output control input pin 2
D1
LDOOUT4
O
LDO4 output pin ( + 2.9 V)
B1
LDOOUT3
O
LDO3 output pin ( + 1.2 V/1.3 V)
C1
LDOOUT1
O
LDO1 output pin ( + 2.9 V)
A3
LDOOUT2
O
LDO2 output pin ( + 1.2 V)
G4
SWOUT1
O
DC/DC1 converter inductance connection output pin
E4
FB1
I
DC/DC1 converter output voltage feedback input pin (1.2 V)
G2
SWOUT2
O
DC/DC2 converter inductance connection output pin
E3
FB2
I
DC/DC2 converter output voltage feedback input pin (1.8 V)
E7
SWOUT31
⎯
DC/DC3 converter inductance connection pin 1
E6
SWOUT32
⎯
DC/DC3 converter inductance connection pin 2
C7
SWIN31
⎯
DC/DC3 converter inductance connection pin 1
C6
SWIN32
⎯
DC/DC3 converter inductance connection pin 2
B7
DDOUT31
O
DC/DC3 converter output pin 1
B6
DDOUT32
O
DC/DC3 converter output pin 2
G6
FB3
I
DC/DC3 converter output voltage feedback input pin (3.3 V)
D4
SCL
I
I2C interface clock input pin
D3
SDA
I/O
A6
OSCIN
I
Input pin for crystal oscillator connection
A5
OSCOUT
O
Output pin for crystal oscillator connection
F1
RTC_CLK
O
32.768 kHz Clock output pin
C3
ONOFF
I
Enable pin for the MB39C316
E1
XRST1
O
Reset output pin 1
E2
XRST2
O
Reset output pin 2
C4
V24IO
O
Power supply output pin for internal 2.4 V I/O
A4
VFIL1
O
Reference voltage output pin 1 (0.47 µF connected )
B4
VFIL2
O
Reference voltage output pin 2 (0.47 µF connected )
I2C interface data I/O pin
(Continued)
DS04–27266–2E
3
MB39C316
(Continued)
Block
Pin No.
TEST
GND
4
Pin name
I/O
Descriptions
A1
NC1
⎯
Pin for TEST (Set to Non Connect. Prohibited to connect to others.)
A7
NC2
⎯
Pin for TEST (Set to Non Connect. Prohibited to connect to others.)
G7
NC3
⎯
Pin for TEST (Set to Non Connect. Prohibited to connect to others.)
G1
NC4
⎯
Pin for TEST (Set to Non Connect. Prohibited to connect to others.)
B5
GND1
⎯
Ground pin (COMMON, RTC)
D2
GND2
⎯
Ground pin (LDO, INPUT_IF, OUTPUT_IF)
G5
AGND
⎯
Ground pin (DC/DC converter control block)
G3
DGND1
⎯
DC/DC1 converter ground pin
F3
DGND2
⎯
DC/DC2 converter ground pin
D7
DGND31
⎯
DC/DC3 converter ground pin 1
D6
DGND32
⎯
DC/DC3 converter ground pin 2
DS04–27266–2E
MB39C316
■ BLOCK DIAGRAM
MB39C316
VCC1
SCL
I2C interface
SDA
ONOFF
XRST1
VIN_RTC
OSCIN
OSCOUT
RTC_CLK
Control start/stop
RTC
XRST2
Constant voltage power supply
LDOCNT1
VCC_D
LDOCNT2
VDD1
DC/DC1 converter
SWOUT1
step down
1.200 V 800 mA
VCC4
LDOOUT1
LDO1
2.875 V 200 mA
FB1
DGND1
VDD2
DC/DC2 converter
SWOUT2
LDOOUT4
VCC2
LDOOUT2
LDO4
2.925 V 6.5 mA
LDO2
1.225 V 260 mA
step down
1.825 V 600 mA
FB2
DGND2
VDD31
VDD32
SWOUT31
SWOUT32
SWIN31
SWIN32
DDOUT31
DDOUT32
FB3
DGND31
DGND32
DC/DC3 converter
step up/down
3.300 V 650 mA
VCC3
LDOOUT3
LDO3
1.200 V, 1.300 V 84 mA
Reference voltage output
Protection circuit
(UVLO, OTP, SCP, OCP)
V24IO
VFIL1
VFIL2
LDO5
NC1
NC2
Test circuit
NC3
NC4
GND1
DS04–27266–2E
GND2
AGND
5
MB39C316
■ ABSOLUTE MAXIMUM RATINGS
Parameter
Power supply voltage
Input voltage
Storage temperature
range
ESD
withstand voltage
latch-up
withstand voltage
Symbol
Condition
Rating
Min
Max
Unit
Vmax1
VCC1, VCC_D, VDD1,
VDD2, VDD31, VDD32
− 0.3
+ 6.0
V
Vmax2
VCC2, VCC3
− 0.3
+ 6.0
V
Vmax3
VCC4
− 0.3
+ 6.0
V
Vmax4
VIN_RTC
− 0.3
+ 3.6
V
Vinmax1
LDOCNT1, LDOCNT2, SCL,
SDA
− 0.3
Vvcc3 + 0.3
V
Vinmax2
ONOFF, FB1, FB2, FB3
− 0.3
Vvcc1 + 0.3
V
Vinmax3
OSCIN
− 0.3
Vrtc
V
− 55
+ 125
°C
⎯
Tstg
Vesdh
Human Body Model
(100 pF, 1.5 kΩ)
− 1000
+ 1000
V
Vesdm
Machine Model (200 pF, 0 Ω)
− 100
+ 100
V
EIA/JEDEC Standard
− 150
+ 150
mA
Vlatchup
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
■ RECOMMENDED OPERATION CONDITIONS
Parameter
Power supply voltage
Symbol
Operating
temperature range
Value
Min
Typ
Max
Unit
Vvcc1
VCC1, VCC_D, VDD1,
VDD2, VDD31, VDD32
2.7
3.3
5.5
V
Vvcc2
VCC2, VCC3
1.75
⎯
1.90
V
Vvcc3
VCC4
3.2
⎯
5.5
V
2.325
⎯
2.475
V
Vrtc
Input voltage
Condition
VIN_RTC
VIvcc1
ONOFF
0.0
⎯
Vvcc1
V
VIvcc3
LDOCNT1, LDOCNT2, SCL,
SDA
0.0
⎯
Vvcc3
V
VIdd1
FB1
0.0
⎯
Voutdd1
V
VIdd2
FB2
0.0
⎯
Voutdd2
V
VIdd3
FB3
0.0
⎯
Voutdd3
V
VIrtc
OSCIN
0.0
⎯
Vrtc
V
− 30
⎯
+ 85
°C
Ta
⎯
WARNING: The recommended operating conditions are required in order to ensure the normal operation of
the semiconductor device. All of the device's electrical characteristics are warranted when the
device is operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges.
Operation outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented
on the data sheet. Users considering application outside the listed conditions are advised to contact
their representatives beforehand.
6
DS04–27266–2E
MB39C316
■ ELECTRICAL CHARACTERISTICS
1. DC characteristics
(Ta = − 30 °C to + 85 °C, Vvcc1 = 2.7 V to 5.5 V ,Vvcc3 = 3.2 V to 5.5 V,
Vvcc2 = 1.75 V to 1.90 V,Vrtc = 2.325 V to 2.475 V)
Parameter
LDO1
LDO2
Symbol
Value
Condition
Unit
Min
Typ
Max
2.800
2.875
3.000
V
200
⎯
⎯
mA
⎯
5
⎯
mV
⎯
20
⎯
mV
f = 1 kHz
⎯
60
⎯
dB
f = 10 kHz
⎯
40
⎯
dB
f = 10 Hz to 100 kHz,
Iout = 10 mA to Iomax
⎯
30
45
µVrms
Output voltage
Voutld1
Iout = 0 to Iomax
Maximum output
current
Ioutld1
⎯
Input stability
Vlineld1
Load stability
Vloadld1 Iout = 0 to Iomax
Ripple removal
ratio
RR1kld1 Vinput = 0.2 Vpp,
Vvcc1 = 3.3 V,
RR10kld1 Iout = Iomax/2
Output noise
voltage
Vnoiseld1
Iout = − 10 mA
Rise time
Trld1
Vvcc1 = 3.3 V, Iout = 0 mA,
Vout = 90%
⎯
200
⎯
µs
Fall time
Tfld1
Vvcc1 = 3.3 V, Iout = 0 mA,
Vout = 10%
⎯
70
⎯
µs
1.150
1.225
1.300
V
260
⎯
⎯
mA
⎯
5
⎯
mV
⎯
25
⎯
mV
f = 1 kHz
⎯
60
⎯
dB
f = 10 kHz
⎯
40
⎯
dB
f = 10 Hz to 100 kHz,
Iout = 10 mA to Iomax
⎯
30
45
µVrms
Output voltage
Voutld2
Iout = 0 to Iomax
Maximum output
current
Ioutld2
⎯
Input stability
Vlineld2
Load stability
Vloadld2 Iout = 0 to Iomax
Ripple removal
ratio
RR1kld2 Vinput = 0.2 Vpp,
Vvcc1, Iout = 1 mA
RR10kld2 to Iomax
Output noise
voltage
Vnoiseld2
Iout = − 10mA
Rise time
Trld2
Vvcc1, Iout = 0 mA,
Vout = 90%
⎯
70
⎯
µs
Fall time
Tfld2
Vvcc1, Iout = 0 mA,
Vout = 10%
⎯
150
⎯
µs
(Continued)
DS04–27266–2E
7
MB39C316
Parameter
Output voltage
Voutld3
Value
Condition
Unit
Min
Typ
Max
Iout = 0 to Iomax, VSEL_SYN =
“0” ( register 02H[0])
1.100
1.200
1.300
V
Iout = 0 to Iomax, VSEL_SYN =
“1” ( register 02H[0])
1.200
1.300
1.400
V
84
⎯
⎯
mA
⎯
5
⎯
mV
⎯
20
⎯
mV
f = 1 kHz
⎯
60
⎯
dB
f = 10 kHz
⎯
40
⎯
dB
f = 10 Hz to 100 kHz,
Iout = 10 mA to Iomax
⎯
30
40
µVrms
Maximum output
current
Ioutld3
Input stability
Vlineld3
Load stability
Vloadld3 Iout = 0 to Iomax
Ripple removal
ratio
RR1kld3 Vinput = 0.2 Vpp,
Vvcc1,
RR10kld3 Iout = 1mA to Iomax
Output noise
voltage
Vnoiseld3
LDO3
LDO4
Symbol
⎯
Iout = − 10 mA
Rise time
Trld3
Vvcc1, Iout = 0 mA,
Vout = 90%
⎯
60
⎯
µs
Fall time
Tfld3
Vvcc1, Iout = 0 mA,
Vout = 10%
⎯
150
⎯
µs
2.850
2.925
3.000
V
6.5
⎯
⎯
mA
⎯
5
⎯
mV
Iout = 0 to Iomax
Output voltage
Voutld4
Maximum output
current
Ioutld4
Input stability
Vlineld4
Load stability
Vloadld4 Iout = 0 to Iomax
⎯
5
⎯
mV
Ripple removal
ratio
RR1kld4 Vinput = 0.2 Vpp,
f = 1 kHz
Vvcc1 = Vvcc3 = 3.3 V,
RR10kld4 Iout = 1 mA to Iomax f = 10 kHz
⎯
60
⎯
dB
⎯
40
⎯
dB
Output noise
voltage
Vnoiseld4
f = 10 Hz to 100 kHz,
Iout = 1 mA to Iomax
⎯
30
40
µVrms
⎯
Iout = − 6.5 mA
Rise time
Trld4
Vvcc1 = Vvcc3 = 3.3 V,
Iout = 0 mA, Vout = 90%
⎯
130
⎯
µs
Fall time
Tfld4
Vvcc1 = Vvcc3 = 3.3 V,
Iout = 0 mA, Vout = 10%
⎯
70
⎯
µs
(Continued)
8
DS04–27266–2E
MB39C316
Parameter
Symbol
Condition
Typ
Max
1.100
1.200
1.300
V
800
⎯
⎯
mA
Vrpldd11 Iout = 0 to Iomax
⎯
15
⎯
mV
Vlinedd1 Vvcc1 = 2.7 V to 5.5 V
⎯
10
⎯
mV
Vloaddd1 Iout = − 1 mA to Iomax
⎯
⎯
20
mV
Voutdd1 Iout = 0 to Iomax
Maximum
output current
Ioutdd1
DC/DC1 Input stability
converter Load stability
Unit
Min
Output voltage
Output ripple
voltage
Value
⎯
Oscillation
frequency
Fdd1
PWM mode
⎯
1.7
⎯
MHz
Efficiency
ηdd1
Vvcc1 = 3.3 V, Iout = − 200 mA
75
85
⎯
%
Rise time
Trdd1
Vvcc1 = 3.3 V, Iout = 0 mA
⎯
50
⎯
µs
Fall time
Tfdd1
Vvcc1 = 3.3 V, Iout = 0 mA
⎯
200
⎯
µs
1.750
1.825
1.900
V
600
⎯
⎯
mA
Vrpldd21 Iout = 0 to Iomax
⎯
15
⎯
mV
Vlinedd2 Vvcc1 = 2.7 V to 5.5 V
⎯
10
⎯
mV
Vloaddd2 Iout = − 1 mA to Iomax
⎯
⎯
20
mV
Output voltage
Voutdd2 Iout = 0 to Iomax
Maximum
output current
Ioutdd2
Output ripple
voltage
DC/DC2 Input stability
converter Load stability
⎯
Oscillation
frequency
Fdd2
PWM mode
⎯
1.7
⎯
MHz
efficiency
ηdd2
Vvcc1 = 3.3 V, Iout = − 200 mA
80
90
⎯
%
Rise time
Trdd2
Vvcc1 = 3.3 V, Iout = 0 mA
⎯
50
⎯
µs
Fall time
Tfdd2
Vvcc1 = 3.3 V, Iout = 0 mA
⎯
200
⎯
µs
3.200
3.300
3.400
V
650
⎯
⎯
mA
Vrpldd31 Iout = 0 to Iomax
⎯
60
⎯
mV
Vlinedd3 Vvcc1 = 2.7 V to 5.5 V
⎯
10
⎯
mV
Vloaddd3 Iout = − 1 mA to Iomax
⎯
⎯
30
mV
Output voltage
Voutdd3 Iout = 0 to Iomax
Maximum
output current
Ioutdd3
Output ripple
voltage
DC/DC3 Input stability
converter Load stability
⎯
Oscillation
frequency
Fdd3
PWM mode
⎯
1.7
⎯
MHz
efficiency
ηdd3
Vvcc1 = 3.3 V, Iout = − 200 mA
80
90
⎯
%
Rise time
Trdd3
Vvcc1 = 3.3 V, Iout = 0 mA
⎯
100
⎯
µs
Fall time
Tfdd3
Vvcc1 = 3.3 V, Iout = 0 mA
⎯
120
⎯
µs
(Continued)
DS04–27266–2E
9
MB39C316
(Continued)
Parameter
Min
Value
Typ
0.0
⎯
Max
0.3 ×
Vvcc1
Vih1
0.7 ×
Vvcc1
⎯
Vvcc1
V
Vil2
0.0
⎯
0.3 ×
Vvcc3
V
0.7 ×
Vvcc3
⎯
Vvcc3
V
0.0
⎯
0.15 ×
Vvcc3
V
0.85 ×
Vvcc3
⎯
Vvcc3
V
2.55
2.6
2.65
V
2.3
2.4
2.5
V
0.0
⎯
0.15 ×
Vrtc
V
0.85 ×
Vrtc
⎯
Vrtc
V
Symbol
Condition
Vil1
ONOFF
Input voltage
LDOCNT1, LDOCNT2
Vih2
Start/stop
control block Output
voltage
Vol1
XRST1, XRST2, Iout = 1 mA
Voh1
XRST1, XRST2, Iout = − 1 mA
VCC1
power supply
Vdetvon VCC1 rise = 0.1 V/10 µs
detection voltage
VCC1
Voltage for
Vdetvoff VCC1 fall = 0.3 V/10 µs
power supply
cut-off detection
Vol32k
RTC_CLK, Iout = 0.5 mA
Output voltage
Voh32k RTC_CLK, Iout = − 0.5 mA
RTC block
Internal
oscillation
capacitance 1
Internal
oscillation
capacitance 2
OSCIN
⎯
10
⎯
pF
Cd
OSCOUT
⎯
10
⎯
pF
0.0
⎯
0.3 ×
Vvcc3
V
0.7 ×
Vvcc3
⎯
Vvcc3
V
0.0
⎯
0.4
V
1.175
0.575
2.325
1.225
0.60
2.40
1.275
0.625
2.475
V
V
V
Input voltage
VFIL1,
VFIL2
LDO5
UVLO
Over temperature
protection
(OTP)
Output voltage
Output voltage
UVLO release
voltage
UVLO detection
voltage
Detection
temperature
Release
temperature
Output short
circuit
Detection
protection
protection time
(SCP)
10
SCL, SDA (for input)
Vih14
Output voltage
V
Cg
Vil14
I2C interface
Unit
SDA (for output)
Iout = 3 mA
Vovfil1 VFIL1
Vovfil2 VFIL2
Voutld5 Iout = 0 to Iomax
Vol18
Vuvlod
⎯
2.1
2.2
2.3
V
Vuvlor
⎯
2.0
2.1
2.2
V
Totpd
⎯
+ 135
+ 150
+ 165
°C
Totpr
⎯
+ 105
+ 120
+ 135
°C
Tshort
Output = 0.6 V ± 0.2 V or less
75
100
125
ms
DS04–27266–2E
MB39C316
2. AC characteristics
(Ta = − 30 °C to + 85 °C, Vvcc1 = 2.7 V to 5.5 V ,Vvcc3 = 3.2 V to 5.5 V,
Vvcc2 = 1.75 V to 1.90 V, Vrtc = 2.35 V to 2.475 V)
Parameter
Symbol
Condition
Unit
Min
Typ
Max
Fck
When using RTC_CLK,
and FC_12M (manufactured by Epson Toyocom Corporation) for
external crystal.
⎯
32.768
⎯
kHz
Clock duty
Rck
When using RTC_CLK,
and FC_12M (manufactured by Epson Toyocom Corporation) for
external crystal.
25
50
75
%
Margin for oscillation
Rfm
Rmax = 90 kΩ
10 ×
Rmax
⎯
⎯
kΩ
Clock frequency
Fscl
SCL
⎯
⎯
400
kHz
SCL, SDA
0.6
⎯
⎯
µs
Clock frequency
RTC block
Start condition hold time
I2C
interface
Value
Thold1
SCL clock L cycle
Tscll
SCL
1.3
⎯
⎯
µs
SCL clock H cycle
Tsclh
SCL
0.6
⎯
⎯
µs
Start condition set up time
Tsetup1
SCL, SDA
0.6
⎯
⎯
µs
Data hold time
Thold2
SCL, SDA
0
⎯
0.9
µs
Data set up time
Tsetup2
SCL, SDA
0.1
⎯
⎯
µs
Stop condition set up time
Tsetup3
SCL, SDA
0.6
⎯
⎯
µs
1.3
⎯
⎯
µs
Bus open time between
stop condition-start
condition
Tbusopen SDA
Rise time
TrI2C
SCL, SDA
⎯
⎯
300
ns
Fall time
TfI2C
SCL, SDA
⎯
⎯
300
ns
2
• I C interface
Tsetup 1
70%
70%
70%
30% 30%
SCL
TfI2C
TrI2C
SDA
Tsclh
Tscll
1/Fscl
70%
start
condition
70%
70%
70%
70%
30%
30%
stop
condition
30%
30%
TrI2C
TfI2C
Tbusopen
Thold 1
Tsetup 2
Tsetup 3
Thold2
3. Current dissipation
Parameter
Condition
Value
Typ
Max
Unit
Standby current
ONOFF : L
150
250
µA
ON current
DC/DC1 converter, DC/DC2 converter : ON (no load)
LDO1, LDO2, LDO3, LDO4 : ON (no load)
650
850
µA
DS04–27266–2E
11
MB39C316
■ TYPICAL CHARACTERISTICS
For the reference of design, typical characteristics are shown below.
• Characteristics of Voltage step-down DCDC (DCDC1, Vout = 1.200 V)
Efficiency vs. Output current
DCDC1 efficiency (Ta = + 25 °C)
VCC = 3.3 V
100%
Efficiency [%]
95%
90%
85%
80%
75%
70%
65%
60%
55%
50%
1.0E-03
1.0E-02
1.0E-01
1.0E+00
Iout [A]
Load changes suddenly characteristics
IOUT = 0 mA → 800 mA
Iout = 800 mA → 0 mA
∆ : 164 mV
@: −170 mV
T
∆ : 152 mV
@: −14 mV
Iout
Iout
1
T
1
VOUT
T
VOUT
2
2
T
Ch1
500 mAΩ
Ch2
100 mV
BW
M 5.00 µs
Ch1
670 mA
Ch1
500 mAΩ
Ch2
100 mV
BW
M 100 µs Ch1
500 mA
Output ripple voltage
VCC = 3.3 V, Iout = 200 mA
∆ : 3.0 mV
@: −1.8 mV
T
1
Ch1
12
5.00 mV
BW
M 1.00 µs Ch1
−200 µV
DS04–27266–2E
MB39C316
Output voltage vs. Load current characteristics
DCDC1 Output voltage vs. Load current
(Ta = + 25 °C)
VCC = 3.3 V
1.400
1.200
Vout [V]
1.000
0.800
0.600
0.400
0.200
0.000
0.0
0.5
1.0
1.5
2.0
Iout [A]
DS04–27266–2E
13
MB39C316
• Characteristics of Voltage step-down/up DCDC (DCDC3, Vout = 3.300 V)
Efficiency vs.Output current
DCDC3 efficiency (Ta = + 25 °C)
100%
Efficiency [%]
90%
80%
70%
60%
50%
40%
VCC=2.7 V
30%
VCC=3.3 V
20%
VCC=3.6 V
10%
VCC=4.9 V
0%
1.0E-03
1.0E-02
1.0E-01
1.0E+00
Iout [A]
Output ripple voltage
VCC = 3.3 V, Iout = 400 mA
VCC = 2.7 V, Iout = 400 mA
Tek Stop: 50.0 MS/s
358 Acqs
T
∆ : 17.8 mV
@: −9.4 mV
∆ : 16.2 mV
@: −9.2 mV
T
1
1
T
Ch1
10.0 mV
M 1.00 µs Ch1
BW
−600 µV
Ch1
10.0 mV
M 1.00 µs Ch1
BW
−1.8 mV
VCC = 4.9 V, Iout = 0 mA
VCC = 4.9 V, Iout = 400 mA
∆ : 37.0 mV
@: 21.8 mV
∆ : 7.8 mV
@: −3.2 mV
T
1
1
T
Ch1
14
10.0 mV
BW
M 1.00 µs Ch1
600 µV
Ch1
10.0 mV
BW
M 1.00 ms Ch1
−1.2 mV
DS04–27266–2E
MB39C316
• LDO(LDO1) characteristics
VCC Min
VCC Typ
VCC Max
LDO1 Load Regulation
( Ta = + 25 °C)
3.500
3.000
Vout [V]
2.500
2.000
1.500
1.000
0.500
0.000
0.0E+00
1.0E-01
2.0E-01
3.0E-01
Iout [A]
4.0E-01
LDO1 Line Regulation
( Ta = + 25 °C)
5.0E-01
Io = 0 mA
Io = Max
3.120
Vout [V]
3.020
2.920
2.820
2.720
2.620
3
3.5
4
4.5
5
VCC [V]
LDO1 PSRR
( Ta = + 25 °C, VCC = 3.3 V)
1 kHz
10 kHz
0
PSRR [dB]
-20
-40
-60
-80
-100
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
Iout [A]
DS04–27266–2E
15
MB39C316
■ START/STOP CONTROL FUNCTION
Conditions of the VCC1 power supply pin and ONOFF, LDOCNT1 and LDOCNT2 pins and the setting of the
REON register control the output of the LDO, the DC/DC converter and reset signals (XRST1 and XRST2).
Also, the setting of the HRST register controls the output of the reset signal.
1. Conditions for start and stop
• Conditions for start
When all conditions mentioned below are completed, the LDO and the DC/DC converter will start.
• VCC1 pin input voltage 2.6 V or more
• ONOFF pin input “H”
• Conditions for stop
When one of conditions mentioned below occurs, the LDO and the DC/DC converter will stop.
• VCC1 pin input voltage 2.4 V or less
• ONOFF pin input “L”
• When the REON bit in the REON register changes “0” to “1”
• OTP (Over temperature protection) detection
VCC1 pin
2.4 V 2.6 V
2.6 V
ONOFF pin
OTP
VCONT
Power supply
Stop
Start
Stop
Start
Stop
Start
Stop
Start
The start and stop status in the constant voltage power supply block by the VCC1 pin input voltage and the
ONOFF pin input is reflected to the VCONT bit (address 05H [0]) in the STATE register.
16
DS04–27266–2E
MB39C316
2. Start/stop sequence by VCC1 power supply pin and ONOFF pin
• When using VCC1 pin
(Stop)
(Start)
2.6 V
2.4 V
VCC1
DC/DC3 converter
DC/DC1 converter
DC/DC2 converter
XRST1
90%
LDO4
XRST2
(1)
(2)
Trrst
Tofdelay
LDO2
LDO3
LDO1
• When using ONOFF pin
(Stop)
(Start)
ONOFF
DC/DC3 converter
DC/DC1 converter
DC/DC2 converter
XRST1
90%
LDO24
XRST2
(1)
(2)
Trrst
Tofdelay
LDO2
LDO3
LDO1
Parameter
Symbol
(1)
(2)
DS04–27266–2E
Value
Unit
Min
Typ
Max
Trrst
4
5
6
ms
Tofdelay
150
200
250
µs
17
MB39C316
3. Start/stop by LDOCNT1 and LDOCNT2 pins (intermittent control)
When the XRST1 and the XRST2 pins are in “H”, the LDO starts and stops depending on the conditions of
the LDOCNT1 and the LDOCNT2 pins.
(Stop)
(Start)
LDOCNT1
L
L
LDOCNT2
L
H
LDO4
OFF
OFF
LDO2
OFF
OFF
LDO3
OFF
OFF
LDO1
OFF
OFF
Input condition
LDO1
LDO2
LDO3
LDO4
H
ON
ON
ON
ON
H
L
OFF
OFF
OFF
ON
L
L
OFF
OFF
OFF
OFF
L
H
OFF
OFF
OFF
OFF
LDOCNT1
LDOCNT2
H
4. Start/stop by REON register (Restart power supply)
When “1” is written to the REON bit in the REON register (address 04H [0]), the power supply stops following
the sequence and starts again after a fixed period has passed.
The STOPTIMEB bit (address 04H [5:4]) can set the time between the stop of the power supply and the
restart of the power supply (calculated by the 140 kHz internal clock ). The REON bit is automatically cleared
after the time set by the STOPTIMEB bit has passed.
140 kHz
REON
(Internal signal)
DC/DC3 converter
(When using DC/DC3 converter)
DC/DC1 converter
(When not using DC/DC3 converter)
Parameter
TREON
18
STOPTIMEB bit [1:0]
10%
10%
TREON
Value
Unit
Min
Typ
Max
00B
0.8
1.0
1.2
ms
01B
3.4
4.0
5.2
ms
10B
6.8
8.0
9.8
ms
11B
13.6
16.0
19.0
ms
DS04–27266–2E
MB39C316
5. Reset control by HRST register
When “1” is written to the HRST bit in the HRST register (address 03H [0]), the output of XRST2 remains at
“L” level for a fixed period.
The STOPTIMEA bit (address 03H [5:4]) can set the time for remaining on XRST2 = “L”. The HRST bit is
automatically cleared after the time set by the STOPTIMEA bit has passed.
140 kHz
HRST
(Internal signal)
XRST1
“H” fixed
XRST2
THRST
Parameter
THRST
Value
STOPTIMEA bit
[1:0]
Min
Typ
Max
00B
0.8
1.0
1.2
ms
01B
3.4
4.0
5.2
ms
10B
6.8
8.0
9.8
ms
11B
13.6
16.0
19.0
ms
Unit
■ 32.768 kHz OUTPUT (CMOS output)
If the crystal oscillator is connected to the OSCIN and the OSCOUT pins, the 32.768 kHz clock can be output
from the RTC_CLK pin.
DS04–27266–2E
19
MB39C316
■ I2C INTERFACE
This is the interface which is compliant with the I2C bus standard. The internal register data are read and
write to the internal register data via two bidirectional bus lines which are the serial data line (SDA) and the
serial clock line (SCL).
The MB39C316 has the following features.
• This LSI is set as slave, so the LSI cannot be set to master.
• The slave address is “2AH”.
• Supports high speed mode (Max 400 kbps)
1. Writing flow
(1) Detect start condition
(2) Receive slave address (“2AH”) and W/R bit (“0”)
(3) Transmit ACK
(4) Receive register address
(5) Transmit ACK
(6) Receive write data
(7) Transmit ACK
(8) Increase the register address and then go back to (6), when a stop condition is not detected.*
(9) Communication stops after detecting a stop condition.
* : Increment stops at address FFH and keeps at FFH. The flow does not go back to 00H.
: Signals that master transmits
: Signals that this LSI transmits
slave address
S
0
1
0
1
0
register address
1
0
0
W/R=0
(write)
A
MSB
DATA1
LSB
A
DATA2
LSB
MSB
writing to
(register address)
S : Start condition
P : Stop condition
A : ACK
A
MSB
LSB
A
writing to
(register address+1)
DATA3
MSB
LSB
A
P
writing to
(register address+2)
Notes : • If the register address which does not exist or the bit which are not assigned is specified, ACK will be
returned, but data will not be written.
• If writing is set to the Read Only address, ACK will not be returned, but data will not be written.
20
DS04–27266–2E
MB39C316
2. Reading flow
(1) Detect start condition
(2) Receive slave address (“2AH”) and W/R bit (“0”)
(3) Transmit ACK
(4) Receive register address
(5) Transmit ACK
(6) Detect start condition
(7) Receive slave address (“2AH”) and W/R bit (“1”)
(8) Transmit ACK
(9) Transmission of read data
(10) Increase the register address and then go back to (9).*
If [1] ACK is received. Release the bus if [2] NACK is received.
(11) Communication stops after detecting a stop condition.
* : Increment stops at address FFH and keeps FFH. Increment does not go back to 00H.
: Signals that master
transmits
S :Start condition
P :Stop condition
A :ACK
NA:NACK
: Signals that this LSI
transmits
slave address
register address
S 0 1 0 1 0 1 0 0 A
MSB
DATA1
slave address
LSB
A S 0 1 0 1 0 1 0 1 A
W/R=0
(write)
MSB
LSB
reading from
(register address)
W/R=1
(read)
DATA2
MSB
A
DATA3
LSB
reading from
(register address+1)
A
MSB
LSB
NA
P
reading from
(register address+2)
Note : If the register address which does not exist and the bit which does not execute the bit assign are specified,
read data becomes “0”.
DS04–27266–2E
21
MB39C316
■ REGISTERS
1. Address allocation
Address
(hex)
Type
00
Register Contents
Register name
(function)
W/R
Reset
SRST
(Soft reset control)
01
Version
02
Default
value
D7
D6
D5
D4
D3
D2
D1
D0
*
RSTDET
⎯
⎯
⎯
⎯
⎯
⎯
SRST
0000 0000
VERSION
(Information about
versions)
R
⎯
⎯
⎯
⎯
VER3
VER2
VER1
VER0
0000 0011
Constant
voltage
power
supply
VSEL_SYN
(LDO
voltage setting)
WR
⎯
⎯
⎯
⎯
⎯
⎯
⎯
03
Reset
HRST
(Hard reset control)
WR
HRDET
⎯
STOPTI
MEA1
STOPTI
MEA0
⎯
⎯
⎯
HRST
0000 0000
04
Power
supply
control
REON
(Control of
re-starting power
supply)
WR
REDET
⎯
STOPTI
MEB1
STOPTI
MEB0
⎯
⎯
⎯
REON
0000 0000
05
Notice of
state
STATE
(Notice of state)
R
⎯
⎯
⎯
⎯
CUR_lim
OTP
RTC_OSC
VCONT
0000 0000
06
General
GP
(General-purpose
register)
WR
GP7
GP6
GP5
GP4
GP3
GP2
GP1
GP0
0000 0000
07-7F
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
80-8B
TEST
reserved
(reserved bytes)
⎯
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
⎯
8C
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
VSEL_SYN 0000 0000
* : 00H [D0] is Write only, [D7] is Write/Read.
• Although data which “_” is shown is accessible to read and write, writing is invalid and reading data becomes
“0”.
• All registers are initialized to the default value by power-on reset.
• Executing the soft reset control initializes all Write registers to the default value. There is a possibility that
written data during execution of the soft reset control is not reflected correctly.
Note : Address 80H to 8BH is mapped on the registers for this LSI test. It is prohibited to write to 80H to 8BH
when using this LSI.
22
DS04–27266–2E
MB39C316
2. Functional description
• Soft reset control (Address 00H)
D7
D6
D5
D4
D3
D2
D1
D0
At Write
RSTDET
⎯
⎯
⎯
⎯
⎯
⎯
SRST
At Read
RSTDET
0
0
0
0
0
0
0
Default
0
0
0
0
0
0
0
0
bit [7] RSTDET : Register reset history bit
RSTDET
Operation
0
No execution of soft reset control (Read)/RSTDET clear bits (Write)
1
Execution of register reset by soft reset control (Read)
This bit saves the execution history of the reset operation by the soft reset control. If the reset
operation by the soft reset control is executed, this bit is set to “1”.
When clearing this bit, write “00H” to this register.
Writing RSTDET = “1” is ignored.
bit [0] SRST : Register reset bit
SRST
Operation
0
Normal operation
1
Reset the Write register for other than address 00H.
If writing “1” to this bit, all Write registers are reset, and the read value for address 00H is “80H”.
The reset state will be remained for about 15 µs after writing SRST = “1”.
This bit is for the write only and the read value is always “0”.
Notes : • If RSTDET = “0” and SRST = “1” are written simultaneously, RSTDET = “0” is ignored. The reset
operation by SRST = “1” is executed and the RSTDET bit is set to “1”.
• There is a possibility that written data during the soft reset control execution is not written correctly.
• Information about versions (Address 01H)
D7
D6
D5
D4
D3
D2
D1
D0
At Write
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
At Read
0
0
0
0
VER3
VER2
VER1
VER0
Default
0
0
0
0
Fixed value for each version
bit [3:0] VER : Version display bit
VER
Operation
0000
⎯
0001
1
0010
2
0011
3
:
:
This register reads information about device's versions.
DS04–27266–2E
23
MB39C316
• LDO voltage setting (Address 02H)
D7
D6
D5
D4
D3
D2
D1
D0
At Write
⎯
⎯
⎯
⎯
⎯
⎯
⎯
VSEL_SYN
At Read
0
0
0
0
0
0
0
VSEL_SYN
Default
0
0
0
0
0
0
0
0
D3
D2
D1
D0
bit [0] VSEL_SYN : Selection bit of LDO3 voltage
VSEL_SYN
Operation
0
1.2 V (Typ)
1
1.3 V (Typ)
This bit switches output voltage of LDO3.
• Hard reset control (Address 03H)
D7
D6
D5
D4
At Write
HRDET
⎯
STOPTIMEA1 STOPTIMEA0
⎯
⎯
⎯
HRST
At Read
HRDET
0
STOPTIMEA1 STOPTIMEA0
0
0
0
HRST
Default
0
0
0
0
0
0
0
0
bit [7] HRDET : HRST history bit
HRDET
Operation
0
No execution of hard reset control (Read)/HRDET clear bits (Write)
1
Execution of XRST2 reset by hard reset control (Read)
This bit saves the execution history of the reset operation by the hard reset control. The reset
operation by the hard reset control sets this bit to “1” (same time as re-writing of the HRST bit).
Write “00H” to this register when clearing this bit.
Writing HRDET = “1” is ignored.
bit [5:4] STOPTIMEA : XRST2 = “L” time setting bit
STOPTIMEA
Operation
00
1 ms (Typ)
01
4 ms (Typ)
10
8 ms (Typ)
11
16 ms (Typ)
This bit selects the time of XRST2 = “L” by the hard reset control.
bit [0] HRST : HRST Control bit
HRST
Operation
0
Normal operation (Read)
1
Instructions of hard reset control start (Write)
When writing “1” to this bit, the output of the XRST2 pin will remain in “L” for the time set by the
STOPTIMEA bit.
This bit is automatically cleared after the time set has passed.
Note : If HRDET = “0” and HRST = “1” are written at the same time, HRDET = “0” is ignored. The reset operation
is executed by HRST = “1” and the HRDET bit is set to “1”.
24
DS04–27266–2E
MB39C316
• Control of re-starting power supply (Address 04H)
D7
D6
At Write
REDET
⎯
At Read
REDET
0
Default
0
0
D5
D4
D3
D2
D1
D0
STOPTIMEB1 STOPTIMEB0
⎯
⎯
⎯
REON
STOPTIMEB1 STOPTIMEB0
0
0
0
REON
0
0
0
0
0
0
bit [7] REDET : REON history bit
REDET
Operation
0
No execution of re-starting power supply control (Read)/REDET Clear
bits (Write)
1
Re-starting power supply by re-starting power supply control (Read)
This bit keeps the execution history of re-starting power supply by the re-starting power supply
control. When re-starting power supply is executed by the re-starting power supply control, this bit
is set to “1” (same time as re-writing of the REON bit).
Write “00H” to this register to clear this bit.
Writing REDET = “1” is ignored.
bit [5:4] STOPTIMEB : Time setting bit to maintain power supply stop status
STOPTIMEB
Operation
00
1 ms (Typ)
01
4 ms (Typ)
10
8 ms (Typ)
11
16 ms (Typ)
This bit selects the time between completion of the stop sequence and the beginning of the re-start.
bit [0] REON : REON Control bit
REON
Operation
0
Normal operation (Read)
1
Instructions to re-start power supply (Write)
Writing “1” to this bit turns power supply on again (Stop → Start the constant voltage power supply).
The power supply start sequence starts when the time set by the STOPTIMEB bit passes after the
power supply stop sequence has completed.
This bit is automatically cleared after the time set has passed.
Note : If REDET = “0” and REON = “1” are written at the same time, REDET = “0” is ignored. Re-starting power
supply by REON = “1” is executed, and the REDET bit is set to “1”.
DS04–27266–2E
25
MB39C316
• Notice of power supply state (Address 05H)
D7
D6
D5
D4
D3
D2
D1
D0
At Write
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
At Read
0
0
0
0
CUR_lim
OTP
RTC_OSC
VCONT
Default
0
0
0
0
0
0
0
0
D4
D3
D2
D1
D0
bit [3] CUR_lim : Display bit to detect short circuit
CUR_lim
0
Detection of no short circuit
1
Detection of short circuit
Operation
This bit reads detection signals of short circuit.
bit [2] OTP : OTP status display bit
OTP
Operation
0
No problem with over temperature
1
Problem with over temperature
This bit reads the abnormal over temperature signal.
bit [1] RTC_OSC : RTC oscillation status display bit
RTC_OSC
Operation
0
Oscillation stop
1
Normal oscillation
This bit reads the oscillation status of the RTC clock.
bit [0] VCONT : VCONT Status display bit
VCONT
Operation
0
VCONT = L (power supply stops)
1
VCONT = H (power supply starts)
This bit reads the VCONT status.
• General-purpose register (Address 06H)
D7
D6
D5
At Write
GP7
GP6
GP5
GP4
GP3
GP2
GP1
GP0
At Read
GP7
GP6
GP5
GP4
GP3
GP2
GP1
GP0
Default
0
0
0
0
0
0
0
0
bit [7:0] GP : general-purpose register
This register is the general-purpose register which can be used by users freely. It is possible to read
and write to “0/1”.
This register is reset to the default value by the soft reset control and power-on reset.
26
DS04–27266–2E
MB39C316
■ PROTECTION FUNCTIONS
1. Over current protection (OCP)
This function controls the current value of the LDO and the DC/DC converter in the over load condition.
When the output current excessively increases, the output voltage drops dramatically so as not to exceed
the current of the over current protection operation.
The output of the LDO and the DC/DC converter stops when the output voltage drops dramatically below
the short circuit protection detection voltage.
Recommended
operation range
Output voltage
When using
DC/DC
converter
Vout (Max)
Vout
Vout (Min)
When using
LDO
0
Short circuit protection
detection voltage
Output current
Over current protection
operation current
2. Output Short Circuit Protection (SCP)
If either of the LDO and the DC/DC converter output short circuit (GND short circuit) continues for 100 ms
(Typ), all output of the LDO and the DC/DC converter except LDO5 stop. The output short circuit protection
is released by power-on reset, and each output of the LDO and the DC/DC converter is restarted following
the start sequence when the VCC1 pin exceeds 2.6 V (Typ).
3. Under Voltage Lock Out (UVLO)
When the VCC1 pin becomes less than 2.1 V (Typ), the inside of LSI is reset by the UVLO protection (poweron reset). The UVLO is released when the VCC1 pin becomes more than 2.2 V (Typ).
4. Over temperature protection (OTP)
If the chip temperature exceeds +150 °C (Typ), all output of the LDO and the DC/DC converter except for
the LDO5 stop. If the chip temperature drops below +120 °C (Typ), OTP is released and each output of the
LDO and the DC/DC converter is automatically restarted.
DS04–27266–2E
27
MB39C316
■ TYPICAL APPLICATION CIRCUIT
1. When using DC/DC3 converter
R1
3 kΩ
MB39C316
C1
1 µF
VCC1
R2
3 kΩ
SCL
SDA
ONOFF
VIN_RTC
XRST1
C5
0.1µF
C20
OSCIN
XRST2
OSCOUT
X1
32.768 kHz
C21
RTC_CLK
VCC_D
LDOCNT1
SWOUT1
C2
1 µF
VCC4
FB1
Place this close
C14
10 µF to the pin
L1
2.2 µH
DGND1
LDOOUT1
C17
10 µF
VDD2
C7
1 µF
SWOUT2
FB2
LDOOUT4
DGND2
C8
1 µF
C3
1 µF
C6
1 µF
VDD1
LDOCNT2
VDD31
VDD32
SWOUT31
SWOUT32
SWIN31
SWIN32
DDOUT31
DDOUT32
FB3
DGND31
DGND32
VCC3
LDOOUT2
C9
2.2 µF
VCC2
C4
1 µF
LDOOUT3
C10
2.2 µF
C15
10 µF
L2
2.2 µH
Place this close
to the pin
C18
10 µF
C16
10 µF
Place this close
to the pin
L3
2.2 µH
C19
10 µF
AGND
V24IO
C11
1 µF
NC1
VFIL1
NC2
C12
0.47 µF
NC3
VFIL2
NC4
GND1
28
GND2
C13
0.47 µF
DS04–27266–2E
MB39C316
2. When not using DC/DC3 converter
VCC
R1
3 kΩ
MB39C316
C1
1 µF
VCC1
R2
3 kΩ
SCL
SDA
ONOFF
VIN_RTC
C20
XRST1
OSCIN
XRST2
OSCOUT
C5
0.1 µF
X1
32.768 kHz
C21
RTC_CLK
VCC_D
C6
1 µF
LDOCNT1
VDD1
LDOCNT2
SWOUT1
C2
1 µF
C7
1 µF
VCC4
FB1
L1
2.2 µH
DGND1
LDOOUT1
C17
10 µF
VDD2
SWOUT2
FB2
LDOOUT4
DGND2
C8
1 µF
C3
1 µF
C14 Place to the closest
10 µF
C15 Place to the closest
10 µF
L2
2.2 µH
C18
10 µF
VDD31
VDD32
SWOUT31
SWOUT32
SWIN31
SWIN32
DDOUT31
DDOUT32
FB3
DGND31
DGND32
VCC3
LDOOUT2
C9
2.2 µF
VCC2
C4
1 µF
LDOOUT3
C10
2.2 µF
AGND
V24IO
C11
1 µF
NC1
VFIL1
C12
0.47 µF
NC2
NC3
VFIL2
NC4
GND1
DS04–27266–2E
GND2
C13
0.47 µF
29
MB39C316
■ PART LIST
Circuit
symbol
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
Part characteristic
Package
1 µF
1 µF
1 µF
1 µF
0.1 µF
1 µF
1.0 µF (6.3 V, ± 10%)
1.0 µF (6.3 V, ± 10%)
2.2 µF (4.0 V, ± 20%)
2.2 µF (4.0 V, ± 20%)
1.0 µF (6.3 V, ± 10%)
0.47 µF (6.3 V, ± 10%)
0.47 µF (6.3 V, ± 10%)
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
C14
10 µF (6.3 V, ± 20%)
C15
10 µF (6.3 V, ± 20%)
C16
10 µF (6.3 V, ± 20%)
C17
10 µF (6.3 V, ± 20%)
C18
10 µF (6.3 V, ± 20%)
C19
10 µF (6.3 V, ± 20%)
C20
⎯
C21
⎯
L1
2.2 µH
L2
2.2 µH
L3
2.2 µH
R1
R2
X1
3 kΩ
3 kΩ
32.768 kHz
FDK
Epson Toyocom
murata
Application
Power supply input
Power supply input
Power supply input
Power supply input
Power supply input
Power supply input
LDO1 output capacitor
LDO4 output capacitor
LDO2 output capacitor
LDO3 output capacitor
LDO5 output capacitor
VFIL1 output capacitor
VFIL2 output capacitor
DC/DC1 converter
Ceramic
input capacitor
DC/DC2 converter
Ceramic
input capacitor
DC/DC3 converter
Ceramic
input capacitor
DC/DC1 converter
Ceramic
output capacitor
DC/DC2 converter
Ceramic
output capacitor
DC/DC3 converter
Ceramic
output capacitor
RTC block
⎯
frequency adjustment
RTC block
⎯
frequency adjustment
DC/DC1 converter
Multi layered
Coil
DC/DC2 converter
Multi layered
Coil
DC/DC3 converter
Multi layered
Coil
⎯
SCL pull-up resistor
⎯
SDA pull-up resistor
⎯
⎯
Recommended part
⎯
⎯
⎯
⎯
⎯
⎯
GRM155B30J105K(murata)
GRM155B30J105K(murata)
GRM155B30G225M(murata)
GRM155B30G225M(murata)
GRM155B30J105K(murata)
GRM155B30J474K(murata)
GRM155B30J474K(murata)
GRM188B30J106M(murata)
GRM188B30J106M(murata)
GRM188B30J106M(murata)
GRM188B30J106M(murata)
GRM188B30J106M(murata)
GRM188B30J106M(murata)
⎯
⎯
MIPSTZ2012D2R2(FDK)
MIPSTZ2012D2R2(FDK)
MIPSAZ3225D2R2(FDK)
⎯
⎯
FC-12M(Epson Toyocom)
: FDK Corporation
: Epson Toyocom Corporation
: Murata Manufacturing Co., Ltd.
1. External parts for DC/DC converter
1. A capacitor (10 µF) between the DC/DC converter power supply and GND pins needs to be connected
at the closest place to both pins.
2. A coil needs to be selected with consideration for the frequency characteristics of inductance and DC
bias characteristics.
30
DS04–27266–2E
MB39C316
1. External parts for DC/DC converter
1. A capacitor (10 µF) between the DC/DC converter power supply and GND pins needs to be connected
at the closest place to both pins.
2. A coil needs to be selected with consideration for the frequency characteristics of inductance and DC
bias characteristics.
3. A capacitor needs to be selected with consideration for the DC bias characteristic of its capacitance.
2. External parts for LDO
1. A capacitor between the LOD output and GND pins needs to be connected at the closest place to both pins.
2. A capacitor needs to be selected with consideration for the DC bias and AC characteristics of its
capacitance.
DS04–27266–2E
31
MB39C316
■ USAGE PRECAUTION
1. Do not configure the IC over the maximum ratings.
If the IC is used over the maximum ratings, the LSI may be permanently damaged.
It is preferable for the device to normally operate within the recommended usage conditions. Usage outside
of these conditions can have an adverse effect on the reliability of the LSI.
2. Use the device within the recommended operating conditions.
The recommended values guarantee the normal LSI operation under the recommended operating conditions.
The electrical ratings are guaranteed when the device is used within the recommended operating conditions
and under the conditions stated for each item.
3. Printed circuit board ground lines should be set up with consideration for common
impedance.
4. Take appropriate measures against static electricity.
• Containers for semiconductor materials should have anti-static protection or be made of conductive material.
• After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.
• Work platforms, tools, and instruments should be properly grounded.
• Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ in serial body and ground.
5. Do not apply negative voltages.
The use of negative voltages below − 0.3 V may make the parasitic transistor activated to the LSI, and can
cause malfunctions.
■ ORDERING INFORMATION
Part number
Package
Remarks
MB39C316PW-G-ERE1
WL-CSP pin
(WLP-49P-M01)
Lead free version
■ EV BOARD ORDERING INFORMATION
EV board number
EV board version No.
MB39C316EVB
1.0
Remarks
■ RoHS COMPLIANCE INFORMATION OF LEAD (Pb) FREE VERSION
The LSI products of Fujitsu Microelectronics with “E1” are compliant with RoHS Directive, and has observed
the standard of lead, cadmium, mercury, Hexavalent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl ethers (PBDE). A product whose part number has trailing characters “E1” is RoHS
compliant.
32
DS04–27266–2E
MB39C316
■ LABELING SAMPLE (Lead-free version)
Lead-free mark
JEITA logo
MB123456P - 789 - GE1
(3N) 1MB123456P-789-GE1
1000
(3N)2 1561190005 107210
JEDEC logo
G
Pb
QC PASS
PCS
1,000
MB123456P - 789 - GE1
2006/03/01
ASSEMBLED IN JAPAN
MB123456P - 789 - GE1
1/1
0605 - Z01A
1000
1561190005
The part number of a lead-free product has the trailing characters “E1”.
DS04–27266–2E
33
MB39C316
■ MARKING FORMAT (Lead-free version)
39C316
XXXXXX
E1
Lead-free version
INDEX
34
DS04–27266–2E
MB39C316
■ PACKAGE DIMENSIONS
49-pin plastic WLP
Lead pitch
0.40 mm
Package width ×
package length
3.14 mm × 3.11 mm
Lead shape
Soldering ball
Sealing method
Print
Mounting height
0.80 mm MAX
Weight
0.0145 g
(WLP-49P-M01)
49-pin plastic WLP
(WLP-49P-M01)
3.14
.124
+0.05
–0.10
+.002
–.004
2.40(.095)
0.40(.016)
TYP
Y
7
6
5
3.11
.122
+0.05
–0.10
+.002
–.004
2.40
(.095)
4
3
2
1
INDEX
(LASER MARKING)
0.40(.016)
TYP
X
0.80(.031)
Max
Z
C
0.06(.002) Z
3-ø0.13
(3-ø.005)
G
F
E
D
49-ø0.22±0.04
(49-ø.009±.002)
C
B
0.05(.002)
A
M
XYZ
0.15±0.04
(.006±.002)
2008 FUJITSU MICROELECTRONICS LIMITED W49001Sc-1-1
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
DS04–27266–2E
35
MB39C316
■ CONTENTS
-
36
page
DESCRIPTION .................................................................................................................................................... 1
FEATURES .......................................................................................................................................................... 1
APPLICATIONS .................................................................................................................................................. 1
PIN ASSIGNMENT ............................................................................................................................................. 2
PIN DISCRIPTIONS ........................................................................................................................................... 3
BLOCK DIAGRAM .............................................................................................................................................. 5
ABSOLUTE MAXIMUM RATINGS ................................................................................................................... 6
RECOMMENDED OPERATION CONDITIONS ............................................................................................ 6
ELECTRICAL CHARACTERISTICS ................................................................................................................ 7
TYPICAL CHARACTERISTICS ........................................................................................................................ 12
START/STOP CONTROL FUNCTION ............................................................................................................ 16
32.768 kHz OUTPUT (CMOS output) .............................................................................................................. 19
I2C INTERFACE ................................................................................................................................................. 20
REGISTERS ........................................................................................................................................................ 22
PROTECTION FUNCTIONS ............................................................................................................................. 27
TYPICAL APPLICATION CIRCUIT .................................................................................................................. 28
PART LIST ........................................................................................................................................................... 30
USAGE PRECAUTION ...................................................................................................................................... 32
ORDERING INFORMATION ............................................................................................................................. 32
EV BOARD ORDERING INFORMATION ....................................................................................................... 32
RoHS COMPLIANCE INFORMATION OF LEAD (Pb) FREE VERSION .................................................. 32
LABELING SAMPLE (Lead-free version) ........................................................................................................ 33
MARKING FORMAT (Lead-free version) ........................................................................................................ 34
PACKAGE DIMENSIONS .................................................................................................................................. 35
DS04–27266–2E
MB39C316
MEMO
DS04–27266–2E
37
MB39C316
MEMO
38
DS04–27266–2E
MB39C316
MEMO
DS04–27266–2E
39
MB39C316
FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome,
Shinjuku-ku, Tokyo 163-0722, Japan
Tel: +81-3-5322-3347 Fax: +81-3-5322-3387
http://jp.fujitsu.com/fml/en/
For further information please contact:
North and South America
FUJITSU MICROELECTRONICS AMERICA, INC.
1250 E. Arques Avenue, M/S 333
Sunnyvale, CA 94085-5401, U.S.A.
Tel: +1-408-737-5600 Fax: +1-408-737-5999
http://www.fma.fujitsu.com/
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE. LTD.
151 Lorong Chuan,
#05-08 New Tech Park 556741 Singapore
Tel : +65-6281-0770 Fax : +65-6281-0220
http://www.fmal.fujitsu.com/
Europe
FUJITSU MICROELECTRONICS EUROPE GmbH
Pittlerstrasse 47, 63225 Langen, Germany
Tel: +49-6103-690-0 Fax: +49-6103-690-122
http://emea.fujitsu.com/microelectronics/
FUJITSU MICROELECTRONICS SHANGHAI CO., LTD.
Rm. 3102, Bund Center, No.222 Yan An Road (E),
Shanghai 200002, China
Tel : +86-21-6146-3688 Fax : +86-21-6335-1605
http://cn.fujitsu.com/fmc/
Korea
FUJITSU MICROELECTRONICS KOREA LTD.
206 Kosmo Tower Building, 1002 Daechi-Dong,
Gangnam-Gu, Seoul 135-280, Republic of Korea
Tel: +82-2-3484-7100 Fax: +82-2-3484-7111
http://kr.fujitsu.com/fmk/
FUJITSU MICROELECTRONICS PACIFIC ASIA LTD.
10/F., World Commerce Centre, 11 Canton Road,
Tsimshatsui, Kowloon, Hong Kong
Tel : +852-2377-0226 Fax : +852-2376-3269
http://cn.fujitsu.com/fmc/en/
Specifications are subject to change without notice. For further information please contact each office.
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with sales representatives before ordering.
The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose
of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS
does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information.
FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use
or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or
any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other
right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property
rights or other rights of third parties which would result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured
as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect
to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in
nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in
weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages
arising in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of overcurrent levels and other abnormal operating conditions.
Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations
of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.
The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited: Sales Promotion Department
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