The following document contains information on Cypress products. FUJITSU MICROELECTRONICS DATA SHEET DS04–27266–2E ASSP (for Mobile Terminals) Power Management IC for Mobile Terminals 3ch DC/DC Converter + 4ch LDO MB39C316 ■ DESCRIPTION The MB39C316 is equipped with the 3 ch DC/DC converter and the 4 ch linear regulator (LDO), and is the power supply LSI for mobile terminals which operate in the range of power supply voltage with 1-cell Li-ion power by 1ch high efficiency voltage step-up/down DC/DC. The MB39C316 contains the 2ch synchronous rectification DC/DC converter with current mode system and the 1ch voltage step-up/down DC/DC converter. Detecting load current by each DC/DC converter alternates the Normal mode (PWM) with the ECO mode (PFM) automatically. MB39C316 has the built-in 4ch LDO which is suitable to supply voltage to the system block and the built-in 1ch LDO which generates stable internal reference voltage. It is possible to control a notice of internal condition, the power supply and reset in order to support the communication interface which is compliant with the I2C bus standard. ■ FEATURES • • • • • • • • • Input voltage range : 2.7 V to 5.5 V Step-down regulators : 2 channels Step-up/down regulator : 1 channel Linear regulator (LDO) : 4 channels Possible to select output voltage : LDO3 1.2 V/1.3 V (register setting) On/Off control of LDO and DC/DC converter by external signals and register settings Compliant with I2C bus standard (Max 400 kbps) Possible to output the 32.768 kHz clock by connecting crystal oscillator Protection function:Over current protection (OCP), Output short circuit protection (SCP), Under voltage lock out protection (UVLO), Over temperature protection (OTP) • Package : 49 pin, WL-CSP (3.14 mm × 3.11 mm × 0.8 mm) ■ APPLICATIONS • Mobile WiMAX terminals • Other mobile terminals etc. Copyright©2009 FUJITSU MICROELECTRONICS LIMITED All rights reserved 2009.1 MB39C316 ■ PIN ASSIGNMENT (BOTTOM VIEW) G F E D C B A 7 7 NC3 VDD31 SWOUT31 DGND31 SWIN31 DDOUT31 NC2 6 6 FB3 VDD32 SWOUT32 DGND32 SWIN32 DDOUT32 OSCIN 5 5 AGND VCC_D LDOCNT1 LDOCNT2 VIN_RTC GND1 OSCOUT 4 4 SWOUT1 VDD1 FB1 SCL V24IO VFIL2 VFIL1 3 3 DGND1 DGND2 FB2 SDA ONOFF VCC1 LDOOUT2 2 2 SWOUT2 VDD2 XRST2 GND2 VCC4 VCC2 VCC3 1 2 1 NC4 RTC_CLK XRST1 LDOOUT4 LDOOUT1 LDOOUT3 NC1 G F E D C B A DS04–27266–2E MB39C316 ■ PIN DISCRIPTIONS Block External power supply Constant voltage power supply I2C interface RTC Start/Stop Reference voltage Pin No. Pin name I/O Descriptions B3 VCC1 I Power supply input, Power supply input pin for LDO2, LDO3 control B2 VCC2 I Power supply input pin for LDO2 power A2 VCC3 I Power supply input pin for LDO3 power C2 VCC4 I Power supply input pin for LDO1, LDO4 control/power F5 VCC_D I Power supply input pin for DC/DC converter control F4 VDD1 I Power supply input pin for DC/DC1 converter power F2 VDD2 I Power supply input pin for DC/DC2 converter power F7 VDD31 I Power supply input pin 1 for DC/DC3 converter power F6 VDD32 I Power supply input pin 2 for DC/DC3 converter power C5 VIN_RTC I Power supply input pin for RTC E5 LDOCNT1 I LDO output control input pin 1 D5 LDOCNT2 I LDO output control input pin 2 D1 LDOOUT4 O LDO4 output pin ( + 2.9 V) B1 LDOOUT3 O LDO3 output pin ( + 1.2 V/1.3 V) C1 LDOOUT1 O LDO1 output pin ( + 2.9 V) A3 LDOOUT2 O LDO2 output pin ( + 1.2 V) G4 SWOUT1 O DC/DC1 converter inductance connection output pin E4 FB1 I DC/DC1 converter output voltage feedback input pin (1.2 V) G2 SWOUT2 O DC/DC2 converter inductance connection output pin E3 FB2 I DC/DC2 converter output voltage feedback input pin (1.8 V) E7 SWOUT31 ⎯ DC/DC3 converter inductance connection pin 1 E6 SWOUT32 ⎯ DC/DC3 converter inductance connection pin 2 C7 SWIN31 ⎯ DC/DC3 converter inductance connection pin 1 C6 SWIN32 ⎯ DC/DC3 converter inductance connection pin 2 B7 DDOUT31 O DC/DC3 converter output pin 1 B6 DDOUT32 O DC/DC3 converter output pin 2 G6 FB3 I DC/DC3 converter output voltage feedback input pin (3.3 V) D4 SCL I I2C interface clock input pin D3 SDA I/O A6 OSCIN I Input pin for crystal oscillator connection A5 OSCOUT O Output pin for crystal oscillator connection F1 RTC_CLK O 32.768 kHz Clock output pin C3 ONOFF I Enable pin for the MB39C316 E1 XRST1 O Reset output pin 1 E2 XRST2 O Reset output pin 2 C4 V24IO O Power supply output pin for internal 2.4 V I/O A4 VFIL1 O Reference voltage output pin 1 (0.47 µF connected ) B4 VFIL2 O Reference voltage output pin 2 (0.47 µF connected ) I2C interface data I/O pin (Continued) DS04–27266–2E 3 MB39C316 (Continued) Block Pin No. TEST GND 4 Pin name I/O Descriptions A1 NC1 ⎯ Pin for TEST (Set to Non Connect. Prohibited to connect to others.) A7 NC2 ⎯ Pin for TEST (Set to Non Connect. Prohibited to connect to others.) G7 NC3 ⎯ Pin for TEST (Set to Non Connect. Prohibited to connect to others.) G1 NC4 ⎯ Pin for TEST (Set to Non Connect. Prohibited to connect to others.) B5 GND1 ⎯ Ground pin (COMMON, RTC) D2 GND2 ⎯ Ground pin (LDO, INPUT_IF, OUTPUT_IF) G5 AGND ⎯ Ground pin (DC/DC converter control block) G3 DGND1 ⎯ DC/DC1 converter ground pin F3 DGND2 ⎯ DC/DC2 converter ground pin D7 DGND31 ⎯ DC/DC3 converter ground pin 1 D6 DGND32 ⎯ DC/DC3 converter ground pin 2 DS04–27266–2E MB39C316 ■ BLOCK DIAGRAM MB39C316 VCC1 SCL I2C interface SDA ONOFF XRST1 VIN_RTC OSCIN OSCOUT RTC_CLK Control start/stop RTC XRST2 Constant voltage power supply LDOCNT1 VCC_D LDOCNT2 VDD1 DC/DC1 converter SWOUT1 step down 1.200 V 800 mA VCC4 LDOOUT1 LDO1 2.875 V 200 mA FB1 DGND1 VDD2 DC/DC2 converter SWOUT2 LDOOUT4 VCC2 LDOOUT2 LDO4 2.925 V 6.5 mA LDO2 1.225 V 260 mA step down 1.825 V 600 mA FB2 DGND2 VDD31 VDD32 SWOUT31 SWOUT32 SWIN31 SWIN32 DDOUT31 DDOUT32 FB3 DGND31 DGND32 DC/DC3 converter step up/down 3.300 V 650 mA VCC3 LDOOUT3 LDO3 1.200 V, 1.300 V 84 mA Reference voltage output Protection circuit (UVLO, OTP, SCP, OCP) V24IO VFIL1 VFIL2 LDO5 NC1 NC2 Test circuit NC3 NC4 GND1 DS04–27266–2E GND2 AGND 5 MB39C316 ■ ABSOLUTE MAXIMUM RATINGS Parameter Power supply voltage Input voltage Storage temperature range ESD withstand voltage latch-up withstand voltage Symbol Condition Rating Min Max Unit Vmax1 VCC1, VCC_D, VDD1, VDD2, VDD31, VDD32 − 0.3 + 6.0 V Vmax2 VCC2, VCC3 − 0.3 + 6.0 V Vmax3 VCC4 − 0.3 + 6.0 V Vmax4 VIN_RTC − 0.3 + 3.6 V Vinmax1 LDOCNT1, LDOCNT2, SCL, SDA − 0.3 Vvcc3 + 0.3 V Vinmax2 ONOFF, FB1, FB2, FB3 − 0.3 Vvcc1 + 0.3 V Vinmax3 OSCIN − 0.3 Vrtc V − 55 + 125 °C ⎯ Tstg Vesdh Human Body Model (100 pF, 1.5 kΩ) − 1000 + 1000 V Vesdm Machine Model (200 pF, 0 Ω) − 100 + 100 V EIA/JEDEC Standard − 150 + 150 mA Vlatchup WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. ■ RECOMMENDED OPERATION CONDITIONS Parameter Power supply voltage Symbol Operating temperature range Value Min Typ Max Unit Vvcc1 VCC1, VCC_D, VDD1, VDD2, VDD31, VDD32 2.7 3.3 5.5 V Vvcc2 VCC2, VCC3 1.75 ⎯ 1.90 V Vvcc3 VCC4 3.2 ⎯ 5.5 V 2.325 ⎯ 2.475 V Vrtc Input voltage Condition VIN_RTC VIvcc1 ONOFF 0.0 ⎯ Vvcc1 V VIvcc3 LDOCNT1, LDOCNT2, SCL, SDA 0.0 ⎯ Vvcc3 V VIdd1 FB1 0.0 ⎯ Voutdd1 V VIdd2 FB2 0.0 ⎯ Voutdd2 V VIdd3 FB3 0.0 ⎯ Voutdd3 V VIrtc OSCIN 0.0 ⎯ Vrtc V − 30 ⎯ + 85 °C Ta ⎯ WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand. 6 DS04–27266–2E MB39C316 ■ ELECTRICAL CHARACTERISTICS 1. DC characteristics (Ta = − 30 °C to + 85 °C, Vvcc1 = 2.7 V to 5.5 V ,Vvcc3 = 3.2 V to 5.5 V, Vvcc2 = 1.75 V to 1.90 V,Vrtc = 2.325 V to 2.475 V) Parameter LDO1 LDO2 Symbol Value Condition Unit Min Typ Max 2.800 2.875 3.000 V 200 ⎯ ⎯ mA ⎯ 5 ⎯ mV ⎯ 20 ⎯ mV f = 1 kHz ⎯ 60 ⎯ dB f = 10 kHz ⎯ 40 ⎯ dB f = 10 Hz to 100 kHz, Iout = 10 mA to Iomax ⎯ 30 45 µVrms Output voltage Voutld1 Iout = 0 to Iomax Maximum output current Ioutld1 ⎯ Input stability Vlineld1 Load stability Vloadld1 Iout = 0 to Iomax Ripple removal ratio RR1kld1 Vinput = 0.2 Vpp, Vvcc1 = 3.3 V, RR10kld1 Iout = Iomax/2 Output noise voltage Vnoiseld1 Iout = − 10 mA Rise time Trld1 Vvcc1 = 3.3 V, Iout = 0 mA, Vout = 90% ⎯ 200 ⎯ µs Fall time Tfld1 Vvcc1 = 3.3 V, Iout = 0 mA, Vout = 10% ⎯ 70 ⎯ µs 1.150 1.225 1.300 V 260 ⎯ ⎯ mA ⎯ 5 ⎯ mV ⎯ 25 ⎯ mV f = 1 kHz ⎯ 60 ⎯ dB f = 10 kHz ⎯ 40 ⎯ dB f = 10 Hz to 100 kHz, Iout = 10 mA to Iomax ⎯ 30 45 µVrms Output voltage Voutld2 Iout = 0 to Iomax Maximum output current Ioutld2 ⎯ Input stability Vlineld2 Load stability Vloadld2 Iout = 0 to Iomax Ripple removal ratio RR1kld2 Vinput = 0.2 Vpp, Vvcc1, Iout = 1 mA RR10kld2 to Iomax Output noise voltage Vnoiseld2 Iout = − 10mA Rise time Trld2 Vvcc1, Iout = 0 mA, Vout = 90% ⎯ 70 ⎯ µs Fall time Tfld2 Vvcc1, Iout = 0 mA, Vout = 10% ⎯ 150 ⎯ µs (Continued) DS04–27266–2E 7 MB39C316 Parameter Output voltage Voutld3 Value Condition Unit Min Typ Max Iout = 0 to Iomax, VSEL_SYN = “0” ( register 02H[0]) 1.100 1.200 1.300 V Iout = 0 to Iomax, VSEL_SYN = “1” ( register 02H[0]) 1.200 1.300 1.400 V 84 ⎯ ⎯ mA ⎯ 5 ⎯ mV ⎯ 20 ⎯ mV f = 1 kHz ⎯ 60 ⎯ dB f = 10 kHz ⎯ 40 ⎯ dB f = 10 Hz to 100 kHz, Iout = 10 mA to Iomax ⎯ 30 40 µVrms Maximum output current Ioutld3 Input stability Vlineld3 Load stability Vloadld3 Iout = 0 to Iomax Ripple removal ratio RR1kld3 Vinput = 0.2 Vpp, Vvcc1, RR10kld3 Iout = 1mA to Iomax Output noise voltage Vnoiseld3 LDO3 LDO4 Symbol ⎯ Iout = − 10 mA Rise time Trld3 Vvcc1, Iout = 0 mA, Vout = 90% ⎯ 60 ⎯ µs Fall time Tfld3 Vvcc1, Iout = 0 mA, Vout = 10% ⎯ 150 ⎯ µs 2.850 2.925 3.000 V 6.5 ⎯ ⎯ mA ⎯ 5 ⎯ mV Iout = 0 to Iomax Output voltage Voutld4 Maximum output current Ioutld4 Input stability Vlineld4 Load stability Vloadld4 Iout = 0 to Iomax ⎯ 5 ⎯ mV Ripple removal ratio RR1kld4 Vinput = 0.2 Vpp, f = 1 kHz Vvcc1 = Vvcc3 = 3.3 V, RR10kld4 Iout = 1 mA to Iomax f = 10 kHz ⎯ 60 ⎯ dB ⎯ 40 ⎯ dB Output noise voltage Vnoiseld4 f = 10 Hz to 100 kHz, Iout = 1 mA to Iomax ⎯ 30 40 µVrms ⎯ Iout = − 6.5 mA Rise time Trld4 Vvcc1 = Vvcc3 = 3.3 V, Iout = 0 mA, Vout = 90% ⎯ 130 ⎯ µs Fall time Tfld4 Vvcc1 = Vvcc3 = 3.3 V, Iout = 0 mA, Vout = 10% ⎯ 70 ⎯ µs (Continued) 8 DS04–27266–2E MB39C316 Parameter Symbol Condition Typ Max 1.100 1.200 1.300 V 800 ⎯ ⎯ mA Vrpldd11 Iout = 0 to Iomax ⎯ 15 ⎯ mV Vlinedd1 Vvcc1 = 2.7 V to 5.5 V ⎯ 10 ⎯ mV Vloaddd1 Iout = − 1 mA to Iomax ⎯ ⎯ 20 mV Voutdd1 Iout = 0 to Iomax Maximum output current Ioutdd1 DC/DC1 Input stability converter Load stability Unit Min Output voltage Output ripple voltage Value ⎯ Oscillation frequency Fdd1 PWM mode ⎯ 1.7 ⎯ MHz Efficiency ηdd1 Vvcc1 = 3.3 V, Iout = − 200 mA 75 85 ⎯ % Rise time Trdd1 Vvcc1 = 3.3 V, Iout = 0 mA ⎯ 50 ⎯ µs Fall time Tfdd1 Vvcc1 = 3.3 V, Iout = 0 mA ⎯ 200 ⎯ µs 1.750 1.825 1.900 V 600 ⎯ ⎯ mA Vrpldd21 Iout = 0 to Iomax ⎯ 15 ⎯ mV Vlinedd2 Vvcc1 = 2.7 V to 5.5 V ⎯ 10 ⎯ mV Vloaddd2 Iout = − 1 mA to Iomax ⎯ ⎯ 20 mV Output voltage Voutdd2 Iout = 0 to Iomax Maximum output current Ioutdd2 Output ripple voltage DC/DC2 Input stability converter Load stability ⎯ Oscillation frequency Fdd2 PWM mode ⎯ 1.7 ⎯ MHz efficiency ηdd2 Vvcc1 = 3.3 V, Iout = − 200 mA 80 90 ⎯ % Rise time Trdd2 Vvcc1 = 3.3 V, Iout = 0 mA ⎯ 50 ⎯ µs Fall time Tfdd2 Vvcc1 = 3.3 V, Iout = 0 mA ⎯ 200 ⎯ µs 3.200 3.300 3.400 V 650 ⎯ ⎯ mA Vrpldd31 Iout = 0 to Iomax ⎯ 60 ⎯ mV Vlinedd3 Vvcc1 = 2.7 V to 5.5 V ⎯ 10 ⎯ mV Vloaddd3 Iout = − 1 mA to Iomax ⎯ ⎯ 30 mV Output voltage Voutdd3 Iout = 0 to Iomax Maximum output current Ioutdd3 Output ripple voltage DC/DC3 Input stability converter Load stability ⎯ Oscillation frequency Fdd3 PWM mode ⎯ 1.7 ⎯ MHz efficiency ηdd3 Vvcc1 = 3.3 V, Iout = − 200 mA 80 90 ⎯ % Rise time Trdd3 Vvcc1 = 3.3 V, Iout = 0 mA ⎯ 100 ⎯ µs Fall time Tfdd3 Vvcc1 = 3.3 V, Iout = 0 mA ⎯ 120 ⎯ µs (Continued) DS04–27266–2E 9 MB39C316 (Continued) Parameter Min Value Typ 0.0 ⎯ Max 0.3 × Vvcc1 Vih1 0.7 × Vvcc1 ⎯ Vvcc1 V Vil2 0.0 ⎯ 0.3 × Vvcc3 V 0.7 × Vvcc3 ⎯ Vvcc3 V 0.0 ⎯ 0.15 × Vvcc3 V 0.85 × Vvcc3 ⎯ Vvcc3 V 2.55 2.6 2.65 V 2.3 2.4 2.5 V 0.0 ⎯ 0.15 × Vrtc V 0.85 × Vrtc ⎯ Vrtc V Symbol Condition Vil1 ONOFF Input voltage LDOCNT1, LDOCNT2 Vih2 Start/stop control block Output voltage Vol1 XRST1, XRST2, Iout = 1 mA Voh1 XRST1, XRST2, Iout = − 1 mA VCC1 power supply Vdetvon VCC1 rise = 0.1 V/10 µs detection voltage VCC1 Voltage for Vdetvoff VCC1 fall = 0.3 V/10 µs power supply cut-off detection Vol32k RTC_CLK, Iout = 0.5 mA Output voltage Voh32k RTC_CLK, Iout = − 0.5 mA RTC block Internal oscillation capacitance 1 Internal oscillation capacitance 2 OSCIN ⎯ 10 ⎯ pF Cd OSCOUT ⎯ 10 ⎯ pF 0.0 ⎯ 0.3 × Vvcc3 V 0.7 × Vvcc3 ⎯ Vvcc3 V 0.0 ⎯ 0.4 V 1.175 0.575 2.325 1.225 0.60 2.40 1.275 0.625 2.475 V V V Input voltage VFIL1, VFIL2 LDO5 UVLO Over temperature protection (OTP) Output voltage Output voltage UVLO release voltage UVLO detection voltage Detection temperature Release temperature Output short circuit Detection protection protection time (SCP) 10 SCL, SDA (for input) Vih14 Output voltage V Cg Vil14 I2C interface Unit SDA (for output) Iout = 3 mA Vovfil1 VFIL1 Vovfil2 VFIL2 Voutld5 Iout = 0 to Iomax Vol18 Vuvlod ⎯ 2.1 2.2 2.3 V Vuvlor ⎯ 2.0 2.1 2.2 V Totpd ⎯ + 135 + 150 + 165 °C Totpr ⎯ + 105 + 120 + 135 °C Tshort Output = 0.6 V ± 0.2 V or less 75 100 125 ms DS04–27266–2E MB39C316 2. AC characteristics (Ta = − 30 °C to + 85 °C, Vvcc1 = 2.7 V to 5.5 V ,Vvcc3 = 3.2 V to 5.5 V, Vvcc2 = 1.75 V to 1.90 V, Vrtc = 2.35 V to 2.475 V) Parameter Symbol Condition Unit Min Typ Max Fck When using RTC_CLK, and FC_12M (manufactured by Epson Toyocom Corporation) for external crystal. ⎯ 32.768 ⎯ kHz Clock duty Rck When using RTC_CLK, and FC_12M (manufactured by Epson Toyocom Corporation) for external crystal. 25 50 75 % Margin for oscillation Rfm Rmax = 90 kΩ 10 × Rmax ⎯ ⎯ kΩ Clock frequency Fscl SCL ⎯ ⎯ 400 kHz SCL, SDA 0.6 ⎯ ⎯ µs Clock frequency RTC block Start condition hold time I2C interface Value Thold1 SCL clock L cycle Tscll SCL 1.3 ⎯ ⎯ µs SCL clock H cycle Tsclh SCL 0.6 ⎯ ⎯ µs Start condition set up time Tsetup1 SCL, SDA 0.6 ⎯ ⎯ µs Data hold time Thold2 SCL, SDA 0 ⎯ 0.9 µs Data set up time Tsetup2 SCL, SDA 0.1 ⎯ ⎯ µs Stop condition set up time Tsetup3 SCL, SDA 0.6 ⎯ ⎯ µs 1.3 ⎯ ⎯ µs Bus open time between stop condition-start condition Tbusopen SDA Rise time TrI2C SCL, SDA ⎯ ⎯ 300 ns Fall time TfI2C SCL, SDA ⎯ ⎯ 300 ns 2 • I C interface Tsetup 1 70% 70% 70% 30% 30% SCL TfI2C TrI2C SDA Tsclh Tscll 1/Fscl 70% start condition 70% 70% 70% 70% 30% 30% stop condition 30% 30% TrI2C TfI2C Tbusopen Thold 1 Tsetup 2 Tsetup 3 Thold2 3. Current dissipation Parameter Condition Value Typ Max Unit Standby current ONOFF : L 150 250 µA ON current DC/DC1 converter, DC/DC2 converter : ON (no load) LDO1, LDO2, LDO3, LDO4 : ON (no load) 650 850 µA DS04–27266–2E 11 MB39C316 ■ TYPICAL CHARACTERISTICS For the reference of design, typical characteristics are shown below. • Characteristics of Voltage step-down DCDC (DCDC1, Vout = 1.200 V) Efficiency vs. Output current DCDC1 efficiency (Ta = + 25 °C) VCC = 3.3 V 100% Efficiency [%] 95% 90% 85% 80% 75% 70% 65% 60% 55% 50% 1.0E-03 1.0E-02 1.0E-01 1.0E+00 Iout [A] Load changes suddenly characteristics IOUT = 0 mA → 800 mA Iout = 800 mA → 0 mA ∆ : 164 mV @: −170 mV T ∆ : 152 mV @: −14 mV Iout Iout 1 T 1 VOUT T VOUT 2 2 T Ch1 500 mAΩ Ch2 100 mV BW M 5.00 µs Ch1 670 mA Ch1 500 mAΩ Ch2 100 mV BW M 100 µs Ch1 500 mA Output ripple voltage VCC = 3.3 V, Iout = 200 mA ∆ : 3.0 mV @: −1.8 mV T 1 Ch1 12 5.00 mV BW M 1.00 µs Ch1 −200 µV DS04–27266–2E MB39C316 Output voltage vs. Load current characteristics DCDC1 Output voltage vs. Load current (Ta = + 25 °C) VCC = 3.3 V 1.400 1.200 Vout [V] 1.000 0.800 0.600 0.400 0.200 0.000 0.0 0.5 1.0 1.5 2.0 Iout [A] DS04–27266–2E 13 MB39C316 • Characteristics of Voltage step-down/up DCDC (DCDC3, Vout = 3.300 V) Efficiency vs.Output current DCDC3 efficiency (Ta = + 25 °C) 100% Efficiency [%] 90% 80% 70% 60% 50% 40% VCC=2.7 V 30% VCC=3.3 V 20% VCC=3.6 V 10% VCC=4.9 V 0% 1.0E-03 1.0E-02 1.0E-01 1.0E+00 Iout [A] Output ripple voltage VCC = 3.3 V, Iout = 400 mA VCC = 2.7 V, Iout = 400 mA Tek Stop: 50.0 MS/s 358 Acqs T ∆ : 17.8 mV @: −9.4 mV ∆ : 16.2 mV @: −9.2 mV T 1 1 T Ch1 10.0 mV M 1.00 µs Ch1 BW −600 µV Ch1 10.0 mV M 1.00 µs Ch1 BW −1.8 mV VCC = 4.9 V, Iout = 0 mA VCC = 4.9 V, Iout = 400 mA ∆ : 37.0 mV @: 21.8 mV ∆ : 7.8 mV @: −3.2 mV T 1 1 T Ch1 14 10.0 mV BW M 1.00 µs Ch1 600 µV Ch1 10.0 mV BW M 1.00 ms Ch1 −1.2 mV DS04–27266–2E MB39C316 • LDO(LDO1) characteristics VCC Min VCC Typ VCC Max LDO1 Load Regulation ( Ta = + 25 °C) 3.500 3.000 Vout [V] 2.500 2.000 1.500 1.000 0.500 0.000 0.0E+00 1.0E-01 2.0E-01 3.0E-01 Iout [A] 4.0E-01 LDO1 Line Regulation ( Ta = + 25 °C) 5.0E-01 Io = 0 mA Io = Max 3.120 Vout [V] 3.020 2.920 2.820 2.720 2.620 3 3.5 4 4.5 5 VCC [V] LDO1 PSRR ( Ta = + 25 °C, VCC = 3.3 V) 1 kHz 10 kHz 0 PSRR [dB] -20 -40 -60 -80 -100 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00 Iout [A] DS04–27266–2E 15 MB39C316 ■ START/STOP CONTROL FUNCTION Conditions of the VCC1 power supply pin and ONOFF, LDOCNT1 and LDOCNT2 pins and the setting of the REON register control the output of the LDO, the DC/DC converter and reset signals (XRST1 and XRST2). Also, the setting of the HRST register controls the output of the reset signal. 1. Conditions for start and stop • Conditions for start When all conditions mentioned below are completed, the LDO and the DC/DC converter will start. • VCC1 pin input voltage 2.6 V or more • ONOFF pin input “H” • Conditions for stop When one of conditions mentioned below occurs, the LDO and the DC/DC converter will stop. • VCC1 pin input voltage 2.4 V or less • ONOFF pin input “L” • When the REON bit in the REON register changes “0” to “1” • OTP (Over temperature protection) detection VCC1 pin 2.4 V 2.6 V 2.6 V ONOFF pin OTP VCONT Power supply Stop Start Stop Start Stop Start Stop Start The start and stop status in the constant voltage power supply block by the VCC1 pin input voltage and the ONOFF pin input is reflected to the VCONT bit (address 05H [0]) in the STATE register. 16 DS04–27266–2E MB39C316 2. Start/stop sequence by VCC1 power supply pin and ONOFF pin • When using VCC1 pin (Stop) (Start) 2.6 V 2.4 V VCC1 DC/DC3 converter DC/DC1 converter DC/DC2 converter XRST1 90% LDO4 XRST2 (1) (2) Trrst Tofdelay LDO2 LDO3 LDO1 • When using ONOFF pin (Stop) (Start) ONOFF DC/DC3 converter DC/DC1 converter DC/DC2 converter XRST1 90% LDO24 XRST2 (1) (2) Trrst Tofdelay LDO2 LDO3 LDO1 Parameter Symbol (1) (2) DS04–27266–2E Value Unit Min Typ Max Trrst 4 5 6 ms Tofdelay 150 200 250 µs 17 MB39C316 3. Start/stop by LDOCNT1 and LDOCNT2 pins (intermittent control) When the XRST1 and the XRST2 pins are in “H”, the LDO starts and stops depending on the conditions of the LDOCNT1 and the LDOCNT2 pins. (Stop) (Start) LDOCNT1 L L LDOCNT2 L H LDO4 OFF OFF LDO2 OFF OFF LDO3 OFF OFF LDO1 OFF OFF Input condition LDO1 LDO2 LDO3 LDO4 H ON ON ON ON H L OFF OFF OFF ON L L OFF OFF OFF OFF L H OFF OFF OFF OFF LDOCNT1 LDOCNT2 H 4. Start/stop by REON register (Restart power supply) When “1” is written to the REON bit in the REON register (address 04H [0]), the power supply stops following the sequence and starts again after a fixed period has passed. The STOPTIMEB bit (address 04H [5:4]) can set the time between the stop of the power supply and the restart of the power supply (calculated by the 140 kHz internal clock ). The REON bit is automatically cleared after the time set by the STOPTIMEB bit has passed. 140 kHz REON (Internal signal) DC/DC3 converter (When using DC/DC3 converter) DC/DC1 converter (When not using DC/DC3 converter) Parameter TREON 18 STOPTIMEB bit [1:0] 10% 10% TREON Value Unit Min Typ Max 00B 0.8 1.0 1.2 ms 01B 3.4 4.0 5.2 ms 10B 6.8 8.0 9.8 ms 11B 13.6 16.0 19.0 ms DS04–27266–2E MB39C316 5. Reset control by HRST register When “1” is written to the HRST bit in the HRST register (address 03H [0]), the output of XRST2 remains at “L” level for a fixed period. The STOPTIMEA bit (address 03H [5:4]) can set the time for remaining on XRST2 = “L”. The HRST bit is automatically cleared after the time set by the STOPTIMEA bit has passed. 140 kHz HRST (Internal signal) XRST1 “H” fixed XRST2 THRST Parameter THRST Value STOPTIMEA bit [1:0] Min Typ Max 00B 0.8 1.0 1.2 ms 01B 3.4 4.0 5.2 ms 10B 6.8 8.0 9.8 ms 11B 13.6 16.0 19.0 ms Unit ■ 32.768 kHz OUTPUT (CMOS output) If the crystal oscillator is connected to the OSCIN and the OSCOUT pins, the 32.768 kHz clock can be output from the RTC_CLK pin. DS04–27266–2E 19 MB39C316 ■ I2C INTERFACE This is the interface which is compliant with the I2C bus standard. The internal register data are read and write to the internal register data via two bidirectional bus lines which are the serial data line (SDA) and the serial clock line (SCL). The MB39C316 has the following features. • This LSI is set as slave, so the LSI cannot be set to master. • The slave address is “2AH”. • Supports high speed mode (Max 400 kbps) 1. Writing flow (1) Detect start condition (2) Receive slave address (“2AH”) and W/R bit (“0”) (3) Transmit ACK (4) Receive register address (5) Transmit ACK (6) Receive write data (7) Transmit ACK (8) Increase the register address and then go back to (6), when a stop condition is not detected.* (9) Communication stops after detecting a stop condition. * : Increment stops at address FFH and keeps at FFH. The flow does not go back to 00H. : Signals that master transmits : Signals that this LSI transmits slave address S 0 1 0 1 0 register address 1 0 0 W/R=0 (write) A MSB DATA1 LSB A DATA2 LSB MSB writing to (register address) S : Start condition P : Stop condition A : ACK A MSB LSB A writing to (register address+1) DATA3 MSB LSB A P writing to (register address+2) Notes : • If the register address which does not exist or the bit which are not assigned is specified, ACK will be returned, but data will not be written. • If writing is set to the Read Only address, ACK will not be returned, but data will not be written. 20 DS04–27266–2E MB39C316 2. Reading flow (1) Detect start condition (2) Receive slave address (“2AH”) and W/R bit (“0”) (3) Transmit ACK (4) Receive register address (5) Transmit ACK (6) Detect start condition (7) Receive slave address (“2AH”) and W/R bit (“1”) (8) Transmit ACK (9) Transmission of read data (10) Increase the register address and then go back to (9).* If [1] ACK is received. Release the bus if [2] NACK is received. (11) Communication stops after detecting a stop condition. * : Increment stops at address FFH and keeps FFH. Increment does not go back to 00H. : Signals that master transmits S :Start condition P :Stop condition A :ACK NA:NACK : Signals that this LSI transmits slave address register address S 0 1 0 1 0 1 0 0 A MSB DATA1 slave address LSB A S 0 1 0 1 0 1 0 1 A W/R=0 (write) MSB LSB reading from (register address) W/R=1 (read) DATA2 MSB A DATA3 LSB reading from (register address+1) A MSB LSB NA P reading from (register address+2) Note : If the register address which does not exist and the bit which does not execute the bit assign are specified, read data becomes “0”. DS04–27266–2E 21 MB39C316 ■ REGISTERS 1. Address allocation Address (hex) Type 00 Register Contents Register name (function) W/R Reset SRST (Soft reset control) 01 Version 02 Default value D7 D6 D5 D4 D3 D2 D1 D0 * RSTDET ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ SRST 0000 0000 VERSION (Information about versions) R ⎯ ⎯ ⎯ ⎯ VER3 VER2 VER1 VER0 0000 0011 Constant voltage power supply VSEL_SYN (LDO voltage setting) WR ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 03 Reset HRST (Hard reset control) WR HRDET ⎯ STOPTI MEA1 STOPTI MEA0 ⎯ ⎯ ⎯ HRST 0000 0000 04 Power supply control REON (Control of re-starting power supply) WR REDET ⎯ STOPTI MEB1 STOPTI MEB0 ⎯ ⎯ ⎯ REON 0000 0000 05 Notice of state STATE (Notice of state) R ⎯ ⎯ ⎯ ⎯ CUR_lim OTP RTC_OSC VCONT 0000 0000 06 General GP (General-purpose register) WR GP7 GP6 GP5 GP4 GP3 GP2 GP1 GP0 0000 0000 07-7F ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 80-8B TEST reserved (reserved bytes) ⎯ reserved reserved reserved reserved reserved reserved reserved reserved ⎯ 8C ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ VSEL_SYN 0000 0000 * : 00H [D0] is Write only, [D7] is Write/Read. • Although data which “_” is shown is accessible to read and write, writing is invalid and reading data becomes “0”. • All registers are initialized to the default value by power-on reset. • Executing the soft reset control initializes all Write registers to the default value. There is a possibility that written data during execution of the soft reset control is not reflected correctly. Note : Address 80H to 8BH is mapped on the registers for this LSI test. It is prohibited to write to 80H to 8BH when using this LSI. 22 DS04–27266–2E MB39C316 2. Functional description • Soft reset control (Address 00H) D7 D6 D5 D4 D3 D2 D1 D0 At Write RSTDET ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ SRST At Read RSTDET 0 0 0 0 0 0 0 Default 0 0 0 0 0 0 0 0 bit [7] RSTDET : Register reset history bit RSTDET Operation 0 No execution of soft reset control (Read)/RSTDET clear bits (Write) 1 Execution of register reset by soft reset control (Read) This bit saves the execution history of the reset operation by the soft reset control. If the reset operation by the soft reset control is executed, this bit is set to “1”. When clearing this bit, write “00H” to this register. Writing RSTDET = “1” is ignored. bit [0] SRST : Register reset bit SRST Operation 0 Normal operation 1 Reset the Write register for other than address 00H. If writing “1” to this bit, all Write registers are reset, and the read value for address 00H is “80H”. The reset state will be remained for about 15 µs after writing SRST = “1”. This bit is for the write only and the read value is always “0”. Notes : • If RSTDET = “0” and SRST = “1” are written simultaneously, RSTDET = “0” is ignored. The reset operation by SRST = “1” is executed and the RSTDET bit is set to “1”. • There is a possibility that written data during the soft reset control execution is not written correctly. • Information about versions (Address 01H) D7 D6 D5 D4 D3 D2 D1 D0 At Write ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ At Read 0 0 0 0 VER3 VER2 VER1 VER0 Default 0 0 0 0 Fixed value for each version bit [3:0] VER : Version display bit VER Operation 0000 ⎯ 0001 1 0010 2 0011 3 : : This register reads information about device's versions. DS04–27266–2E 23 MB39C316 • LDO voltage setting (Address 02H) D7 D6 D5 D4 D3 D2 D1 D0 At Write ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ VSEL_SYN At Read 0 0 0 0 0 0 0 VSEL_SYN Default 0 0 0 0 0 0 0 0 D3 D2 D1 D0 bit [0] VSEL_SYN : Selection bit of LDO3 voltage VSEL_SYN Operation 0 1.2 V (Typ) 1 1.3 V (Typ) This bit switches output voltage of LDO3. • Hard reset control (Address 03H) D7 D6 D5 D4 At Write HRDET ⎯ STOPTIMEA1 STOPTIMEA0 ⎯ ⎯ ⎯ HRST At Read HRDET 0 STOPTIMEA1 STOPTIMEA0 0 0 0 HRST Default 0 0 0 0 0 0 0 0 bit [7] HRDET : HRST history bit HRDET Operation 0 No execution of hard reset control (Read)/HRDET clear bits (Write) 1 Execution of XRST2 reset by hard reset control (Read) This bit saves the execution history of the reset operation by the hard reset control. The reset operation by the hard reset control sets this bit to “1” (same time as re-writing of the HRST bit). Write “00H” to this register when clearing this bit. Writing HRDET = “1” is ignored. bit [5:4] STOPTIMEA : XRST2 = “L” time setting bit STOPTIMEA Operation 00 1 ms (Typ) 01 4 ms (Typ) 10 8 ms (Typ) 11 16 ms (Typ) This bit selects the time of XRST2 = “L” by the hard reset control. bit [0] HRST : HRST Control bit HRST Operation 0 Normal operation (Read) 1 Instructions of hard reset control start (Write) When writing “1” to this bit, the output of the XRST2 pin will remain in “L” for the time set by the STOPTIMEA bit. This bit is automatically cleared after the time set has passed. Note : If HRDET = “0” and HRST = “1” are written at the same time, HRDET = “0” is ignored. The reset operation is executed by HRST = “1” and the HRDET bit is set to “1”. 24 DS04–27266–2E MB39C316 • Control of re-starting power supply (Address 04H) D7 D6 At Write REDET ⎯ At Read REDET 0 Default 0 0 D5 D4 D3 D2 D1 D0 STOPTIMEB1 STOPTIMEB0 ⎯ ⎯ ⎯ REON STOPTIMEB1 STOPTIMEB0 0 0 0 REON 0 0 0 0 0 0 bit [7] REDET : REON history bit REDET Operation 0 No execution of re-starting power supply control (Read)/REDET Clear bits (Write) 1 Re-starting power supply by re-starting power supply control (Read) This bit keeps the execution history of re-starting power supply by the re-starting power supply control. When re-starting power supply is executed by the re-starting power supply control, this bit is set to “1” (same time as re-writing of the REON bit). Write “00H” to this register to clear this bit. Writing REDET = “1” is ignored. bit [5:4] STOPTIMEB : Time setting bit to maintain power supply stop status STOPTIMEB Operation 00 1 ms (Typ) 01 4 ms (Typ) 10 8 ms (Typ) 11 16 ms (Typ) This bit selects the time between completion of the stop sequence and the beginning of the re-start. bit [0] REON : REON Control bit REON Operation 0 Normal operation (Read) 1 Instructions to re-start power supply (Write) Writing “1” to this bit turns power supply on again (Stop → Start the constant voltage power supply). The power supply start sequence starts when the time set by the STOPTIMEB bit passes after the power supply stop sequence has completed. This bit is automatically cleared after the time set has passed. Note : If REDET = “0” and REON = “1” are written at the same time, REDET = “0” is ignored. Re-starting power supply by REON = “1” is executed, and the REDET bit is set to “1”. DS04–27266–2E 25 MB39C316 • Notice of power supply state (Address 05H) D7 D6 D5 D4 D3 D2 D1 D0 At Write ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ At Read 0 0 0 0 CUR_lim OTP RTC_OSC VCONT Default 0 0 0 0 0 0 0 0 D4 D3 D2 D1 D0 bit [3] CUR_lim : Display bit to detect short circuit CUR_lim 0 Detection of no short circuit 1 Detection of short circuit Operation This bit reads detection signals of short circuit. bit [2] OTP : OTP status display bit OTP Operation 0 No problem with over temperature 1 Problem with over temperature This bit reads the abnormal over temperature signal. bit [1] RTC_OSC : RTC oscillation status display bit RTC_OSC Operation 0 Oscillation stop 1 Normal oscillation This bit reads the oscillation status of the RTC clock. bit [0] VCONT : VCONT Status display bit VCONT Operation 0 VCONT = L (power supply stops) 1 VCONT = H (power supply starts) This bit reads the VCONT status. • General-purpose register (Address 06H) D7 D6 D5 At Write GP7 GP6 GP5 GP4 GP3 GP2 GP1 GP0 At Read GP7 GP6 GP5 GP4 GP3 GP2 GP1 GP0 Default 0 0 0 0 0 0 0 0 bit [7:0] GP : general-purpose register This register is the general-purpose register which can be used by users freely. It is possible to read and write to “0/1”. This register is reset to the default value by the soft reset control and power-on reset. 26 DS04–27266–2E MB39C316 ■ PROTECTION FUNCTIONS 1. Over current protection (OCP) This function controls the current value of the LDO and the DC/DC converter in the over load condition. When the output current excessively increases, the output voltage drops dramatically so as not to exceed the current of the over current protection operation. The output of the LDO and the DC/DC converter stops when the output voltage drops dramatically below the short circuit protection detection voltage. Recommended operation range Output voltage When using DC/DC converter Vout (Max) Vout Vout (Min) When using LDO 0 Short circuit protection detection voltage Output current Over current protection operation current 2. Output Short Circuit Protection (SCP) If either of the LDO and the DC/DC converter output short circuit (GND short circuit) continues for 100 ms (Typ), all output of the LDO and the DC/DC converter except LDO5 stop. The output short circuit protection is released by power-on reset, and each output of the LDO and the DC/DC converter is restarted following the start sequence when the VCC1 pin exceeds 2.6 V (Typ). 3. Under Voltage Lock Out (UVLO) When the VCC1 pin becomes less than 2.1 V (Typ), the inside of LSI is reset by the UVLO protection (poweron reset). The UVLO is released when the VCC1 pin becomes more than 2.2 V (Typ). 4. Over temperature protection (OTP) If the chip temperature exceeds +150 °C (Typ), all output of the LDO and the DC/DC converter except for the LDO5 stop. If the chip temperature drops below +120 °C (Typ), OTP is released and each output of the LDO and the DC/DC converter is automatically restarted. DS04–27266–2E 27 MB39C316 ■ TYPICAL APPLICATION CIRCUIT 1. When using DC/DC3 converter R1 3 kΩ MB39C316 C1 1 µF VCC1 R2 3 kΩ SCL SDA ONOFF VIN_RTC XRST1 C5 0.1µF C20 OSCIN XRST2 OSCOUT X1 32.768 kHz C21 RTC_CLK VCC_D LDOCNT1 SWOUT1 C2 1 µF VCC4 FB1 Place this close C14 10 µF to the pin L1 2.2 µH DGND1 LDOOUT1 C17 10 µF VDD2 C7 1 µF SWOUT2 FB2 LDOOUT4 DGND2 C8 1 µF C3 1 µF C6 1 µF VDD1 LDOCNT2 VDD31 VDD32 SWOUT31 SWOUT32 SWIN31 SWIN32 DDOUT31 DDOUT32 FB3 DGND31 DGND32 VCC3 LDOOUT2 C9 2.2 µF VCC2 C4 1 µF LDOOUT3 C10 2.2 µF C15 10 µF L2 2.2 µH Place this close to the pin C18 10 µF C16 10 µF Place this close to the pin L3 2.2 µH C19 10 µF AGND V24IO C11 1 µF NC1 VFIL1 NC2 C12 0.47 µF NC3 VFIL2 NC4 GND1 28 GND2 C13 0.47 µF DS04–27266–2E MB39C316 2. When not using DC/DC3 converter VCC R1 3 kΩ MB39C316 C1 1 µF VCC1 R2 3 kΩ SCL SDA ONOFF VIN_RTC C20 XRST1 OSCIN XRST2 OSCOUT C5 0.1 µF X1 32.768 kHz C21 RTC_CLK VCC_D C6 1 µF LDOCNT1 VDD1 LDOCNT2 SWOUT1 C2 1 µF C7 1 µF VCC4 FB1 L1 2.2 µH DGND1 LDOOUT1 C17 10 µF VDD2 SWOUT2 FB2 LDOOUT4 DGND2 C8 1 µF C3 1 µF C14 Place to the closest 10 µF C15 Place to the closest 10 µF L2 2.2 µH C18 10 µF VDD31 VDD32 SWOUT31 SWOUT32 SWIN31 SWIN32 DDOUT31 DDOUT32 FB3 DGND31 DGND32 VCC3 LDOOUT2 C9 2.2 µF VCC2 C4 1 µF LDOOUT3 C10 2.2 µF AGND V24IO C11 1 µF NC1 VFIL1 C12 0.47 µF NC2 NC3 VFIL2 NC4 GND1 DS04–27266–2E GND2 C13 0.47 µF 29 MB39C316 ■ PART LIST Circuit symbol C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 Part characteristic Package 1 µF 1 µF 1 µF 1 µF 0.1 µF 1 µF 1.0 µF (6.3 V, ± 10%) 1.0 µF (6.3 V, ± 10%) 2.2 µF (4.0 V, ± 20%) 2.2 µF (4.0 V, ± 20%) 1.0 µF (6.3 V, ± 10%) 0.47 µF (6.3 V, ± 10%) 0.47 µF (6.3 V, ± 10%) Ceramic Ceramic Ceramic Ceramic Ceramic Ceramic Ceramic Ceramic Ceramic Ceramic Ceramic Ceramic Ceramic C14 10 µF (6.3 V, ± 20%) C15 10 µF (6.3 V, ± 20%) C16 10 µF (6.3 V, ± 20%) C17 10 µF (6.3 V, ± 20%) C18 10 µF (6.3 V, ± 20%) C19 10 µF (6.3 V, ± 20%) C20 ⎯ C21 ⎯ L1 2.2 µH L2 2.2 µH L3 2.2 µH R1 R2 X1 3 kΩ 3 kΩ 32.768 kHz FDK Epson Toyocom murata Application Power supply input Power supply input Power supply input Power supply input Power supply input Power supply input LDO1 output capacitor LDO4 output capacitor LDO2 output capacitor LDO3 output capacitor LDO5 output capacitor VFIL1 output capacitor VFIL2 output capacitor DC/DC1 converter Ceramic input capacitor DC/DC2 converter Ceramic input capacitor DC/DC3 converter Ceramic input capacitor DC/DC1 converter Ceramic output capacitor DC/DC2 converter Ceramic output capacitor DC/DC3 converter Ceramic output capacitor RTC block ⎯ frequency adjustment RTC block ⎯ frequency adjustment DC/DC1 converter Multi layered Coil DC/DC2 converter Multi layered Coil DC/DC3 converter Multi layered Coil ⎯ SCL pull-up resistor ⎯ SDA pull-up resistor ⎯ ⎯ Recommended part ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ GRM155B30J105K(murata) GRM155B30J105K(murata) GRM155B30G225M(murata) GRM155B30G225M(murata) GRM155B30J105K(murata) GRM155B30J474K(murata) GRM155B30J474K(murata) GRM188B30J106M(murata) GRM188B30J106M(murata) GRM188B30J106M(murata) GRM188B30J106M(murata) GRM188B30J106M(murata) GRM188B30J106M(murata) ⎯ ⎯ MIPSTZ2012D2R2(FDK) MIPSTZ2012D2R2(FDK) MIPSAZ3225D2R2(FDK) ⎯ ⎯ FC-12M(Epson Toyocom) : FDK Corporation : Epson Toyocom Corporation : Murata Manufacturing Co., Ltd. 1. External parts for DC/DC converter 1. A capacitor (10 µF) between the DC/DC converter power supply and GND pins needs to be connected at the closest place to both pins. 2. A coil needs to be selected with consideration for the frequency characteristics of inductance and DC bias characteristics. 30 DS04–27266–2E MB39C316 1. External parts for DC/DC converter 1. A capacitor (10 µF) between the DC/DC converter power supply and GND pins needs to be connected at the closest place to both pins. 2. A coil needs to be selected with consideration for the frequency characteristics of inductance and DC bias characteristics. 3. A capacitor needs to be selected with consideration for the DC bias characteristic of its capacitance. 2. External parts for LDO 1. A capacitor between the LOD output and GND pins needs to be connected at the closest place to both pins. 2. A capacitor needs to be selected with consideration for the DC bias and AC characteristics of its capacitance. DS04–27266–2E 31 MB39C316 ■ USAGE PRECAUTION 1. Do not configure the IC over the maximum ratings. If the IC is used over the maximum ratings, the LSI may be permanently damaged. It is preferable for the device to normally operate within the recommended usage conditions. Usage outside of these conditions can have an adverse effect on the reliability of the LSI. 2. Use the device within the recommended operating conditions. The recommended values guarantee the normal LSI operation under the recommended operating conditions. The electrical ratings are guaranteed when the device is used within the recommended operating conditions and under the conditions stated for each item. 3. Printed circuit board ground lines should be set up with consideration for common impedance. 4. Take appropriate measures against static electricity. • Containers for semiconductor materials should have anti-static protection or be made of conductive material. • After mounting, printed circuit boards should be stored and shipped in conductive bags or containers. • Work platforms, tools, and instruments should be properly grounded. • Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ in serial body and ground. 5. Do not apply negative voltages. The use of negative voltages below − 0.3 V may make the parasitic transistor activated to the LSI, and can cause malfunctions. ■ ORDERING INFORMATION Part number Package Remarks MB39C316PW-G-ERE1 WL-CSP pin (WLP-49P-M01) Lead free version ■ EV BOARD ORDERING INFORMATION EV board number EV board version No. MB39C316EVB 1.0 Remarks ■ RoHS COMPLIANCE INFORMATION OF LEAD (Pb) FREE VERSION The LSI products of Fujitsu Microelectronics with “E1” are compliant with RoHS Directive, and has observed the standard of lead, cadmium, mercury, Hexavalent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl ethers (PBDE). A product whose part number has trailing characters “E1” is RoHS compliant. 32 DS04–27266–2E MB39C316 ■ LABELING SAMPLE (Lead-free version) Lead-free mark JEITA logo MB123456P - 789 - GE1 (3N) 1MB123456P-789-GE1 1000 (3N)2 1561190005 107210 JEDEC logo G Pb QC PASS PCS 1,000 MB123456P - 789 - GE1 2006/03/01 ASSEMBLED IN JAPAN MB123456P - 789 - GE1 1/1 0605 - Z01A 1000 1561190005 The part number of a lead-free product has the trailing characters “E1”. DS04–27266–2E 33 MB39C316 ■ MARKING FORMAT (Lead-free version) 39C316 XXXXXX E1 Lead-free version INDEX 34 DS04–27266–2E MB39C316 ■ PACKAGE DIMENSIONS 49-pin plastic WLP Lead pitch 0.40 mm Package width × package length 3.14 mm × 3.11 mm Lead shape Soldering ball Sealing method Print Mounting height 0.80 mm MAX Weight 0.0145 g (WLP-49P-M01) 49-pin plastic WLP (WLP-49P-M01) 3.14 .124 +0.05 –0.10 +.002 –.004 2.40(.095) 0.40(.016) TYP Y 7 6 5 3.11 .122 +0.05 –0.10 +.002 –.004 2.40 (.095) 4 3 2 1 INDEX (LASER MARKING) 0.40(.016) TYP X 0.80(.031) Max Z C 0.06(.002) Z 3-ø0.13 (3-ø.005) G F E D 49-ø0.22±0.04 (49-ø.009±.002) C B 0.05(.002) A M XYZ 0.15±0.04 (.006±.002) 2008 FUJITSU MICROELECTRONICS LIMITED W49001Sc-1-1 Dimensions in mm (inches). Note: The values in parentheses are reference values. Please confirm the latest Package dimension by following URL. http://edevice.fujitsu.com/package/en-search/ DS04–27266–2E 35 MB39C316 ■ CONTENTS - 36 page DESCRIPTION .................................................................................................................................................... 1 FEATURES .......................................................................................................................................................... 1 APPLICATIONS .................................................................................................................................................. 1 PIN ASSIGNMENT ............................................................................................................................................. 2 PIN DISCRIPTIONS ........................................................................................................................................... 3 BLOCK DIAGRAM .............................................................................................................................................. 5 ABSOLUTE MAXIMUM RATINGS ................................................................................................................... 6 RECOMMENDED OPERATION CONDITIONS ............................................................................................ 6 ELECTRICAL CHARACTERISTICS ................................................................................................................ 7 TYPICAL CHARACTERISTICS ........................................................................................................................ 12 START/STOP CONTROL FUNCTION ............................................................................................................ 16 32.768 kHz OUTPUT (CMOS output) .............................................................................................................. 19 I2C INTERFACE ................................................................................................................................................. 20 REGISTERS ........................................................................................................................................................ 22 PROTECTION FUNCTIONS ............................................................................................................................. 27 TYPICAL APPLICATION CIRCUIT .................................................................................................................. 28 PART LIST ........................................................................................................................................................... 30 USAGE PRECAUTION ...................................................................................................................................... 32 ORDERING INFORMATION ............................................................................................................................. 32 EV BOARD ORDERING INFORMATION ....................................................................................................... 32 RoHS COMPLIANCE INFORMATION OF LEAD (Pb) FREE VERSION .................................................. 32 LABELING SAMPLE (Lead-free version) ........................................................................................................ 33 MARKING FORMAT (Lead-free version) ........................................................................................................ 34 PACKAGE DIMENSIONS .................................................................................................................................. 35 DS04–27266–2E MB39C316 MEMO DS04–27266–2E 37 MB39C316 MEMO 38 DS04–27266–2E MB39C316 MEMO DS04–27266–2E 39 MB39C316 FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE. LTD. 151 Lorong Chuan, #05-08 New Tech Park 556741 Singapore Tel : +65-6281-0770 Fax : +65-6281-0220 http://www.fmal.fujitsu.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 47, 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 http://emea.fujitsu.com/microelectronics/ FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm. 3102, Bund Center, No.222 Yan An Road (E), Shanghai 200002, China Tel : +86-21-6146-3688 Fax : +86-21-6335-1605 http://cn.fujitsu.com/fmc/ Korea FUJITSU MICROELECTRONICS KOREA LTD. 206 Kosmo Tower Building, 1002 Daechi-Dong, Gangnam-Gu, Seoul 135-280, Republic of Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://kr.fujitsu.com/fmk/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, 11 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel : +852-2377-0226 Fax : +852-2376-3269 http://cn.fujitsu.com/fmc/en/ Specifications are subject to change without notice. For further information please contact each office. All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of overcurrent levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners. Edited: Sales Promotion Department