LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND REEL TYPE LED LAMPS Pb Lead-Free Parts LG3331-PF/TRF-X DATA SHEET DOC. NO : QW0905-LG3331-PF/TRF-X REV. : A DATE : 13 - Jul. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG3331-PF/TRF-X Page 1/7 Package Dimensions P2 △H H2 W2 H1 H L W0 W1 P1 F D - + P T LG3331-PF 5.0 5.9 7.6 8.6 1.5MAX 25.0MIN □0.5 TYP 2.54TYP + - 1.0MIN Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. W3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/7 PART NO. LG3331-PF/TRF-X Absolute Maximum Ratings at Ta=25 ℃ Absolute Maximum Ratings Symbol Parameter UNIT G Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 120 mA Power Dissipation PD 100 mW Reverse Current @5V Ir 10 μA Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted LG3331-PF/TRF-X GaP Green Forward Peak Spectral voltage wave halfwidth @20mA(V) length △λ nm λPnm @10mA(mcd) Viewing angle 2θ 1/2 (deg) Min. Max. Min. Typ. Lens Green Transparent Luminous intensity 565 30 1.7 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 2.6 65 150 20 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG3331-PF/TRF-X Page 3/7 •Dimensions Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 4.8 0.19 5.8 0.23 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 Height Of Seating Plane ------- H 15.5 0.61 16.5 0.65 TRF-1 17.5 0.69 19.5 0.77 TRF-2 19.0 0.75 21.0 0.83 TRF-3 22.5 0.89 24.5 0.96 TRF-4 25.5 1.0 26.5 1.04 TRF-5 21.5 0.85 22.5 0.89 20.2 0.8 21.2 0.83 TRF-7 17.125 0.67 21.125 0.83 TRF-8 20.0 0.79 22.5 0.89 TRF-9 26.0 1.02 28.0 1.1 TRF-11 24.0 0.94 26.0 1.02 TRF-12 21.0 0.83 23.0 0.91 ------- 36 1.42 11.0 0.43 Feed Hole To Bottom Of Component H1 TRF-6 Feed Hole To Overall Component Height ------- H2 Lead Length After Component Height ------- L Feed Hole Pitch ------- P 12.4 0.49 13.0 0.51 Lead Location ------- P1 3.15 0.12 4.55 0.18 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19.0 0.75 ------- W0 REMARK:TRF=Tape And Reel Forming Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum mm inch mm inch Reel Diameter D 78.2 3.08 380 14.96 Core Diameter D1 34.9 1.37 102 4.02 Hub Recess Inside Diameter D2 28.6 1.13 88.0 3.46 Arbor Hole Diameter D3 13.8 0.54 38.1 1.5 Overall Reel Thickness T --- --- 57.2 2.25 Iside Reel Flange Thickness T1 30.0 1.18 50.0 1.97 LG3331-PF/TRF-X 1000PCS D3 MARKING D2 D1 D T1 T2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG3331-PF/TRF-X Page 4/7 •Dimensions Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Maximum Minimum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 4.8 0.19 5.8 0.23 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 Height Of Seating Plane ------- H 15.5 0.61 16.5 0.65 TRF-13 19.0 0.75 20.0 0.79 TRF-14 21.7 0.85 23.7 0.93 TRF-15 22.5 0.89 23.5 0.93 TRF-16 17.5 0.69 18.0 TRF-17 18.5 Feed Hole To Bottom Of Component 19.5 0.77 20.5 0.81 21.5 0.85 TRF-19 25.5 1.0 27.5 1.08 TRF-20 20.5 0.81 22.5 0.89 TRF-21 25.0 0.98 27.0 1.06 TRF-22 22.0 0.87 23.0 0.91 ------- 36 1.42 11.0 0.43 TRF-18 Feed Hole To Overall Component Height 0.73 0.71 H1 ------- H2 Lead Length After Component Height ------- L Feed Hole Pitch ------- P 12.4 0.49 13.0 0.51 Lead Location ------- P1 3.15 0.12 4.55 0.18 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19.0 0.75 ------- W0 REMARK:TRF=Tape And Reel Forming Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum mm inch mm inch Reel Diameter D 78.2 3.08 380 14.96 Core Diameter D1 34.9 1.37 102 4.02 Hub Recess Inside Diameter D2 28.6 1.13 88.0 3.46 Arbor Hole Diameter D3 13.8 0.54 38.1 1.5 Overall Reel Thickness T --- --- 57.2 2.25 Iside Reel Flange Thickness T1 30.0 1.18 50.0 1.97 LG3331-PF/TRF-X 1000PCS D3 MARKING D2 D1 D T1 T2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/7 PART NO. LG3331-PF/TRF-X Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 5.0 1.0 10 1.2 Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 100 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1000 Forward Current(mA) Forward Voltage(V) -40 100 Fig.6 Directive Radiation 0° 1.0 -30° 30° -60° 0.5 0.0 500 550 600 Wavelength (nm) 650 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/7 PART NO. LG3331-PF/TRF-X Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/7 PART NO. LG3331-PF/TRF-X Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11