LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SQUARE WITH 4LEADS TYPE LED LAMPS Pb Lead-Free Parts LUES9653-30B/H7-AM DATA SHEET DOC. NO : QW0905-LUES9653-30B/H7-AM REV. : A DATE : 10 - Aug. - 2012 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUES9653-30B/H7-AM Page 1/5 Package Dimensions R0.7 C1.25 CATHODE 7.62±0.5 ANODE ψ3.0 7.62±0.5 1.9 2.5±0.5 0.4 4.55±0.5 1.55 0.5 3.5±0.5 5.08 5.08±0.3 Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/5 PART NO. LUES9653-30B/H7-AM Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT UES Forward Current IF 50 mA Peak Forward Current Duty 1/10@10KHz IFP 90 mA Power Dissipation PD 120 mW Ir 10 μA Electrostatic Discharge( * ) ESD 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Reverse Current @5V Typical Electrical & Optical Characteristics (Ta=25 ℃) Forward Dominant Spectral voltage wave halfwidth @70mA(V) length △λ nm λDnm COLOR PART NO MATERIAL Emitted LUES9653-30B/H7-AM AlGaInP @70mA(Im) Viewing angle 2θ 1/2 (deg) Min. Max. Min. Typ. Lens Orange Water Clear Luminous intensity 615 27 2.0 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 3.0 2.2 6.3 44 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page3/5 PART NO. LUES9653-30B/H7-AM Typical Electro-Optical Characteristics Curve UES CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0 1.0 2.0 3.0 4.0 5.0 1.0 10 Forward Current(mA) Forward Voltage(V) Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity @20mA Normalize @25℃ Forward Voltage@20mA Normaliz @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength Relative Intensity @20mA 1.0 0.5 0 600 650 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) 550 1000 100 700 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5 PART NO. LUES9653-30B/H7-AM Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/5 PART NO. LUES9653-30B/H7-AM Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=240 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11