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Typical RoHS Reflow Profile
300
Time within 5°C
of peak temperature
(30 seconds)
250
Peak temperature
255 – 260°C
217
Temperature (°C)
Ramp-Down
6°C /sec max
Ramp-Up
3°C /sec max
200
150
100
Preheat / Soak
Reflow
(60 –120 seconds)
Time above 217°C
(60 – 150 seconds)
50
0
0
30
60
90
120
150
180
210
240
270
300
Time (seconds)
All Coilcraft RoHS-compliant parts are backward compatible with tin-lead soldering processes. Soldering temperature
must be greater than 230°C to ensure proper melting of lead-free solder.
For all soldering methods, the optimal reflow profile for a circuit board assembly is dependent on the solder material,
solder amount, flux, temperature limit of each soldered component, heat transfer characteristics of the circuit board and
component materials, and the layout of all components. The temperature versus time limitation of the least robust
component of the circuit board assembly ultimately may determine the actual temperature profile that must be used. For
these reasons, Coilcraft does not specify soldering profiles for our components.
This typical reflow profile is based on IPC/JEDEC J-STD-020 Revision D.1 (March 2008). It is provided only as a guide.
For additional information, refer to these web sites: www.jedec.org, www.kester.com and www.indium.com.
Document 755 Revised 04/15/09
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