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Product Brief
PressFIT
Our established, reliable mounting technology
Infineon’s established PressFIT technology offers the possibility for reliable, solder-less
mounting of power modules, meeting the nowadays demands of lead-free technology.
According to the RoHS directive, since 2006 most lead-containing solder alloys have to be
replaced by lead-free solders. This results in higher melting point solders and lead-free tin
metallization of the PCB, which has significant effects on the mounting process.
PressFIT technology is one time-saving possibility for lead-free solderless mounting of
power modules. The low electrical and thermal contact resistance makes the contact
suitable for a wide range of currents and applications.
Environmental tests show that vibration loads and climate sequences have no negative
influence on the contact resistance. This results from the gas-tight contact and high
contact force. The high holding forces of the contact are independent of the PCB hole
tolerances. This reduces the effort for mechanical fixing.
The PressFIT process can be separated from soldering and allows module mounting on
the soldering and the component side of the PCB. This increases the design flexibility.
Additionally, the module mounting process can be separated from the soldering process
of the PCB. The high reliability of PressFIT contacts in general promises increased system
reliability. This is especially of interest if modules are operating in harsh environments.
Key features
››PressFIT saves process time
››Reliable cold welding connection
of module pins and PCB
››Low ohmic resistance
››Module mounting possible on
soldering and component side
of PCB
››Established technology in
automotive, communication &
industrial applications
››Decrease of FIT rate
Applications
››Industrial drives
››Uninterruptable power supplies
››Renewable energy systems
››Air conditioning
››Welding
››Inductive heating
››Medical equipment
››Commercial and agricultural
vehicles (CAV)
www.infineon.com/IGBTmodules
Product Brief
PressFIT
Background of PressFIT technology
As mentioned above, the PressFIT technology enables
lead-free solderless solder less mounting of power
modules. In addition, it offers the possibility of
quicker mounting of the assembly, thus saving
process time and costs with the resulting
potential of higher output capacity. The
possibility of mounting the module on either
the soldering or the component side of the PCB
provides further flexibility to meet the requirements
of modern assembly lines.
Quality of PressFIT modules
Several tests regarding the application of the PressFIT
technology and its reliability in power modules have been
performed according to the well-known IEC standards
(e.g. IEC 60352-5), but with enhanced conditions. The result of the
whole program can be concluded as follows: Not one of the tests caused any measurable
contact degradation. The resistance of the connection, which is the leading indicator for
the quality of the connection, is very stable during and after several loadings. This means
not only that high current can be handled safely over the lifetime, but also the advanced
integrated functions with low voltage and current (e.g. current sensing) will be kept
absolutely stable beyond the lifetime of the system. Due to this, the PressFIT technology
is well suited to power semiconductor modules – especially for future high-reliability
requirements.
Overview
Econo press-in & press-out tools
Easy press-in & press-out tools
Modules
Product Brief
PressFIT
Background of PressFIT technology
Type of connection
Conductor cross-section in mm 2)
Failure rate λref in FIT 1)
Notes: Standards/Guide
Solder manual
machine
0.5
0.03
IPC 610 2). class 2
Wire bond for hybrid circuits
Au
0.1
0.1
28μm / Wetch - Bond
25μm / Ball - Bond
0.05 to 0.5
0.002
DIN EN 60352 - 1 / IEC 60352 - 1 CORR1
Wire-warp
Crimp
1)
0.05 to 300
0.25
DIN EN 60352 - 2 / IEC 60352 - 2A 1+2
Termi-point
manual, machine
0.1 to 0.5
0.02
DIN 41611-4
Press in
0.3 to 2
0.005
IEC 60352 - 5
Insulation displacement
0.05 to 1
0.25
IEC 60352 - 3. IEC 60352 - 4
Screw
0.5 to 16
0.5
DIN EN 60999 - 1
Clamp (elastic force)
0.5 to 16
0.5
DIN EN 60999 - 1
1 FIT equals one failure in 109 component hours
2)
Acceptability of Printed Board Assemblies
Usually if two contact faces are assembled, there are only a few spots which are really
connected (metal to metal) and which carry the current – this is also true for polished
surfaces. The minimum radius of such a microscopic metal-metal contact is typically
10 µm. In force-fitting technologies like PressFIT, there is always a necessary plastic
deformation on these truly effective contact points within the contact zone. The contact
radius increases due to the high contact pressure that occurs since the macroscopic
contact force concentrates on a small microscopic contact area. That means the two
faces will be merged.
Thus, the effective contact zone will be increased and – most importantly – a gas-tight
contact zone is generated, which is very robust against corrosive environments. The
connection principle is the well-known cold welding effect. Here, free electrons are
generated from the plastic deformation of both contact faces. The metal-bond electron
cloud links the free electrons and connects them again with the same mechanism as in
the basic metal. The bonding force is indeed lower than in the prior grid, but is increasing
within the first hours of the connection due to recrystallization effects.
Cold welding is not suitable for detachable contacts (e.g. bonding of relay contacts) but is
well suited for permanent contacts, where the requirements regarding reliability are often
much higher.
Picture 1
Picture 1:
SEM micrograph from a cross section of well-merged surfaces in a force-fitting connection
Product Brief
PressFIT Portfolio
From 10 A to 600 A
IC [A]
650 V
500
450
300
225
200
150
100
FS450R17OE4
FS300R17OE4
FS225R17OE4
FS200R07N3E4R_B11
FS200R07PE4
FS450R12OE4
FS300R12OE4
FS225R12OE4
FS200R12PT4
FS200R12KT4R_B11
FS150R07N3E4_B11
FS150R12PT4
FS150R17PE4
FS150R07PE4
FS150R12KT4_B11
FS150R17N3E4_B11
FS100R07N3E4_B11
FS100R12PT4
FS100R17PE4
FS100R07N2E4_B11
FS100R12KT4G_B11
FS100R07PE4
FS100R12KT4_B11
FS75R07N2E4_B11
50
FS50R07N2E4_B11
FS50R06W1E3_B11
35
IC[A]
600
500
450
360
300
240
225
FS100R17N3E4_B11
FS75R12KT4_B11
FS75R12W2T4_B11
FS50R12KT4_B11
FS50R12W2T4_B11
FS35R12W1T4_B11
FS35R12KT4_B11
650 V
1200 V
FP150R07N3E4_B11
FP100R07N3E4_B11
FP100R12KT4_B11
FP75R07N2E4_B11
FP75R12KT4_B11
FP50R07N2E4_B11
FP50R06W2E3_B11
FP50R12KT4_B11
FP35R12KT4_B11
FP35R12W2T4_B11
FS30R06W1E3_B11
25
20
15
10
PIM modules
1700 V
FS500R17OE4D*
75
30
6-pack modules
1200 V
FP30R06W1E3_B11
FP25R12W2T4_B11
FP25R12KT4_B11
FS25R12W1T4_B11
FS20R06W1E3_B11
650 V
FF600R07ME4_B11
FF450R07ME4_B11
FP20R06W1E3_B11
FP15R06W1E3_B11
FP10R06W1E3_B11
Dual modules
1200 V
FF600R12ME4A_B11
FF600R12ME4_B11
FF600R12ME4C_B11
FF450R12ME4_B11
1700 V
FP15R12W1T4_B11
FP10R12W1T4_B11
n
n
n
n
n
n
n
Bridge rectifier
1600 V
FF600R17ME4_B11
FF450R17ME4_B11
TDB6HK360N16P
FF300R07ME4_B11
180
134
104
75
Published by
Infineon Technologies AG
85579 Neubiberg, Germany
© 2016 Infineon Technologies AG.
All Rights Reserved.
FF300R12ME4_B11
FF300R17ME4_B11
EconoDUAL™ 3 PressFIT
EconoPACK™ 4
Econo3 PressFIT
Econo2 PressFIT
Easy2B PressFIT
Easy1B PressFIT
TDB6HK240N16P
FF225R12ME4_B11
FF225R17ME4_B11
DDB6U180N16RR_B11
DDB6U180N16RRP_B37
TDB6HK180N16RR_B11
DDB6U134N16RR_B11
DDB6U104N16RRP_B37
DDB6U75N16W1R_B11
Please note!
THIS DOCUMENT IS FOR INFORMATION PURPOSES ONLY AND
ANY INFORMATION GIVEN HEREIN SHALL IN NO EVENT BE
REGARDED AS A WARRANTY, GUARANTEE OR DESCRIPTION OF
ANY FUNCTIONALITY, CONDITIONS AND/OR QUALITY OF OUR
PRODUCTS OR ANY SUITABILITY FOR A PARTICULAR PURPOSE.
WITH REGARD TO THE TECHNICAL SPECIFICATIONS OF OUR
PRODUCTS, WE KINDLY ASK YOU TO REFER TO THE RELEVANT
PRODUCT DATA SHEETS PROVIDED BY US. OUR CUSTOMERS AND
THEIR TECHNICAL DEPARTMENTS ARE REQUIRED TO EVALUATE
THE SUITABILITY OF OUR PRODUCTS FOR THE INTENDED
APPLICATION.
WE RESERVE THE RIGHT TO CHANGE THIS DOCUMENT AND/OR
THE INFORMATION GIVEN HEREIN AT ANY TIME.
Order Number: B133-H9210-V8-7600-EU-EC-P
Date: 05 / 2016
EconoPACK™ + / PressFIT
* with enhanced diode
Additional information
For further information on technologies, our products, the
application of our products, delivery terms and conditions
and/or prices, please contact your nearest Infineon Technologies
office (www.infineon.com).
Warnings
Due to technical requirements, our products may contain
dangerous substances. For information on the types in question,
please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by us in a written
document signed by authorized representatives of Infineon
Technologies, our products may not be used in any lifeendangering applications, including but not limited to medical,
nuclear, military, life-critical or any other applications where a
failure of the product or any consequences of the use thereof
can result in personal injury.
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