Product Brief PressFIT Our established, reliable mounting technology Infineon’s established PressFIT technology offers the possibility for reliable, solder-less mounting of power modules, meeting the nowadays demands of lead-free technology. According to the RoHS directive, since 2006 most lead-containing solder alloys have to be replaced by lead-free solders. This results in higher melting point solders and lead-free tin metallization of the PCB, which has significant effects on the mounting process. PressFIT technology is one time-saving possibility for lead-free solderless mounting of power modules. The low electrical and thermal contact resistance makes the contact suitable for a wide range of currents and applications. Environmental tests show that vibration loads and climate sequences have no negative influence on the contact resistance. This results from the gas-tight contact and high contact force. The high holding forces of the contact are independent of the PCB hole tolerances. This reduces the effort for mechanical fixing. The PressFIT process can be separated from soldering and allows module mounting on the soldering and the component side of the PCB. This increases the design flexibility. Additionally, the module mounting process can be separated from the soldering process of the PCB. The high reliability of PressFIT contacts in general promises increased system reliability. This is especially of interest if modules are operating in harsh environments. Key features ››PressFIT saves process time ››Reliable cold welding connection of module pins and PCB ››Low ohmic resistance ››Module mounting possible on soldering and component side of PCB ››Established technology in automotive, communication & industrial applications ››Decrease of FIT rate Applications ››Industrial drives ››Uninterruptable power supplies ››Renewable energy systems ››Air conditioning ››Welding ››Inductive heating ››Medical equipment ››Commercial and agricultural vehicles (CAV) www.infineon.com/IGBTmodules Product Brief PressFIT Background of PressFIT technology As mentioned above, the PressFIT technology enables lead-free solderless solder less mounting of power modules. In addition, it offers the possibility of quicker mounting of the assembly, thus saving process time and costs with the resulting potential of higher output capacity. The possibility of mounting the module on either the soldering or the component side of the PCB provides further flexibility to meet the requirements of modern assembly lines. Quality of PressFIT modules Several tests regarding the application of the PressFIT technology and its reliability in power modules have been performed according to the well-known IEC standards (e.g. IEC 60352-5), but with enhanced conditions. The result of the whole program can be concluded as follows: Not one of the tests caused any measurable contact degradation. The resistance of the connection, which is the leading indicator for the quality of the connection, is very stable during and after several loadings. This means not only that high current can be handled safely over the lifetime, but also the advanced integrated functions with low voltage and current (e.g. current sensing) will be kept absolutely stable beyond the lifetime of the system. Due to this, the PressFIT technology is well suited to power semiconductor modules – especially for future high-reliability requirements. Overview Econo press-in & press-out tools Easy press-in & press-out tools Modules Product Brief PressFIT Background of PressFIT technology Type of connection Conductor cross-section in mm 2) Failure rate λref in FIT 1) Notes: Standards/Guide Solder manual machine 0.5 0.03 IPC 610 2). class 2 Wire bond for hybrid circuits Au 0.1 0.1 28μm / Wetch - Bond 25μm / Ball - Bond 0.05 to 0.5 0.002 DIN EN 60352 - 1 / IEC 60352 - 1 CORR1 Wire-warp Crimp 1) 0.05 to 300 0.25 DIN EN 60352 - 2 / IEC 60352 - 2A 1+2 Termi-point manual, machine 0.1 to 0.5 0.02 DIN 41611-4 Press in 0.3 to 2 0.005 IEC 60352 - 5 Insulation displacement 0.05 to 1 0.25 IEC 60352 - 3. IEC 60352 - 4 Screw 0.5 to 16 0.5 DIN EN 60999 - 1 Clamp (elastic force) 0.5 to 16 0.5 DIN EN 60999 - 1 1 FIT equals one failure in 109 component hours 2) Acceptability of Printed Board Assemblies Usually if two contact faces are assembled, there are only a few spots which are really connected (metal to metal) and which carry the current – this is also true for polished surfaces. The minimum radius of such a microscopic metal-metal contact is typically 10 µm. In force-fitting technologies like PressFIT, there is always a necessary plastic deformation on these truly effective contact points within the contact zone. The contact radius increases due to the high contact pressure that occurs since the macroscopic contact force concentrates on a small microscopic contact area. That means the two faces will be merged. Thus, the effective contact zone will be increased and – most importantly – a gas-tight contact zone is generated, which is very robust against corrosive environments. The connection principle is the well-known cold welding effect. Here, free electrons are generated from the plastic deformation of both contact faces. The metal-bond electron cloud links the free electrons and connects them again with the same mechanism as in the basic metal. The bonding force is indeed lower than in the prior grid, but is increasing within the first hours of the connection due to recrystallization effects. Cold welding is not suitable for detachable contacts (e.g. bonding of relay contacts) but is well suited for permanent contacts, where the requirements regarding reliability are often much higher. Picture 1 Picture 1: SEM micrograph from a cross section of well-merged surfaces in a force-fitting connection Product Brief PressFIT Portfolio From 10 A to 600 A IC [A] 650 V 500 450 300 225 200 150 100 FS450R17OE4 FS300R17OE4 FS225R17OE4 FS200R07N3E4R_B11 FS200R07PE4 FS450R12OE4 FS300R12OE4 FS225R12OE4 FS200R12PT4 FS200R12KT4R_B11 FS150R07N3E4_B11 FS150R12PT4 FS150R17PE4 FS150R07PE4 FS150R12KT4_B11 FS150R17N3E4_B11 FS100R07N3E4_B11 FS100R12PT4 FS100R17PE4 FS100R07N2E4_B11 FS100R12KT4G_B11 FS100R07PE4 FS100R12KT4_B11 FS75R07N2E4_B11 50 FS50R07N2E4_B11 FS50R06W1E3_B11 35 IC[A] 600 500 450 360 300 240 225 FS100R17N3E4_B11 FS75R12KT4_B11 FS75R12W2T4_B11 FS50R12KT4_B11 FS50R12W2T4_B11 FS35R12W1T4_B11 FS35R12KT4_B11 650 V 1200 V FP150R07N3E4_B11 FP100R07N3E4_B11 FP100R12KT4_B11 FP75R07N2E4_B11 FP75R12KT4_B11 FP50R07N2E4_B11 FP50R06W2E3_B11 FP50R12KT4_B11 FP35R12KT4_B11 FP35R12W2T4_B11 FS30R06W1E3_B11 25 20 15 10 PIM modules 1700 V FS500R17OE4D* 75 30 6-pack modules 1200 V FP30R06W1E3_B11 FP25R12W2T4_B11 FP25R12KT4_B11 FS25R12W1T4_B11 FS20R06W1E3_B11 650 V FF600R07ME4_B11 FF450R07ME4_B11 FP20R06W1E3_B11 FP15R06W1E3_B11 FP10R06W1E3_B11 Dual modules 1200 V FF600R12ME4A_B11 FF600R12ME4_B11 FF600R12ME4C_B11 FF450R12ME4_B11 1700 V FP15R12W1T4_B11 FP10R12W1T4_B11 n n n n n n n Bridge rectifier 1600 V FF600R17ME4_B11 FF450R17ME4_B11 TDB6HK360N16P FF300R07ME4_B11 180 134 104 75 Published by Infineon Technologies AG 85579 Neubiberg, Germany © 2016 Infineon Technologies AG. All Rights Reserved. FF300R12ME4_B11 FF300R17ME4_B11 EconoDUAL™ 3 PressFIT EconoPACK™ 4 Econo3 PressFIT Econo2 PressFIT Easy2B PressFIT Easy1B PressFIT TDB6HK240N16P FF225R12ME4_B11 FF225R17ME4_B11 DDB6U180N16RR_B11 DDB6U180N16RRP_B37 TDB6HK180N16RR_B11 DDB6U134N16RR_B11 DDB6U104N16RRP_B37 DDB6U75N16W1R_B11 Please note! THIS DOCUMENT IS FOR INFORMATION PURPOSES ONLY AND ANY INFORMATION GIVEN HEREIN SHALL IN NO EVENT BE REGARDED AS A WARRANTY, GUARANTEE OR DESCRIPTION OF ANY FUNCTIONALITY, CONDITIONS AND/OR QUALITY OF OUR PRODUCTS OR ANY SUITABILITY FOR A PARTICULAR PURPOSE. WITH REGARD TO THE TECHNICAL SPECIFICATIONS OF OUR PRODUCTS, WE KINDLY ASK YOU TO REFER TO THE RELEVANT PRODUCT DATA SHEETS PROVIDED BY US. OUR CUSTOMERS AND THEIR TECHNICAL DEPARTMENTS ARE REQUIRED TO EVALUATE THE SUITABILITY OF OUR PRODUCTS FOR THE INTENDED APPLICATION. WE RESERVE THE RIGHT TO CHANGE THIS DOCUMENT AND/OR THE INFORMATION GIVEN HEREIN AT ANY TIME. Order Number: B133-H9210-V8-7600-EU-EC-P Date: 05 / 2016 EconoPACK™ + / PressFIT * with enhanced diode Additional information For further information on technologies, our products, the application of our products, delivery terms and conditions and/or prices, please contact your nearest Infineon Technologies office (www.infineon.com). Warnings Due to technical requirements, our products may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by us in a written document signed by authorized representatives of Infineon Technologies, our products may not be used in any lifeendangering applications, including but not limited to medical, nuclear, military, life-critical or any other applications where a failure of the product or any consequences of the use thereof can result in personal injury.