4xR01T3v130.pdf

HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
Features
MCU Features
·
MCU Operating voltage:
fSYS= 4MHz: 2.2V~3.6V
fSYS= 8MHz: 3.0V~3.6V
·
Power Down modes and wake-up functions to reduce power consumption
·
Oscillator types
- External high frequency Crystal
- External RC
- Internal RC
- External low frequency crystal
- Watchdog Timer Internal RC Oscillator
·
Three operational modes: Normal, Slow, Sleep
·
Fully integrated internal 4MHz, 8MHz oscillator requires no external components
·
OTP Program Memory: 1K´15
·
RAM Data Memory: 96´8
·
Watchdog Timer function
·
All instructions executed in one or two instruction cycles
·
Table read instructions
·
63 powerful instructions
·
6-level subroutine nesting
·
Bit manipulation instruction
·
Low voltage reset function
·
16-pin NSOP package type
·
Up to 8 bidirectional I/O lines
·
4 channel 12-bit ADC
·
1 channel 8-bit PWM
·
External interrupt input shared with an I/O line
·
Two 8-bit programmable Timer/Event Counter with overflow interrupt and prescaler
·
Time-Base function
·
Programmable Frequency Divider - PFD
RF Transmitter Features
Rev. 1.30
·
Complete UHF ASK/OOK transmitter
·
Frequency range 300MHz to 450MHz
·
Data rates more than 10k bps
·
Output Power up to 10dBm
·
Low voltage operation - down to 2.2V
·
Data tracking function for power saving
·
Reference clock output for MCU IRC clock synchronisation
1
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
General Description
These devices provide a combination of a fully featured MCU plus an RF transmitter function, giving
them great flexibility for use in wide range of wireless I/O control applications such as industrial
control, consumer products, subsystem controllers, etc.
Analog features include a multi-channel 12-bit A/D converter. Multiple and extremely flexible
Timer/Event Counters provide full timing functions. Protective features such as an internal Watchdog
Timer and Low Voltage Reset coupled with excellent noise immunity and ESD protection ensure that
reliable operation is maintained in hostile electrical environments. An extensive choice of oscillator
functions are provided including a fully integrated system oscillator which requires no external
components for its implementation. The ability to operate and switch dynamically between a range of
operating modes using different clock sources gives users the ability to optimise microcontroller
operation and minimise power consumption. The devices also include flexible I/O programming
features Time-Base functions and a range of other features.
The RF transmitter is a high performance and easy to use transmitter operating in the 300MHz to
450MHz frequency band. One only needs to add a crystal reference frequency, and a limited number of
external components to create a complete and versatile RF transmitter system. The device is capable of
delivering more than +9dBm into a 50W load. Such a power level enables a small form factor
transmitter to operate near the maximum limit of the transmission regulations. The device can operate
with ASK - Amplitude Shift Keying, and OOK - On-Off Keying, UHF receiver types from wide-band
super-regenerative radios to narrow-band, high performance super-heterodyne receivers. The data rate
is higher than 10kbps, allowing the device to support more complicated control protocols.
For enhanced power saving, the device includes a data tracking function. The data tracking function
enables the PLL to be activated as long as high transient data input trigger signals are received. The
PLL will also be automatically switched off if there are no data input transients for a time exceeding
approximately 300ms. As there is a reference clock input on line PB0, the MCU can use its internal RC
clock rather than using an additional crystal for the system clock. These features add up to ensure that
the devices can offer excellent capabilities in terms of functionality and power-saving as well as being
highly cost effective in a huge range of remote wireless applications
Selection Guide
Part No.
Program
Data
Memory Memory
I/O
8-bit
Timer
Time
Base
RF
Transmitter
A/D
PWM
¾
¾
HT48R01T3
1K´15
96´8
9
2
1
Ö
HT46R01T3
1K´15
96´8
9
2
1
Ö
Rev. 1.30
2
12-bit´4 8-bit´1
Stack Package
6
16NSOP
6
16NSOP
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
Block Diagram
The following block diagram illustrates the dual-chip structure of the devices, where an individual
MCU and RF Transmitter devices are combined into a single package.
V
A V
D D
D D
P B 1 /D O U T
P A 0 /A N 0
P A O U T
R F M o d u le
P A 1 /P F D /A N 1
P A 2 /T M R 0 /A N 2
H T 4 6 R 0 1 B
H T 4 8 R 0 1 B
P A 3 /IN T /A N 3
P A 4 /P W M /T M R 1
P B 1
D IN
P B 0
C R E F
X O U T
X IN
E N
P A 5 /O S C 2
P A 6 /O S C 1
P A 7 /R E S
V S S
A V
S S
Internal Chip Interconnection Diagram
Note: The PWM and AN0~AN3 shared-pin functions only exist in the HT46R01T3 device.
L o w
V o lta g e
R e s e t
P W M
D r iv e r
P F D
D r iv e r
R F
T r a n s m itte r
W a tc h d o g
T im e r
I/O
P o rts
R e s e t
C ir c u it
8 - b it
R IS C
M C U
C o re
In te rru p t
C o n tr o lle r
E x te rn a l
R C /X T
O s c illa to r
A /D
C o n v e rte r
T im e r s
T im e
B a s e
In te rn a l
O s c illa to r
Note: The PWM and A/D Converter functions only exist in the HT46R01T3 device.
Rev. 1.30
3
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
Pin Assignment
P B 1 /D O U T
1
1 6
P A 4 /P W M /T M R 1
P B 1 /D O U T
1
1 6
P A 4 /T M R 1
P A 3 /IN T /A N 3
2
1 5
P A 5 /O S C 2
P A 3 /IN T
2
1 5
P A 5 /O S C 2
P A 2 /T M R 0 /A N 2
3
1 4
P A 6 /O S C 1
P A 2 /T M R 0
3
1 4
P A 6 /O S C 1
P A 1 /P F D /A N 1
4
1 3
P A 7 /R E S
P A 1 /P F D
4
1 3
P A 7 /R E S
P A 0 /A N 0
5
1 2
V D D
P A 0
5
1 2
V D D
V S S
6
1 1
X O U T
V S S
6
1 1
X O U T
A V S S
7
1 0
X IN
A V S S
7
1 0
X IN
P A O U T
8
9
P A O U T
8
9
A V D D
A V D D
H T 4 8 R 0 1 T 3
1 6 N S O P -A
H T 4 6 R 0 1 T 3
1 6 N S O P -A
Pin Description
HT46R01T3
Pin Name
Function
OPT
I/T
PA0
PAPU
PAWK
ST
AN0
ADCR
AN
PA1
PAPU
PAWK
ST
CMOS General purpose I/O. Register enabled pull-up and wake-up.
PFD
CTRL0
¾
CMOS PFD output
AN1
ADCR
AN
PA2
PAPU
PAWK
ST
TC0
¾
ST
¾
External Timer 0 clock input
AN2
ADCR
AN
¾
A/D channel 2
PA3
PAPU
PAWK
ST
INT
¾
ST
¾
External interrupt input
AN3
ADCR
AN
¾
A/D channel 3
PA4
PAPU
PAWK
ST
TC1
¾
ST
PWM
CTRL0
¾
CMOS PWM output
PA5
PAPU
PAWK
ST
CMOS General purpose I/O. Register enabled pull-up and wake-up.
OSC2
CO
¾
PA6
PAPU
PAWK
ST
OSC1
CO
OSC
PA7
PAWK
ST
RES
CO
ST
PA0/AN0
PA1/PFD/AN1
PA2/TMR0/AN2
PA3/INT/AN3
PA4/TMR1/PWM
PA5/OSC2
PA6/OSC1
PA7/RES
Rev. 1.30
O/T
Description
CMOS General purpose I/O. Register enabled pull-up and wake-up.
¾
¾
A/D channel 0
A/D channel 1
CMOS General purpose I/O. Register enabled pull-up and wake-up.
CMOS General purpose I/O. Register enabled pull-up and wake-up.
CMOS General purpose I/O. Register enabled pull-up and wake-up.
¾
OSC
External Timer 1 clock input
Oscillator pin
CMOS General purpose I/O. Register enabled pull-up and wake-up.
¾
Oscillator pin
NMOS General purpose I/O. Register enabled wake-up.
¾
Reset input
4
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
Pin Name
Function
OPT
I/T
O/T
Description
General purpose I/O. Register enabled pull-up.
CMOS Internally connected to DIN pin on RF module.
Must be setup as output for interfacing to RF module.
PB1
PBPU
ST
DOUT
¾
¾
¾
PAOUT
¾
¾
NSO
RF power amplifier output
XOUT
¾
¾
HXT
RF chip crystal pin
XIN
XIN
¾
HXT
¾
RF chip crystal pin
VDD
VDD
¾
PWR
¾
MCU power supply
PB1/DOUT
PAOUT
XOUT
Data output from MCU to RF module
Connected internally to PB1
VSS
¾
PWR
¾
MCU ground
AVDD
AVDD
¾
PWR
¾
RF chip power supply
AVSS
AVSS
¾
PWR
¾
RF chip ground
VSS
Note:
I/T: Input type
O/T: Output type
OPT: Optional by configuration option (CO) or register option
PWR: Power
CO: Configuration option
ST: Schmitt Trigger input
CMOS: CMOS output
NSO: Non-standard output
HT48R01T3
Pin Name
PA0
Function
OPT
I/T
PA0
PAPU
PAWK
ST
CMOS General purpose I/O. Register enabled pull-up and wake-up.
PA1
PAPU
PAWK
ST
CMOS General purpose I/O. Register enabled pull-up and wake-up.
PFD
CTRL0
¾
CMOS PFD output
PA2
PAPU
PAWK
ST
CMOS General purpose I/O. Register enabled pull-up and wake-up.
TC0
¾
ST
PA3
PAPU
PAWK
ST
INT
¾
ST
PA4
PAPU
PAWK
ST
TC1
¾
ST
PA5
PAPU
PAWK
ST
OSC2
CO
¾
PA6
PAPU
PAWK
ST
OSC1
CO
OSC
PA1/PFD
PA2/TMR0
PA3/INT
PA4/TMR1
PA5/OSC2
PA6/OSC1
Rev. 1.30
O/T
¾
Description
External Timer 0 clock input
CMOS General purpose I/O. Register enabled pull-up and wake-up.
¾
External interrupt input
CMOS General purpose I/O. Register enabled pull-up and wake-up.
¾
External Timer 1 clock input
CMOS General purpose I/O. Register enabled pull-up and wake-up.
OSC
Oscillator pin
CMOS General purpose I/O. Register enabled pull-up and wake-up.
¾
Oscillator pin
5
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
Pin Name
Function
OPT
I/T
PA7
PAWK
ST
RES
CO
ST
PB1
PBPU
ST
DOUT
¾
¾
¾
PAOUT
¾
¾
NSO
RF power amplifier output
XOUT
¾
¾
HXT
RF chip crystal pin
XIN
XIN
¾
HXT
¾
RF chip crystal pin
VDD
VDD
¾
PWR
¾
MCU power supply
VSS
VSS
¾
PWR
¾
MCU ground
AVDD
AVDD
¾
PWR
¾
RF chip power supply
AVSS
AVSS
¾
PWR
¾
RF chip ground
PA7/RES
PB1/DOUT
PAOUT
XOUT
Note:
O/T
Description
NMOS General purpose I/O. Register enabled wake-up.
¾
Reset input
General purpose I/O. Register enabled pull-up.
CMOS Internally connected to DIN pin on RF module.
Must be setup as output for interfacing to RF module.
Data output from MCU to RF module
Connected internally to PB1
I/T: Input type
O/T: Output type
OPT: Optional by configuration option (CO) or register option
PWR: Power
CO: Configuration option
ST: Schmitt Trigger input
CMOS: CMOS output
NSO: Non-standard output
Internally Connected Pins
In addition to the internal connection between MCU pin, PB1, and RF Transmitter pin, DIN, the MCU
pin, PB0, and RF Transmitter pin, CREF, are also internally connected. However it should be noted
that PB0/CREF is not connected to any external pins on the device package.
Pin Name
Function
OPT
I/T
O/T
PB0
PBPU
ST
CMOS
CREF
¾
¾
¾
PB0/CREF
Rev. 1.30
Description
General Purpose I/O. Register enabled pull-high resistor.
Internally connected to CREF pin on RF module.
Must be setup as an input for interfacing to RF module.
Not available on package.
RF Transmitter generated pulses for synchronisation.
Connected internally to PB0. Not available on package.
6
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
D.C. Characteristics
Ta=25°C
Test Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
fSYS=4MHz
2.2
¾
3.6
V
fSYS=8MHz
3.3
¾
3.6
V
2.0
¾
3.6
V
VDD
VDD
Operating Voltage
¾
Conditions
AVDD
RF Transmitter Power Supply
¾
IDD1
Operating current
(Crystal OSC, RC OSC)
3V
No load, fSYS=4MHz,
ADC disable
¾
1
2
mA
IDD2
Operating Current (internal
RC+RTC OSC, Normal Mode)
3V
No load, fSYS=4MHz,
ADC disable
¾
1
2
mA
ISTB1
Standby Current
(WDT OSC on, RTC off)
3V
No load, system HALT
¾
¾
5
mA
ISTB2
Standby Current
(WDT OSC off, RTC off)
3V
No load, system HALT
¾
¾
1
mA
ISTB3
Standby Current
(WDT OSC off, RTC on)
3V
No load, system HALT,
RTC osc slowly start-up
¾
¾
5
mA
VIL1
Input Low Voltage for PA, PB,
TMR0, TMR1, INT
¾
¾
0
¾
0.3VDD
V
VIH1
Input High Voltage for PA, PB,
TMR0, TMR1, INT
¾
¾
0.7VDD
¾
VDD
V
VIL2
Input Low Voltage (RES)
¾
¾
0
¾
0.4VDD
V
VIH2
Input High Voltage (RES)
¾
¾
0.9VDD
¾
VDD
V
VLVR1
Low Voltage Reset 1
¾
Configuration option=2.1V
1.98
2.10
2.22
V
VLVR2
Low Voltage Reset 2
¾
Configuration option=3.15V
2.98
3.15
3.32
V
IOL
I/O Port Sink Current for PA, PB
3V
VOL=0.1VDD
4
8
¾
mA
IOH
I/O Port Source Current for PA, PB 3V
VOH=0.9VDD
-2
-4
¾
mA
RPH
Pull-high Resistance for I/O
20
60
100
kW
Rev. 1.30
¾
¾
3V
7
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
A.C. Characteristics
Ta=25°C
Test Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
-10%
4/8
+10%
MHz
2.2V~3.6V
0
¾
4000
kHz
3.3V~3.6V
0
¾
8000
kHz
VDD
fHIRC
System Clock
(HIRC)
3V
fTIMER
Timer Input Frequency
(TCn)
¾
Conditions
Ta= -40°C~85°C
tWDTOSC Watchdog Oscillator Period
3V
¾
45
90
180
ms
tRES
External Reset Low Pulse Width
¾
¾
1
¾
¾
ms
tSST
System Start-up Time Period
¾
¾
1024
¾
tSYS
tINT
Interrupt Pulse Width
¾
¾
1
¾
¾
ms
tLVR
Low Voltage Width to Reset
¾
¾
0.25
1.00
2.00
ms
Note:
Wake-Up from HALT
1. tSYS=1/fSYS
2. *For fERC, as the resistor tolerance will influence the frequency a precision resistor is recommended.
A/D Converter Electrical Characteristics
Ta=25°C
Test Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
2.7
¾
3.6
V
0
¾
VADC/
VREF
V
TBD
(TBC)
¾
VADC
+0.1
V
VREF=VADC=VDD,
tAD=0.5ms
-2
¾
2
LSB
-4
¾
4
LSB
3V
VREF=VADC=VDD,
tAD=0.5ms (calculated
on best-fit line)
3V
No load, tAD=0.5ms
¾
0.5
¾
mA
0.5
¾
10
ms
VDD
VADC
A/D Operating Voltage
¾
VADI
A/D Converter Input Voltage
¾
VREF
A/D Converter Input reference
Voltage Range
¾
DNL
A/D Converter Differential
Non-Linearity
A/D Converter Integral
Non-Linearity
INL
2.7V
3V
2.7V
Conditions
VREF=VADC
¾
VADC=3V
IADC
Additional Power Consumption
if A/D Converter is Used
tAD
A/D Converter Clock Period
2.7V~
3.6V
tADC
A/D Converter Sampling Time
(see note)
2.7V~
12-bit ADC
3.6V
¾
16
¾
tAD
tON2ST
A/D Converter on to ADC Start
2.7V~
3.6V
2
¾
¾
ms
Note:
¾
¾
ADC conversion time (tAD)= n (bits ADC) + 4 (sampling time), the conversion for each bit needs one ADC
clock(tAD).
Rev. 1.30
8
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
RF Transmitter Electrical Characteristics
Specifications apply for AVDD=3.0V, Ta = 25°C, Freq X¢tal OSC=13.560MHz, DATA is
transmitting. Bold values indicate -20°C to 70°C unless otherwise noted. 1kbps data rate 50% duty
cycle. RL 50W load (matched)
Test Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
@315MHz, POUT=+10dBm
¾
12.5
¾
mA
@433.92MHz
¾
12.5
¾
mA
@315MHz
¾
3.0
¾
mA
@433.92 MHz
¾
3.0
¾
mA
@315MHz
¾
1.0
¾
mA
@433.92 MHz
¾
1.0
¾
mA
@315MHz *
¾
9.5
¾
dBm
@433.92MHz *
¾
9.5
¾
dBm
@630MHz, 2nd harm
¾
-48
¾
dBc
@945MHz, 3rd harm
¾
-60
¾
dBc
@867.84MHz, 2nd harm
¾
-45
¾
dBc
@1301.76MHz, 3rd harm
¾
-55
¾
dBc
AVDD
II
Data High Current
IO
Data Low Current
ISTB
EN Low & DIN Low Current
Conditions
3V
3V
3V
RF and Crystal
Output power level
Harmonics output for 315 MHz
Harmonics Output for 433.92MHz
Note:
3.3V
3V
3V
Extinction Ratio for ASK 10Kbps
3V
¾
¾
70
¾
dBc
Data Rate
3V
¾
10
¾
¾
kbps
@315MHz
¾
kHz
3V
¾
<900
Occupied Bandwidth
@433.92MHz
¾
<1000
¾
kHz
100kHz from Carrier
¾
-78
¾
dBc/Hz
1000kHz from Carrier
¾
-77
¾
dBc/Hz
100kHz from Carrier
¾
-78
¾
dBc/Hz
1000kHz from Carrier
¾
-76
¾
dBc/Hz
315MHz Single Side Band Phase
Noise
3V
433.92MHz Single Side Band
Phase Noise
3V
XTLIN, XTLOUT
3V
Pin capacitance
¾
2
¾
pF
Output Blanking
3V
Standby transition from low
to high **
¾
500
¾
ms
ASK to RF Out Response Time
3V
Delta between ASK input
transition from Low To High
to RF output transition from
low to high
¾
1
¾
ms
@315MHz
¾
Hz
3V
¾
150
CREF Clock Output Frequency
@433.92MHz
¾
207
¾
Hz
* Depend on PC board layout
** Generally limited by crystal
Rev. 1.30
9
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
Power-on Reset Characteristics
Ta=25°C
Test Conditions
Symbol
Parameter
VDD
Conditions
Min.
Typ.
Max.
Unit
VPOR
VDD Start Voltage to Ensure
Power-on Reset
¾
¾
¾
¾
100
mV
RRVDD
VDD raising rate to Ensure
Power-on Reset
¾
¾
0.035
¾
¾
V/ms
Ta=25°C,
without 0.1mF between
VDD and VSS
0.9
¾
1.5
V
Ta=-40°C~85°C,
without 0.1mF between
VDD and VSS
0.6
¾
1.8
V
without 0.1mF between
VDD and VSS
2
¾
¾
ms
without 0.1mF between
VDD and VSS
TBD
¾
¾
ms
VPOR MAX
tPOR
V
Maximum VDD Start Voltage to
Ensure Power-on Reset
Power-on Reset Low Pulse
Width
¾
¾
D D
tP
R R
O R
V D D
V
P O R
T im e
Functional Description
As these device packages contain different chips, for a detailed functional description, users must refer
to the relevant datasheets for the related MCU. The following table shows which individual devices
are inside each package.
Device
MCU
HT48R01T3
HT48R01B
HT46R01T3
HT46R01B
Multi-chip Internal Devices
The MCU controls the RF transmitter via a two line interface using two of its I/O pins, PB0 and PB1.
Pin PB1, which should be setup as an output by the MCU, is used to generate the encoding data. Pin
PB0, which should be setup as an input by the MCU, is used for synchronising purposes. There are
some special considerations which need to be taken into account when using these devices. These
points will be mentioned in the hardware and software consideration sections.
Hardware Considerations
As these devices are composed of an individual MCU and RF Transmitter, using them together
requires the user to take care of some special points.
Rev. 1.30
10
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
Absolute Maximum Ratings
The Absolute Maximum Ratings must be checked for discrepancies and the necessary care taken in
device handling and usage.
Power Supply
Examination of the block diagram will reveal that the Power Supply and Ground pins of the RF
Transmitter and MCU are independent and must be connected together if they are to share the same
power supply. If the same power supply is to be used for both chips then care must be taken as both
have different power supply requirements.
When calculating the total current consumption of the device, the internal DC specification currents
for the MCU and RF parts must be added together.
The RF data to be transmitted is derived from the PB1 line. When the PB1 line is high the device will
transmit allowing users to program their encoded data on this line. If the RF transmitter is in its
standby mode then there will be a delay of about 500ms before transmission begins. When the device
is transmitting, a synchronising signal will be generated on the CREF/PB0 pin which allows the
MCU to use it to calibrate its internal RC oscillator. To avoid the RF circuits entering an unknown
state, pin PB1 should be setup as an output as soon as possible after power-on.
To minimise power consumption, only when PB1 is high, can the RF signal be transmitted and the
reference clock on PB0 be generated. If no data transitions are generated on PB1 for 300~500ms, the
transmitter will enter a standby state and the RF circuits will be switched off along with the internal
PLL to save power. The signal generated on the CREF/PB0 line will also remain at a low level. The
internal PLL function is used to generate the RF frequency with a multiplier of 32 times the crystal
frequency. The relationship is: RF frequency = 32 ´ Crystal frequency. Therefore a 9.84375MHz
crystal will generate an RF frequency of 315MHz and a13.56MHz crystal will generate an RF
frequency of 433.92MHz. All PLL circuits are contained within the device and the only external
component required is a suitable crystal.
Power Down and Wake up
It is important to note that if the MCU is powered down or placed into a low power mode to conserve
power, that the RF Transmitter may continue running and will consume a certain amount of power.
Before powering down the MCU it is important to carefully manage the PB1 pin to ensure the
RF-Transmitter enters its power down state.
Programming Considerations
As MCU lines PB0 and PB1 are used to control the RF transmitter function, care must be taken to
manage these lines correctly in the application program. As line PB1 is used to send data to the RF
circuitry this line must be setup as an output. To avoid erroneous operation of the RF circuits this line
should be setup as an output immediately after power-on. The PB0 pin on the MCU is used to receive
synchronising pulses from the RF circuits and should therefore be setup as an input.
As the MCU will be powered down independently of the RF Transmitter Peripheral Module, care must
be taken to ensure that the MCU first clears its PB1 line to zero before powering down. This will allow
the RF Transmitter Peripheral Module to enter its standby state and thus keep power consumption to a
minimum.
Rev. 1.30
11
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
Application Circuits
Note:
1. 9.84375MHz crystal used for RF frequency of 315MHz
13.56MHz crystal used for RF frequency of 433.92MHz
2. The extra LC filter on the PAOUT pin can reduce second harmonics
3. The L and C values shown in brackets are for 433.92MHz
Rev. 1.30
12
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
Package Information
16-pin NSOP (150mil) Outline Dimensions
1 6
A
9
B
8
1
C
C '
G
H
D
E
=
F
MS-012
Symbol
Nom.
Max.
A
0.228
¾
0.244
B
0.150
¾
0.157
C
0.012
¾
0.020
C¢
0.386
¾
0.402
D
¾
¾
0.069
E
¾
0.050
¾
F
0.004
¾
0.010
G
0.016
¾
0.050
H
0.007
¾
0.010
a
0°
¾
8°
Symbol
A
Rev. 1.30
Dimensions in inch
Min.
Dimensions in mm
Min.
Nom.
Max.
5.79
¾
6.20
B
3.81
¾
3.99
C
0.30
¾
0.51
C¢
9.80
¾
10.21
D
¾
¾
1.75
E
¾
1.27
¾
F
0.10
¾
0.25
G
0.41
¾
1.27
H
0.18
¾
0.25
a
0°
¾
8°
13
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
Reel Dimensions
D
T 2
A
C
B
T 1
SOP 16N (150mil)
Symbol
Description
Dimensions in mm
A
Reel Outer Diameter
330.0±1.0
B
Reel Inner Diameter
100.0±1.5
C
Spindle Hole Diameter
D
Key Slit Width
T1
Space Between Flange
T2
Reel Thickness
Rev. 1.30
13.0
+0.5/-0.2
2.0±0.5
16.8
+0.3/-0.2
22.2±0.2
14
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
Carrier Tape Dimensions
P 0
D
P 1
t
E
F
W
B 0
C
D 1
P
K 0
A 0
R e e l H o le
IC
p a c k a g e p in 1 a n d th e r e e l h o le s
a r e lo c a te d o n th e s a m e s id e .
SOP 16N (150mil)
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
16.0±0.3
P
Cavity Pitch
8.0±0.1
E
Perforation Position
1.75±0.1
F
Cavity to Perforation (Width Direction)
7.5±0.1
D
Perforation Diameter
1.55
+0.10/-0.00
D1
Cavity Hole Diameter
1.50
+0.25/-0.00
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
6.5±0.1
B0
Cavity Width
10.3±0.1
K0
Cavity Depth
2.1±0.1
t
Carrier Tape Thickness
0.30±0.05
C
Cover Tape Width
13.3±0.1
Rev. 1.30
15
November 23, 2010
HT46R01T3/HT48R01T3
8-Bit OTP MCU with RF Transmitter
Holtek Semiconductor Inc. (Headquarters)
No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
Tel: 886-3-563-1999
Fax: 886-3-563-1189
http://www.holtek.com.tw
Holtek Semiconductor Inc. (Taipei Sales Office)
4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan
Tel: 886-2-2655-7070
Fax: 886-2-2655-7373
Fax: 886-2-2655-7383 (International sales hotline)
Holtek Semiconductor Inc. (Shenzhen Sales Office)
5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057
Tel: 86-755-8616-9908, 86-755-8616-9308
Fax: 86-755-8616-9722
Holtek Semiconductor (USA), Inc. (North America Sales Office)
46729 Fremont Blvd., Fremont, CA 94538, USA
Tel: 1-510-252-9880
Fax: 1-510-252-9885
http://www.holtek.com
Copyright Ó 2010 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.
Rev. 1.30
16
November 23, 2010
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