LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT LED TAPE AND REEL Pb Lead-Free Parts LSEFDGM9553/R9 DATA SHEET DOC. NO : QW0905-LSEFDGM9553/R9 REV. : A DATE : 22 - May. - 2014 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/12 PART NO. LSEFDGM9553/R9 Features: 1. Top view LED. 2. white SMT package. 3. Leadframe package with individual 4 pin. 4.Wide viewing angle. 5.Soldering methods:IR reflow soldering. 6.Feature of the device:more light due to higher optical efficiency;extremely wide viewing angle;ideal for backlighting and coupling in light guide. Descriptions: The LSEFDGM9553 SMD has wide viewing angle and optimized light coupling by inter reflector,The low current requirement makes this device ideal for portable equipment or any other application where power is at a premium. Applications: 1. Telecommunication: indicator and backlighting in telephone and fax. 2. Indicators. 3. Switch lights. Device Selection Guide: PART NO LSEFDGM9553/R9 MATERIAL COLOR Emitted AlGaInP Orange InGaN Green Lens Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/12 PART NO. LSEFDGM9553/R9 Package Dimensions 3.5 1.9 3 0.8 2 0.7±0.05 0.8 0.7±0.05 2.7 4 2.2 1 0.7±0.05 0.7±0.05 Soldering Terminal 3.2 SEF 0.8 3- +2 4+ -1 DGM 0.8 0.8 Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 4.9 1.6 1.6 0.85 0.65 0.85 Note : The tolerances unless mentioned is ±0.1mm,Unit=mm. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/12 PART NO. LSEFDGM9553/R9 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol UNIT SEF DGM Forward Current IF 50 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 100 mA Power Dissipation PD 130 108 mW Reverse Current @5V Ir 10 50 μA Electrostatic Discharge ESD 2000 500 V Operating Temperature Topr -20 ~ + 80 ℃ Storage Temperature Tstg -30 ~ + 100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) Items Luminous Intensity Dominant Wavelength Spectral Line Half-Width Forward Voltage Viewing Angle Symbol Iv λD △λ VF 2θ 1/2 SEF Min. Typ. 320 400 ---- 1100 ---- DGM 800 Max. UNIT SEF ---- 605 ---- DGM ---- 525 ---- SEF ---- 17 ---- DGM ---- 36 ---- SEF 1.7 ---- 2.6 DGM 2.8 ---- 3.6 SEF ---- 120 ---- DGM ---- 120 ---- CONDITION mcd IF=20mA nm IF=20mA nm IF=20mA V IF=20mA deg IF=20mA Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2.The luminous intensity data did not including ±15% testing tolerance. 3. The dominant wavelength data did not including ±1nm testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/12 PART NO. LSEFDGM9553/R9 Luminous Intensity Classification BIN CODE SEF Min. Max. T 320 500 U 500 800 BIN CODE DGM Iv(mcd) at 20mA Iv(mcd) at 20mA Min. Max. V-1 800 1000 V-2 1000 1250 W-1 1250 1600 W-2 1600 2000 Dominant Wavelength Classification BIN CODE SEF Min. Max. 20 598 600 21 600 603 22 603 606 23 606 609 24 609 612 BIN CODE DGM λD(nm) at 20mA λD(nm) at 20mA Min. Max. 1O 519 522 1P 522 525 1Q 525 528 1R 528 531 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/12 PART NO. LSEFDGM9553/R9 Typical Electro-Optical Characteristics Curve SEF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 1.5 2.0 2.5 3.0 1.0 10 1.2 Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 100 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity @20mA 1000 Forward Current(mA) Forward Voltage(V) -40 100 Fig.6 Directive Radiation 1.0 0° -30° 30° 0.5 -60° 60° 0 500 550 600 650 100% 75% 50% Wavelength (nm) 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/12 PART NO. LSEFDGM9553/R9 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 5.0 1.0 10 1000 Forward Current(mA) Forward Voltage(V) Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 100 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 2.5 2.0 1.5 1.0 0.5 0.0 -40 100 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation Relative Intensity@20mA 1.0 0° -30° 30° 0.5 -60° 60° 0.0 450 500 550 600 100% 75% 50% Wavelength (nm) 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/12 PART NO. LSEFDGM9553/R9 Carrier Type Dimensions Loaded quantity 2000 PCS per reel 4.0 2.0 4.0 2.08 ψ1.5 1.75 3.5 8.0 ±0.3 5.4 3.84 3.02 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. ‧ Packing Specifications 0.2 0.8 0.6 0.8 0.6 0.2 0.4 0.4 Label Aluminum Moist-Proof bag Label LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/12 PART NO. LSEFDGM9553/R9 Label Explanation LIGITEK ELECTRONICS CO., LTD. Pb PART : LSEFDGM9553/R9 BIN : Luminous Intensity LOT : GS11450168 HUE : Dominant Wavelength QTY(PCS): 2000 VF:1.7-2.6 BIN/HUE : T/21-V-1/1P VF:2.8-3.6 VF : Forward Voltage Reel Dimensions 0.2 0.4 0.8 0.8 0.6 0.2 0.4 0.6 2.0±0.5 178±1.5 60.0±1.0 9.0±1.0 ψ13.5±1.0 12.0±1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/12 PART NO. LSEFDGM9553/R9 Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 10/12 PART NO. LSEFDGM9553/R9 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 320℃ 3 sec one time only. 2 PB-Free Reflow Solder 1~5°C/sec 1~5°C/sec Preheat 180~200°C 260°C MaX. 10sec.Max 6°C/sec Above 220°C 60 sec.Max. 120 sec.Max. Note: 1.Reflow soldering should not be done more than two times. 2.When soldering,do not put stress on the LEDs during heating. 3.After soldering,do not warp the circuit board. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 11/12 PART NO. LSEFDGM9553/R9 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃±5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40% of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 12/12 PART NO. LSEFDGM9553/R9 Reliability Test: (1)Test items and results Test Item Classification Test Condition Sample Size Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs 22 High Temperature Storage Test 1.Ta=105 ℃± 5℃ 2.t= 500 hrs 22 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs 22 High Temperature High Humidity Storage Test 1.IR-Reflow In-Board, 2 Times 2.Ta= 85℃± 5℃ 3.RH=90 %~95 % 4.t= 500hrs±2hrs 22 1.IR-Reflow In-Board,2 times 2.Ta=105 ℃ ±5℃& -40 ℃± 5℃ ( 30min) (30min) 3.total 100 cycles 22 1.T.Sol=260 ℃±5℃ 2.Dwell Time= 10 Max. 22 1.105 ℃ ~ 25℃ ~ - 40℃ 30mins 15mins 30mins 2.10 0 Cyeles 22 Endurance Test Thermal Shock Test Environmental Test Reflow Soldering Test Temperature Cycling (2)Criteria for judging the damage Item Symbol Test Conditions Criteria for Judgement Min. Max. Forward Voltage Vf If=20mA - U.S.L x1.2 Reverse Current Ir Vr=5V - U.S.L x2.0 Luminous Intensity Iv If=20mA L.S.L x 0.5 - Note: 1.U.S.L.:Upper Standard Level. 2.L.S.L.:Lower Standard Level.