LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Pa LG-195HRF/DBK-CT DATA SHEET DOC. NO : QW0905-LG-195HRF/DBK-CTB REV: A DATE : 04 - Mar. - 2016 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/12 PART NO. LG-195HRF/DBK-CT Features: 1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with infrared and vapor phase reflow solder process. Descriptions: 1. The LG-195 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: PART NO LG-195HRF/DBK-CT MATERIAL COLOR Emitted AlGaInP Red InGaN Blue Lens Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/12 PART NO. LG-195HRF/DBK-CT Package Dimensions 1 1.5 Soldering Terminal 0.55 4 0.25 0.18 0.4 Die1 Die2 1.6 1.1 0.4 RESIN Cathode 0.6 PCB 0.85 3 2 1 + 4 + HRF DBK 2 3 Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 2.2 0.4 1.85 0.25 Note : The tolerances unless mentioned is ±0.1mm,Angle ±0.5. Unit=mm. 0.6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/12 PART NO. LG-195HRF/DBK-CT Absolute Maximum Ratings at Ta=25℃ Ratings Symbol Parameter HRF DBK UNIT Power Dissipation PD 60 72 mW Peak Forward Current Duty 1/10@10KHz IFP 90 100 mA Forward Current IF 25 20 mA Reverse Current @5V Ir 10 50 μA Electrostatic Discharge(HMB) ESD 2000 500 V Operating Temperature Topr -40 ~ + 85 ℃ Storage Temperature Tstg -40 ~ + 100 ℃ Typical Electrical & Optical Characteristics (Ta=25℃) Items Luminous Intensity Dominant Wavelength Spectral Line Half-Width Forward Voltage Viewing Angle Min. Typ. HRF 32 125 ---- DBK 50 125 ---- HRF ---- 630 ---- DBK ---- 470 ---- HRF ---- 20 ---- DBK ---- 30 ---- HRF 1.5 ---- 2.4 DBK 2.8 ---- 3.6 HRF ---- 130 ---- DBK ---- 130 ---- Symbol Iv λD △λ VF 2θ 1/2 Max. UNIT Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 3.The dominant wavelength data did not including ±1nm testing tolerance CONDITION mcd IF=20mA nm IF=20mA nm IF=20mA V IF=20mA deg IF=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/12 PART NO. LG-195HRF/DBK-CT Luminous Intensity Classification BIN CODE HRF Min. Max. N 32 50 P 50 80 Q 80 125 R 125 200 BIN CODE DBK Iv(mcd) at 20mA Iv(mcd) at 20mA Min. Max. P 50 80 Q 80 125 R 125 200 S 200 320 Dominant Wavelength Classification BIN CODE HRF Min. Max. 29 624 627 30 627 630 31 630 633 32 633 636 BIN CODE DBK λD(nm) at 20mA λD(nm) at 20mA Min. Max. 0D 465 468 0C 468 471 0B 471 474 0A 474 477 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/12 PART NO. LG-195HRF/DBK-CT Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1.0 1.5 2.0 2.5 3.0 1.0 10 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Current vs. Temperature 3.0 Relative Intensity@20mA Normalize@25℃ 40 Forward Current(mA) 1000 Forward Current(mA) Forward Voltage(V) 30 20 10 0 0 20 40 60 80 100 Ambient Temperature (Ta°C) 1.0 0.5 0 550 600 650 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 100 700 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/12 PART NO. LG-195HRF/DBK-CT Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 3.0 2.0 4.0 5.0 1 10 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Current vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Current(mA) 40 30 20 10 0 20 40 60 80 100 Ambient Temperature (Ta°C) Relative Intensity@20mA 1.0 0.5 0.0 450 500 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength 400 1000 Forward Current(mA) Forward Voltage(V) 0 100 550 Fig.6 Directive Radiation 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/12 PART NO. LG-195HRF/DBK-CT Carrier Tape Dimensions 4.0±0.2 0.23 2.0 1.75 3.5±0.2 8.0±0.3 1.75 5.3 0.7 1.65 4.0 ±0.2 Note : The tolerances unless mentioned is ± 0.1mm,Angle ± 0.5. Unit=mm. ‧ Packing Specifications Label Aluminum Moist-Proof bag Label Part No. Description Quantity/Reel LG-195HRF/DBK-CT 8.0mm tape,7"reel 4000 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/12 PART NO. LG-195HRF/DBK-CT Label Explanation LIGITEK ELECTRONICS CO., LTD. Pb PART : LG-195HRF/DBK-CT LOT : GS11630168 QTY(PCS): 4000 VF:1.5-2.4 BIN/HUE : N/29-P/0D VF:2.8-3.6 BIN : Luminous Intensity HUE : Dominant Wavelength VF : Forward Voltage Reel Dimensions 0.2 0.4 0.8 178 ± 1.5 60 ± 1.0 0.8 0.6 0.2 0.4 0.6 2.0 ± 0.5 9.0 ± 1.0 ψ13.5±1.0 12.0 ± 1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/12 PART NO. LG-195HRF/DBK-CT Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-195HRF/DBK-CT Page 10/12 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280 ℃ 3 sec one time only. 3 PB-Free Reflow Solder 1~5°C/sec 1~5°C/sec Preheat 180~200°C 260°C MaX. 10sec.Max 6°C/sec Above 220°C 60 sec.Max. 120 sec.Max. Note: 1.Reflow soldering should not be done more than two times. 2.When soldering,do not put stress on the LEDs during heating. 3.After soldering,do not warp the circuit board. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 11/12 PART NO. LG-195HRF/DBK-CT Precautions For Use: Storage time: 1. Calculated shelf life before opening is 18 months at < 30°C and < 90% relative humidity (RH) 2. After bag is opened, devices which will be subjected to reflow soldering or other high temperature processes must be a) Assemblied within one years in an environment of ≦ 30°C / 60% RH, or b) Stored at ambient of 10% RH or less 3. Devices are required baking before assembly if: a) Humidity Indicator Card reads >10% (for level 2a -5a) or >60% (for level 2) at ambient temperature 23 ±5°C b) 2.a) or 2.b) doesn't meet 4. If baking is required, devices should be baked for >24 hours at 60±5°C.Performing baking only once, and using the baked devices within 72 hours.. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forward current should not be allowed to change by more than 40% of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 12/12 PART NO. LG-195HRF/DBK-CT Reliability Test: Classification Test Item Test Condition Sample Size Operating Life Test 1.Ta=25°C 2.If=20mA 3.t=1000 hrs (-24hrs,+72hrs) 22 High Temperature Storage Test 1.Ta=100°C±5°C 2.t=1000 hrs (-24hrs,+72hrs) 22 Low Temperature Storage Test 1.Ta=-40°C±5°C 2.t=1000 hrs (-24hrs,+72hrs) 22 High Temperature High Humidity Storage Test 1.Ta=85°C 2.RH=85% 3.t=1000hrs(-24hrs,+72hrs) 22 1.Ta=100°C±5°C ~ -40°C±5°C 20min/ 10sec / 20min 2.total 100 cycles 22 1.100°C±5°C ~ -40°C±5°C 30mins / 5mins / 30mins 2.100 Cyeles 22 Endurance Test Thermal Shock Test Environmental Test Temperature Cycling IR Reflow 1.T=260°C Max. 10sec.Max. 2. 6 Min 22