PTCTZ Datasheet

PTCTZ
www.vishay.com
Vishay BCcomponents
SMD PTC Thermistors For Overload Protection
FEATURES
•
•
•
•
•
•
Compact resettable overload protection
Low mounting height
Suitable for reflow soldering
Small ceramic diameter for faster response
Low heat transfer to substrate
Flat terminations for stable positioning and good
solderability
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
QUICK REFERENCE DATA
VALUE
PARAMETER
Resistance value at 25 °C
Tolerance on R25 value
Maximum overload current
Iol (Vmax. dependent)
STANDARD
TYPES (1)
TELECOM
TYPES (1)
2 to 500
10 to 70
Ω
± 10; ± 15; ± 20
%
2 to 10
A
Maximum holding current
(Int)
50 to 500
(at 25 °C)
50 to 100
(at 70 °C)
Maximum voltage
(RMS or DC)
16 to 400
220 to 600
Maximum trip time at 1 A
UNIT
0.8 to 6
Switching temperature
(Tsw)
105 to 140
Operating temperature
range at max. voltage
-40 to 85
Storage temperature
-40 to 155
Maximum continuous
power at 25 °C
2
VRMS
s
°C
W
Note
(1) Customized products are available on request in the indicated
nominal R25 range. Larger 8 mm ceramics for lower resistance
values or higher voltages are in use in the PTCCZ08 series.
Over-temperature/over-load protection:
• Telecom
-Central Office Switching (C.O.)
-Subscriber Terminal Equipment (T.E.)
-Set-top Box
-Modems
• General industry and automotive
-Low power overload protection
-Inrush current limitation
DESCRIPTION
The component consists of a high performance PTC
ceramic mounted in a lead frame with lead (Pb)-free tin
plated contacts. The terminations are joined to the Ag plated
ceramic by a high melting solder. The ceramic is covered
with a protective high temperature silicone layer.
MARKING
• All SMD PTCs are marked with a 3-digit type number
(XXX) and a date code (YYWW)
ELECTRICAL DATA AND ORDERING INFORMATION
RESISTANCE
It at
OPERATING
Int at
MAX.
STORAGE
MAX.
TEMP.
MATCHING Vmax. 25
70
25 TRIP-TIME Iol at T
TEMP.
RANGE
R25
TOL.
sw
(Ω)
V
(V)
°C
°C
°C
max.
RANGE
at 1 A (s)
AT MAX.
(Ω)
(%)
(A)
(mA) (mA) (mA)
VOLTAGE
TELECOM AND INDUSTRIAL TYPES
10
20
245 165 100 270
3.0
2.0 105
0 to 70
-25 to 125
10
20
0.5 245 165 100 270
3.0
2.0 105
0 to 70
-25 to 125
40
25
no
265 80
50 130
0.8
2.0 105
0 to 70
-25 to 125
25
20
1 265 120 70 220
1.3
2.0 110
0 to 70
-25 to 125
15 to 20
300 150 100 250
1.5
1.5 115
0 to 70
-25 to 125
15 to 20
0.5 300 150 100 250
1.5
2.0 115
0 to 70
-25 to 125
20
20
0.5 300 120 70 250
1.4
1.5 105
0 to 70
-25 to 125
35
+15 / -20
1 425 110 70 175
1.0
0.7 125 -25 to 85
-40 to 155
50
20
1 425 90
60 150
0.8
0.7 125 -40 to 70
-40 to 125
GENERAL INDUSTRIAL TYPES
3.3
25
24 400
650
6.0
8.0 140 -40 to 85
-40 to 155
9.4
25
60 150 100 300
1.8
3.0 115 -40 to 85
-40 to 155
CATALOG NUMBER
SAP ORDERING
CODE
TYPE NR
MARKING
PTCTZ3NR100GTT (2)
PTCTZ3MR100GTT (2)
PTCTZ3NR400HTT
PTCTZ3MR250HTT (2)
PTCTZ3NR150KTT (2)
PTCTZ3MR150KTT (2)
PTCTZ3MR200KTT (2)
PTCTZ3MR350MTT (2)
PTCTZ3MR500MTT
012
016
002
005
004
003
018
009
019
PTCTZ3NR339CTT
PTCTZ3NR949ETT
013
011
Note
(2) These types pass ITU-K20-21-45 telecommunication protection recommendation
Revision: 27-Nov-15
Document Number: 29068
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PTCTZ
www.vishay.com
Vishay BCcomponents
PTC OUTLINES
DIMENSIONS in millimeters
PTC SMD ceramic size: 6.5 mm
2
0
7.3 - 0.2
8.0
3
1
2
3.45
± 0.15
0.2
1
1.2
3.6 ± 0.1
10°
max.
DIMENSIONS OF SOLDER LANDS in millimeters
2
4 ± 0.2
2.8
2
3
+ 0.6
0
0.6
7.6 ± 0.25
10 ± 0.25
5
11
4 ± 0.1
PACKAGING
TYPE
QUANTITY
CARRIER TAPE
WIDTH
PITCH
REEL DIAMETER
PTCTZ
1500
PS conductive blister tape acc. IEC60286-3
16 mm
12 mm
330 mm
MATERIAL INFORMATION
REF.
DESCRIPTION
MATERIAL AND REMARKS
1
Ceramic
BaTiO3 doped
2
Metalization
NiCr Ag layer (vacuum deposition)
3
Lead frame
Ni plated phosphor bronze material covered by matte tin layer
SOLDERING CONDITIONS
This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020D. Soldering processes
which can be used are reflow (infrared and convection heating) and vapor phase. The maximum temperature of 260 °C during
10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
Reflow soldering
Vapor phase soldering
T
(°C)
10 s
300
260 °C
250
245 °C
215 °C
200
180 °C
150
130 °C
T
(°C)
10 s
40 s
200
180 °C
150
130 °C
100 °C
100
2 K/s
50
50
External
preheating
50
0
0
20 s to 40 s
250
215 °C
100
0
300
100
Typical values (solid line)
Process limits (dotted lines)
150
200
t (s)
250
0
Forced
cooling
Internal preheating,
e.g. by infrared,
max. 2 K/s
50
100
Typical values (solid line)
Process limits (dotted lines)
150
200
t (s)
250
MOUNTING CONDITIONS
A flat pick-up area of minimum 10 mm2 and low weight allows for fast placement.
Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue
of perspiration can influence component behavior at high temperatures.
Handling forces applied to the component should be limited to 5 N in any condition.
Revision: 27-Nov-15
Document Number: 29068
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000